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China Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report 2023 Featuring 11 Automotive Power Supply Providers and 7 Automotive Power Supply Chip Suppliers

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DUBLIN, Feb. 15, 2024 /PRNewswire/ — The “Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report, 2023” report has been added to ResearchAndMarkets.com’s offering.

Automotive power supply and IC: Chinese chips are promising in the evolution from physical integration to system integration

As the core component of a new energy vehicle, automotive power supply is mainly used to convert the electric energy of the power battery into the voltage and current suitable for the vehicle, and also provides stable power support for the electrical equipment inside the vehicle. The surging new energy vehicle sales spur the boom of automotive power supply market.

OBCs, DC/DC converters and PDUs in automotive power supply can be independent components or integrated systems. As per the product structure of mainstream suppliers in recent two years, the proportion of independent components is declining sharply, while the shipments of ‘two-in-one’, ‘three-in-one’ and ‘all-in-one’ integrated forms are jumping.

All-in-one solution from physical integration to system integration

The integration trend of automotive power supply is clear, and OBCs, DC/DC converters and PDUs are further integrated with electric drive and ECU. FinDreams Powertrain, Changan NE, Huawei Digital Power, etc. are all promoting the all-in-one electric drive assembly integrated with OBCs. The mode of high integration can save space, reduce weight and improve the overall efficiency.

In the future, the ‘all-in-one’ integrated solution will evolve from mechanical hardware integration to power components integration, and deeply integrate software with the backend to form a control domain for the drive system – fully combining battery data, electric drive data, charging data, etc., evolving towards the power domain controller.

Huawei: the hyper-converged ‘ten-in-one’ power domain module launched in April 2023 pioneers chip integration, power integration, function integration and domain controller integration to reduce the BOM by 40% and the number of chips by 60%, thus improving the development efficiency of automakers by 30%. In addition, it enables more concise layout of the front cabin of vehicles, releases more interior space and provides better comfort experiences for occupants.

ST: ST New Energy Vehicle Innovation Center has built a range of system solutions based on Stella series, including the 22kW Stellar E-based OBC-DC/DC combined solution and the Stella P-based all-in-one powertrain domain controller.

The all-in-one powertrain domain controller is based on ST’s latest Stellar P series automotive MCU, and integrates the following components: main drive inverter, vehicle control unit (VCU), battery management unit (BMU) motherboard, on-board charger (OBC) and DC/DC converter. The highly integrated solution improves power density, reduces the number of high/low-voltage connectors, and optimizes the cost of hardware BOM and software development and maintenance.

Localization is promising in the upstream supply chain of automotive power supply.

Silicon carbide is widely used in automotive power supply products.

Conventional silicon-based power semiconductors can only limitedly improve the efficiency and power density of automotive power supply, while SiC power devices have advantages in on-resistance, blocking voltage and junction capacitance, and are rapidly introduced in high-end new energy electric vehicles.

OBCs and DC/DC converters have started wide adoption of SiC devices, for instance, PFC diodes are replaced by SiC SBDs, or DC/DC primary circuit MOS tubes of OBCs are substituted by SiC MOS, and all-SiC solution is expected to enter the stage of mass application soon. So far, BYD, Tesla, Hyundai, Jaguar Land Rover, Geely, Renault, SAIC Volkswagen and Nissan among others have used the third-generation SiC semiconductor devices in automotive power supply.

Infineon: In June 2023, Infineon presents its new generation of 1200 V CoolSiCT MOSFETs in TO263-7 for automotive applications. The automotive-graded silicon carbide (SiC) MOSFET generation offers high power density and efficiency, enables bi-directional charging and significantly reduces system cost in on-board charging (OBC) and DC-DC applications. In addition, the 1200 V CoolSiC family member offers best-in-class switching performance through 25% lower switching losses and lowers the SiC MOSFET junction temperature by 25%, compared to the first generation.

The pace of homemade automotive power supply MCUs in China replacing imported counterparts quickens.

At present, major automotive power supply IC vendors are working to improve product performance to meet ever higher requirements.

TI: In the existing automotive power supply system, customers often have high requirements for high efficiency and better thermal performance. Both OBCs and communication power supply products are getting smaller, and the switching frequency is also becoming higher, posing bigger EMI challenges. In March 2023, TI introduced standalone active electromagnetic interference (EMI) filter integrated circuits (ICs), enabling engineers to implement smaller, lighter EMI filters, to enhance system functionality at reduced system cost while simultaneously meeting EMI regulatory standards.

The new portfolio of stand-alone active EMI filter ICs can sense and cancel common-mode EMI by as much as 30 dB at frequencies between 100 kHz and 3 MHz in single- and three-phase AC power systems. This capability enables designers to reduce the size of chokes by 50%, compared to purely passive filter solutions.

Currently, ST and TI’s solutions prevail in the automotive power supply market, especially TI’s C2000 series chips that are still seen in popular electric models, such as Xpeng P7, and are used by mainstream OBC/DC-DC suppliers such as Shinry Technologies and Zhejiang EV-Tech as the main control chips.

In the recent two years, Chinese main control chip suppliers have stood a chance to replace foreign counterparts with the products made in China. Domestic suppliers have accelerated their layout in the field of main control chips, and are developing from basic OBC and DC-DC applications to all-in-one dynamic domains.

Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report, 2023 highlights the following:

Automotive power supply (technology trends, market size, products & solutions, etc.);On-board charger (OBC) (product structure, technology development trends, market size, structure of main suppliers, price trend, etc.);DC/DC converter (technology trends, market size, competitive landscape, cost structure, main solutions, etc.);Power distribution unit (PDU) (product structure, technology trends, market size, competitive landscape, cost structure, solutions of main suppliers, etc.);Main automotive power supply components (MCU, power supply IC, relay, PFC converter, etc.) (product structure, main suppliers and products, etc.);Main automotive power supply suppliers (product line, technology layout, product price, main customers, market position, etc.).

Key Topics Covered:

1. Automotive Power Supply Industry Development
1.1 Development Status of China New Energy Vehicle Industry
1.2 Overview of New Energy Vehicle Power Supply Products
1.3 Development Trend of Automotive Power Supply Technology
1.4 Automotive Power Supply Market Size and Share
1.5 Automotive Power Supply Cost, Price and Supply Chain
1.6 Automotive Power Supply Suppliers and Product Solutions

2. Automotive On-board Charger (OBC) Technology and Market
2.1 OBC Overview
2.2 Development Trend of OBC Technology
2.3 OBC Market Size and Share
2.4 OBC Cost, Price and Supply Chain
2.5 OBC Suppliers and Product Solutions
2.6 Main Suppliers of New Energy Passenger Car OBC

3. DC/DC Converter Technology and Market
3.1 DC/DC Converter Overview
3.2 Development Trend of DC/DC Technology
3.3 DC/DC Market Size and Share
3.4 DC/DC Cost, Price and Supply Chain
3.5 DC/DC Suppliers and Product Solutions

4. Power Distribution Unit (PDU) Technology and Market
4.1 PDU Product Overview
4.2 Development Trend of PDU Technology
4.3 PDU Market Size and Share
4.4 PDU Cost, Price and Supply Chain
4.5 PDU Suppliers and Product Solutions

5 Research on Vehicle Power Supply Chain (Chips, Components)
5.1 Analysis of Vehicle Power Supply Solution
5.2 Key Technology of Vehicle Power Supply: MCU
5.3 Key Technology of Automotive Power Supply: Power Chip
5.4 Key Technology of Automotive Power Supply: Isolation Chip
5.5 Key Technology of Automotive Power Supply: silicon carbide
5.6 Key Technology of Automotive Power Supply: relay
5.7 Key Technology of Automotive Power Supply PFC converter

6. Automotive Power Supply Providers
6.1 Shenzhen VMAX New Energy Co., Ltd.
6.2 FinDreams Powertrain
6.3 Zhejiang EV-Tech Co., Ltd.
6.4 Tesla (Sanmina Corporation)
6.5 Shinry Technologies
6.6 Tiecheng Information Technology Co., Ltd.
6.7 Zhuhai Enpower Electric Co., Ltd.
6.8 KOSTAL
6.9 Shanghai Huawei Digital Energy Technology Co., Ltd.
6.10 Meta System (Chongqing) (Shenzhen Deren Electronic )
6.11 Valeo

7. Automotive Power Supply Chip Suppliers
7.1 ST
7.2 TI
7.3 NXP
7.4 OnSemiconductor
7.5 ChipON
7.6 SemiDrive
7.7 Silergy

For more information about this report visit https://www.researchandmarkets.com/r/xer5pl

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Huawei Launches All-New Xinghe Intelligent Campus with Full Upgrades, Maximizing Enterprises’ Intelligent Productivity

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September 21, 2024

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SHANGHAI, Sept. 21, 2024 /PRNewswire/ — During HUAWEI CONNECT 2024, the Xinghe Intelligent Campus session was successfully held, attracting more than 200 industry pioneers, experts, and scholars from around the world to explore campus network trends and technological innovations. Also at the event, Huawei unveiled its all-new Xinghe Intelligent Campus Solution that stands out for full upgrades to wireless, application, and operations & maintenance (O&M) experience.

Shawn Zhao, President of the Campus Network Domain, Huawei’s Data Communication Product Line, said, “As video conferencing, AI terminals, and AI applications become more widespread, the campus network access density has increased threefold, and the demand for bandwidth has grown tenfold. In this case, users place new requirements on the assurance for AI applications and audio/video services while expecting more intelligent O&M.”

To meet these needs, Huawei launched its all-new Xinghe Intelligent Campus Solution with full upgrades. Specifically, this solution upgrades wireless experience in performance, roaming, and IoT convergence. It also leverages X-Scheduler (an experience scheduling engine) to upgrade application experience, while drawing on AI-assisted decision-making and a tidal prediction algorithm to upgrade O&M experience. These help customers build an industry-leading digital infrastructure and facilitate the digital and intelligent transformation of enterprises.

In addition, the solution provides end-to-end security assurance. On the wireless side, the innovative Wi-Fi Shield technology radically prevents packet eavesdropping on the air interface. On the wired side, the full-link MACsec capabilities from switches to APs ensure secure campus network data transmission since the very beginning.

Also at the session, leading analyst firms, customers, and partners in various industries shared their unique insights, best practices, and successful cases. Key speakers include Sian Morgan, Research Director of Dell’Oro Group; Dr. Haitham S. Hamsa, Professor of Information Technology, Cairo University; Shang Qun, Assistant to the Director of the Computing Center, Peking University; Sun Pan, Director of Infrastructure Operations Dept, System Digitalization Dept, FAW Group; Connee Zhang, CEO of CypressTel. Their valuable practices will provide a unique reference for the digital and intelligent transformation of enterprises across industries.

Looking ahead, Huawei believes that the Xinghe Intelligent Campus Solution will become the preferred choice for global enterprises’ digital and intelligent transformation to reap more benefits.

For more information about Huawei’s Xinghe Intelligent Campus Solution, visit https://e.huawei.com/en/solutions/enterprise-network/campus-network.

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SOURCE Huawei

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Duplicate File Finder from Nektony goes global: Now available in six languages

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16 mins ago

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September 21, 2024

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Nektony proudly announces the release of Duplicate File Finder version 8, featuring six additional languages and the highly anticipated Dark Mode.

ODESA, Ukraine , Sept. 21, 2024 /PRNewswire-PRWeb/ — Nektony is excited to unveil Duplicate File Finder version 8, a powerful tool designed to help users efficiently find and remove duplicate files on their Macs, freeing up valuable disk space and improving system performance.

With the latest update, Duplicate File Finder is now accessible to an even broader audience, thanks to its new multilingual support. In addition to localization, version 8 introduces Dark Mode.

With the latest update, Duplicate File Finder is now accessible to an even broader audience, thanks to its new multilingual support:

FrenchItalianUkrainianRussianChineseGermanSpanish

The addition of these languages ensures that users around the world can navigate and utilize the app in their native language, making the process of cleaning up duplicate files even more intuitive and user-friendly.

In addition to localization, version 8 introduces Dark Mode, allowing users to switch to a darker interface that’s easier on the eyes, especially in low-light environments. Dark Mode not only enhances visual comfort but also provides a modern and stylish look to the app, aligning with macOS’s native Dark Mode functionality.

Best strengths

Accurate byte-to-byte resultsFinding all types of duplicate filesSupport of any drive type, Photos, and Music librariesThe Auto Select feature to quickly select all duplicatesFinding similar photos and musicComparing and merging foldersCleaning up duplicates from similar foldersChecking two files to see whether they are duplicates

Availability:

Duplicate File Finder v.8 is available for download from the Mac App Store. It is compatible with macOS 10.13 or later and requires a 64-bit processor. The app is free to use for finding duplicate files, while advanced features are available through an in-app purchase of $14.95.

Brief Description:

App Name: Duplicate File FinderSystem Requirements: macOS 10.13 – 15, 64-bit processorPrice: Free, with advanced features for $14.95

Key Links:

Duplicate File Finder product pageDownload Duplicate File Finder from the App Store

About Nektony:

Nektony is a trusted developer of Mac optimization software tools with over 10 years of experience and millions of satisfied customers worldwide. Nektony’s products include MacCleaner Pro, App Cleaner & Uninstaller, Disk Space Analyzer, and more. The company’s mission is to help users get the most out of their Macs by providing simple, effective, and affordable solutions.

For more information, please contact:

pr@nektony.com

nektony.com

Copyright © 2011 Nektony.

All Rights Reserved. Apple, the Apple logo, and Macintosh are registered trademarks of Apple Inc. in the U.S. and other countries.

Media Contact

Asya Karapetyan, Nektony, 34 624983684, pr@nektony.com, https://nektony.com/help

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2024 World Manufacturing Convention Showcases Next-Gen Technologies

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16 mins ago

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September 21, 2024

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HEFEI, China, Sept. 21, 2024 /PRNewswire/ — As technology and innovation converge, a grand feast celebrating the manufacturing industry is commencing. On September 20, the 2024 World Manufacturing Convention opened its doors at the Hefei Binhu International Convention and Exhibition Center in Hefei, Anhui Province. As a premier event in the manufacturing sector, this convention has brought together top global enterprises, innovative technologies, and cutting-edge concepts to present a feast of technology and innovation to the attendees.

In the Smart Robotics Zone, a variety of robots are busy showcasing their diverse capabilities. The latest unveiling at Jianghuai Advance Technology Center, the ‘Qijiang No.2’ humanoid robot, standing at 1.8 meters tall and weighing 60 kilograms, with 38 degrees of freedom throughout its body. It can not only perform basic human limb movements but also execute delicate tasks like folding clothes, opening bottles, pouring water, and washing dishes with ease. Moreover, it can navigate rough terrains, resembling an intelligent steel companion, sparking anticipation for the future of automation and intelligence in the manufacturing industry.

In the 3D Printing Zone, exquisite exhibits leave spectators in awe. From intricate mechanical components to lifelike artworks, 3D printing technology, with its precise replication and rapid prototyping capabilities, has brought revolutionary changes to the manufacturing industry. Inside the zone, staff are busy calibrating equipment, preparing for a spectacular 3D printing showcase. Meanwhile, the third-generation locally developed 72-qubit superconducting quantum computer, “Origin Wukong,” from the Hefei High-tech Zone, is capturing significant interest. This quantum computer, with over 80% domestic components from hardware to quantum chips, operating systems, and application software, boasts unimaginable computing power, paving new paths for future research, finance, and numerous other fields, shining brightly as a rising star in the quantum technology realm.

Green energy and environmental protection technologies are also significant highlights of this convention. The Green Manufacturing Zone showcases a wide array of energy-saving and eco-friendly equipment and renewable energy products. The application of these technologies not only reduces energy consumption and emissions in manufacturing but also provides robust support for sustainable development.

Furthermore, the convention features multiple zones such as Precision Manufacturing and Intelligent Manufacturing, comprehensively displaying the latest achievements and future trends in the manufacturing industry. Exhibitors have expressed their intentions to leverage this platform to showcase their capabilities, seek collaboration opportunities, and collectively drive high-quality development in manufacturing.

The 2024 World Manufacturing Convention is not just a feast of technology and innovation but also a platform for exchange and cooperation. Here, top leaders in the global manufacturing sector will convene to discuss the future trajectories and pathways of manufacturing. It is believed that in the near future, these cutting-edge technologies and innovative concepts will lead the manufacturing industry towards an even brighter future.

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SOURCE World Manufacturing Convention

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