Shaping the Future of AI with Cutting-Edge Connectivity, Computing, and Multimedia Tech

TAIPEI, May 19, 2025 /PRNewswire/ — At Computex 2025, MediaTek will present its latest advancements in AI computing under the theme “AI for Everyone: From Edge to Cloud”. Dr. Rick Tsai, Vice Chairman and CEO of MediaTek, will deliver a keynote on May 20, the opening day of the exhibition, offering key insights into the roles of AI, 6G, edge and cloud computing in digital transformation and demonstrate how MediaTek’s vision is empowering a connected, intelligent world – from edge to cloud — for everyone.

“We are looking forward to highlighting MediaTek’s long-standing expertise in connectivity, computing, and multimedia products and technologies,” said Joe Chen, President and COO of MediaTek. “These comprehensive solutions from edge to cloud demonstrate our cutting-edge portfolio and its collaborations with global ecosystem partners, aiming to offer AI-driven experiences across multiple applications and promote the broader adoption of generative AI.”

Hybrid Computing Integrates Computing and Connectivity, Empowering a New AI World 

To address the issue of information silos in the era of generative AI, MediaTek has proposed a hybrid computing concept that integrates both computing and communications. This approach fosters greater collaboration among various AI agents and facilitates smoother interaction throughout the AI ecosystem. In line with this vision, MediaTek will showcase the world’s first 5G Generative AI Gateway as a conceptual hybrid computing solution. This device merges MediaTek’s leading 5G FWA platform with on-device generative AI capabilities in a single device, delivering high performance, robust privacy, substantial bandwidth, and low latency. Having completed proof-of-concept (PoC) trials with a leading telecommunications infrastructure provider, it was selected for this year’s Computex Best Choice Award.

Building on this concept, MediaTek will demonstrate a fully connected smart home vision through AI Hub to connect household devices, with on-device AI agents collaborating as customized personal assistants. MediaTek and NVIDIA will also co-present an “edge cloud” that consists of a “RAN-cloud” (combining Radio Access Network (RAN) nodes with computing resources) and a “device cloud” (consisting of device-based computing resources). The result is low latency, carrier-grade privacy, and personal data governance in agentic AI and dynamic resource allocation scenarios.

Transforming AI for the Cloud: MediaTek’s Impact and Innovation

MediaTek is revolutionizing the AI and cloud technology ecosystem through its strategic collaboration with NVIDIA, resulting in the creation of the NVIDIA GB10 Grace Blackwell Superchip for NVIDIA DGX Spark. This partnership has led to the creation of the world’s smallest AI supercomputer for cloud developers, delivering an unprecedented 1000 TOPS performance. DGX Spark is designed to run AI models with up to 200 billion parameters locally, bringing the power of NVIDIA AI directly to the desktop.

MediaTek’s custom ASIC solutions are tailored for AI accelerators and datacenters, addressing the evolving complexities of dense compute and high-speed networking in custom silicon design. Our world-class roadmap includes advanced solutions utilizing cutting edge process nodes and high-speed interconnects to meet demanding AI networking speeds, along with adopting modern packaging and custom HBM integrations. These advancements are driving significant enhancements in performance and efficiency, underscoring MediaTek’s commitment to pushing the boundaries of technology and delivering leading-edge solutions for the most demanding applications.

MediaTek Dimensity Auto Brings Together 5G and AI for Next-Gen Automotive Applications

The MediaTek Dimensity Auto platform continues to push innovation forward in smart, connected, software-defined vehicles. The Dimensity Auto Cockpit solutions offer scalable hardware and software platforms with advanced AI capabilities. Its flagship Dimensity Auto Cockpit C-X1 chipset integrates the latest generative AI models with AI acoustic technologies for personalized virtual assistant service. The Dimensity Auto Cockpit platform also supports 8K and Dolby Vision HDR, alongside Dolby Atmos, for a truly exceptional in-vehicle entertainment experience.

The flagship Dimensity Auto Connect MT2739 features the world’s first in-vehicle 5G DSDA 3Tx technology, intelligent driving scene recognition, and AI-powered network optimization, automatically switching between connectivity modes based on real-time needs. This substantially improves connection speed and stability, enhancing the overall user experience. MediaTek will also demo a 5G NG eCall feature; in the event of a severe collision, the vehicle will automatically initiate a call for emergency assistance.

MediaTek Genio Platform Opens a New Era of IoT AI

Designed for a broad range of IoT devices spanning smart homes, smart retail, and industrial and commercial applications, MediaTek’s Genio IoT platform supports the latest generative AI models, human-machine interfaces (HMI), multimedia, and connectivity technology. Together with various partners, MediaTek will showcase vertical applications including motorcycle control boards, robotic arms, retail, healthcare, and service robots. Addressing the fragmented IoT market, the Genio platform provides a one-stop development toolkit. It integrates NVIDIA TAO, a model training toolkit in MediaTek’s NeuroPilot AI development tool, creating a comprehensive edge AI development environment that supports Android, Yocto Linux, and Ubuntu operating systems. The newly introduced Genio 720/520 platform features generative AI capabilities for added value in vertical applications. MediaTek has already engaged in co-development projects with major domestic and international IoT players, such as Advantech, ADLINK, and VIA.

Connectivity Technology to Support Hybrid AI Computing 

Smartphones and wearables often suffer reduced antenna configurations due to size constraints, compromising connectivity performance. MediaTek’s device collaborative multi-antenna technology allows a wearable to aggregate and receive 5G/6G signals through another device nearby, drastically boosting throughput—especially indoors where base station signals may be more prone to blockage—a boon for low-latency applications. Meanwhile, the MediaTek Filogic Wi-Fi optimizes user experiences with AI-enhanced features. It accurately detects interference sources, automatically adjusts settings, and identifies different applications across multiple devices to intelligently allocate bandwidth. These capabilities ensure smoother operation for low-latency scenarios. Additionally, MediaTek’s industry-leading, next-generation 5G-Advanced LEO NR non-terrestrial network (NTN) over the Ku-band will be showcased in Taiwan for the first time.

Multimedia Technologies That Elevate Smart Display Experiences 

MediaTek leverages extensive multimedia expertise to bolster edge computing. Highlights include its world’s first 15,000+ zone RGB mini-LED local-dimming control SoC for large screens. It offers high brightness, a wide color gamut, low power consumption, and compatibility with large screen sizes. Compared to OLED, RGB mini-LED increases brightness by 276%, expands the color gamut by 18%, saves 20% power at the same size, and surpasses OLED’s size limitations by 18%. Compared to White mini-LED, RGB mini-LED improves viewing angles by 14%, expands the color gamut by 16%, and reduces power consumption by 10%. In addition, MediaTek introduces the world’s first 8K 60Hz AI-enhanced scaler, featuring pixel-based processing for zero-frame latency and intelligent scene-detection for ultra-realistic visuals, with no separate operating system required. This solution suits both consumer and commercial displays.

For more information on MediaTek at Computex 2025, visit booth M0806 or visit: https://www.mediatek.com/computex2025

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About MediaTek Inc.

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.

Media Enquiries: 

Kevin Keating
pr@mediatek.com 

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SOURCE MediaTek Inc.

Nexus 2.3 Build Expands Hardware Compatibility and User Experiences; New Y70, FA12 Fan Colorways and Gen. 5 Hyper Riser Details Revealed

TAIPEI, Taiwan, May 19, 2025 /PRNewswire-PRWeb/ — HYTE, a leading manufacturer of cutting-edge PC components and peripherals, announced all-new features coming to its revolutionary Nexus software solution with its 2.3 update at this year’s Computex. The company also shared details on its Computex lineup, including their upcoming PCIE 5.0 Hyper Riser, and new colorways for its FA12 fans and Y70 case. For more information, please visit: https://hyte.co/computex25-pr

HYTE’s 2.3 update for its Nexus software will focus on increased compatibility with the latest PC hardware via further integration of OpenRGB’s SDK and other hardware libraries for precise performance monitoring. The 2.3 update will also expand on HYTE’s “Powered by Nexus” hardware capabilities with all new widgets for the Y70 Touch Infinite display – including new lighting and FPS widgets – and all-new multi-stat panels for HYTE’s Q-Series line of AIO liquid coolers.

Some of HYTE’s other items from its Computex lineup include:

PCIE 5.0 Hyper Riser – Designed to unleash the full potential of next generation PC graphics, HYTE is set to launch its Hyper Riser cable soon, which offers industry-leading performance and bandwidth set against the PCI Express 5.0 standard.Matcha Milk Y70 – After listening to the community demand, HYTE is excited to share an all-new colorway for its popular Y70 case that paints the stylish chassis in deep and distinct “Matcha Tea”-green colors.HYTE is also releasing a “Matcha Milk” Y70 Touch Infinite display upgrade kit that will be available as a separate purchase.Milky FA12 Four-Fan Packs – New colorways, including Strawberry Milk,Taro Milk, Snow White, and Matcha Milk, will soon be available Like the original FA12 fans, these also offer a hybrid blade design for the best balance of performance in airflow and static pressure, along with PWM control for a higher range of speeds with more precise control.

These items, along with the recently announced X50 and X50 Air Modern Performance Case from HYTE, are on display in the HYTE Suite at Computex 2025. For all items, fans can visit HYTE.com and click “Notify Me” to be informed on when these items become available for purchase

PRICING & AVAILABILITY
Details on launch timing for Nexus 2.3, the PCIE 5.0 Hyper Riser, Milky FA12 Four-Fan Packs, the Y70 Matcha Milk Modern Aesthetic Case, and the Y70 Touch Infinite Matcha Milk display upgrade will be shared at a later date. MSRP for these products will also be shared later.

WEBSITES:
To learn more about HYTE’s Computex lineup, please visit: https://hyte.co/computex25-pr

IMAGES
For additional images of HYTE’s Computex lineup, please visit: https://hyte.co/computex25-press-kit

ABOUT HYTE
HYTE is a lifestyle-centered brand focused on enhancing play with its fresh and innovative PC components and accessories. Designed to fuel passions in gaming, music, the arts and entertainment, all HYTE products are rigorously researched and tested before they are brought to fruition. HYTE, as a company and its products, are inspired by the needs and behaviors of its community and the many ways people play. HYTE is committed to designing products to help people experience play throughout their lifestyle, no matter what that may be. To learn more, please visit: http://www.hyte.com

Media Contact

Steven Kunz, HYTE, 9099649898, steven.kunz@hyte.com, http://www.hyte.com

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SOURCE HYTE

Latest PC Chassis Balances Form and Function Delivered through a Disciplined Multi-Dimensional Design with Flagship Capabilities, Feature Sets, and Highly Accessible Pricing

TAIPEI, Taiwan, May 19, 2025 /PRNewswire-PRWeb/ — HYTE, a leading manufacturer of cutting-edge PC components and peripherals, revealed the X50 and X50 Air, all-new PC cases with prosumer-grade engineering that delivers unobstructed airflow, incredible durability, future-proof component compatibility, and thoughtful design for superior build experiences. Both cases are expected to launch in Summer 2025. To learn more, please visit: https://hyte.co/computex25-pr

“At HYTE, we don’t want to get too comfortable. While everyone loves our Y-series of cases, it is important we continue experimenting on our core component designs to achieve further innovation that will trickle down to the PC community,” said Rob Teller, Product Director at HYTE. “Our new X50 and X50 Air chassis represent HYTE’s goals of reimagining the modern PC with innovative design, function, and experiences at competitive prices, and we are eager to see how our community embraces this new case.”

MODERN PERFORMANCE CASE
HYTE’s new X50 cases redefine traditional PC chassis with a fully rounded design that opens several performance optimizations. These include a Full-Coverage Micro-Mesh front and side panel for low-pressure and low-resistance air intake, HYTE’s patent-pending Louvered Blade Ventilation that reduces exhaust impedance and reinforces case rigidity, and a structural top-mounted PSU canopy for hassle-free cable management, which also lets the PSU act as an exhaust fan to remove hot air. In addition to Cold-Floor Cooling that keeps any GPU cool with up to 3x 120mm extra-thick fans, the X50 and X50 Air also features massive 360mm radiator support on adjustable front and side, with a total capacity of up-to-10 fans in a compact mid-tower profile.

STRENGTH SHAPED BY DESIGN
The X50 and X50 Air balance form and function with a disciplined multi-dimensional design that seamlessly blends premium materials with exquisite craftsmanship. The X50 is equipped with a sweeping curved and Shatter-Proof(ish) 4mm-thick Laminated Acoustic Glass panel for maximum visibility into the PC that significantly enhances passive noise damping. For those who prefer the X50 Air, the glass panel is replaced with a curved Full-Coverage Micro-Mesh panel that further enhances the case’s airflow capabilities.

In addition to using 1 mm-thick steel that offers enhanced chassis strength and durability, the X50 cases are HYTE’s cleanest and most cohesive design as it was manufactured with an Automative Grade Tooling with 4x tighter tolerances than with industry-standard cases to achieve the rounded compound curves. While the X50 Air only comes in Snow White and Pitch Black colorways, the standard X50 will be available across a rainbow of colorways, including Snow White, Pitch Black, Cherry, Taro Milk, Strawberry Milk, and Matcha Milk colorways.

A SUPERIOR BUILD EXPERIENCE    
The X50 and X50 Air cases’ rounded design contributes to the ease of any PC build without being harsh on a builder’s hands. The tool-less front and side panels also contribute how easy it is to build, upgrade, maintain, and move the case around. In addition to covertly routed cable-routing channels for cable management, the spacious and clutter-free interior provides ample room to build inside the case with no obstructions. Both cases are equipped with modular multi-stage front radiator brackets for AIO compatibility and aesthetic tuning for RGB fans.

The X50 and X50 Air will be on display in the HYTE Suite at Computex 2025. Fans can visit HYTE.com and click “Notify Me” to be informed on when the X50 and X50 Air will become available for purchase.

PRICING & AVAILABILITY
The X50 Modern Performance Case will be available for purchase at $149.99 MSRP + VAT / Tariff, and is expected to launch in Summer 2025.

The X50 Air Modern Performance Case will be available for purchase at $119.99 MSRP + VAT / Tariff, and is expected to launch in Summer 2025.

WEBSITES:
To learn more about the X50 and X50 Air cases, please visit: https://hyte.co/computex25-pr

IMAGES
For additional images of the X50 and X50 Air, please visit: https://hyte.co/computex25-press-kit

ABOUT HYTE
HYTE is a lifestyle-centered brand focused on enhancing play with its fresh and innovative PC components and accessories. Designed to fuel passions in gaming, music, the arts and entertainment, all HYTE products are rigorously researched and tested before they are brought to fruition. HYTE, as a company and its products, are inspired by the needs and behaviors of its community and the many ways people play. HYTE is committed to designing products to help people experience play throughout their lifestyle, no matter what that may be. To learn more, please visit: http://www.hyte.com

Media Contact

Steven Kunz, HYTE, 9099649898, steven.kunz@hyte.com, http://www.hyte.com 

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SOURCE HYTE