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Advanced Packaging Market to Reach $119.4 Billion, Globally, by 2032 at 10.6% CAGR: Allied Market Research

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The global advanced packaging market has experienced growth due to several factors such as an increase in demand for miniaturization and expansion of the consumer electronics sector. 

Wilmington, Del., Aug. 7, 2024 /PRNewswire/ — Allied Market Research published a report, titled, “Advanced Packaging Market by Type (Flip chip CSP, Flip-chip ball grid array, Wafer level CSP, 2.5D/3D, Fan-out WLP and Others), End user (Consumer electronics, Automotive, Industrial, Healthcare, Aerospace & defense and Others), By (): Global Opportunity Analysis and Industry Forecast, 2024-2032″. According to the report, the advanced packaging market was valued at $48.5 billion in 2023, and is estimated to reach $119.4 billion by 2032, growing at a CAGR of 10.6% from 2024 to 2032.

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(We are providing report as per your research requirement, including the Latest Industry Insight’s Evolution, Potential and COVID-19 Impact Analysis)

130 – Tables58 – Charts250 – Pages

Prime Determinants of Growth 

The notable factors positively affecting the advanced packaging market include increasing demand for miniaturization of devices and improved system performance and optimization of advanced packaging. However, problems regarding the high cost of advanced packaging technology hamper market growth. Moreover, emerging trends toward fan-out wafer level packaging are expected to offer huge opportunities for the advanced packaging market. 

Report Coverage & Details: 

Report Coverage 

Details 

Forecast Period 

2024–2032 

Base Year 

2023

Market Size in 2023 

$48.5 billion 

Market Size in 2032 

$119.4 billion 

CAGR 

10.6 %

No. of Pages in Report 

250

Segments Covered 

Type, End User, and Region. 

Drivers 

Increasing demand for miniaturizationGrowth in consumer electronics The expansion of IoT applications across various sectors, including industrial, healthcare, and smart homes 

Opportunities 

The growing adoption of electronic components in automotive applications Growth in Data Centers and Cloud Computing 

Restraint 

High costs associated with advanced packaging 

Segment Highlights

The demand for CSP flip chip ball grid array segment in advanced packaging market is driven by its superior performance characteristics, essential for high-performance and compact electronic devices. FCBGA technology offers excellent electrical and thermal performance, allowing for higher interconnection density, improved signal integrity, and efficient heat dissipation. These features are critical for applications in high-performance computing, mobile devices, and consumer electronics. The increasing demand for miniaturization, enhanced processing power, and energy efficiency in these devices fuel the growth of CSP FCBGA packaging solutions, meeting the evolving requirements of advanced semiconductor applications. 

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The demand for the consumer electronics segment in the advanced packaging market is on the rise due to the increasing need for compact, high-performance devices such as smartphones, tablets, wearables, and gaming consoles. Advanced packaging technologies like Fan-Out Wafer-Level Packaging (FOWLP) and Through-Silicon Via (TSV) enable miniaturization, improved power efficiency, and enhanced functionality, which are essential for modern consumer electronics. The rapid adoption of technologies such as 5G, IoT, and AI in these devices further drives the need for sophisticated packaging solutions that support higher processing speeds, better heat dissipation, and greater interconnection density, thus fueling market growth.

Regional Outlook 

In Asia-pacific, China attained the highest market share in the advanced packaging market due to strong semiconductor manufacturing infrastructure, substantial investments in research and development, and a strong focus on technological innovation. China is home to major semiconductor foundries and packaging companies that drive advancements in packaging technologies. In addition, the high demand for consumer electronics, automotive electronics, and telecommunication devices in the domestic market fuels the need for advanced packaging solutions. Government support through favorable policies and initiatives to boost the semiconductor industry further propels China’s leadership position in the advanced packaging market. 

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Key Players: – 

Amkor TechnologyIntel CorporationQualcomm Technologies Inc.Taiwan Semiconductor Manufacturing CompanyIBMMicrochip TechnologyRenesas Electronics CorporationTexas InstrumentsAnalog Devices

The report provides a detailed analysis of these key players in the global advanced packaging market. These players have adopted different strategies such as new product launches, collaborations, expansion, joint ventures, agreements, and others to increase their market share and maintain dominant shares in different regions. The report is valuable in highlighting business performance, operating segments, product portfolio, and strategic moves of market players to showcase the competitive scenario.

Recent Development: 

In October 2023, Advanced Semiconductor Engineering Inc. (ASE) announced the launch of its Integrated Design Ecosystem (IDE), a collaborative design toolset optimized to enhance advanced package architecture across its VIPack platform. This innovative approach facilitates a seamless transition from single-die SoC to multi-die disaggregated IP blocks, including chiplets and memory, for integration using 2.5D or advanced fanout structures. The IDE is designed to systematically boost the efficiency and effectiveness of advanced packaging, supporting the evolving demands of semiconductor technology. 

Key Benefits For Stakeholders:

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the advanced packaging market analysis from 2024 to 2032 to identify the prevailing advanced packaging market opportunities.The market research is offered along with information related to key drivers, restraints, and opportunities.Porter’s five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.In-depth analysis of the advanced packaging market segmentation assists to determine the prevailing market opportunities.Major countries in each region are mapped according to their revenue contribution to the global market.Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.The report includes the analysis of the regional as well as global advanced packaging market trends, Advanced Packaging Company List,  Advanced Packaging Market Share by Companies,   Advanced Packaging Industry Report,  Advanced Packaging Sector Analysis,  Semiconductor Advanced Packaging,  Advanced Packaging Technology key players, market segments, application areas, and market growth strategies.

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Advanced Packaging Market Key Segments:

By Type

Flip chip CSPFlip-chip ball grid arrayWafer level CSP2.5D/3DFan-out WLPOthers

By End User

Consumer electronicsAutomotiveIndustrialHealthcareAerospace & defenseOthers

By Region:

North America (U.S., Canada, and Mexico)Europe (UK, Germany, France, Russia, and Rest of Europe)Asia-Pacific (China, Japan, India, Australia, South Korea, and Rest of Asia-Pacific)Latin America (Brazil, Argentina, and Rest of Latin America)Middle East and Africa (UAE, Saudi Arabia, and Rest of Middle East and Africa)

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Trending Reports in Semiconductor and Electronics Industry:

Semiconductor Packaging Market size is expected to reach $60.44 billion by 2030 from $27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030

Consumer Electronics Packaging Market was valued at $22.1 billion in 2022, and is projected to reach $49.1 billion by 2032, growing at a CAGR of 8.4% from 2023 to 2032

Quad-Flat-No-Lead Packaging Market size was valued at $453.1 million in 2021, and is projected to reach $1.1 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031

Embedded Die Packaging Technology Market was valued at $69.2 million in 2021, and is projected to reach $370.7 million by 2031, growing at a CAGR of 18.3% from 2022 to 2031

Wafer Level Packaging Market size was valued at $4.5 billion in 2020, and is projected to reach $23.6 billion by 2030, growing at a CAGR of 18.8% from 2021 to 2030.

About Us:

Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Wilmington, Delaware. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of “Market Research Reports Insights” and “Business Intelligence Solutions.” AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

We are in professional corporate relations with various companies, and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Allied Market Research CEO Pawan Kumar is instrumental in inspiring and encouraging everyone associated with the company to maintain high quality of data and help clients in every way possible to achieve success. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.

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Technology

Galloway Company Expansion Nearly Doubles United States Industrial Sweetened Condensed Milk Capacity

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January 9, 2025

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NEENAH, Wis., Jan. 9, 2025 /PRNewswire/ — Galloway Company, a leader in premium dairy ingredients, announces the completion of a major expansion to its production capabilities. The addition of a custom-built evaporator will nearly double the United States’ total capacity for industrial sweetened condensed milk. The expansion comes at a critical time, relieving a highly constrained market for premium concentrated dairy ingredients in the United States.

The expansion will set new industry benchmarks in capacity, operational efficiency, and quality.

The expansion will allow the company to serve existing clients with the same premium quality ingredients they’ve come to rely on, while also welcoming new customers for the first time in four years.

“Over the last four years, we’ve seen growing constraints from the bakery and confectionery markets, with extended lead times and maxed-out production capacities,” said Mike Hasler, Director of Industrial Sales, Galloway Company. “This expansion ensures we can not only meet the demand of our existing customers but also welcome new business.”

With the addition of the second evaporator, Galloway Company is building redundancy into its production process, minimizing the risk of service interruptions for clients. The new system will also enable greater customization of products, allowing the company to meet the needs of clients of all sizes—from full tanker trucks to smaller batches packaged in totes and 5-gallon pails.

The expansion will set new industry benchmarks in capacity, operational efficiency, and quality. The upgraded system includes high-efficiency motors and precision-engineered valve systems, with a fully automated homogenization process, advanced lactose seeding technologies, and state-of-the-art cooling systems. These updates minimize energy consumption and reduce environmental impact while advanced quality control measures ensure consistent performance and accuracy. 

For more information or to place an order, please visit gallowaycompany.com or contact Mike Hasler at mhasler@gallowaycompany.com.

About Galloway Company

Galloway Company is the number one supplier of cream liqueur bases and sweetened condensed milk in the U.S. Located in Neenah, Wisconsin, Galloway specializes in producing unique formulations of condensed dairy blends and beverage bases. Classic Mix Partners, a subsidiary of Galloway Company, is the largest manufacturer of frozen dairy dessert mixes in Wisconsin, serving customers nationwide. For more information on our complete line of innovative dairy product mixes and bases, visit gallowaycompany.com.

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SOURCE Galloway Company

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SOCi Scales its AI Agent Solutions While Bolstering Path to Profitability

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January 9, 2025

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SAN DIEGO, Jan. 9, 2025 /PRNewswire/ — SOCi, Inc., the leader in AI-powered marketing solutions for multi-location businesses, today announced initial results from its AI Agent strategy. In less than eight months, SOCi’s Genius AI™ solutions now account for more than 10% of the company’s annual recurring revenue (ARR). These results cap off a year of remarkable milestones for SOCi, including surpassing $100 million in ARR—a feat that places the company among the elite Centaur SaaS organizations globally.

In 2025, the company plans to continue to enhance and expand its advanced Genius AI™ technology, allowing SOCi’s AI Agents to take on even more local marketing tasks at scale and deliver unprecedented efficiency and value for SOCi’s nearly 1,000 multi-location customers. Additionally, SOCi is committed to accelerating its journey to profitability by strategically realigning resources to focus on high-impact areas with proven success. This reorganization is designed to enhance efficiency, drive scalability, and position the company for sustainable, long-term growth.

“We remain committed to revolutionizing the industry with our AI Agent innovation and Genius solutions, delivering the first digital workforce to drive unparalleled value for our customers,” said Afif Khoury, CEO of SOCi. “Simultaneously, we are focused on achieving sustainable growth by prioritizing financial stability and operational efficiency, solidifying our position as the leader in marketing innovation.”

Recently recognized as an Inc. 5000 fastest-growing company for the seventh consecutive year, and named one of Fast Company Most Innovative Companies, SOCi continues to expand its reach into new high-growth markets with its cutting-edge local marketing solutions. Over the past two years, the company has forged partnerships with iconic enterprises such as Ford, Jersey Mike’s Subs, and Ace Hardware, while establishing a strong presence in the Financial Services and Insurance sectors with notable partners like Liberty Tax and Motto Mortgage.

About SOCi, Inc.
SOCi is the leader in AI-powered marketing solutions for multi-location businesses. With its proprietary Genius AI™ and suite of Genius Agents™, SOCi provides a first-of-its-kind, AI-powered digital workforce capable of handling the workload of 1,000 local marketers™, empowering brands to achieve unmatched digital visibility, strengthen customer engagement, and scale faster than ever before.

SOCi is recognized by Fast Company as one of the World’s Most Innovative Companies, and is trusted by nearly 1,000 top brands—including Ford, Ace Hardware, Kumon, Liberty Tax, and more—to automate and optimize local marketing tasks across all locations. Founded in 2012 and backed by leading strategic investors, SOCi is transforming how multi-location brands manage and scale their marketing efforts. Learn more at www.soci.ai or contact us at hello@soci.ai.

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SOURCE SOCi, Inc.

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Verdantas Acquires M-H-M, Inc. Expanding Water Services Throughout Northern California

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25 minutes ago

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January 9, 2025

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TAMPA, Fla., Jan. 9, 2025 /PRNewswire/ — Verdantas, a leader in digitally enabled technical consulting solutions for the environment, water, and energy transition markets, backed by Sterling Investment Partners, is pleased to announce the acquisition of M-H-M, Inc. (MHM). The acquisition aims to enhance Verdantas’ expertise in the northern California water market and expand the services offered by both firms.

Based in Marysville, California, MHM brings invaluable expertise and experience to Verdantas, broadening the depth and range of services within the water, and land development markets with strong relationships with municipalities, public agencies, and private clients. The integration of MHM into Verdantas enhances its water service capabilities bringing valuable expertise in water supply and storage, distribution, irrigation, water master planning, flood control, storm drainage, as well as land development and surveying.

Jesse Kropelnicki, CEO of Verdantas, stated about the acquisition: “Integrating MHM into Verdantas will continue our growth strategy by further diversifying our business on the west coast, and by furthering our capabilities in the water market. This expansion enhances our expertise and ability to serve water clients more effectively in northern California. Additionally, MHM improves our land development and surveying capabilities, which will enhance other services we provide in the same geography. We look forward to providing their team with new opportunities for growth while they continue to contribute to our mission.”

“California brings unique engineering design complexities. By partnering with Verdantas, we can now integrate robust in-house geotechnical and geological, structural engineering, and environmental expertise into our projects that we previously outsourced,” stated Sean Minard, President of MHM. “Our collaboration with Verdantas aims to expand our service offerings, providing comprehensive solutions in flood control, storm drainage, and water resource management as well as land development. This growth will add value to our current clients in Northern California, enabling us to deliver a more extensive suite of engineering and environmental solutions.”

James Soldano, Partner at Sterling, said, “We are proud to support Verdantas in this strategic acquisition of MHM. This move reflects our shared vision of growing Verdantas’ presence throughout the western United States and addresses the critical need for water-related expertise in a region facing challenges related to water resources and flood control.”

This acquisition is a vital component of the company’s sustainable service offerings objectives. By participating in significant projects, Verdantas plans to address critical water challenges, advocate for conservation, improve water quality, and encourage sustainable practices.

About Verdantas

Verdantas is a leader in digitally enabled technical consulting solutions for the environment, water, and energy transition markets. Blending balanced strengths in environmental and engineering expertise, we partner with clients and communities to create comprehensive solutions that contribute to a sustainable future. With a team of over 1,700 professionals nationwide, we harness diverse skills and innovative technologies to address complex challenges, protect vital resources, and foster resilient communities. For more information, visit www.verdantas.com.

About Sterling Investment Partners

Sterling Investment Partners is a leading private equity firm that has been building leading middle-market companies for over 30 years with a highly experienced, cohesive team of senior investment professionals. Sterling focuses on control investments in value-added distribution and business services, acquiring businesses that the firm believes have strong, sustainable competitive advantages and significant opportunities for value creation. Over its history, Sterling has completed over 230 transactions, representing over $31 billion in aggregate value, and was recently ranked a Top 10 performing middle market private equity firm globally by Dow Jones-HEC Paris. For more information, visit www.sterlinglp.com.

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SOURCE Verdantas LLC

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