The over $10-million investment will reduce carbon emissions at the Lafarge Canada Brookfield Cement Plant by 12,000 tonnes per year

TORONTO, Sept. 24, 2024 /CNW/ – Lafarge Canada and Geocycle Canada, members of Holcim Group, and the Department of Natural Resources Canada (NRCan), Office of Energy Research and Development (OERD), today announced the opening of Geocycle’s first low-carbon1 fuel plant in Canada – a more than $10-million facility located at the Lafarge Canada Brookfield Cement Plant (NS). The investment represents one of the most transformative initiatives in the 50-year history of the cement plant. The project received $3.53 million from the federal government’s Energy Innovation Program (EIP), created to advance clean energy technologies to support Canada’s transition to a low-carbon economy.

“Cement is a vital component of infrastructure projects that contribute to economic growth. By implementing sustainable and innovative solutions to reduce our environmental impact, we’re serving the needs of our customers and the communities in which we operate both now and in the future,” says David Redfern, president and CEO, Lafarge Canada (East). “Our continued collaboration with Geocycle Canada reinforces our commitment to invest and advance circular construction in Canada.”

When in full production, the new plant will divert approximately 14,000 tonnes of waste away from landfills annually to be pre-processed into low-carbon fuel, minimizing the Brookfield Cement Plant’s reliance on traditional fossil fuels. It is expected that this will reduce carbon emissions at the plant by more than 12,000 tonnes per year2; equivalent to taking 13,480 passenger vehicles off the road.3 

As Geocycle’s first-of-its-kind in the country, the low-carbon fuel plant will take waste products like nonrecyclable plastics, and soon, construction and demolition waste materials, from local sources, turning it into low carbon fuels to make cement, and ultimately the concrete used in construction projects in the area and beyond. The new facility is also expected to create jobs in the local Nova Scotia community.

“At Geocycle, our solutions are circular by design,” says Sophie Wu, Head of Geocycle North America. “We are happy to take another significant step in our ongoing partnership with Lafarge Canada. This is a great example of our work toward the decarbonization of the construction industry in Canada.”

“By taking waste from the local community and turning it into low-carbon energy, Lafarge Canada and Geocycle Canada are reducing Canada’s reliance on traditional fossil fuels, and paving the way for additional lower carbon energy projects in the construction industry,” says The Honourable Jonathan Wilkinson, Minister of Energy and Natural Resources.

The Plant commissioning started in June 2024 when the Lafarge and Geocycle teams initiated their work with local manufacturers and materials recovery facilities (MRFs) to collect their waste to be pre-processed at the new facility. Together, both organizations are working toward finding solutions to decarbonize the construction industry. In May, the companies announced the completion of a pilot project to produce high-quality clinker made of recycled materials recovered from waste sources. Clinker is the main ingredient in cement – the active ingredient in concrete.

About Lafarge Canada Inc.

Lafarge Canada is the largest provider of innovative and sustainable building solutions in Canada, including aggregates, cement, ready mix and precast concrete, asphalt and paving, road and civil construction. We have over 6,900 employees and 400 sites across the country, and as an affiliate of Holcim, Lafarge Canada is driven by the Group’s purpose to build progress for people and the planet. 

Holcim’s 63,448 employees are on a mission to decarbonize building while improving living standards for all. We empower our customers to build better with less, with a broad range of low-carbon and circular solutions, from ECOPact® to ECOPlanet®. Through innovative systems, from Elevate’s roofing to PRB’s insulation, Holcim makes buildings more sustainable in use, driving energy efficiency and green retrofitting. With sustainability at the core of our strategy, we are on the way to becoming a net-zero company with 1.5°C targets validated by SBTi.

www.lafarge.ca

About Geocycle

In a world of increasing population and rising urbanization, Geocycle provides sustainable solutions to municipalities and industries by transforming waste into resources: recycling, when possible, while valorizing non-recyclable materials. As a dedicated part of Holcim Group, we operate globally and offer large-scale and scientifically proven recovery and recycling solutions. We set industry leading standards, foster industrial symbiosis and provide peace of mind to our partners for achieving their own sustainability targets. We strive to achieve zero waste of resources, which leads to decarbonization, circular economy and building progress for people and the planet.

www.geocycle.com

About Holcim

Holcim is a global leader in innovative and sustainable building solutions with net sales of CHF 27.0 billion in 2023. Driven by our purpose to build progress for people and the planet, our 63,448 employees are on a mission to decarbonize building, while improving living standards for all. We empower our customers across all regions to build better with less, with a broad range of low-carbon and circular solutions, from ECOPact and ECOPlanet to our circular technology platform ECOCycle®. Through innovative systems, from Elevate roofing to PRB insulation, Holcim makes buildings more sustainable in use, driving energy efficiency and green retrofitting. With sustainability at the core of our strategy, we are on the way to becoming a net-zero company with 1.5°C targets validated by SBTi.

Learn more about Holcim on www.holcim.com, and by following us on LinkedIn.

SOURCE Lafarge Canada Inc.

More than 15 Product Families of Completely Upgraded Servers Optimized for Maximum Performance or Efficiency, Featuring Next-Generation GPU Support, Higher-Bandwidth Memory, 400GbE Networking, E1.S and E3.S Drives, and Direct-to-Chip Liquid Cooling Support, and are Based on the New Intel® Xeon® 6900 Series Processors with P-Cores and Intel Xeon 6700 Series Processors with E-cores

SAN JOSE, Calif., Sept. 24, 2024 /PRNewswire/ — Supermicro, Inc. (NASDAQ: SMCI) a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, today adds new maximum performance GPU, multi-node, and rackmount systems to the X14 portfolio, which are based on the Intel Xeon 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP). The new industry-leading selection of workload-optimized servers addresses the needs of modern data centers, enterprises, and service providers. Joining the efficiency-optimized X14 servers leveraging the Xeon 6700 Series Processors with E-cores launched in June 2024, today’s additions bring maximum compute density and power to the Supermicro X14 lineup to create the industry’s broadest range of optimized servers supporting a wide variety of workloads from demanding AI, HPC, media, and virtualization to energy-efficient edge, scale-out cloud-native, and microservices applications.

“Supermicro X14 systems have been completely re-engineered to support the latest technologies including next-generation CPUs, GPUs, highest bandwidth and lowest latency with MRDIMMs, PCIe 5.0, and EDSFF E1.S and E3.S storage,” said Charles Liang, president and CEO of Supermicro. “Not only can we now offer more than 15 families, but we can also use these designs to create customized solutions with complete rack integration services and our in-house developed liquid cooling solutions.”

Approved customers can obtain early access to complete, full-production systems via Supermicro’s Early Ship Program or for remote testing with Supermicro JumpStart.

These new Supermicro X14 systems feature completely re-designed architectures, including all-new 10U and multi-node form factors that support next-generation GPUs and higher CPU core densities, updated memory slot configurations with 12 memory channels per CPU and new MRDIMMs, which provide up to 37% better memory bandwidth compared to DDR5 DIMMs.

The new Supermicro X14 family comprises a number of new systems —several of which are completely new architectures—in three distinct, workload-specific categories:

GPU-optimized platforms designed for pure performance and enhanced thermal capacity to support the latest technology and highest-wattage GPUs. System architectures are built from the ground up for large-scale AI training, LLMs, generative AI, 3D media, and virtualization applications.High compute-density multi-nodes including all-new FlexTwin™,SuperBlade®, and GrandTwin®, which leverage resources such as shared power and cooling to increase efficiency, as well as direct-to-chip liquid cooling on specific models to maximize density without compromising on performance.Market-proven Supermicro Hyper rackmounts combine single or dual socket architectures with flexible I/O and storage configurations in traditional form factors to help enterprises and data centers scale up and out as their workloads evolve.

Supermicro’s new max-performance X14 systems support the new Intel Xeon 6900 series processors with P-cores, while X14 efficiency-optimized systems support the Intel Xeon 6700 series processors with E-cores, which launched in June 2024. These systems will also offer socket compatibility with the upcoming Intel Xeon 6900 series processors with E-cores and Intel Xeon 6700 series processors with P-cores in Q1’25 to provide an additional dimension of flexibility when optimizing systems for either performance-per-core or performance-per-watt.

“For the first time, Intel is offering two distinct, workload-optimized families of Xeon processors in the same generation, each designed to deliver specific performance and efficiency profiles that can shorten time-to-results, revolutionize compute, power and rack density, maximizing ROI for modern data centers,” said Ryan Tabrah, VP and GM of Xeon Products at Intel. “With the new additions, Supermicro will be able to provide their customers with even more choice with the introduction of these new performance optimized CPUs for AI and compute-intensive workloads.”

When configured with Intel Xeon 6900 series processors with P-cores, Supermicro systems support new FP16 instructions on the built-in Intel® AMX accelerator to further enhance AI workload performance. These systems include 12 memory channels per CPU with support for both DDR5-6400 and MRDIMMs up to 8800MT/s, CXL 2.0, and feature more extensive support for high-density, industry-standard EDSFF E1.S and E3.S NVMe drives.

Supermicro Liquid Cooling Solutions

Complementing this expanded X14 product portfolio are Supermicro’s rack-scale integration and liquid cooling capabilities. With an industry-leading global manufacturing capacity, extensive rack-scale integration and testing facilities, and a comprehensive suite of management software solutions, Supermicro designs, builds, tests, validates, and delivers complete data center solutions at any scale in a matter of weeks.

Supermicro offers a complete in-house developed liquid cooling solution including cold plates for CPUs, GPUs, memory, Cooling Distribution Units, Cooling Distribution Manifolds, hoses, connectors, and cooling towers. Liquid cooling is easily included in rack-level integrations to increase system efficiency, reduce instances of thermal throttling, and lowers both the TCO and Total Cost to the Environment (TCE) of data center deployments.

New Supermicro max-performance X14 systems featuring Intel Xeon 6900 series processors with P-cores include:

GPU-optimized – The highest performance Supermicro X14 systems designed for large-scale AI training, large language models (LLMs), generative AI and HPC, and supporting eight of the latest-generation SXM5 and SXM6 GPUs. These systems are available in air-cooled or liquid-cooled configurations.

PCIe GPU – Designed for maximum GPU flexibility, supporting up to 10 double-width PCIe 5.0 accelerator cards in a thermally-optimized 5U chassis. These servers are ideal for AI inferencing, media, collaborative design, simulation, cloud gaming, and virtualization workloads.

Intel® Gaudi® 3 AI Accelerators – Supermicro also plans to deliver the industry’s first AI server based on the Intel Gaudi 3 accelerator hosted by Intel Xeon 6 processors. The system is expected to increase efficiency and lower the cost of large-scale AI model training and AI inferencing. The system features eight Intel Gaudi 3 accelerators on an OAM universal baseboard, six integrated OSFP ports for cost-effective scale-out networking, and an open platform designed to use a community-based, open-source software stack, requiring no software licensing costs.

SuperBlade® – Supermicro’s X14 6U high-performance, density-optimized, and energy-efficient SuperBlade maximizes rack density, with up to 100 servers and 200 GPUs per rack. Optimized for AI, HPC, and other compute-intensive workloads, each node features air cooling or direct-to-chip liquid cooling to maximize efficiency and achieve the lowest PUE with the best TCO, as well as connectivity up to four integrated Ethernet switches with 100G uplinks and front I/O supporting a range of flexible networking options up to 400G InfiniBand or 400G Ethernet per node.

FlexTwin™ – The new Supermicro X14 FlexTwin architecture is purpose-built for HPC, cost-efficient, and designed to provide maximum compute power and density in a multi-node configuration with up to 24,576 performance cores in a 48U rack. Optimized for HPC and other compute-intensive workloads, each node features direct-to-chip liquid cooling only to maximize efficiency and reduce instances of CPU thermal throttling, as well as HPC low latency front and rear I/O supporting a range of flexible networking options up to 400G per node.

Hyper – X14 Hyper is Supermicro’s flagship rackmount platform designed to deliver the highest performance for demanding AI, HPC, and enterprise applications, with single or dual socket configurations supporting double-width PCIe GPUs for maximum workload acceleration. Both air cooling and direct-to-chip liquid cooling models are available to facilitate the support of top-bin CPUs without thermal limitations and reduce data center cooling costs while also increasing efficiency.

Also, now shipping are Supermicro’s X14 efficiency-optimized systems featuring Intel Xeon 6700 series processors with E-cores:

SuperBlade® – Supermicro’s high-performance, density-optimized, and energy-efficient multi-node platform optimized for AI, Data Analytics, HPC, Cloud, and Enterprise workloads. Available as a 6U enclosure with 10 or 5 nodes, or an 8U enclosure with 20 or 10 nodes, one rack can feature up to 34,560 Xeon compute cores.

Hyper – Flagship performance rackmount servers designed for scale-out cloud workloads, with storage & I/O flexibility that provides a custom fit for a wide range of application needs.

CloudDC – All-in-one platform for cloud data centers, based on the OCP Data Center Modular Hardware System (DC-MHS) with flexible I/O and storage configurations and dual AIOM slots (PCIe 5.0; OCP 3.0 compliant) for maximum data throughput.

Petascale Storage – Industry-leading all-flash storage density and performance with EDSFF E1.S and E3.S drives, allowing unprecedented capacity and performance in a 1U or 2U chassis.

WIO – Offers flexible I/O configurations in a cost-effective architecture to enable optimization of acceleration, storage, and networking alternatives to accelerate performance, increase efficiency and find the perfect fit for specific enterprise applications.

BigTwin® – 2U 2-Node or 2U 4-Node platform providing superior density, performance, and serviceability with dual processors per node and hot-swappable tool-less design. These systems are ideal for cloud, storage, and media workloads with new models, including E3.S drive support for superior density and throughput.

GrandTwin® – Purpose-built for single-processor performance and memory density, featuring front (cold aisle) hot-swappable nodes and front or rear I/O for easier serviceability. Now available with E1.S drives for better storage density and throughput.

Hyper-E – Delivers the power and flexibility of our flagship Hyper family optimized for deployment in edge environments. Edge-friendly features include a short-depth chassis and front I/O, making Hyper-E suitable for edge data centers and telco cabinets. These short-depth systems support up to 3 high-performance GPU or FPGA cards.

Edge/Telco – High-density processing power in compact form factors optimized for telco cabinet and Edge data center installation. Optional DC power configurations and enhanced operating temperatures up to 55° C (131° F).

About Super Micro Computer, Inc.

Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro’s motherboard, power, and chassis design expertise further enable our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Taiwan, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names, and trademarks are the property of their respective owners.

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LEIDEN, Netherlands, Sept. 24, 2024 /PRNewswire/ — ChannelEngine, a global leader in marketplace integration software, announced its platform is now available on SAP® Store, the marketplace for SAP and partner offerings. This new integration with SAP Order Management Foundation (OMF), a key module of SAP Order Management Services (OMS), enables efficient order and inventory management for marketplace selling while leveraging advanced AI capabilities to optimize multi-channel operations.

“The integration of order management systems with marketplace platforms is crucial to maintaining agility in a fragmented eCommerce environment. Aligning inventory management and marketplace connectivity expands global reach while streamlining operations and scaling efficiently,” explains Heather Hershey, research director, Worldwide Digital Commerce at IDC.

Access 950+ Global Marketplaces

ChannelEngine’s solution empowers businesses to manage their online presence across marketplaces and third-party sales channels. With connections to major players like Amazon, Walmart, Target+, eBay, and Shopee, this integration offers SAP OMS customers unmatched reach and efficiency. Current ChannelEngine users experience exponential year-over-year revenue growth, driven by marketplace access and advanced features.

**Simplified Operations at Scale and Enhanced Efficiency

The integration with SAP OMS allows customers to automatically synchronize inventory, receive orders, update shipments, and manage cancellations across 950 marketplaces, social commerce, and third-party channels. Centralizing order management reduces complexity, prevents overselling, and ensures a smooth consumer experience. ChannelEngine plans to further enhance this integration by supporting SAP Order Management Sourcing Availability (OMSA), providing real-time stock visibility to improve inventory accuracy and availability.

AI-Driven Business Optimization

ChannelEngine’s AI-powered tools simplify category and content mapping between SAP Cloud Platform taxonomy and marketplace taxonomies, reducing manual intervention and accelerating time-to-market. This AI-enabled automation enables businesses to expand into new marketplaces, creating a more agile and responsive eCommerce operation. ChannelEngine is also exploring integration with SAP Omnichannel Pricing Promotion Service (OPPS), allowing sellers to manage pricing and promotions across multiple channels.

Jorrit Steinz, CEO of ChannelEngine, commented: “Our integration with SAP OMS enables users to activate new sales channels and seamlessly reach global markets. By embedding AI-driven automation, we simplify global eCommerce, helping merchants capitalize on leading marketplaces while optimizing their operations at scale.”

Ritu Bhargava, President and Chief Product Officer, SAP Customer Experience & Industries, added: “With SAP Order Management Services integrated with ChannelEngine, customers can sell everywhere, supercharging their unified commerce strategy. This partnership seamlessly connects order channels to customers’ supply chain and finance processes, optimizing global commerce complexity and unlocking profitable growth.”

About ChannelEngine

ChannelEngine is a global marketplace and eCommerce technology company. Its platform provides brands, retailers, and distributors with the technical capabilities needed to overcome complex eCommerce management challenges. For more information, visit channelengine.com.

About SAP

SAP is a global leader in enterprise applications and business AI, trusted for over 50 years to unite business-critical operations. For more information, visit www.sap.com.

Media Contact:
Ronjini Joshua
(949) 295-9779
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SOURCE ChannelEngine