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Fibocom Announces MediaTek-powered 5G RedCap Module FM330 Series to Lead 5G Expansion at MWC Barcelona 2024

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Fibocom announces the launch of the industry-first T300-based 5G RedCap Module FM330 series in collaboration with MediaTek during MWC Barcelona 2024. Expanding the landscape of 5G with MediaTek’s T300, the new RedCap module series features incomparable wireless performances in high transmission reliability, cutting-edge hardware density design, and excellent power efficiency. The FM330 series is positioned to expand the 5G landscape to a broader range, covering consumer-level, enterprise-level and industrial-level scenarios.

BARCELONA, Spain, Feb. 26, 2024 /PRNewswire/ — Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek’s T300 5G modem, which is the world’s first 6nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap. By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.

Compliant with 3GPP R17 standards, the FM330 series supports mainstream 5G frequency bands worldwide and is capable of reaching a maximum bandwidth of 20MHz, thus ensuring the peak data rate of up to 227Mbps downlink and 122Mbps uplink, sufficient to meet the demand for 5G applications with less data throughput while balancing the power efficiency. In hardware design, it adopts the M.2 form factor measured at 30x42mm benefiting from the unique RFSOC solution integrated with T300, in addition to the optimized antenna design in 1T2R, which significantly saves the PCB area. Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers’ migration from 4G to 5G. Furthermore, the module provides 64QAM/256QAM (optional) modulation scheme to greatly optimize the cost and size.

5G Dongle solution built-in with Fibocom 5G RedCap module FM330

5G dongles are gaining popularity in providing portable high-speed, ultra-reliable, and on-device connectivity anywhere, anytime, broadening the landscape of 5G FWA to more use cases. Fibocom’s FM330 series supports mainstream operating systems including Windows, Linux, and Android to match the diversity of terminals. Equipped with a standard USB peripheral interface, it is easy to access the internet with plug and play, and can be widely applied to terminal devices such as PC, tablets, drones, industrial routers, and more. Fibocom will leverage the one-stop 5G dongle solution to help customers adapt to the fast-growing marketplace and realize 5G monetization with less time to market.

“As a key part of the newly announced T300 5G modem, RedCap is a means for us to democratize access to 5G features, making it easier for customers to deliver a wide range of 5G-enabled IoT devices,” said Evan Su, General Manager of Wireless Communications Business Unit at MediaTek. “We’ve been working closely with Fibocom as a partner to ensure faster, more reliable 5G products around the world and power the next generation of connectivity.”

“We are honored to introduce the FM330 series with MediaTek at the world-class stage during MWC 2024, the T300 is an advanced chipset platform that is equipped with multiple cutting-edge designs and will be 100% integrated into Fibocom’s FM330 series modules,” said Simon Tao, VP of MBB BU at Fibocom. “The exclusive and robust partnership we shared with MediaTek will reflect on the evolution of 5G towards next stage and beyond, and we have the confidence to expand the 5G adoption to a large-scale ecosystem with scalable, customized wireless solutions.”

Learn more about Fibocom’s RedCap module portfolio at booth #5I33 in hall 5 during MWC Barcelona 2024.

About Fibocom

Fibocom is a global leading provider of wireless communication modules and solutions as well as the first wireless communication module provider listed on China A-shares stock market (stock code: 300638). Fibocom offers a one-stop solution for industry customers by integrating wireless communication modules and IoT solutions. With over two decades of engagement in M2M and IoT communication technology and extensive expertise, we are capable of bringing reliable, convenient, secure and intelligent connectivity service to every industry, enriching smart life with a perfect wireless experience. Fibocom’s product portfolio ranges from cellular modules (5G/4G/3G/2G/LPWA), automotive-grade modules, AI modules, android-smart modules, GNSS modules and antenna service. Together, we aim to empower digital transformation across industries such as ACPC (Always Connected PC), mobile broadband, smart retail, C-V2X, robotics, smart energy, IIoT, smart cities, smart agriculture, smart home, telemedicine, etc.

Find out the latest news at www.fibocom.com, and follow us on LinkedIn /X /Facebook /Youtube.

Media Contact: pr@fibocom.com

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Edimakor V4.0.0 Launches with AI Singing Photos & AI Animation

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NEW YORK, May 24, 2025 /PRNewswire/ — HitPaw Edimakor, known for its work in smart video editing tools, has announced the official launch of Edimakor V4.0.0. This new version introduces a fresh set of features, including a singing avatar tool, expanded image-to-video templates, upgraded text-to-video capabilities, and more control over background removal. These updates are designed to give users more flexibility and options when building creative content from images, text, and audio.

Edimakor V4.0.0 Key Improvements

AI Singing photo

Upload any image whether it’s a real person, cartoon, animal, or character, and turn it into a singing avatar. The tool supports upload audio, making it suitable for fun projects, education, or creative content.

Image-to-Video Templates
Choose from 80+ ready-made templates designed for different themes and situations.

Update two AI models: model 1 has faster generation speed as well as more stable output; model 2 takes longer to generate and is suitable for complex scenes.

Open correlations, modes, resolutions, and reverse cues to allow the user to change control over the quality of the generated video;

AI Animation
Convert written content into video with five visual styles:

Anime

3D Animation

Comic

Cyberpunk

Clay

Background Removal (Image & Video)

For images: After removing the background, users can apply edge feathering and zooming for a cleaner look.

For video: Two modes are available, Quick Mode for fast edits, and Advanced Mode for more precision. Both modes allow edge feathering and edge scaling.

Subtitle Generator

Adjust subtitle length based on preference.

Apply bilingual subtitle templates with one click.

Choose two-color dynamic subtitle styles.

Set subtitle position anywhere on the screen easily.

Continued Commitment to Practical Tools

Edimakor V4.0.0 reflects a clear effort to build features that respond directly to how people create and edit videos today. Instead of adding tools for the sake of it, each update is designed to solve specific problems, whether it’s making editing faster, improving visual quality, or giving users more control. The goal remains simple: make content creation more accessible, efficient, and adaptable for anyone working with video.

For more information:
https://edimakor.hitpaw.com

Follow Edimakor on social media:
X/Twitter: https://x.com/HitpawEdimakor
YouTube: https://www.youtube.com/@HitPawEdimakorOfficial
Instagram: https://www.instagram.com/edimakor_official

This release was issued through Send2Press® on behalf of the news source. For more information, visit Send2Press Newswire at https://www.send2press.com/.

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SOURCE HitPaw. Co., Ltd

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COMPUTEX 2025: MiTAC Powers Sustainable AI Data Centers with New Server & Cooling Tech

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TAIPEI, May 24, 2025 /PRNewswire/ — At COMPUTEX 2025, MiTAC Computing Technology Corp., a subsidiary of MiTAC Holdings Corp. (TWSE: 3706), unveiled its bold new vision: from hardware provider to full-solution AI and data center innovator. With future-ready solutions covering AI training and inference, high-performance computing (HPC), rack-level liquid cooling, GPU resource management, and real-time data mobility, MiTAC delivers an integrated platform for next-generation data centers.

Rick Hwang, President of MiTAC Computing, emphasized the company’s commitment to open innovation. By aligning with global tech partners and Open Compute Project (OCP) standards, MiTAC now delivers full-spectrum solutions—from server to rack—featuring advanced liquid cooling technology. This simplifies data center operations and improves computing performance and energy efficiency—all driving the vision of smarter, high-performance, and sustainable infrastructure.

“This marks our first appearance at COMPUTEX since the MiTAC brand integration,” Hwang noted. “We’re excited to bring customers a more open, flexible, and deeply integrated portfolio of solutions—reinforcing our role as a trusted partner for AI and data center innovation worldwide.”

Empowering AI with Sustainability and Real-World Solutions

MiTAC Computing is embracing the future of AI with the theme “Empowering Unlimited Possibilities: AI x Sustainability, spotlighting real-world application and introducing a suite of new solutions designed to enable smarter, greener, and more scalable AI ecosystems.

At COMPUTEX, MiTAC Computing displayed an impressive range of cutting-edge AI inference servers. The spotlight is on the MiTAC G4527G6 (MGX™ 4U), featuring eight latest-generation NVIDIA RTX PRO™ 6000 Blackwell server GPUs, the first-ever debut of the NVIDIA MGX™ PCIe Switch board with ConnectX®-8 SuperNIC, and dual Intel® Xeon® 6767P processors. Additionally, the MiTAC G8825Z5 (8U) is equipped with two AMD EPYC™ 9005 series processors and eight newly revealed AMD Instinct™ 350 series GPUs, designed specifically for generative AI, inference workloads, and large language model processing.

Introducing Full-Rack Liquid Cooling Solutions

MiTAC Computing also introduced its full-rack liquid cooling systems, featuring both Liquid-to-Air and Liquid-to-Liquid cooling options. Showcasing the latest in-row Coolant Distribution Units (CDUs) from top-tier global partners, these systems deliver over 2000 kW of cooling power—engineered for intense thermal demands of AI and HPC workloads. Designed for easy integration and customization, these systems include MiTAC’s own monitoring software for optimized management.

Additionally, MiTAC also debuted its Direct Liquid Cooling (DLC) multi-node HPC server, the MiTAC C2820Z5. Built for extreme high-performance computing, this server’s DLC system efficiently cools high-power CPUs and fits within ORv3 standard racks powered by 48VDC – delivering significant energy savings vs. traditional air-cooling technology.

Partnering with AMD for Next-Gen Performance

On May 21st, MiTAC Computing welcomed long-term partner Ted Marena, AMD GPU Market Development Director, who shared the latest trends in AI GPU development and product offerings between MiTAC and AMD. Ken Lin, Senior Vice President of Commercial Business at AMD Taiwan, remarked, “MiTAC and AMD have continuously launched high-performance server platforms integrating AMD EPYC™ processors with AMD Instinct™ GPUs. We are also actively developing the MI350 GPU series with liquid cooling systems to support even more demanding AI cluster workloads, fully addressing the modern data center’s need for both AI computing power and energy efficiency.”

Rick Hwang added that AI technology is rapidly accelerating. MiTAC is committed to enabling future AI applications with solutions that combine high performance, low power consumption, and intelligent management. By optimizing data center infrastructure, MiTAC aims to assist global customers in advancing efficient and sustainable development in key sectors such as AI, HPC, and cloud computing, promoting the widespread adoption of next-generation AI technologies.

Learn more: https://www.mitaccomputing.com/en/campaign/computex2025

About MiTAC Computing Technology Corp.

MiTAC Computing Technology Corp., a subsidiary of MiTAC Holdings, delivers comprehensive, energy-efficient server solutions backed by industry expertise dating back to the 1990s. Specializing in AI, HPC, cloud, and edge computing, MiTAC Computing employs rigorous methods to ensure uncompromising quality not just at the barebone level but, more importantly, at the system and rack levels—where true performance and integration matter most. This commitment to quality at every level sets MiTAC Computing apart from others in the industry. The company provides tailored platforms for hyperscale data centers, HPC, and AI applications, guaranteeing optimal performance and scalability.

With a global presence and end-to-end capabilities—from R&D and manufacturing to global support—MiTAC Computing offers flexible, high-quality solutions designed to meet unique business needs. Leveraging the latest advancements in AI and liquid cooling, along with the recent integration of Intel DSG and TYAN server products, MiTAC Computing stands out for its innovation, efficiency, and reliability, empowering businesses to tackle future challenges.

Website: https://www.mitaccomputing.com/

 

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SOURCE MiTAC Computing Technology Corp.

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“Made-in-Shanghai” Blossoms in Umeda, Celebrating Creativity & Innovation

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OSAKA, Japan, May 24, 2025 /PRNewswire/ — As the Chinese solar term “Grain Buds” kicked in, a fashion summer breeze carried “Made-in-Shanghai“, an official five-day multi-format event, exhibition and forum series created by Shanghai, to Grand Green Osaka of Umeda, north of JR Osaka Station, the largest transportation hub and a super popular commercial destination in Japan.

This is not just a showcase of Shanghai’s fashion superpower, but an intimate encounter of Shanghai’s fashion ecosystem with local visitors. As FANG Wei, China’s Vice Consul General in Osaka remarked at the event’s grand opening on May 21st, “Made-in-Shanghai” took the ShanghaiOsaka ties to a new level through showcasing tech-savvy and Shanghai-style fashion, beauty and creative products to local and international visitors, while fostering business cooperation amidst the shift from “Made-in-China” to “Created-in-China“.

This overseas debut of Shanghai’s fashion and beauty parks and communities appeals greatly to Osaka’s business community. CREATER, a Shanghai-based property operator shared the experience of transforming the historic Yuyuan Road into a fashion and creative hub, featuring worldwide launches of products and a shining cluster of creative companies. Likewise, Fengxian District’s Oriental Beauty Valley, hailed as China’s beauty and cosmetic industry capital, stunned discerning Japanese consumers with leading Chinese beauty brands and innovation.

As an intimate encounter with Shanghai lifestyle, the Public Open Days attracted KOLs and Japanese consumers to a China market with fashion, home furnishings, beauty products, and even a tea-sake oriental tea house. Shanghai Chicmax exhibited its new products and introduced its Japanese R&D center and factory. Shanghai brand “nice rice” offered to consumers simple-lifestyle apparels. Hankyu Department Store opened “WINDow of EAST” pop-up stores with works from six Chinese young designers, curated by Shanghai Fashion Designers’ Association.

The event went deeper to a “Shanghai-Osaka Forum”, featuring a panel on “Evolution of Consumer Culture”, consisting of WWD China chief content officer, founders of Herbeast and RichandRare Jewellery, Confis’ senior partner and a journalist from WWD Japan. Another forum delved deep into sustainable urban renewal and green design, a common challenge for Shanghai and Osaka, featuring Dezeen’s China editor, famous Japanese architects, Aedas’s global design principal and UNS’s director.

The event is guided by China’s Ministry of Industry and Information Technology, hosted by Shanghai Commissions of Economy & Informatization and Commerce, and Administration for Market Regulation, and executed by Commission of Commerce in Changning District, Shanghai Design Week, Shanghai Fashion Designers’ Association and the Paper.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/made-in-shanghai-blossoms-in-umeda-celebrating-creativity–innovation-302464723.html

SOURCE the Paper

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