Optimized EDA and IP Solutions Deliver Enhanced Compute Performance, Power and Engineering Productivity for TSMC N2 and A16 Processes 

Highlights

Production-ready AI-driven EDA flows, powered by Synopsys.ai, on N2 deliver exceptional quality of results and accelerate design node migration for industry leadersDeveloping new backside power delivery capabilities on TSMC’s A16 to enable efficient power distribution and system performanceJoint TSMC, Synopsys and Ansys multi-physics flow supporting CoWoS interposer packaging addresses thermal and power integrity challengesSynopsys 3DSO.ai delivers AI-driven system analysis for maximum quality of results with support for TSMC’s 3DFabricNew development of 40G UCIe, HBM4 and 3DIO IP on advanced TSMC nodes optimizes latency, power, performance and area

SUNNYVALE, Calif., Sept. 25, 2024 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC’s most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs. The relentless computational demands in AI applications require semiconductor technologies to keep pace. From an industry leading AI-driven EDA suite, powered by Synopsys.ai™ for enhanced productivity and silicon results to complete solutions that facilitate the migration to 2.5/3D multi-die architectures, Synopsys and TSMC have worked closely for decades to pave the path for the future of billion to trillion-transistor AI chip designs.

“TSMC is excited to collaborate with Synopsys to develop pioneering EDA and IP solutions tailored for the rigorous compute demands of AI designs on TSMC advanced process and 3DFabric technologies,” said Dan Kochpatcharin, head of the Ecosystem and Alliance Management Division at TSMC. “The results of our latest collaboration across Synopsys’ AI-driven EDA suite and silicon-proven IP have helped our mutual customers significantly enhance their productivity and deliver remarkable performance, power, and area results for advanced AI chip designs.

“For decades, Synopsys has closely collaborated with TSMC, providing mission-critical EDA and IP solutions spanning all generations of TSMC’s most advanced nodes,” said Sanjay Bali, senior vice president of EDA product management at Synopsys. “This partnership has been instrumental in helping our mutual customers accelerate their innovation in the AI era and advance the future of semiconductor designs. Together, we are pushing the boundaries of what’s possible, enabling groundbreaking advancements in performance, power efficiency, and engineering productivity.”

Synopsys AI-Driven EDA Design Flows Boost PPA and Engineering Productivity
Industry leaders have embraced Synopsys AI-driven EDA flows, powered by Synopsys.ai for their advanced chip designs on N2.

“Synopsys’ certified Custom Compiler and PrimeSim solutions provide the performance and productivity gains that enable our designers to meet the silicon demands of high-performance analog design on the TSMC N2 process,” said Ching San Wu, Corporate VP at MediaTek. “Expanding our collaboration with Synopsys makes it possible for us to leverage the full potential of their AI-driven flow to accelerate our design migration and optimization efforts, improving the process required for delivering our industry-leading SoCs to multiple verticals.”

In addition, Synopsys is collaborating with TSMC on the new backside routing capabilities supporting TSMC’s A16 process in the Synopsys digital design flow to address power distribution and signal routing for design performance efficiency and density optimization. Interoperable process design kits (iPDKs) and Synopsys IC Validator™ physical verification runsets are available for design teams to handle the increasing complexity of physical verification rules and efficiently transition designs to TSMC N2 technology.

To further accelerate chip design, Synopsys and TSMC have enabled Synopsys EDA tools on the cloud through TSMC’s Cloud Certification, providing mutual customers with cloud-ready EDA tools that deliver accurate quality of results and seamlessly integrate with TSMC’s advanced process technology. Synopsys’ cloud-certified tools include synthesis, place and route, static timing and power analysis, transistor-level static timing analysis, custom implementation, circuit simulation, EMIR analysis and design rule checking.

Advancing Multi-Die Innovation with Comprehensive EDA Solutions
Synopsys, Ansys and TSMC have collaborated to address the complex multi-physics challenge for multi-die designs with a comprehensive system analysis flow by leveraging their prime solutions. The most recent flow based on Synopsys 3DIC Compiler unified exploration-to-signoff platform, which integrates 3DSO.ai, combined with Ansys RedHawk-SC™ power integrity signoff platform for digital and 3D integrated circuits, enhances the thermal and IR-aware timing analysis. Synopsys 3DIC Compiler is a TSMC-certified platform supporting 3Dblox, TSMC’s 3DFabric, which includes TSMC-SoIC® (System on Integrated Chips) and CoWoS packaging technologies.

“Our collaboration with Synopsys and TSMC exemplifies our collective commitment to driving innovation and enabling the future of AI and multi-die chip design,” said John Lee, vice president and general manager, semiconductor, electronics and optics business at Ansys. “Together, we are tackling the multi-physics challenges inherent in multi-die architectures, helping our mutual customers achieve golden signoff accuracy for chip, package, and system-level effects within the Synopsys design environment on the latest TSMC technologies.”

Reduce Risk with Silicon-Proven IP
Synopsys‘ comprehensive multi-die test solutions, available with the Synopsys UCIe and HBM3 IP, ensure multi-die package health during manufacturing test and in-field. In collaboration with TSMC, Synopsys has taped out a test chip utilizing TSMC’s CoWoS interposer technology with full support for test, monitor, debug, and repair capabilities. The diagnosis, traceability, and mission mode signal integrity monitoring allow in-design, in-ramp, in-production, and in-field optimization for purposes such as predictive maintenance. The Monitoring, Test, and Repair (MTR) IP for UCIe PHY provides testability at the die, die-to-die interface and multi-die package levels. 

Synopsys has achieved multiple silicon successes for UCIe and HBM3 IP solutions across N3E and N5 process technologies, accelerating IP integration and minimizing risk. Latest developments of the Synopsys UCIe IP, operating up to 40G, allows maximum bandwidth and energy efficiency without the need for additional area while the HBM4 and 3DIO IP solutions accelerate heterogeneous integration of 3D stacked-dies on TSMC’s advanced processes.

Additional Resources

LinkedIn article: Synopsys-TSMC Successful Tapeout of a Test Chip Featuring a Multi-Die Design Using TSMC’s CoWoS TechnologySynopsys is hosting several demonstrations at the TSMC OIP Ecosystem Forum today in Santa Clara at Booth #204

About Synopsys
Catalyzing the era of pervasive intelligence, Synopsys, Inc. (Nasdaq: SNPS) delivers trusted and comprehensive silicon to systems design solutions, from electronic design automation to silicon IP and system verification and validation. We partner closely with semiconductor and systems customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.  Learn more at www.synopsys.com.

Editorial Contact 
Kelli Wheeler 
Synopsys, Inc. 
(650) 584-5000
corp-pr@synopsys.com

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SOURCE Synopsys, Inc.

Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors

/ Key Highlights

Ansys artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasksAnsys multiphysics platform supports TSMC customers’ reliability analysis needs for evolving 3D-IC designAnsys and TSMC developed a comprehensive multiphysics analysis workflow for TSMC’s compact universal photonics engine (COUPE) for optical data communication

PITTSBURGH, Sept. 25, 2024 /PRNewswire/ — Ansys (NASDAQ: ANSS) and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies. Together, the companies developed new workflows to analyze 3D-IC, photonic, electromagnetic (EM), and radio frequency (RF) designs while achieving higher productivity. These capabilities are critical to creating the world’s leading semiconductor products for high-performance computing (HPC), AI, datacenter connectivity, and wireless telecommunication.

Productivity enhancement with AI

Creating the right 3D-IC design that optimizes thermal and electrical effects — such as channel profile — requires extensive, time-consuming design flows. To minimize this constraint, designers use Ansys optiSLang® process integration and optimization software to quickly identify optimal design configurations through automation. By integrating optiSLang and Ansys RaptorX™ silicon-optimized EM solver for design analysis and modeling into the design process earlier, the solution reduced the number of EM simulations and demonstrated co-optimized channel design. This time savings delivers lower design costs and faster time-to-market.

Additionally, TSMC, Ansys, and Synopsys continue their long-standing collaboration to ensure the best technical solutions for their customers. Together, the companies developed an innovative AI-assisted RF migration flow by combining the RaptorX EM modeling engine with optiSLang that enables customers to automatically migrate analog circuits from one silicon process to another.

Multiphysics analysis for reliability

As TSMC advances 3D-IC packaging technologies, thermal and stress multiphysics analysis has become essential for ensuring the reliability of advanced multi-chip manufacturing. To address this need, TSMC is expanding its collaboration with Ansys RedHawk-SC Electrothermal™ thermal and multiphysics signoff platform for 3D-IC, incorporating mechanical stress analysis solutions to better support mutual customers’ requirements.

TSMC, Ansys, and Synopsys have developed an efficient flow to address multiphysics coupling challenges among timing, thermal, and power integrity. The flow, including Synopsys’ 3DIC Compiler™ exploration-to-signoff platform combined with Ansys solutions RedHawk-SC Electrothermal and Ansys RedHawk-SC™, helps customers reduce design challenges, enhance power, performance, and area (PPA), and ensure the reliability of their designs.

Ansys and TSMC also continue to jointly support the latest version of 3Dblox, with a focus on implementing hierarchical support to address the continuous rise of 3D-IC complexity. The new features of 3Dblox provide modularity and flexibility to help 3D-IC designers shorten the design implementation and analysis cycle.

COUPE solution enablement

TSMC’s COUPE is a 3D-IC assembly that stacks electronic chips on top of photonic chips, connecting fiber optics directly to electronic systems. Ansys, Synopsys, and TSMC are working to jointly enable a COUPE design solution that links a broad range of physics capabilities. The innovative optics simulation flow integrates:

Ansys Zemax OpticStudio® and Ansys Lumerical™ FDTD to simulate photonic devices on sub-wavelength scale and microlens at millimeter scaleAnsys RedHawk-SC and Ansys Totem™ for simulating power delivery network and signal net tracing to ensure voltage drop remains within acceptable design margins and signals can tolerate design current between electrical control IC and photonic ICRaptorX for modeling high-speed inter-chip connections in a multi-die package to accurately capture high-frequency signal behavior, andRedHawk-SC Electrothermal for simulating critical photonic heat and device components and overall 3D stacking thermal integrity

A16 Enablement

TSMC recently announced an advanced, new silicon process A16 that includes innovative backside power contact technology and backside power delivery. While this makes it suitable for AI and HPC applications, thermal management becomes an important reliability consideration. To address this, TSMC and Ansys are collaborating to enable RedHawk-SC Electrothermal to provide accurate thermal analysis. Moreover, TSMC collaborates with Ansys to enable power integrity and reliability technology with Redhawk-SC and Totem. Overall, the solutions will help designers improve performance, enhance power efficiency, and ensure an optimal and reliable design.

“Our advanced process and 3DFabric technologies have made huge strides in enabling more powerful and energy-efficient chips to tackle the ever-increasing computational demands of AI applications, but this also requires design tools that have a deep understanding of complex multi-physics interactions,” said Dan Kochpatcharin, head of Ecosystem and Alliance Management Division at TSMC. “The collaboration with our Open Innovation Platform (OIP) ecosystem partners like Ansys gives our mutual customers reliable access to a very broad range of proven analysis capabilities to deliver reliable solutions for their business needs.”

“Just as semiconductors have a wide range of applications, the Ansys multiphysics platform offers an equally broad range of reliable technical solutions,” said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. “Whether this be thermal, mechanical, electromagnetic, or a combination of different physics, we strive to ensure that our customers are well equipped with the strongest analysis tools to stay ahead of the curve. The continued collaborations with TSMC and Synopsys are a testament to our understanding of customer needs and how precise, predictively accurate simulation can help them deliver the most powerful products.”

/ About Ansys

Our Mission: Powering Innovation that Drives Human Advancement™

When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.

Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

ANSS–T

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SOURCE Ansys

Expanding our Partnership: HCI and SpryPoint

CHARLOTTETOWN, PE, Sept. 25, 2024 /PRNewswire-PRWeb/ — Hometown Connections has selected SpryPoint to recommend SpryPoint’s Software as a Service (SaaS) Customer Information and Billing Solution to Hometown’s Public Power associates across the United States. In addition, Hometown will also help promote SpryPoint’s SpryEngage and SpryIDM. Hometown has helped recommend SpryPoint’s mobile workforce application, SpryMobile since 2022.

SpryCIS is designed to meet the needs of single-service and multi-service utilities with comprehensive business requirements. SpryCIS is fully cloud-based, with a focus on user experience and usability. SpryPoint’s development, deployment and support model allows for fast implementation and integration of improved features.

Marc Gerken, President and CEO of Hometown Connections said, “We’ve worked diligently since January to weigh the attributes of the RFP responses we received. We reviewed features, costs, ease of implementation and integration and usability. We studied and compared contract language and spoke with numerous references. At the end of this process, SpryCIS was the clear favorite. And with the addition of the SpryEngage and SpryIDM modules, we are confident we are presenting the best possible solution to our associates in Public Power.”

SpryEngage provides a comprehensive, user-friendly portal that streamlines customer interactions with the utility. SpryIDM is a meter data management system that helps utilities derive business value from the extensive interval data collected by AMI metering systems.

“We’re thrilled to partner with Hometown Connections (HCI) to provide our integrated suite of utility software-as-a-service solutions,” said Kyle Strang, CEO of SpryPoint. “Our platform is architected to empower utilities with the essential tools to boost efficiency and deliver outstanding service to their customers. As the utility landscape continues to evolve, we’re excited to collaborate with Hometown Connections to offer our cloud-native platform tailored specifically for the needs and goals of community-owned utility systems.”

SpryPoint was founded in 2011 to help utilities address the technological advances of the past decade, helping public utilities address customer satisfaction and operational efficiency.

About Hometown Connections

Hometown Connections, Inc. is a national, non-profit utility services organization which has been specializing in the unique challenges of community-owned utilities for more than 25 years. Hometown’s team of consultants and vendor partners help public power utilities streamline business processes, enhance customer service, improve security, develop plans for the future, and much more.

About SpryPoint

SpryPoint is the leading provider of software for public utilities, focusing on delivering innovative and efficient technologies to enable exceptional customer service while optimizing operations. With a robust product line that addresses everything from customer information systems to field service management, SpryPoint is at the forefront of the digital transformation in the utilities sector. To learn more about SpryPoint, please visit us at sprypoint.com, by phone at 1-855-879-7779 (855-TRY-SPRY) or info@sprypoint.com.

Media Contact
Emily Beardsley, SpryPoint, 1 855-879-7779, info@sprypoint.com, www.sprypoint.com

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SOURCE SpryPoint