Connect with us

Technology

LITEON Debuts Integrated AI Cloud Server Rack Solutions Powered by NVIDIA at 2024 OCP Summit

Published

on

Pioneering Green Data Centers with Five Key Technologies: Power Supplies, Liquid Cooling, Racks, Software, and Systems

AI. Revolutionized. Green Resilience.

SAN JOSE, Calif., Oct. 17, 2024 /PRNewswire/ — LITEON Technology (2301.tw) is participating in the 2024 OCP Global Summit ( Open Compute Project ) in San Jose, USA, from October 15 to 17. Under the theme “AI. Revolutionized. Green Resilience,” LITEON will debut its new “Integrated AI cloud server rack solution.” This solution combines LITEON’s five key technologies: high-performance power supplies compliant with ORV3 standards, comprehensive liquid cooling systems, integrated mechanical design, intelligent power management software, and hardware-software system integration. Additionally, LITEON will showcase power supplies, racks, and liquid cooling systems compatible with NVIDIA architectures at the event. These include support for the NVIDIA GB200 NVL72 platform with a high-efficiency power system and NVIDIA MGX™ with modular system design racks, as well as liquid-to-liquid and liquid-to-air cooling solutions from LITEON. These innovations aim to enhance high-performance computing capabilities, efficient energy management, and cooling performance in data centers during the AI era, helping customers achieve low-carbon green data center energy management goals and creating comprehensive high-end AI computing system solutions.

Anson Chiu, the president of LITEON, states: “The AI-driven era has already transformed lifestyles and industries. Leveraging our deep technical expertise in high-end cloud server power supplies, LITEON integrates five key core capabilities: power, cooling, racks, software, and systems. This showcases LITEON’s comprehensive autonomous design and development technology. We continue to create sustainable and high-performance integrated server rack solutions, helping our customers achieve sustainable operations in green data centers, and pioneering a revolutionary new landscape in the AI field.”

“LITEON COOLING,” LITEON’s comprehensive liquid cooling solution, brings revolutionary changes to the cooling systems of green data centers, meeting the high-performance AI computing needs of data centers. At this event, LITEON showcases five liquid cooling series products. These include a fanless design 5600W Cold Plate Power Supply Unit with titanium-level efficiency, a liquid-to-liquid multi-intelligent in-row CDU 600kW,, liquid-to-liquid 120kW in-rack CDU compatible with the NVIDIA GB200 NVL72 platform, and liquid-to-air 140kW sidecar with the highest heat exchange efficiency, also compatible with the NVIDIA GB200 NVL72 architecture. These solutions offer flexible combinations for customers to meet various field and application needs, overcoming the limitations of traditional air cooling, significantly improving cooling efficiency, and enabling data centers to maintain high-performance workloads while reducing energy and carbon footprint consumption, creating more environmentally friendly green resilient data centers.

At this OCP exhibition, LITEON also showcases integrated cabinet power systems and solutions. These provide 97.5% high-density power conversion efficiency to meet the high-performance computing applications of AI servers. Additionally, LITEON’s self-developed intelligent power management system (PMC) offers customers digital management and remote real-time monitoring to assist decision-making, along with a robust power backup system featuring high-efficiency lithium battery backup power (BBU). Supported by intelligent power management software, it visualizes energy consumption patterns to ensure data center reliability.

LITEON integrates the advantages of five core energy management technologies, combining mechanical design, power system solutions, thermal management technology, and hardware-software integration capabilities. Paired with revolutionary server liquid cooling solutions, the integrated server rack design provides customers with rapid deployment in data center applications, committing to the advanced development of green resilient data centers.

For more information about LITEON’s power and liquid cooling solutions of green data center, please visit : https://www.liteon.com/en/solutions/green-data-center

LITEON’s Booth of OCP 2024 Information :

Date: October 15 – 17, 2024Location: San Jose McEnery Convention CenterBooth No.: C17-18Contact: Simon.Ong@liteon.com

View original content to download multimedia:https://www.prnewswire.com/news-releases/liteon-debuts-integrated-ai-cloud-server-rack-solutions-powered-by-nvidia-at-2024-ocp-summit-302279996.html

SOURCE LITEON Technology

Continue Reading
Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *

Technology

RADCOM to Report Fourth Quarter and Full Year 2024 Results on February 12, 2025

Published

on

By

Management to hold a conference call on the same day at 8:00 AM ET

TEL AVIV, Israel, Jan. 15, 2025 /PRNewswire/ — RADCOM Ltd. (Nasdaq: RDCM) announced today that it will report its financial results for the fourth quarter and full year 2024, which ended December 31, 2024, on Wednesday, 12, February 2025, before the opening of trade on the Nasdaq Stock Market.

RADCOM’s management will hold an interactive conference call on the same day at 8:00 AM Eastern Time (3:00 PM Israel Standard Time) to discuss the results and answer participants’ questions.

A live webcast of the presentation will be available at https://Veidan.activetrail.biz/radcomq4-2024. The webcast will be archived for 90 days following the live presentation.

To join the interactive call, please call one of the following numbers approximately five minutes before the call is scheduled to begin:

From the US (toll-free): +1-866-652-8972
From other locations: +972-3-9180644

A conference call replay will be available the same day on the Company’s investor relations website, www.radcom.com/investor-relations.

For all investor inquiries, please contact:

Investor Relations:
Miri Segal
MS-IR LLC
msegal@ms-ir.com

Company Contact:
Hadar Rahav
CFO
+972-77-7745062
hadar.rahav@radcom.com 

About RADCOM

RADCOM (Nasdaq: RDCM) is the leading expert in 5G ready cloud-native, network intelligence solutions for telecom operators transitioning to 5G. RADCOM Network Intelligence consists of RADCOM Network Visibility, RADCOM Service Assurance, and RADCOM Network Insights. The RADCOM Network Intelligence suite offers intelligent, container-based, on-demand solutions to deliver network analysis from the RAN to the core for 5G assurance. Utilizing automated and dynamic solutions with smart minimal data collection and on-demand troubleshooting and cutting-edge techniques based on machine learning, these solutions work in harmony to provide operators with an understanding of the entire customer experience and allow them to troubleshoot network performance from a high to granular level while reducing storage costs and cloud resource utilization. For more information on how to RADCOMize your network today, please visit www.radcom.com, the content of which does not form a part of this press release.

View original content:https://www.prnewswire.com/news-releases/radcom-to-report-fourth-quarter-and-full-year-2024-results-on-february-12-2025-302351552.html

SOURCE Radcom

Continue Reading

Technology

NJFX Welcomes Multinational Bank to Ecosystem Advancing Cloud and AI Connectivity

Published

on

By

WALL TOWNSHIP, N.J., Jan. 15, 2025 /PRNewswire/ — NJFX, the Tier 3 carrier-neutral cable landing station and colocation campus is thrilled to welcome another major multinational bank into its robust ecosystem. This new partnership underscores NJFX’s pivotal role in facilitating secure, efficient, and resilient network strategies for financial organizations.

The latest addition to the NJFX ecosystem represents a leading European financial institution with over 160 years of heritage and a presence spanning 65 countries. The bank’s expertise in Private Banking, Insurance, Global Banking and Investor Solutions, and International Retail, Mobility, and Leasing Services positions it as a critical player in the global economy. Leveraging NJFX’s unique infrastructure, the bank aims to enhance its private and public cloud connectivity and explore advanced AI applications, setting a benchmark for innovation and resilience.

NJFX’s Wall, New Jersey campus is the hub where leading global cloud operators interconnect with transatlantic subsea cables linking Europe, South America, and the Caribbean. By joining NJFX’s, the bank secures unprecedented access to diverse, carrier-neutral pathways, ensuring a “never down” approach to its global operations. NJFX’s ecosystem offers an unique connectivity model guaranteeing transparency and true diversity, aligning with the stringent requirements of the financial market.

“Our ecosystem has always been a cornerstone for industries requiring unparalleled network reliability and global reach,” said Gil Santaliz, Founder and CEO of NJFX. “Welcoming this esteemed financial institution further validates our vision to provide transformative infrastructure that supports not just today’s needs but also tomorrow’s advancements in AI and cloud technologies.”

The collaboration exemplifies NJFX’s commitment to serving the financial sector with cutting-edge connectivity solutions. As NJFX continues to expand its global footprint, this partnership highlights its role in bridging continents and fostering innovation.

About NJFX
NJFX owns and operates a Tier 3 Connectivity Hub offering data center, colocation, and CLS services in Wall, New Jersey. Hosting over 35 global and US operators providing direct transatlantic connectivity to Europe, South America, and the Caribbean. NJFX offers high and low-density colocation solutions with 24/7 support. NJFX provides a carrier-neutral marketplace to operators, content providers, enterprise, financial, and government entities who need network reliability, security, and scalability. The NJFX facility enables diverse connectivity options and ensures cost efficiency by offering direct interconnection without recurring cross-connect fees.

For media inquiries, please contact:
Emily Newman – Director of Marketing
emily@njfx.net

View original content to download multimedia:https://www.prnewswire.com/news-releases/njfx-welcomes-multinational-bank-to-ecosystem-advancing-cloud-and-ai-connectivity-302351133.html

SOURCE NJFX

Continue Reading

Technology

GSV Announces the 2025 GSV Cup 50

Published

on

By

CHICAGO and NEW YORK and SAN FRANCISCO, Jan. 15, 2025 /PRNewswire/ — The GSV Cup, presented by Amazon Web Services (AWS) and GSV Ventures, is proud to unveil the 50 most innovative digital learning and workforce skills startups that are poised to revolutionize “PreK to Gray” learning in 2025 and beyond. 

The world’s most innovative digital learning and workforce skills startups.

With the most nominations in GSV Cup history, 1,900+ nominations were evaluated using GSV’s “Five P’s” framework—People, Product, Potential, Predictability, and Purpose—to select the top 50 pre-seed and seed-stage startups advancing innovation across early childhood, K-12, higher education, workforce learning, and adult consumer learning. 

“Startups are the lifeblood of the ASU+GSV community,” said Deborah Quazzo, Managing Partner of GSV Ventures and Co-founder of the ASU+GSV Summit. “The GSV Cup 50 are the brightest stars of tomorrow, enabling Learning at the Speed of Light for educators, workforce leaders, and learners everywhere. We’re proud to recognize these early-stage innovators as they revolutionize learning in the age of AI.” 

The 2025 GSV Cup 50 are Amigo, Atypical AI, Avoca, Axio AI, Bloom App, Boddle, BrightBee, Brisk Teaching, Careerflow.ai, Cerebry, Class Companion, Coconote, Doowii, Ed Machina, Eddi, Ednition, Emversity, Fizz, Flint, Gizmo, Glasp, GrowthSchool, Heeyo, Hoogly, Kollegio, Lightscreen Ai, Ludenso, Lyssn, Masters’ Union, Mentava, Mesa School, mytalents.ai, OutSmart College, Paloma, Praxis AI, Puzzicle, Quizard AI, SchoolAI, Schoolytics, SigIQ, Sizzle AI, Skillfully, Snorkl, Solvely.ai, Stimuler, TAP, Toko, Unriddle, Upsmith, and Woolf.

Of the 50, 78% are US-based, with additional representation from India, Singapore, Norway, Austria, and Australia. The GSV Cup 50 will showcase their innovations at the 16th Annual ASU+GSV Summit, April 6-9, in San Diego, CA.

Learn more here

ABOUT ASU+GSV
Founded in 2011, GSV is a global platform driving education and workforce skills innovation. We believe ALL people deserve equal access to the future and that scaled innovations in “PreK to Gray” learning and skills are crucial to achieving this goal. The GSV platform includes the ASU+GSV Summit, hosted annually in San Diego with 7,000+ attendees; the third annual India-based ASU+GSV & Emeritus Summit; and The AI Show @ ASU+GSV, an immersive exploration of the AI Revolution in education, which welcomed 10,000+ attendees in 2024. GSV Ventures, founded in 2015, is a multi-stage venture fund investing in the most transformational companies across the global “PreK to Gray” landscape.

View original content:https://www.prnewswire.com/news-releases/gsv-announces-the-2025-gsv-cup-50-302351418.html

SOURCE ASU+GSV Summit

Continue Reading

Trending