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Standing Out in the Crowd: PANJIT’s Unique ESD Protection Devices Take Center Stage

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PANJIT’s ultra-low capacitance ESD protection devices earned significant recognition among engineers.

TAIPEI, Jan. 6, 2025 /PRNewswire/ — As artificial intelligence (AI) and high-performance computing (HPC) applications expand rapidly, the demand for higher data transmission rates has surged. This trend has brought heightened attention to the security of high-speed transmission interfaces. With over 38 years of experience in the semiconductor industry, PANJIT International Inc. has identified the growing safety requirements as transmission speeds double with each generation. Ultra-low capacitance ESD protection devices have become more critical than ever to address these challenges.

Leveraging proprietary component designs and innovative packaging technologies, PANJIT has introduced ultra-low capacitance ESD protection devices offering compact size and robust protection. These devices have earned significant recognition among engineers, securing the prestigious “Best Discrete of the Year” award at this year’s EE Awards Asia, organized by EE Times Taiwan.

Explore > Ultra-low capacitance ESD protection devices.

Exceptional Protection and Compact Design: The Advantages of PANJIT’s ESD Protection Devices

Speaking about the award-winning ESD protection device, Edgar Chen, COO of PANJIT International Inc., explained the company’s motivation for entering this segment. PANJIT had traditionally focused on high-power protection devices, with limited emphasis on ESD protection for signal ports. However, as high-speed interfaces like USB4, Thunderbolt 5, and PCIe Gen 6 doubling transmission speeds each generation, challenges related to signal attenuation and ESD protection have intensified. Advanced process chips are becoming increasingly miniaturized, exacerbating ESD protection issues.

Chen stated, “To provide customers with a more comprehensive solution, PANJIT not only has extensive experience in high-power protection components but is now actively expanding its product line to include high-seepd signal port ESD protection.” Recognizing the growing importance and market potential of ESD protection devices, PANJIT shifted its design platform to prioritize ESD protection for high-speed signal ports, complementing its existing high-power protection products. This comprehensive “Total Solution” strategy helps engineers address current and future challenges.

Years of research and optimization have enabled PANJIT to overcome traditional trade-offs in ESD protection design through patented technologies. Engineers no longer need to compromise between protection capabilities, parasitic capacitance, and component size. Amanda Cheng, Business Development Manager at PANJIT, highlighted the three critical parameters where the company’s ESD protection devices excel:

Capacitance: The ultra-low capacitance ensures signal integrity, preventing high-speed signal distortion and communication failures.

Clamping Voltage: Despite its minimal capacitance, the device maintains low clamping voltage, effectively dissipating ESD energy and offering superior protection.

Surge Protection: PANJIT’s devices uniquely combine low capacitance with high surge protection, addressing both ESD and EOS (Electrical Overstress) challenges. This capability reduces EOS-related RMA rates and enhances product reliability.

Cheng emphasized that as transmission speeds increase, capacitance has become a decisive factor for customers. PANJIT is already preparing for the next generation with capacitance targets as low as 0.05pF while maintaining low clamping voltage for optimal chip protection. The company’s holistic approach, from market research and product design to wafer and packaging processes, along with close collaboration with partners, has been instrumental in achieving these breakthroughs.

Miniaturization and Integration: Driving ESD Device Evolution

Another standout feature of PANJIT’s ESD protection devices is their compact size. “As end devices become increasingly miniaturized, so do transmission interface connectors and internal components,” said Cheng. While the current mainstream size for ESD protection devices is 0402, PANJIT is advancing toward even smaller sizes, such as 0201 and 01005. Integration is also a promising trend, as demonstrated by the award-winning ultra-low capacitance ESD protection device, which is an integrated product.

PANJIT’s innovative ESD protection devices continue to set new industry standards, raising the bar for market entry. The “Best Discrete of the Year” award at EE Awards Asia reflects this achievement. “Our highest standard when developing products is to avoid me-too designs,” said Chen. “We aim to create the most competitive products in the market. Compared to our competitors, this ESD protection device’s performance parameters are truly impressive.”

Future-Ready Development to Meet Customer Needs

Based on deep market insights, PANJIT has outlined a comprehensive development roadmap for its ESD protection and other product lines. Chen emphasized PANJIT’s proactive strategy in anticipating market and customer needs. Future ESD protection devices will evolve toward smaller sizes, lower capacitance, greater protection, and lower clamping voltage, while maintaining high flexibility. “We prepare our product specifications well in advance and provide early samples for customer testing, ensuring we stay ahead of competitors,” Chen added with a sense of optimism.

Currently, ESD protection devices contribute only 4% of PANJIT’s total revenue. However, Chen foresees significant growth potential in this market. PANJIT plans to expand both domestic and international markets with superior products and skilled technical personnel. Many customers have already integrated PANJIT’s ESD protection devices into their designs, with mass production scheduled for next year. Chen expressed confidence that the ESD product line will achieve remarkable success in the coming year.

Visit PANJIT’s official website.

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SOURCE EE Times Taiwan

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For Fourth Year, Everspring Recognized Among Chicago’s Best Places to Work

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Award Recognition Reflects Company’s Continued Momentum, Growth and Innovation in Higher Ed Technology

CHICAGO, Jan. 8, 2025 /PRNewswire/ — Everspring, a rapidly growing force in education technology, today announced its recognition on Built In’s 2025 Best Places to Work Awards, earning a coveted spot on Chicago’s 100 Best Midsize Companies list. This achievement comes at a pivotal moment for Everspring, following the successful launch of its VIA enrollment marketing platform and continued strategic partnerships that enable universities to adapt and thrive in a dynamic higher ed landscape.

“This recognition reflects the extraordinary momentum we’re experiencing at Everspring,” says Beth Hollenberg, CEO of Everspring. “Our team’s innovative spirit and dedication to transforming higher education have created an environment where top talent thrives. As we continue to expand our technology solutions and deepen our university partnerships, this award validates our commitment to fostering a workplace that attracts and retains the industry’s brightest minds.”

The honor arrives as Everspring expands its comprehensive education services with powerful SaaS technology offerings. The company’s recent launch of VIA, its enrollment marketing intelligence platform, exemplifies how Everspring’s growing suite of solutions addresses critical challenges in higher education, from disconnected data to enrollment optimization.

“Being recognized as a Best Place to Work is a testament to these companies’ commitment to building a workplace where individuals and innovation thrive,” says Built In CEO and Founder, Maria Christopoulos Katris. “At Built In, we understand that great companies are powered by great teams, and this achievement showcases their dedication to fostering a culture of growth, inclusivity, and excellence. Congratulations on this well-deserved honor.”

Built In determines the winners of Best Places to Work using company data about compensation and benefits, weighing criteria such as remote and flexible work opportunities, DEI programs, and other people-first cultural offerings that today’s tech professionals value most.

About Built In
Built In is the “always on” recruiting platform that reaches the tech professionals that other leading recruiting platforms don’t. Designed to help companies hire expert tech talent, Built In continuously drives brand awareness with content. Monthly, millions of the industry’s most in-demand global tech professionals visit our site to stay ahead of tech trends and news, learn skills to accelerate their careers, find the right job opportunities and get hired. Thousands of companies, from fast-growing startups to the largest enterprises rely on Built In. www.builtin.com

About Built In’s Best Places to Work
Built In’s annual Best Places to Work program honors companies with the best total rewards packages across the U.S. and in the following tech hubs: Atlanta, Austin, Boston, Chicago, Colorado, Dallas, Houston, Los Angeles, Miami, New York, San Diego, San Francisco, Seattle and Washington DC. Best Places to Work is distinct because its algorithm selects tech companies that build their offerings specifically around what tech professionals value in a workplace. https://employers.builtin.com/best-places-to-work

About Everspring
Everspring is a leading provider of education technology and services solutions for higher education. Our advanced technology, proven marketing approach, and robust faculty support and instructional design services deliver outstanding outcomes for our university partners, powering their success online. Everspring offers a range of full-service turnkey solutions, as well as standalone fee-for-service offerings, and innovative self-service products that enable universities to establish themselves as leaders in the digital delivery of higher education. Based in Chicago, Everspring serves a growing number of colleges and universities nationwide.

Visit www.everspringpartners.com for more information.

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SOURCE Everspring

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HCMF Group Unveils Cutting-Edge Smart Cockpit and Body Mechatronic Systems at CES 2025

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LAS VEGAS, Jan. 8, 2025 /PRNewswire/ — HCMF Group, a global leader in Tier 1 automotive parts and systems, is proud to unveil its groundbreaking advancements in smart cockpit and body mechatronic systems at CES 2025, held from January 7 to January 9. Partnering with industry leaders such as AUO, AGC, Inventec, TMYTEK (TMY Technology Inc.), BenQ Materials, and KINPO GROUP, HCMF is redefining intelligent mobility through transformative innovations and unmatched integration capabilities.

HCMF’s showcase features its integrated vehicle control system, developed with Inventec, which centralizes functionalities onto the front dashboard. This system combines an intuitive user interface, a UWB electronic key, and wireless charging, offering a seamless and futuristic cockpit experience. Also debuting is HCMF’s Micro LED transparent smart window technology, created with AUO and AGC. These high-transparency touch displays are integrated into rear car windows with patented window regulator mechanism, enabling applications such as real-time driving information, AR gaming, personal calendars, and rear-view mirror functions for enhanced convenience and safety.

HCMF’s smart glass solutions, developed with BenQ Materials, deliver privacy and energy efficiency through advanced PDLC 98 black dimming film. These materials block heat and UV rays while providing futuristic aesthetics. Passenger safety takes center stage with the second-generation Child Presence Detection (CPD) system, introduced with TMYTEK. Capable of detecting subtle life signs such as heartbeats and breathing, this system sends real-time alerts to the user’s smartphone, preventing safety risks for children or pets left inside the vehicle.

For rear-seat entertainment, HCMF introduces its foldable 28.6-inch, 32:9 ceiling display featuring JET OPTO’s dual-view single-screen technology. Passengers can view separate content or participate in virtual meetings, redefining in-car leisure and productivity. The company also showcases systems tailored for electric vehicles, such as a front hood automatic opening system and a centralized door control system (DCU) that combines E-latch, radar-based collision avoidance, and automatic opening mechanisms. Additionally, the innovative automatic tailgate system, developed with KINPO GROUP, delivers a user-friendly experience by overcoming traditional design limitations.

Jeffrey Hsi, Chief Innovation Officer of HCMF Group, remarked, “CES 2025 is a pivotal platform for HCMF to showcase its leadership in smart cockpit and body mechatronic systems. We are committed to driving innovation and breakthroughs, advancing automotive technology to deliver safer, more convenient, and enjoyable smart mobility experiences for consumers worldwide.”

HCMF’s participation at CES 2025 underscores its leadership in smart cockpit technologies and collaborative innovation with global partners. From enhancing passenger safety to redefining in-car entertainment and advancing intelligent mobility, HCMF is setting new benchmarks in automotive intelligence and automation. The company remains focused on innovation-driven research and development, delivering future-ready solutions that create value for the global automotive industry and its consumers.

About HCMF Group

HCMF was established in 1961 and as a global automobile Tier 1 system supplier with more than 60 years experience in design and manufacturing. HCMF has around 40 sites globally to provide tailored service to our customers. Our vast knowledge and expertise through years of product experience provide solutions to satisfy our customer needs. We believe strongly in upholding integrity and cooperation to maximize benefits to our customers and partners.

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SOURCE HCMF Group

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DELFI Diagnostics to Participate in J.P. Morgan Healthcare Conference

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Leader in liquid biopsy, cancer screening, and monitoring speaks at largest healthcare investment symposium

BALTIMORE and PALO ALTO, Calif., Jan. 8, 2025 /PRNewswire/ —  DELFI Diagnostics, Inc., developer of accessible blood-based, liquid biopsy tests that deliver a new way to enhance early cancer detection, today announced the company will participate in the upcoming 43rd Annual J.P. Morgan Healthcare Conference in San Francisco.

The company’s management is scheduled to present and participate in a Q&A session on Thursday, January 16, 2025, at 7:30 a.m. PT/10:30 a.m. ET. To learn more about DELFI Diagnostics, visit DELFIDiagnostics.com

About DELFI Diagnostics
DELFI Diagnostics is developing next-generation, blood-based tests that are accurate, accessible, and deliver a new way to help detect cancer. DELFI tests are built to solve the highest-burden population health issues, including in historically underserved demographics, and have the potential to save lives on a global scale. FirstLook Lung, for individuals eligible for lung cancer screening, is our first laboratory-developed screening test and requires a simple blood draw that can be incorporated with routine blood work. The test is based on fragmentomics, the discovery that cancer cells are more chaotic than normal cells and, when they die, leave behind tell-tale patterns and characteristics of cell-free DNA (cfDNA) fragments in the blood. The DELFI platform applies advanced machine-learning technology to whole-genome sequencing data to assess individuals’ cfDNA fragments against populations with and without cancer. FirstLook Lung uses these millions of data points to reliably identify individuals who may have cancer detected through low-dose CT, including early-stage disease, with a negative predictive value of 99.8 percent. This test has not been cleared or approved by the FDA.

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SOURCE DELFI Diagnostics

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