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SJSemi closed $700M new financing to further boost its Advanced Packaging projects

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JIANGYIN, China, Dec. 31, 2024 /PRNewswire/ — SJ Semiconductor Corporation (hereinafter referred to as “SJSemi” or “the company”) announced the efficient and successful closure of a new financing round amounting to $700 million on Dec. 31, 2024. The roster of newly onboarded investors includes Wuxi Chanfa Science and Technology Innovation Fund, Jiangyin Binjiang Chengyuan Investment Group, Fortera Capital, Shanghai International Group, Lingang Xinxin Fund of Shanghai Lingang Special Area Administration and Lingang Shuke Fund of Lingang Group, together with Social Security Fund Zhongguancun Independent Innovation Fund, China Life Private Equity Investment Limited, Golden Link, etc.

Since its inception in 2014, SJSemi has continuously dedicated to the high-quality and high-standard production of 12-inch mid-end wafers. Complementing this, SJSemi extends its service to offer advanced packaging and testing services for the whole process of wafer level advanced packaging and multi-die integration processing, which are widely used in smartphones, 5G communication, high-performance computing, data centers, automotive and other electronics fields. In the wake of the artificial intelligence and digital economy boom, SJSemi is able to provide a variety of advanced packaging solutions for Chiplet production and continues to increase investments in innovation and R&D efforts, especially in the 3D multi-die integration space.

In 2023 and 2024, SJSemi witnessed remarkable revenue growth for two successive years. According to Yole’s market research report, SJSemi is the company with the highest revenue growth among global OSATs in 2023. According to CIC Insight Consulting, SJSemi is ranked No.1 in market share in mainland China’s 12-inch Bumping, 12-inch WLCSP markets, and is ranked No.1 in revenue in the wafer testing and chip probing market. As of 2024, SJSemi is currently the only provider capable of mass producing silicon-based 2.5D packaging solutions in mainland China.

In recent years, SJSemi has made significant progress in advanced packaging technologies due to its commitment to innovation. In May 2024, SJSemi debuted its 3x reticle TSV interposer technology, marking the company’s entry into a new era of sub-micron level advanced chip interconnect technology, further improving interconnect density in its products. The latest round of $700M USD in financing will help the company further technological progress into ultra-high density 3D Multi-Die Integration project, allowing it to strengthen its position as a leading advanced packaging provider, becoming a one-stop shop solutions provider for multi-die integration solutions.

Mr. Cui Dong, Chairman and Chief Executive Officer of SJSemi, states that, while proceeding  toward the IPO application process, the company opened the latest round of new financing for patient capital and industrial capitals who are firmly aligned with the long-term vision of SJSemi. This will also help to improve and optimize the company’s equity governance structure.  The synergy between SJSemi’s strategic business planning and state-owned capital from both Wuxi and Shanghai will look to inject new momentum into the company’s long-term development and success, positioning the company favorably to best capitalize on new opportunities in artificial intelligence and the digital economy!”

About SJSemi

Established in August 2014, SJ Semiconductor Co., Ltd. is the first Middle-End-Of-Line (MEOL) pure play foundry equipped with Front-End-Of-Line (FEOL) manufacturing and quality system, serving global customers. Starting with advanced 12-inch bumping and RDL, SJSemi devotes to offer world-class Middle-End-Of-Line (MEOL) manufacturing and testing services, and develops to provide the advanced 3D Multi-Die Integration technology and solutions. Headquartered in Jiangyin High-tech Industrial Development Zone, China, the company has branches in Shanghai and Silicon Valley of the United States, serving advanced chip design enterprises at home and abroad.

View original content:https://www.prnewswire.com/news-releases/sjsemi-closed-700m-new-financing-to-further-boost-its-advanced-packaging-projects-302340626.html

SOURCE SJ Semiconductor Corporation

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P&R Measurement Debuts at CES 2025: Redefining Industrial Applications and Flexible Manufacturing

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LAS VEGAS, Jan. 9, 2025 /PRNewswire/ — P&R Measurement, a key player in the measurement and control industry, is making its global debut at CES 2025, showcasing breakthrough solutions in AI-driven industrial applications and flexible manufacturing. Highlighting its upgraded brand vision, “Empowering everyone to be an innovator,” the company focuses on “AI-enhanced industrial applications + flexible manufacturing solutions” for modern industrial needs.

At the heart of P&R Measurement’s exhibit is PRIME, its self-developed industrial AI Agent. Designed to integrate testing and manufacturing systems with advanced automation, PRIME simplifies workflows, reduces technical barriers, and empowers non-expert users to confidently handle complex engineering tasks. This transformative technology embodies P&R Measurement’s commitment to innovation, delivering greater value to clients while expanding opportunities for growth.

Flexible Manufacturing and Tailored Solutions

P&R Measurement’s flexible manufacturing innovations also take center stage alongside PRIME. The company offers customized solutions for automated testing and assembly lines, enhancing precision, efficiency, and reliability across industries. In collaboration with a leading home appliance manufacturer, its Smart Lab—an AI and IoT-powered automated laboratory platform—optimized product development by reducing energy consumption by 30%, lowering R&D costs, and boosting testing efficiency in high-energy labs.

Additionally, P&R Measurement is showcasing its A²S Lab, a sensory testing solution, and A²TP, a flexible testing platform, which streamline complex product testing and enhance user experience.

Cross-Industry Collaboration and Market Recognition

Leveraging expertise across AI, information technology, industrial manufacturing, measurement and testing, P&R Measurement creates high-value solutions tailored to the consumer electronics, home appliances, and automotive sectors. Its AI-enhanced visual defect detection system has enabled a pass rate exceeding 99.8% for large automotive parts, while its deep learning model for a consumer electronics client automated sound anomaly detection, ensuring production accuracy and efficiency.

These innovations have addressed critical challenges, including on-time delivery and quality control, earning P&R Measurement widespread market recognition and trust.

Vision for the Future

P&R Measurement continues to transform intelligent manufacturing by integrating AI and advanced testing technologies into industrial and everyday applications. With a flexible, customer-focused approach, the company remains committed to evolving market demands. Following CES 2025, P&R Measurement will showcase its cutting-edge concepts at Design Con on January 28, reinforcing its leadership in shaping the future of global industrial ecosystems.

For more information, visit the P&R Measurement website at
https://prmeasure.com/
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View original content:https://www.prnewswire.co.uk/news-releases/pr-measurement-debuts-at-ces-2025-redefining-industrial-applications-and-flexible-manufacturing-302346562.html

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RedBox Storage Appoints Benny Chung as New CEO to Drive Continued Growth and Innovation

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HONG KONG, Jan. 9, 2025 /PRNewswire/ — RedBox Storage is pleased to announce the appointment of Benny Chung as its new Chief Executive Officer, effective January 1, 2025.

Mr Chung brings a wealth of experience to RedBox, having most recently served as the Group Head of Investment at JustCo Group where he successfully led initiatives that drove corporate development, asset management strategies across the APAC region.

His prior experiences included various leadership roles at Shangri-La Group where Mr Chung managed assets exceeding HK$25 billion and oversaw a portfolio of more than 15 assets in South China.  Additionally, he served as Chief of Staff at CapitaLand driving corporate planning and focusing on the operations of CapitaMalls across Asia, which had a market capitalization of US$7 billion.

Since 2022, RedBox Storage has expanded its footprint, now owning and operating six modern facilities with over 400,000 gross floor area (GFA). The recent launch of a new facility on Western Hong Kong Island highlights the strong demand for self-storage solutions.

Redbox Storage Interim CEO Michael Cocozzo said:  “RedBox aims to be the leading self-storage operator in Hong Kong, and we see significant opportunities for further growth. With his extensive expertise in investment and asset management, Mr Chung is well-positioned to drive RedBox’s strategy and innovation in a competitive market. We look forward to collaborating with him as he leads the company through the next phase of development.”

Mr Chung said: “I am honored by the opportunity to lead RedBox Storage. Delivering high-quality customer experiences and innovative solutions is key to achieving success in the dynamic business environment of 2025 and beyond. Together with our talented team, I believe we can deliver exceptional value to our customers and maintain our reputation for reliability and excellence.”

For more information about RedBox Storage, please visit https://www.redboxstorage.com.hk/

About RedBox Storage

RedBox Storage has established itself as a premier storage provider, known for its reliability and personalized services. With ownership and operation of six modern facilities across Hong Kong, RedBox ensures convenient access for customers, boasting a combined space that spans over 400,000 GFA. The company takes pride in its unwavering dedication to security and the pursuit of innovative service solutions designed to meet individual client requirements, emphasizing customer peace of mind. Its consistent record of growth led to a landmark acquisition by global investment giant Brookfield Asset Management in 2022, highlighting the company’s successful expansion and enduring commitment to excellence.

View original content:https://www.prnewswire.com/apac/news-releases/redbox-storage-appoints-benny-chung-as-new-ceo-to-drive-continued-growth-and-innovation-302343728.html

SOURCE RedBox Storage

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Touch the Future: Hanvon Unveils the World’s First EMC-Touch Chip & Penstar Brand at CES 2025

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LAS VEGAS, Jan. 8, 2025 /PRNewswire/ — Hanvon Technology, a pioneer in China’s artificial intelligence industry, made a significant splash at the CES 2025 Global Consumer Electronics Show, held at the Las Vegas Convention Center. Under the theme “Touch the Future,” Hanvon showcased a range of innovative technologies and products, including the world’s first EMC-Touch chip, HW0888, the Penstar digital notebook brand, biomimetic flying robots, digital signature, input method and OCR solutions. The event highlighted Hanvon’s key original technologies and its extensive industrial layout.

EMC-Touch Chip: Touch the Future Together
Since its founding in 1993, Hanvon has been deeply involved in the field of electromagnetic touch technology and is one of only two companies globally holding wireless passive electromagnetic patents. In 2010, Hanvon expanded into the capacitive touch field. Combining 30 years of expertise in electromagnetic technology with 15 years in capacitive touch technology, Hanvon has innovatively introduced the world’s first EMC-Touch chip, HW0888. This chip, along with a single layer of sensors, perfectly realizes the EMC solution, supporting both passive electromagnetic pens and capacitive touch. It features 8192 levels of pressure sensitivity and multi-finger touch functionality.

Penstar: Redefining the Digital Notebook Market
To tap into the large and steadily growing global market, Hanvon has developed a new brand strategy for Penstar, actively expanding into overseas e-commerce channels. The Penstar eNote digital notebook opened for sales in the North American market in August 2024 and has quickly gained popularity among users in North America.

The Penstar eNote is equipped with Hanvon’s revolutionary PureView™ ePaper screen technology, which eliminates accidental touches and enhances screen clarity. Since its launch, it has received widespread acclaim. Penstar’s debut at CES marks the accelerated global expansion of Hanvon’s digital notebook offerings, both online and offline, and highlights the company’s ambition in the global digital notebook market.

The New GoGoBird 3010: Soaring Globally
Hanvon’s GoGoBird is the world’s first commercialized autonomous flying biomimetic robot with flapping wings. Since its launch in 2019, it has quickly gained traction in markets across North America, Australia, Europe, Japan, and South Korea. The GoGoBird 3010, also known as “Golden Eagle,” is Hanvon’s latest model. It integrates biomimetic flight, intelligent sensing, and AI technology, offering features such as autonomous obstacle avoidance and high-definition real-time image transmission.

Profound Technological Accumulation and Deep Industry Expertise
At CES, Hanvon also showcased industry-leading solutions in digital signatures, input methods, and OCR, promoting global digital sustainable development.

Hanvon’s input method, integrated with Hanvon’s handwriting recognition, supports multiple languages with high recognition accuracy, low resource consumption, and high security. This method is closely integrated with in-vehicle applications, optimizing input efficiency based on specific scenarios, and is customized for multi-screen input, voice recognition, and multi-terminal screen responses, enabling a more comfortable and secure human-vehicle interaction.

With more than 20 years of experience in OCR, Hanvon has solved world-class challenges, such as recognizing freehand manuscripts, achieving a handwriting recognition rate of over 95%. Hanvon’s OCR solution has been successfully applied in scenarios such as financial bills, cards and certificates, vehicle driving licenses, reimbursement vouchers, and batch data recognition, helping businesses reduce costs and improve efficiency.

Leading AI Innovation and Industrial Development
Hanvon has long been at the forefront of artificial intelligence innovation and industrial development. The introduction of the world’s first EMC-Touch chip, the Penstar digital notebook, GoGoBird, and other groundbreaking applications at CES demonstrates Hanvon’s leadership in AI-driven interactions.

“Hanvon will continue to prioritize original innovation, striving to fulfill the mission of ‘machines understanding you better.’ Together, we will touch the future in this new era of artificial intelligence,” said a Hanvon spokesperson.

 

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SOURCE Hanvon

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