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IDTechEx Discusses Co-Packaged Optics (CPO) Packaging Technology Trends and Market Trajectory

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BOSTON, July 24, 2024 /PRNewswire/ — Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64×400 Gbps or 32×800 Gbps pluggable optical transceiver modules. However, these high-speed modules, within their current form factors, pose significant challenges. Issues include the required densities of electrical and optical connectors, as well as escalating power consumption.

To achieve next-generation optical engines supporting 800 Gbps and beyond per module, the communication rate must double to at least 100 Gbps per lane. This increase introduces substantial signal integrity issues across the switch socket, motherboard, and edge connector, leading to heightened power dissipation at SerDes interfaces. In future Ethernet switching, these signal integrity problems may cause I/O power consumption to exceed that of the switch core. Additionally, the integration density of standard pluggable modules is limited by the QSFP/OSFP form factor, necessitating advanced thermal management solutions not yet widely available.

Co-Packaged Optics (CPO) presents a promising solution to these challenges. Unlike traditional pluggable models, CPO integrates optical modules directly onto the switch ASIC substrate, reducing electrical reach and effectively addressing signal integrity issues. This approach has gained traction among major data centers. However, optimizing the packaging strategy for CPO remains a topic of ongoing industry discussion and development. IDTechEx’s latest report, “Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts“, explores these advancements in CPO technology and packaging techniques enabling its adoption.

The importance of advanced semiconductor packaging technologies for Co-Packaged Optics (CPO)

The integration of CPO in data centers aims to boost I/O bandwidth and reduce energy consumption. The way photonic integrated circuits (PICs) are combined with electronic integrated circuits (EICs) and switch ICs, can significantly influence the areal and edge bandwidth density, as well as packaging parasitics. These factors directly affect the transceiver’s I/O bandwidth and energy efficiency, meaning improper integration can negate the advantages of silicon photonics.

For CPO, the integration of photonic and electronic components can be achieved through various methods, each with unique advantages and challenges. The most advanced, and still in the R&D phase, is the 3D monolithic integration. This embeds photonic components within an existing electronic process node with minimal alterations, co-locating active photonics and driving electronics within the same die. This reduces parasitics and simplifies packaging by eliminating the need for interface pads and bumps. However, monolithic integration typically uses older CMOS nodes, resulting in suboptimal photonic performance and higher energy consumption. Despite these limitations, it offers minimal impedance mismatch and simplified packaging.

Conversely, 2D integration places the PIC and EIC side by side on a PCB, connected by wire bonds or flip-chip. This method is straightforward and cost-effective, but introduces significant parasitic inductance, limiting aggregate I/O due to single-edge connections. While 2D integration is easy to package, the reliance on wire bonds constrains the transceiver bandwidth and increases energy consumption, making it less efficient for high-performance applications.

3D hybrid integration offers a more advanced solution by placing the EIC on top of the PIC, via various advanced semiconductor packaging technologies including Through-Si-Via (TSV), high density fan-out, Cu-Cu hybrid bonding, and active photonic interposer, significantly reducing parasitics. The use of advanced semiconductor packaging technologies in 3D integration allows for dense pitch capabilities, enhancing performance. However, thermal dissipation remains a challenge, as the heat generated by the EIC can impact the PIC, necessitating advanced thermal management solutions. Despite these thermal challenges, 3D hybrid integration achieves higher performance due to minimized packaging parasitics.

2.5D integration serves as a compromise, with both the EIC and PIC flip-chipped onto a passive interposer with TSVs. This approach maintains manageable parasitics and dense pitch capabilities similar to 3D integration but adds complexity with the need for interposer traces. While 2.5D integration balances performance, cost, and fabrication turnaround, it incurs higher parasitics than 3D hybrid integration.

In summary, each integration method presents trade-offs between performance, complexity, and cost, with the choice based on specific application requirements and constraints.

Co-Packaged Optics (CPO) market trajectory

According to IDTechEx, the Co-Packaged Optics (CPO) market is projected to exceed $1.2 billion by 2035, growing at a robust CAGR of 28.9% from 2025 to 2035. CPO network switches are expected to dominate revenue generation, driven by each switch potentially incorporating up to 16 CPO PICs. Optical interconnects for AI systems will constitute approximately 20% of the market, with each AI accelerator typically utilizing one optical interconnect PIC to meet increasing demands for high-speed data processing and communication in advanced computing applications.

IDTechEx’s latest report, “Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts”, offers extensive exploration into the latest advancements within Co-Packaged Optics technology. The report delves deep into key technical innovations and packaging trends, providing a comprehensive analysis of the entire value chain. It thoroughly evaluates the activities of major industry players and delivers detailed market forecasts, projecting how the adoption of CPO will reshape the landscape of future data center architecture.

Central to the report is the recognition of advanced semiconductor packaging as the cornerstone of Co-Packaged Optics technology. IDTechEx places significant emphasis on understanding the potential roles that various semiconductor packaging technologies may play within the realm of CPO.

Key aspects of the report include:

Market Dynamics: Examination of key players such as Nvidia, Broadcom, Cisco, Ranovus, and Intel, and the forces shaping the CPO landscape.Innovations in CPO Design: Exploration of advanced CPO designs and their implications for enhancing data center efficiency and shaping future architecture.Semiconductor Packaging Breakthroughs: Insight into the latest advancements in semiconductor packaging, including 2.5D and 3D technologies, and their role in enabling CPO innovation.Optical Engines: Analysis of the drivers behind CPO’s performance and efficiency advantages.CPO for AI Interconnects: Exploration of how optical I/O can address the limitations of copper connections in AI applications, improving efficiency, latency, and data rates.CPO for Switches: Assessment of the potential 25% efficiency gains in high-performance network switches through CPO integration.Challenges and Solutions: Critical review of obstacles to CPO adoption and strategies to overcome them.Future Analysis: Predictions and insights into the next generation of CPO and its anticipated impact on the industry.

The report is based on extensive research and interviews with industry experts and provides valuable insights for anyone interested in gaining a strategic understanding of Co-Packaged Optics’ role in advancing the future of data centers and AI technology.

Market Forecasts:10-year Data Center Population Cumulative Forecast10-year AI Accelerator Unit Shipments Forecast10-year CPO Interconnect for AI (Optical I/O) Unit Shipments Forecast10-year CPO Interconnect for AI (Optical I/O) Market Revenue Forecast10-year CPO-enabled Network Switch Unit Shipments Forecast10-year CPO-enabled Network Switch Market Revenue Forecast10-year Total CPO Market Revenue

For more information on this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/CPO.

For the full portfolio of related research available from IDTechEx please see www.IDTechEx.com/Research/Semiconductors.

About IDTechEx

IDTechEx provides trusted independent research on emerging technologies and their markets. Since 1999, we have been helping our clients to understand new technologies, their supply chains, market requirements, opportunities and forecasts. For more information, contact research@IDTechEx.com or visit www.IDTechEx.com

Media Contact: 
Charlotte Martin 
Subscriptions Marketing Manager
press@IDTechEx.com 
+44(0)1223 812300

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Vortex Companies Acquires Sancon Technologies

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Expanding Its Leadership in Water and Wastewater Infrastructure Solutions

HOUSTON, Jan. 10, 2025 /PRNewswire/ — Vortex Companies, LLC (Vortex), the nation’s fastest-growing provider of trenchless infrastructure solutions, is proud to announce its acquisition of Sancon Technologies, Inc. (Sancon). Headquartered in Huntington Beach, California, Sancon has been a trusted leader in structure and trenchless rehabilitation across California and Nevada, since 2012.

“Sancon has earned an outstanding reputation in our industry, driven by its strong management team and proven expertise,” said Mike Vellano, CEO of Vortex Companies. “As a long-time licensee of CIPP Corp and a user of Vortex UV technology, sewer robotics, epoxies, and geopolymer lining products, Sancon’s established presence on the West Coast makes them an ideal addition to the Vortex portfolio.”

Led by Chuck Parsons, Gary Drew, and Ryan Helmuth, Sancon’s management team brings decades of trenchless technology experience. “Joining the Vortex family allows us to access resources that were previously unavailable, broadening our service offerings,” said Chuck Parsons. “We’ve cultivated a strong relationship with Vortex over the years and look forward to expanding our comprehensive portfolio of solutions.”

This acquisition bolsters Vortex’s capabilities by adding decades of experience, specialized equipment, and long-standing customer relationships, further strengthening its presence on the West Coast. “The market demand for trenchless rehabilitation solutions continues to grow, particularly in the western states and the California market,” said Ryan Graham, COO of Vortex. “Sancon’s expertise aligns with our mission to deliver environmentally friendly and cost-effective infrastructure solutions to our customers.”

Financial terms of the transaction were not disclosed.

About Vortex Companies
Celebrating its 10th anniversary, Vortex Companies is a global leader in trenchless water and sewer infrastructure solutions. The company provides advanced technologies and turnkey services for municipal, industrial, and commercial systems. Operating from 27 locations worldwide, Vortex specializes in manhole and pipe rehabilitation, polymeric coatings, CIPP liners, sewer robotics, and high-speed drain cleaning tools. For more information, visit www.vortexcompanies.com.

About Sancon Technologies
Sancon Technologies provides trenchless rehabilitation of sewer and water structures through advanced coatings and custom-developed pipelining systems. With over 40 years of experience, Sancon has rehabilitated millions of square feet of sewer structures and several million linear feet of pipelines for over 100 public agencies. For more information, visit www.sancon.com

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Sensors for Smartphones Market to Grow by USD 809 Million from 2025-2029, Driven by Mobile AR Adoption and AI-Redefined Market Landscape – Technavio

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NEW YORK, Jan. 10, 2025 /PRNewswire/ — Report with market evolution powered by AI – The global sensors for smartphones market size is estimated to grow by USD 809 million from 2025-2029, according to Technavio. The market is estimated to grow at a CAGR of 2.7% during the forecast period. Increasing implementation of mobile ar applications by enterprises is driving market growth, with a trend towards emergence of sensor fusion technology. However, design complexity poses a challenge. Key market players include Alps Alpine Co. Ltd., ams OSRAM AG, Broadcom Inc., CEVA Inc., Fingerprint Cards AB, Fujitsu Ltd., Murata Manufacturing Co. Ltd., OmniVision Technologies Inc., Panasonic Holdings Corp., Qualcomm Inc., Robert Bosch GmbH, ROHM Co. Ltd., Samsung Electronics Co. Ltd., Sensirion AG, Shenzhen Goodix Technology Co. Ltd, Sony Group Corp., STMicroelectronics International NV, Synaptics Inc., and TDK Corp..

AI-Powered Market Evolution Insights. Our comprehensive market report ready with the latest trends, growth opportunities, and strategic analysis- View Free Sample Report PDF

Forecast period

2025-2029

Base Year

2024

Historic Data

2019 – 2023

Segment Covered

Price (Premium range, Medium range, and Low range) and Geography (APAC, North America, Europe, South America, and Middle East and Africa)

Region Covered

APAC, North America, Europe, South America, and Middle East and Africa

Key companies profiled

Alps Alpine Co. Ltd., ams OSRAM AG, Broadcom Inc., CEVA Inc., Fingerprint Cards AB, Fujitsu Ltd., Murata Manufacturing Co. Ltd., OmniVision Technologies Inc., Panasonic Holdings Corp., Qualcomm Inc., Robert Bosch GmbH, ROHM Co. Ltd., Samsung Electronics Co. Ltd., Sensirion AG, Shenzhen Goodix Technology Co. Ltd, Sony Group Corp., STMicroelectronics International NV, Synaptics Inc., and TDK Corp.

Key Market Trends Fueling Growth

The smartphone sensors market is experiencing significant growth, driven by trends in videos, standard smartphones, and mobile operating systems. New features such as augmented reality (AR) applications, artificial intelligence (AI) technology, and image stabilization are becoming essential for users. Sensors like accelerometers, gyroscopes, proximity, compass, barometer, and optical are commonly used in smartphones and wearable devices. Quality of experience is a key focus for smartphone manufacturers, with improvements in call quality, display, and battery life. The use of sensors in health monitoring applications, including heart rate monitors and blood pressure sensors, is also increasing. Industrial design and software development are crucial for integrating these sensors into smartphones and other electronic devices. Cyber security is a concern, with the potential for fake sensors and data collection posing risks. Overall, the market for smartphone sensors is expected to continue growing, driven by user purposes, networks, and new materials. 

Sensor fusion is a technology that combines data from multiple sensors in smartphones to deliver more accurate results. This includes data from gyroscopes, compasses, and accelerometers, which are used to calculate elevation, linear translation, gravity, direction, and rotation. Efficient interoperability between sensors is crucial, and sensor-fusion technology plays a vital role in achieving this. Vendors like Bosch Sensortec GmbH offer complete 9-axis fusion solutions, such as FusionLib, to enable sensors to work. These algorithm solutions enhance the overall performance and accuracy of smartphone sensors. 

Insights on how AI is driving innovation, efficiency, and market growth- Request Sample!

Market Challenges

The smartphone sensors market is experiencing significant growth as sensors become increasingly integrated into various electronic devices. One challenge is ensuring compatibility with standard smartphones and mobile operating systems. Wearable devices and new features like AR applications require high-quality sensors for optimal user experience. Processors and communication technologies play a crucial role in data collection and transmission. However, concerns around fake sensors and cyber attacks pose threats to the market. For instance, fake fingerprint sensors or iris recognition can compromise user security. To address this, manufacturers focus on improving sensor quality and implementing advanced technologies like artificial intelligence and time-of-flight sensing. Smartphone sales continue to rise, driving demand for various sensors, including image sensors for cameras, pressure sensors for health monitoring applications, and proximity sensors for usability. Additionally, sensors in wearable devices like smartwatches, such as heart rate monitors and accelerometers, are gaining popularity. The use of sensors extends beyond smartphones to digital media players, remote monitoring systems, and even industrial design. New materials like steel and natural materials are being explored to enhance sensor performance and durability. As sensors become more sophisticated, they enable new applications, such as 5G smartphones, mobile gaming consoles, and surveillance systems. Overall, the smartphone sensors market presents significant opportunities for innovation and growth.The sensors for smartphones market faces a significant challenge due to the restricted board size in mobile devices. With the increasing integration of sensors like fingerprint and facial recognition, the need for more board space becomes a concern. Manufacturers aim to minimize the size of sensors’ ICs while maintaining their functionality and affordability. Continuous advancements in technology, such as shrinking circuit and chip sizes, offer potential solutions to this issue. However, ensuring uncompromised performance remains crucial for sensor manufacturers in this competitive market.

Insights into how AI is reshaping industries and driving growth- Download a Sample Report

Segment Overview

This sensors for smartphones market report extensively covers market segmentation by

Price1.1 Premium range1.2 Medium range1.3 Low rangeGeography2.1 APAC2.2 North America2.3 Europe2.4 South America2.5 Middle East and Africa

1.1 Premium range- The premium smartphone market continues to evolve, with devices priced above USD400 featuring advanced technologies such as Human-Machine Interface (HMI) systems and AI. HMI technologies, including pattern recognition, gesture recognition, facial recognition, fingerprint recognition, and iris recognition, require sophisticated sensors and processors for functionality. In 2023, smartphones from leading brands like Apple and Samsung incorporate sensors such as air gestures, face ID, fingerprint, and iris sensors. The trend towards bezel-less screens is driving the adoption of in-display fingerprint sensors, while the integration of AI chips is facilitating the functioning of HMI technologies and increasing the number of sensors used in premium smartphones. These factors are expected to fuel growth in the premium smartphone sensors market during the forecast period.

Download complimentary Sample Report to gain insights into AI’s impact on market dynamics, emerging trends, and future opportunities- including forecast (2025-2029) and historic data (2019 – 2023) 

Research Analysis

The Sensors for Smartphones market is witnessing significant growth due to the increasing demand for advanced features in mobile devices. Smartphone camera technology is a major driver, with sensors enabling improved image and video quality. Mobile app development is also benefiting from sensor integration, allowing for more interactive and personalized experiences. Health monitoring is another area of focus, with sensors enabling well-being monitoring and accessibility features. Mobile device security is also a priority, with sensors playing a role in biometric authentication and remote analysis. Smartphone trends include mid-level and high-end devices, mobile gaming, VR applications, and sensor-driven innovation. Sensor range includes temperature, humidity, light, proximity, and gyroscopic sensors. Smartphone usage statistics indicate that users prioritize battery life, mobile network performance, and mobile device compatibility. Sensor technology is also driving design trends, with slim designs and sleek aesthetics. Mobile payment solutions and sensor data ethics are also important considerations in the sensor industry. Mobile device repair and recycling are also growing areas of focus. Smartphone manufacturer strategies include segmentation, software updates, and pricing. Overall, the sensor industry is a key player in the innovation and development of smartphone technology. However, concerns around fake face recognition and sensor data privacy remain challenges to be addressed.

Market Research Overview

The sensors for smartphones market is witnessing significant growth due to the increasing demand for new features and improved quality of experience in standard smartphones and wearable devices. Mobile operating systems are continually integrating advanced sensors such as optical sensors, accelerometer sensors, gyroscope sensors, proximity sensors, compass, barometer, and time-of-flight sensing technology to enhance user experiences. New smartphone types, including 5G smartphones, are incorporating more sensors for AR applications, image stabilization, and EIS. Sensors play a crucial role in various applications, including digital media players, remote monitoring, smartphone sales, and health monitoring applications. Cyber attackers are also targeting sensors to gain unauthorized access, leading to the development of advanced security features such as fingerprint sensors, iris recognition sensors, and pressure sensors. The use of new materials, such as steel and natural materials, is also driving innovation in sensor technology. Overall, the sensors market for smartphones and wearable devices is expected to continue growing, driven by the increasing demand for smart devices and the integration of artificial intelligence and other advanced technologies.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

PricePremium RangeMedium RangeLow RangeGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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UGREEN Unveils Groundbreaking AI NAS with Built-In LLM at CES 2025

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LAS VEGAS, Jan. 10, 2025 /PRNewswire/ — UGREEN, a leading innovator in consumer electronics, made waves at CES 2025 with the unveiling of pioneering AI NAS solutions and other cutting-edge products. Under the launch event theme of “Activate the Possibility of AI NAS” on January 8th. UGREEN showcased the world’s first AI NAS with a built-in Large Language Model (LLM), as well as the ultra-powerful Nexode 500W GaN charger and an industry-leading Thunderbolt™ 5 docking station.

UGREEN inked a strategic partnership deal with Intel in 2023, paving the way for the launch of the UGREEN NASync DXP series of NAS products in 2024. This series proved to be a resounding success, and UGREEN is now well-established as a top competitor in the NAS space.

In 2025, UGREEN’s strategic partnership with Intel has now shifted its focus to the exciting new frontier of AI NAS. Following close collaboration, this has now led to the unveiling of the next generation of AI-powered smart storage. The stars of the show at CES were the groundbreaking UGREEN NASync iDX 6011 and 6011 Pro models, introduced by UGREEN North America NAS Manager, Hernan Lopez. A world-first, the iDX series is the inaugural AI NAS solution with a built-in Large Language Model (LLM), delivers exceptional performance, revolutionizing intelligent network-attached storage. The NASync iDX6011 is equipped with the new generation Intel® Core™ Ultra 5 Processor 125H, featuring 14 cores, 18 threads, and a turbo frequency of 4.5GHz. Its AI capabilities are exceptional, with three major AI engines: CPU, GPU, and NPU. This makes it highly efficient across a variety of AI application scenarios.

“Alongside the momentum of AIPC, NAS has the unique opportunity to bring AI to every home,” states Sam Gao, Vice President & General Manager of Intel Client Computing Group China. “Intel® Core™ Ultra 200 Series Processors fit the AI workloads very well which can significantly benefit new AI NAS solutions. Intel is collaborating closely with Ugreen to drive consumer friendly use cases and unleash the future of NAS.” 

UGREEN showcased the impressive AI capabilities of the iDX series, including an AI Photo Album that intelligently recognizes text and objects, supports semantic search, and allows custom learning to create user-defined categories. Notably, UGREEN’s integrated AI LLM, the world’s first local-based LLM for NAS, powers features such as natural and intuitive AI chat, file tag generation, and automated meeting minutes creation.

Other innovative offerings include the UGREEN Revodok 1231 Thunderbolt™ 5 docking station which offers 80 Gbps bidirectional bandwidth and an enhanced mode supporting up to 120 Gbps. The Nexode 500W GaN 6-port desktop charger is the world’s first 500W gallium nitride model, featuring 240W single-port charging up to 48V for high-performance laptops and e-bikes, with intelligent multi-port power allocation.

Following the unveiling, a media roundtable was held featuring Intel’s NAS and Thunderbolt Marketing Director Larry Blackburn, Western Digital’s HDD Marketing Director Brian Mallari, NAS expert Robert Andrews of NASCompares, and UGREEN NAS Product Manager Markus Xie. The group discussed the practical applications of AI-powered NAS, UGREEN’s collaboration with Intel, and concerns regarding security and privacy in the AI landscape.

More than 30 media and industry experts attended the event, praising it for offering valuable insights into AI advancements in the NAS sector and fostering innovation within the industry.

With its groundbreaking AI NAS solutions and other innovations, UGREEN is shaping the future of smart storage and redefining the role of AI in consumer electronics. By pushing the boundaries of what network-attached storage can achieve, UGREEN is driving progress and setting new standards across the industry.

©Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.

About UGREEN

Since 2012, UGREEN has been dedicated to creating innovative electronic devices and accessories that are both technologically advanced and affordable for consumers. Its user-focused approach lies at the core of the brand, which has earned the trust of over 200 million users globally. Lately, the brand has expanded into innovative new fields, including AI-powered NAS solutions, further enhancing its commitment to meet evolving consumer needs.

For more information, please contact: pr@ugreen.com 

 

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