Connect with us

Technology

Enclustra’s Coin-Sized FPGA Solution – Pluto XZU20 Wins Best in Show Award at Embedded World North America

Published

on

AUSTIN, Texas, Oct. 11, 2024 /PRNewswire/ — Enclustra’s Tiny Titan Pluto XZU20 System-on-Module (SoM) has been awarded Best in Show at Embedded World North America by Embedded Computing Design (ECD), a division of OpenSystems Media. The Pluto XZU20 won in the Development Tools & Operating Systems category, recognized for its innovative design and impact on the embedded systems industry.

Measuring just 30 x 30mm, the coin-sized Pluto XZU20 is powered by the AMD Zynq™ UltraScale+™ MPSoC, offering impressive performance in a compact form factor. This SoM accelerates low-power applications in industries like industrial automation, healthcare, medical, vision, and security. Its processing power and portability make it perfect for tasks such as real-time video processing in medical smart devices, AI applications, drones, and environmental monitoring.

“For a first-time event, we were astounded by the number of entries we received,” said Rich Nass, EVP, Open Systems Media. “And just as astonishing was the quality of the products entered. There were no “me-too” entries. It’s an honor to award these companies and their design teams for their exemplary work and technical innovation.”

Phillip Bächtold, CEO of Enclustra, expressed his enthusiasm: “This award validates our commitment to providing our customers with the best possible FPGA solutions and our continuous efforts in research and development.”

The Pluto XZU20’s innovative design was judged based on ECD’s rigorous 15-point rubric, which assesses design excellence, relative performance, and market impact/disruption. 
To help manufacturers explore its unique features, Enclustra offers an Early Access Program for the Pluto XZU20. 

About OpenSystems Media
For more than 40 years, OpenSystems Media (OSM) has focused solely on the embedded computing engineering community across the AI, automotive, IoT, industrial, consumer, aerospace, defense, and transportation markets. OSM’s mission is to promote the development and use of open standards and new technologies in the embedded computing industry globally. Learn more at embeddedcomputing.com.

About Enclustra GmbH
Based in Zurich, with subsidies in Germany, the US, and China, Enclustra is a one-stop shop for everything FPGA – offering design and development services covering the entire spectrum of FPGA-based system development: high-speed hardware or HDL firmware to embedded software, system design, specification and implementation, and prototyping. And soon, Enclustra will be manufacturing “Made in the USA” FPGA products. To learn more, visit www.enclustra.com                                                                                      

CONTACT:                 
Ryan Bowling
+1 650 245 7945
ryan@thrillcommunications.com

View original content to download multimedia:https://www.prnewswire.com/news-releases/enclustras-coin-sized-fpga-solution–pluto-xzu20-wins–best-in-show-award-at-embedded-world-north-america-302274328.html

SOURCE Enclustra GmbH

Continue Reading
Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *

Technology

Shanghai Electric Showcases Green Energy Innovations at Enlit Asia 2024, Bringing Products Designed to Empower Malaysia for Green Transition

Published

on

By

KUALA LUMPUR, Malaysia, Oct. 11, 2024 /PRNewswire/ — Shanghai Electric (SEHK:2727, SSE:601727) unveiled its latest energy innovations at Enlit Asia 2024, the leading conference and expo for the power and energy sector in Southeast Asia, taking place in Kuala Lumpur, Malaysia, from October 8th to 10th. Shanghai Electric showcased its comprehensive portfolio of energy innovations, with its exhibition booth featuring all-encompassing green energy technologies that highlight its latest achievements in clean coal power, solar energy, hydrogen power, and multi-energy technology, offering global attendees a glimpse into Shanghai Electric’s state-of-the-art products designed to facilitate the global transition toward greener energy.

In response to Asia’s rapid solar power growth, Shanghai Electric’s Power Generation Group showcased its latest Hency Solar products to meet the region’s rising demand. Among these were the Creator 210R series heterojunction modules and the Pioneer 210R series TOPCon modules, that deliver a bifacial rate of up to 90% and a maximum output of 640W. The company also introduced its “Intellectual” and “Edgeless” series solar solutions that debuted at the 17th SNEC PV Power Expo, which prioritize safety, real-time optimization, and rapid maintenance for enhanced operational efficiency.

In the hydrogen energy sector, Shanghai Electric has brought its innovations across the entire hydrogen value chain, from production to storage, refueling, and utilization. At the booth, the company put on display its industry-leading alkaline water electrolysis and PEM water electrolysis technologies, with its newly launched next-generation Z series alkaline electrolyzers taking center stage that set a new industry standard with the maximum current density of 10,000A/m² and remarkably low DC energy consumption that hits 4.1kWh/Nm³ at 4000A/m.

On the energy storage front, Shanghai Electric presented a broad spectrum of advanced technologies, including compressed air storage, lithium battery storage, flow battery storage, flywheel energy storage, and molten salt thermal storage, which are equipped with features to empower utilities to provide reliable, affordable, and sustainable electricity while ensuring long-term grid security and resilience.

During the exhibition, the company showcased an extensive range of core equipment and pioneering products, such as compressed air energy storage systems, molten salt heat storage, and exchange systems, as well as tailored solutions for residential, commercial, and industrial energy storage, along with UPS backup power supplies, all of which captivated the attention of visitors who engaged in discussions with Shanghai Electric for future partnerships and collaboration opportunities.

View original content to download multimedia:https://www.prnewswire.com/news-releases/shanghai-electric-showcases-green-energy-innovations-at-enlit-asia-2024-bringing-products-designed-to-empower-malaysia-for-green-transition-302274416.html

SOURCE Shanghai Electric

Continue Reading

Technology

Cirrus Logic Establishes Engineering Merit Scholarships for Women at the University of Strathclyde

Published

on

By

Multi-year Program Created to Support Female Talent Pursuing Engineering Careers

GLASGOW, Scotland, Oct. 11, 2024 /PRNewswire-PRWeb/ — Cirrus Logic, a leading semiconductor company, announced the launch of a new scholarship program at the University of Strathclyde to increase the number of women completing engineering degrees. Two merit scholarships will provide financial support for up to four years for second-year female students in the Department of Electronic and Electrical Engineering, who are passionate about STEM and demonstrate academic excellence.

“We want to inspire and support the next generation of engineers, in this case women in engineering, a group currently underrepresented,” said Eddie Sinnott, Director of Marketing and Applications, Cirrus Logic. “Diversity helps to drive innovation and success in the semiconductor industry. These scholarships will provide two, high-achieving students with the resources they need to achieve their goals and help us cultivate future engineering talent.”

“Cirrus Logic supports STEM programs in our communities around the world to foster future engineering talent,” said Denise Grodé, Chief Human Resource Officer, Cirrus Logic. “Women currently account for a smaller fraction of the global engineering workforce. We want to encourage and support more women pursuing engineering as a career path.”

The Cirrus Logic Merit Scholarships will provide opportunities for female students entering their second year of studying for a bachelor’s or master’s degree in engineering. Recipients will also be considered for internship opportunities with Cirrus Logic for real-world engineering experience and mentorship by Cirrus Logic engineers.

“As a University, we are committed to encouraging more females to consider STEM-related careers, and in particular, to help address the gender imbalance within engineering disciplines,” said Professor Anthony Gachagan, Head of Department for Electronic and Electrical Engineering at the University of Strathclyde. “We’re delighted to grow our relationship with Cirrus Logic to offer a life-changing opportunity for two of our female engineering students.”

The application process will start in mid-October, with recipients announced in November. Eligible students will be contacted when the scholarship applications open.

About Cirrus Logic

Cirrus Logic is a leader in low-power, high-precision mixed-signal processing solutions that create innovative user experiences for the world’s top mobile and consumer applications. With headquarters in Austin, Texas, Cirrus Logic is recognized globally for its award-winning corporate culture. Check us out at http://www.cirrus.com.

Cirrus Logic, Cirrus and the Cirrus Logic logo are registered trademarks of Cirrus Logic, Inc. All other company or product names noted herein may be trademarks of their respective holders.

University of Strathclyde

The University of Strathclyde is a leading international technological university based in the centre of Glasgow.

Inspired by our founding principle as ‘a place of useful learning,’ our mission is to make a positive difference to the lives of our students, to society and to the world.

Strathclyde students benefit from an innovative and practical educational experience enhanced by its integration with our research capabilities, high-quality academic resources and an unparalleled industry engagement programme.

The excellence of our research is evidenced by the growth in range and scale of our research collaborations and by our performance in the Research Excellence Framework 2021 where almost 90% was rated ‘world-leading’ or ‘internationally-excellent.’

We have redefined how we collaborate and work with industry, government and the third sector to ensure innovation and knowledge exchange are fundamental activities that deliver tangible impact.

Strathclyde was named Scottish University of the Year 2024 in the inaugural Daily Mail University Guide, Sunday Times Good University Guide Scottish University of the Year 2020, Times Higher Education UK University of the Year 2019, and was awarded a Queen’s Anniversary Prize for Higher and Further Education for its excellence in energy innovation in 2020, for excellence in advanced manufacturing in 2022 and for excellence in photonics research in 2023.

Media Contact

Derrick Shannon, Touchdown PR, 5125994015, cirruslogic@touchdownpr.com

View original content:https://www.prweb.com/releases/cirrus-logic-establishes-engineering-merit-scholarships-for-women-at-the-university-of-strathclyde-302274316.html

SOURCE Cirrus Logic

Continue Reading

Technology

International Paper Announces Overwhelming Shareholder Approval in Connection with the Proposed Acquisition of DS Smith

Published

on

By

MEMPHIS, Tenn., Oct. 11, 2024 /PRNewswire/ — International Paper (NYSE: IP) is pleased to announce today that it received the necessary shareholder approval for its pending acquisition of DS Smith (LSE: DSS), (the “Combination”). Earlier this week, DS Smith also received the necessary shareholder approval for the Combination.

International Paper will report the final vote results of the special shareholder meeting in a Current Report on Form 8-K filed with the U.S. Securities and Exchange Commission (the “SEC”). International Paper and DS Smith continue to expect the Combination to close late in the fourth quarter of 2024, subject to regulatory clearance and other customary closing conditions.

“The overwhelming approval from both DS Smith and IP shareholders confirms the strong support of this combination,” said Andy Silvernail, Chairman and CEO of International Paper. “Bringing the two companies together will create a true global leader of sustainable packaging solutions which will drive significant value for our employees, customers and shareholders.”

About International Paper
International Paper (NYSE: IP) is a global provider of renewable fiber-based packaging and pulp products, and one of the world’s largest recyclers. Headquartered in Memphis, Tenn., we employ approximately 39,000 colleagues globally who are committed to creating what’s next. We serve customers worldwide, with manufacturing operations in North America, Europe, Latin America and North Africa. Net sales for 2023 were $18.9 billion. Additional information can be found by visiting International Paper.

Cautionary Statement Regarding Forward-Looking Statements
Certain statements in this press release that are not historical in nature may be considered “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act of 1995, as amended. Forward-looking statements can be identified by the use of forward-looking or conditional words such as “expects,” “anticipates,” “believes,” “estimates,” “could,” “should,” “can,” “forecast,” “intend,” “look,” “may,” “will,” “remain,” “confident,” “commit” and “plan” or similar expressions. These statements are not guarantees of future performance and reflect management’s current views and speak only as to the dates the statements are made and are subject to risks and uncertainties that could cause actual results to differ materially from those expressed or implied in these statements. All statements, other than statements of historical fact, are forward-looking statements, including, but not limited to, statements regarding the anticipated financial results, economic conditions, industry trends, future prospects and the execution and consummation of corporate transactions or contemplated acquisitions including the acquisition of DS Smith Plc (the “Combination”). Factors which could cause actual results to differ include but are not limited to: (i) our ability to consummate and achieve the benefits expected from, and other risks associated with, acquisitions, joint ventures, divestitures, spinoffs, capital investments and other corporate transactions, including, but not limited to, the Combination and our ability to integrate and implement our plans, forecasts, and other expectations with respect to the combined company; (ii) uncertainty as to whether or when the Combination may be completed, if at all; (iii) risks with respect to climate change and global, regional, and local weather conditions, as well as risks related to our targets and goals with respect to climate change and the emission of greenhouse gases (“GHG”) and other environmental, social and governance matters, including our ability to meet such targets and goals; (iv) loss contingencies and pending, threatened or future litigation, including with respect to environmental related matters; (v) the level of our indebtedness, risks associated with our variable rate debt, and changes in interest rates (including the impact of interest rate levels); (vi) the impact of global and domestic economic conditions and industry conditions, including with respect to current negative macroeconomic conditions, inflationary pressures and changes in the cost or availability of raw materials, energy sources and transportation sources, supply chain shortages and disruptions, competition we face, cyclicality and changes in consumer preferences, demand and pricing for our products, and conditions impacting the credit, capital and financial markets; (vii) risks arising from conducting business internationally, domestic and global geopolitical conditions, military conflict (including the Russia/Ukraine conflict, the conflict in the Middle East, the possible expansion of such conflicts, and the potential geopolitical and economic consequences associated therewith), changes in currency exchange rates, trade protectionist policies, downgrades in our credit ratings, and/or the credit ratings of banks issuing certain letters of credit, issued by recognized credit rating organizations; (viii) the amount of our future pension funding obligations, and pension and healthcare costs; (ix) the costs of compliance, or the failure to comply with, existing and new environmental (including with respect to climate change and GHG emissions), tax, labor and employment, privacy, anti-bribery and anti-corruption, and other U.S. and non-U.S. governmental laws and regulations; (x) any material disruption at any of our manufacturing facilities or other adverse impact on our operations due to severe weather, natural disasters, climate change or other causes; (xi) our ability to realize expected benefits and cost savings associated with restructuring initiatives; (xii) cybersecurity and information technology risks, including as a result of security breaches and cybersecurity incidents; (xiii) our exposure to claims under our agreements with Sylvamo Corporation; (xiv) our failure to realize the anticipated benefits of the spin-off of Sylvamo Corporation and the qualification of such spin-off as a tax-free transaction for U.S. federal income tax purposes; and (xv) our ability to attract and retain qualified personnel. These and other factors that could cause or contribute to actual results differing materially from such forward-looking statements can be found in our press releases and other reports filed with the SEC. In addition, other risks and uncertainties not presently known to IP or that we currently believe to be immaterial could affect the accuracy of any forward-looking statements. IP undertakes no obligation to publicly update any forward-looking statements, whether as a result of new information, future events or otherwise.

IP’s Definitive Proxy Statement filed with the SEC on September 12, 2024, as supplemented on October 1, 2024 (the “Proxy Statement”) relating to the issuance by International Paper of new shares of common stock, par value $1.00 per share to the shareholders of DS Smith in connection with the Combination (the “Share Issuance”)”, its Annual Report on Form 10-K for the fiscal year ended December 31, 2023, and its Quarterly Reports on Form 10-Q for the periods ended March 31, 2024, and June 30, 2024, contain additional information regarding forward-looking statements and other risk factors with respect to IP.

Additional Information
This press release may be deemed to be solicitation material in respect of the Combination, including the Share Issuance. To the extent IP effects the Combination as a scheme of arrangement under the laws of the United Kingdom, the Share Issuance does not require registration under the U.S. Securities Act of 1933, as amended, and the rules and regulations promulgated thereunder (the “Securities Act”), pursuant to an exemption provided by Section 3(a)(10) under the Securities Act. In the event that IP determines to conduct the Combination pursuant to an offer or otherwise in a manner that is not exempt from the registration requirements of the Securities Act, it will file a registration statement with the SEC containing a prospectus with respect to the Share Issuance. INVESTORS AND SHAREHOLDERS ARE URGED TO READ THE PROXY STATEMENT, THE SCHEME DOCUMENT, AND OTHER RELEVANT DOCUMENTS FILED WITH THE SEC CAREFULLY BECAUSE THEY CONTAIN IMPORTANT INFORMATION ABOUT IP, THE COMBINATION, THE SHARE ISSUANCE, AND RELATED MATTERS.

Investors and shareholders will be able to obtain free copies of the Proxy Statement and other documents filed by IP with the SEC at the SEC’s website at http://www.sec.gov. In addition, investors and shareholders will be able to obtain free copies of the Proxy Statement, the scheme document, and other documents filed by IP with the SEC at https://www.internationalpaper.com/investors.

View original content to download multimedia:https://www.prnewswire.com/news-releases/international-paper-announces-overwhelming-shareholder-approval-in-connection-with-the-proposed-acquisition-of-ds-smith-302274326.html

SOURCE International Paper

Continue Reading

Trending