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Semiconductor Fabrication Software Market to Grow by USD 984.91 Million (2024-2028), Driven by Increased Design Complexity, with AI Driving Market Transformation – Technavio

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NEW YORK, Nov. 18, 2024 /PRNewswire/ — Report with the AI impact on market trends – The global semiconductor fabrication software market size is estimated to grow by USD 984.91 million from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of almost 2.77%  during the forecast period. Growing complexity of semiconductor device designs is driving market growth, with a trend towards high need for semiconductor memory devices. However, increasing chip shortage globally  poses a challenge. Key market players include Advanced Micro Devices Inc., Agnisys Inc., Aldec Inc., ANSYS Inc., Applied Materials Inc., Cadence Design Systems Inc., KLA Corp., Lam Research Corp., Onto Innovation Inc., PDF Solutions Inc., Sasken Technologies Ltd., Siemens AG, Synopsys Inc., The PEER Group Inc., Thermo Fisher Scientific Inc., Zuken Inc., Cantier Systems Pte Ltd., Fabmatics GmbH, Mindteck India Ltd., and Tismo Technology Solutions Pvt. Ltd..

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Semiconductor Fabrication Software Market Scope

Report Coverage

Details

Base year

2023

Historic period

2018 – 2022

Forecast period

2024-2028

Growth momentum & CAGR

Accelerate at a CAGR of 2.77%

Market growth 2024-2028

USD 984.91 million

Market structure

Fragmented

YoY growth 2022-2023 (%)

2.34

Regional analysis

APAC, North America, Europe, Middle East and Africa, and South America

Performing market contribution

APAC at 52%

Key countries

US, China, India, Germany, and UK

Key companies profiled

Advanced Micro Devices Inc., Agnisys Inc., Aldec Inc., ANSYS Inc., Applied Materials Inc., Cadence Design Systems Inc., KLA Corp., Lam Research Corp., Onto Innovation Inc., PDF Solutions Inc., Sasken Technologies Ltd., Siemens AG, Synopsys Inc., The PEER Group Inc., Thermo Fisher Scientific Inc., Zuken Inc., Cantier Systems Pte Ltd., Fabmatics GmbH, Mindteck India Ltd., and Tismo Technology Solutions Pvt. Ltd.

Market Driver

The Semiconductor Fabrication Software market is experiencing significant trends in product pricing, industry coverage, and business strategy. Political and social scenarios, including geopolitical tensions and changing consumer demands, are impacting the market. Positive changes include scalability and innovation, with companies like Applied Materials, Cadence Design Systems, Mentor Graphics, Synopsys, Agnisys, Aldec, Ansoft focusing on cutting-edge product offerings. Negative changes include fragmentation dominance and amalgamation traits. CAE tools for IC, PCB, MCM, and Digital Manufacturing are in focus, with PEER and forefront technologies like Pathfinder and Accumulation driving growth. Strategies include niche differentiation and vital partnerships. The Ace Matrix highlights Synopsys and Cadence Design Systems as innovators, while Amalgamation traits are seen in Applied Materials and Mentor Graphics. Product satisfaction remains key, with companies striving to meet the needs of the industry. 

Semiconductor device manufacturers are focusing on memory devices like 3D NAND and DRAM due to the high growth potential of the semiconductor memory market. Consumer electronics market dynamics offer new opportunities for vendors in this shift. For instance, OEMs have moved from HDD storage to flash memory in smartphones and notebooks due to features such as resistance to vibration, lower chances of corruption, and less data loss. Precise chip fabrication is essential for these additional features, making semiconductor fabrication software solutions a necessity. 

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Market Challenges

The Semiconductor Fabrication Software market faces several challenges, including product pricing pressures and a complex business landscape. Political and social scenarios, such as trade policies and workforce demographics, also impact the industry. Positive changes include the adoption of digital manufacturing and the increasing importance of scalability and business strategy. Winning imperatives include offering cutting-edge solutions, focusing on niche areas, and providing excellent product satisfaction. Key players like Applied Materials, Cadence Design Systems, Mentor Graphics, Synopsys, Agnisys, Aldec, Ansoft, and others are active in the market, with strategies ranging from being innovators to fragmentation dominance and amalgamation traits. CAE tools for IC, PCB, MCM design, and digital manufacturing are in high demand, with PEER continuing to shape the industry landscape. The Ace Matrix identifies Forefront and Pathfinder as current leaders, with Vital, Accumulation, and Amalgamated traits shaping the future.The global semiconductor industry is experiencing significant challenges due to a chip shortage, impacting various sectors from automotive to consumer electronics. This shortage is limiting the world’s manufacturing capabilities, leading to increased prices and stock depletion. Chip orders, typically placed months in advance, are experiencing longer lead times, averaging over 28 weeks for most types of chips. Companies are ordering excess chips to secure their stocks, straining manufacturing capacity and raising costs. The semiconductor fabrication software market is crucial in this scenario, offering solutions to optimize production and reduce lead times, ultimately helping businesses mitigate the impact of the chip shortage.

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Segment Overview 

This semiconductor fabrication software market report extensively covers market segmentation by  

Solution 1.1 CAE1.2 IC physical design and verification1.3 PCB and MCM1.4 Fab management software1.5 OthersEnd-user 2.1 Process documentation2.2 Process integration2.3 OthersGeography 3.1 APAC3.2 North America3.3 Europe3.4 Middle East and Africa3.5 South America

1.1 CAE-  The Computer-Aided Engineering (CAE) segment of the semiconductor fabrication software market includes tools used for engineering tasks, such as electronic system level (ESL) simulation, register transfer level (RTL) simulation, hardware-assisted verification, synthesis, analysis, and various other tools. These tools are essential for solving complex engineering problems, including partial differential equations and boundary value problems, or deriving algorithms for fluid flows and flight tests. CAE tools are then translated into manufacturing instructions using Electronic Design Automation (EDA) software. ESL tools are particularly significant, as they follow a system-level approach, enabling faster design, verification, and simulation at lower costs and in less time. RTL tools help end-users verify logic designs using an RTL language and provide an abstract of complex circuit diagrams for extracting root-level circuit writings. The CAE segment is expected to grow slowly during the forecast period due to the widespread use and contractual business model of EDA software among users.

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Research Analysis

The Semiconductor Fabrication Software market is a critical segment of the semiconductor industry, providing essential tools for Foundries and Integrated Device Manufacturers (IDMs) to design, develop, and manufacture complex Integrated Circuits (ICs), Printed Circuit Boards (PCBs), Multi-Chip Modules (MCMs), and other advanced semiconductor products. The market is characterized by the forefront use of Computer-Aided Engineering (CAE) solutions for digital manufacturing, Process, Equipment and Environmental Reporting (PEER) for regulatory compliance, and Thermo Fisher’s Accumulation software for wafer handling and inspection. The market is fragmented, with several niche players and amalgamation trends, but key areas of dominance include advanced IC design, IC manufacturing execution systems, and PCB design and manufacturing software. Product pricing and political scenarios significantly impact the market dynamics. Tismo Technology and other emerging players are disrupting the market with innovative solutions.

Market Research Overview

The Semiconductor Fabrication Software market is a dynamic and innovative industry, focused on providing advanced solutions for the design, manufacturing, and testing of integrated circuits (ICs), printed circuit boards (PCBs), multi-chip modules (MCMs), and digital manufacturing. Product offerings range from computer-aided engineering (CAE) tools for semiconductor design, layout, and verification, to manufacturing execution systems (MES) for process control and yield optimization. Political scenarios, such as trade policies and regulations, and social factors, including demographic shifts and changing consumer preferences, can significantly impact the market. Positive changes include increasing demand for advanced technologies like AI, IoT, and 5G, while negative changes include rising fabrication costs and intensifying competition. Scalability, business strategy, and industry coverage are key winning imperatives for market players. The Ace Matrix, featuring Active, Cutting Edge, Innovator, and Niche players, highlights the competitive landscape. Applied Materials, Cadence Design Systems, Mentor Graphics, Synopsys, Agnisys, Aldec, Ansoft, and others offer product satisfaction through offerings like Forefront, Pathfinder, Vital, Accumulation, and Fragmentation dominance. Amalgamation traits, such as partnerships and acquisitions, are common strategies to expand market presence. PEER (Process, Equipment, and Materials) integration and digital manufacturing are current industry focuses.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

SolutionCAEIC Physical Design And VerificationPCB And MCMFab Management SoftwareOthersEnd-userProcess DocumentationProcess IntegrationOthersGeographyAPACNorth AmericaEuropeMiddle East And AfricaSouth America

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Xinhua Silk Road: SE. China’s Nanping City empowers green dev’t through integrated measures focusing on Wuyishan National Park

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BEIJING, Nov. 18, 2024 /PRNewswire/ — In recent years, the city of Nanping in southeast China’s Fujian Province has taken integrated measures to promote comprehensive development of Wuyishan National Park, embarking on a characteristic path of green and high-quality development.

Located in Fujian and Jiangxi provinces, Wuyishan National Park was officially designated among the first batch of national parks in China in 2021.

To better preserve the park, Nanping City has demarcated a conservation and development belt peripheral to the park area (hereinafter referred to as “the Belt”), striving to build the Belt into a modern demonstration area for harmonious coexistence between human and nature, and to further promote the city’s green development.

In 2023, the city has compiled an overall plan for the development of the Belt, as well as three special studies focusing on the Belt’s ecological protection, green development, and improvement of people’s livelihood.

Since 2023, Nanping has planned the first batch of 16 projects in 6 categories with a total investment of 4.89 billion yuan (about 674.82 million U.S. dollars), better leveraging its natural and cultural resources including scenic spots, characteristic villages and towns, historical culture, rural landscapes and so on.

This year, Nanping City further issued an implementation plan on integrated reform of institutional innovation for the Belt, clarifying the main tasks and sorting out a list of 48 key items and their responsible parties, so as to ensure the implementation of the reform.

Promoting innovations on the transformation of ecological value and the cultivation of green industries, the city has made solid efforts toward green and high-quality development of the entire region.

Based on its ecological landscape and profound cultural heritage, Nanping has made full use of the ecological and brand advantages of the national park to build an industrial circle of cultural and tourism integration along the Belt.

The city has also been upgrading its tourism business forms and releasing new products for cultural tourism. For instance, the Wuyishan National Park No.1 Scenic Byway was launched in May, and the Chong Yang Creek Trail started trial operation in September, both promoting tourism development while contributing to ecological protection.

Original link: https://en.imsilkroad.com/p/343175.html

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SOURCE Xinhua Silk Road

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The 2024 HLF Summit Kicks Off in Taiwan to Address Innovation for a Resilient Society

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HSINCHU, Nov. 18, 2024 /PRNewswire/ — Amid escalating global challenges such as geopolitical tensions, supply chain disruptions, and aging populations, the world is endeavoring to build more resilient societies. For the first time, Taiwan hosted representatives from the world’s top innovation ecosystems of over 20 countries at the 2024 High Level Forum (HLF) Summit, held in Hsinchu, Taiwan’s Silicon Valley. Hosted by the Industrial Technology Research Institute (ITRI), this milestone event brings together industry leaders, academic scholars, and research experts from the U.S., Canada, France, Finland, Sweden, Israel, Japan, Thailand, and Taiwan to address urgent global issues through innovation.

“This year’s summit, themed with Innovation Ecosystems for Resilient Society, aims to strengthen societal resilience against emerging global challenges, from geopolitical shifts to demographic changes,” said Stephen Su, Senior Vice President of ITRI and Co-chair of the 2024 HLF Summit. “Taiwan’s strong foundation in the semiconductor industry and expanding innovation portfolio has positioned us as a critical driver of global resilient growth. Through long-standing international collaborations, ITRI is committed to strengthening Taiwan’s role in global supply chains and energizing industry with continuous innovation,” he stressed.

Julie Galland, director of CEA Research & Technology Division, and Chair of the HLF Summit, highlighted the forum’s unique role as a catalyst for innovation, underscoring its importance as a platform for in-depth discussions on technology, industry, and policy. “This year’s theme emphasizes the need for global cooperation in building resilient societies capable of navigating future challenges. Taiwan’s world-class semiconductor industry and rapidly advancing innovation ecosystem provide valuable insights for the international community.” Julie Galland further noted that HLF is working to expand its global influence by connecting more resources and members worldwide to foster greater international collaboration and resilience.

ITRI President Edwin Liu expressed pride in hosting this year’s HLF in Hsinchu, welcoming innovation leaders from 20 countries to Taiwan. “This event marks the first time the HLF has taken place in Taiwan, establishing it as a hub to strengthen the network of innovation communities,” he said. “ITRI hopes that this milestone will expand Taiwan’s global visibility and impact while accelerating opportunities for technology partnerships, talent exchange, and regional cooperation.”

The 2024 HLF Summit placed a spotlight on Taiwan’s strengths in semiconductors and artificial intelligence (AI), sparking lively discussions on resilience. Keynote speakers included Patrick Bressler, Director of International Cooperation, Fraunhofer Mikroelektronik; Nicky Lu, Chairman of Etron Technology; John Lee, Managing Director of Merck Group in Taiwan; and Peter Wu, General Manager of ASUS Cloud & TWSC. Other international participants included Amit Kapoor, Honorary Chairman at Institute for Competitiveness, India; and Harvin Moore, Principal of Frontera Technology Ventures. Experts from around the world gathered to share insights and experiences to drive global innovation growth.

About the High Level Forum (HLF)
The High Level Forum (HLF) is an international network of innovation ecosystems founded in 2012 by the French Alternative Energies and Atomic Energy Commission (CEA) in Grenoble, known as the “Silicon Valley of France.” The HLF has grown to include 69 key innovation ecosystems and science parks worldwide, connecting industry, government, academia, and research communities. For the past 12 years, it has served as a key exchange hub, hosting annual summits each November. Professor Gou-Chung Chi, from Taiwan, participated as early as 2012, and ITRI became a formal member in 2017.

About ITRI
Industrial Technology Research Institute (ITRI) is one of the world’s leading technology R&D institutions aiming to innovate a better future for society. Founded in 1973, ITRI has played a vital role in transforming Taiwan’s industries from labor-intensive into innovation-driven. To address market needs and global trends, it has launched its 2035 Technology Strategy and Roadmap that focuses on innovation development in Smart Living, Quality Health, Sustainable Environment, and Resilient Society.

Over the years, ITRI has been dedicated to incubating startups and spinoffs, including well-known names such as UMC and TSMC. In addition to its headquarters in Taiwan, ITRI has branch offices in the U.S., Germany, Japan, and Thailand in an effort to extend its R&D scope and promote international cooperation across the globe. For more information, please visit https://www.itri.org/eng.

Media Contact:
Annie Wu
Office of Marketing Communications, ITRI
+886-3-591-8406
aiyunwu@itri.org.tw

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SOURCE Industrial Technology Research Institute

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ETOE Unveils Innovative Projectors with Built-in Google TV for AV Enthusiasts – Developed by Anker’s Former Head of Projectors

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BERLIN, Nov. 19, 2024 /PRNewswire/ — ETOE (Easy to Enjoy) is the first LCD projector brand with Google TV authorization, founded and developed by Jeric Li, who has 15-year experience in R&D of projection. As the first manager of laser projectors and the previous lead of Anker’s projection category, Jeric has successfully led to several groundbreaking products, including the world’s first coke-can-shaped projector, the first Android TV projector, and the first fully sealed LCD projector, all of which have received unanimous praise from users.

Sourced from renowned manufacturers including Acer, Koda, and SoftBank, ETOE ensures quality and reliability in every device. Since its establishment in September 2021, ETOE has concentrated on sales in the US and Japan, where it has achieved notable recognition as a Top-three Projector Brand in Japan and a Bestseller on Rakuten.

In November 2024, ETOE will enter the EU market with two newly-released standout products: the Seal Pro and E3 Pro, aimed at providing state-of-the-art AV solutions to customers worldwide.

Seal Pro: A Google TV projector with Netflix certification, allowing easy streaming of favorite channels. It features smart voice control for added convenience, 1000 ANSI lumens of brightness and native 1080P for stunning visuals, a built-in Chromecast with TOF autofocus and keystone correction for hassle-free casting and ultimate flexibility.E3 Pro: With autofocus and keystone correction for an enhanced movie experience, the 150″ 3000:1 all-in-one fully-sealed projector boasts 600 ANSI lumens of brightness and 1080P resolution for crystal-clear visuals, a built-in Android TV with Netflix certification for easy channel access, and HDR10+ and HLG support for perfectly balanced highlights and shadows.

Pricing and Availability

The new projectors will be available from November 19th on Geekbuying.com, Geekbuying.pl, Geekmaxi.com, Geekmall.com and Amazon.com with great discounts. All ETOE’s projectors are licensed for Google TV. Stay tuned for more new releases:

Starfish: A fully sealed Android TV 11.0 projector with a touch-sensor nightlight, projecting vertically onto the ceiling with a 140° rotation.Dolphin: A coke-can-sized Google TV projector with Netflix certification and 3-hour battery life. It will be released in December 2024.

About ETOE

ETOE is dedicated to enhancing audiovisual enjoyment for movie chasers, gaming enthusiasts, and tournament fans. Whether for home parties, karaoke, or outdoor movies, ETOE aims to meet customers’ diverse projection needs.

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