Partnership provides a solution, combining OSAT (Outsourced Semiconductor Assembly and Test) services with advanced Tx engine designs for optical communication systems, streamlining the production and integration of silicon photonics technology into the market

SANTA CLARA, Calif., March 31, 2025 /PRNewswire/ — OpenLight, the world leader in custom PASIC chip design and manufacturing, today announced a new ecosystem partnership with Suzhou TFC Optical Communication Co., Ltd. (TFC), a leading provider of optical sub-assembly integrated solutions and advanced optoelectronic package manufacturing services, aimed at advancing the Silicon Photonics back-end process. This collaboration will streamline the back-end procedure of wafer processing to FAU (Fiber Array Unit) subassembly for optical engines, offering a comprehensive solution to optimize the supply chain and enable faster time-to-market at a lower cost amid growing demand in optical interconnects in datacenter AI/ML and LiDAR and sensing markets.

As silicon photonics adoption grows, the entire supply chain must also mature to meet demand, which requires multiple high-volume manufacturing capabilities to be ready for the increasing market need. Currently, a limited number of suppliers can administer the back-end wafer processes to FAU subassembly for optical engines. The ecosystem partnership between OpenLight and TFC will provide a one-stop shop to streamline the supply chain and allow customers to scale manufacturing by creating an efficient workflow and simplified process.

As part of the partnership, OpenLight will support TFC’s development of acquiring completed wafers and provide back-end processes, including wafer-level bumping, testing, grinding, and dicing to deliver known-good dies. Customers will have the flexibility to procure the subassemblies directly. With OpenLight’s fully heterogeneous integration platform including lasers, amplifiers and modulators all integrated into one PIC (Photonic Integrated Circuit), this partnership would allow customers faster time to market without the need to assemble and attach lasers in the subassembly.

“As part of developing a global ecosystem in packaging silicon photonic integrated circuits including backend semiconductor wafer processing, we are very pleased to have the support along with the technical and manufacturing capabilities of Suzhou TFC Co Ltd to enable our global customers as well as those customers in the Chinese markets that we serve,” said Dr Adam Carter, CEO at OpenLight. “Bringing TFC’s expertise in high volume manufacturing capability along with their expertise in passive component technologies and solutions into the OpenLight ecosystem will address the backend wafer processing and packaging challenges, break barriers and enable broader industry adoption of heterogeneously integrated silicon photonics.”

“OpenLight plays a key role in boosting customer value through integration that is highly scalable,” said Lucy Ou, Chief Executive Officer at TFC. “We are excited to work closely with OpenLight and support growing market demands of the silicon photonics space. By leveraging our combined expertise and resources, we will enable wide adoption of silicon photonics through enhancing the value of the laser engines for PIC and semiconductor OSAT.”

About OpenLight 

OpenLight is the world leader in custom PASIC design. OpenLight’s PASIC technology integrates all the components of silicon photonics devices, both active and passive components, into one chip. Our executive and engineering teams deliver the world’s first open silicon photonics platform with integrated lasers amplifiers and modulators to improve the performance, power efficiency, and reliability of designs for telecom, datacom, LiDAR, healthcare, HPC, AI, and optical computing applications. With over 350 patents, OpenLight is bringing optical solutions to places it has never been before and enabling technologies and innovation that were not previously possible. The company is headquartered in Santa Barbara, CA with offices in Silicon Valley. Read more at www.openlightphotonics.com. 

About TFC

Suzhou TFC Optical Communication Co., Ltd (TFC), founded in 2005, is a leading provider of optical sub-assembly integrated solutions and advanced opto-electronic package manufacturing service, dedicated to the R&D, production, and sales of high-speed optical devices. TFC was founded in 2005 and was successfully listed on the Growth Enterprises Market (GEM) in 2015, its products are widely used in Fiber Optical Communications, Optical Sensing, LiDAR, and Bio-photonics etc. For more information visit: http://www.tfcsz.com/ 

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SOURCE OpenLight

TEL AVIV, Israel, March 31, 2025 /PRNewswire/ — LeakZon LTD, a leading provider of innovative solutions for water loss management, announced today the successful completion of its Series A funding round, securing $5 million. This investment was led by PEAL HOLDINGS A.A LTD, LeakZon’s existing investor, and other investors. PEAL HOLDINGS A.A. LTD firmly reaffirms its strong confidence in LeakZon’s strategic vision and promising growth trajectory, highlighting a shared commitment to excellence and innovation.

The newly raised funds will bolster LeakZon’s ambitious plans for penetrating the U.S. market, where the company has already established LeakZon Inc., a dedicated American entity headquartered in the U.S. since January. LeakZon has quickly built a strong local presence, assembling an experienced sales and operations team ready to support and expand its market footprint.

Dan Winter, CEO of LeakZon LTD and President of LeakZon Inc., emphasized the alignment of LeakZon’s approach with the ‘One Water’ movement and government efficiency initiatives:

“We are witnessing a growing demand for LeakZon’s solutions as utilities recognize the inefficiencies and extended timelines associated with traditional water loss management methods. Our cloud-based architecture simplifies deployment and accelerates results, enabling utilities to manage all water sources in an integrated and sustainable manner, consistent with the ‘One Water’ approach. Moreover, our cost-effective solutions align with the US government’s efforts to reduce government expenditures, a cost-saving initiative notably championed by Elon Musk and the Department of Government Efficiency (DOGE).”

The funding will also drive the development of new advanced features, ensuring LeakZon remains at the forefront of water management technology, offering utilities innovative tools to manage and reduce water loss effectively.

LeakZon’s groundbreaking technology has already demonstrated substantial impact, with significant reductions in Non-Revenue Water (NRW) for its customers globally, positioning the company as an essential partner for utilities aiming to optimize their water networks sustainably and economically.

For media inquiries, please contact:

Tomer Eisner, CMO
LeakZon LTD
Phone (US): +1 646 79 72 79 7
Email: tomere@leakzon.com

Logo – https://mma.prnewswire.com/media/2520750/4944980/LeakZon_Logo.jpg

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SOURCE LeakZon LTD

RESTON, Va., March 31, 2025 /PRNewswire/ — Leidos (NYSE: LDOS) is bringing on Daryle Lademan as its new senior vice president of corporate strategy, a role in which she’ll lead company-level growth strategies, strategic partnerships and investments, strategy execution and special projects.

Starting today, Lademan reports to Chief Growth Officer Jason Albanese and will collaborate across the executive leadership team on annual and long-range plans that enable the company’s new NorthStar 2030 strategy.

“Daryle’s three decades of experience across the defense and government technology market makes her ideal to guide NorthStar 2030 implementation,” Albanese said. “Our strategy’s foundation is enabling smarter and more efficient outcomes. Daryle will help ensure we’re pursuing priorities that result in tangible solutions for our customers.”     

Lademan spent 15 years at BAE Systems, Inc., before joining Leidos. Most recently, she led that company’s U.S. strategy and planning at the enterprise level. Before that, she led those activities for that company’s Electronic Systems and Support Solutions businesses. Prior to BAE Systems she was a principal at management consulting firm The Avascent Group (now part of Oliver Wyman) and a director at strategic advisory firm CSP Associates, Inc.

Lademan is a former president and board member of Women in Aerospace, which focuses on increasing the leadership capabilities of women in the industry, and has degrees from George Washington University and the University of Central Florida. She’s also an avid runner who has completed 27 marathons.

About Leidos

Leidos is an industry and technology leader serving government and commercial customers with smarter, more efficient digital and mission innovations. Headquartered in Reston, Virginia, with 48,000 global employees, Leidos reported annual revenues of approximately $16.7 billion for the fiscal year ended January 3, 2025. For more information, visit www.leidos.com.

Certain statements in this announcement constitute “forward-looking statements” within the meaning of the rules and regulations of the U.S. Securities and Exchange Commission (SEC). These statements are based on management’s current beliefs and expectations and are subject to significant risks and uncertainties. These statements are not guarantees of future results or occurrences. A number of factors could cause our actual results, performance, achievements, or industry results to be different from the results, performance, or achievements expressed or implied by such forward-looking statements. These factors include, but are not limited to, the “Risk Factors” set forth in Leidos’ Annual Report on Form 10-K for the fiscal year ended January 3, 2025, and other such filings that Leidos makes with the SEC from time to time. Readers are cautioned not to place undue reliance on such forward-looking statements, which speak only as of the date hereof. Leidos does not undertake to update forward-looking statements to reflect the impact of circumstances or events that arise after the date the forward-looking statements were made.

Media Contact:

Brandon Ver Velde
(571) 526-6257
brandon.p.vervelde@leidos.com  

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SOURCE Leidos Holdings, Inc.