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Belt and Road Forum centering on Digital Economy & Payment Settlement held in Hong Kong, exploring Hong Kong’s role in promoting digital silk road development

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HONG KONG, Dec. 7, 2024 /PRNewswire/ — Belt and Road Forum themed Digital Economy & Payment Settlement, co-organised by the Ng Teng Fong• Sino Group Belt and Road Research Institute of the Hong Kong Chu Hai College, Silk Road Economic Development Research Center and Maritime Silk Road Society was held on 5th December in Hong Kong. Mr Christopher Hui, Secretary for Financial Services and the Treasury, Mr Zhou Qiang, Deputy Director-General of the Economic Affairs Department and Head of the Commercial Office of the Liaison Office of the Central People’s Government in the Hong Kong Special Administrative Region, Mrs Regina Ip, Convenor of Hong Kong Executive Council and Co-Chair of the Maritime Silk Road Society, Mr LAM Kwong Siu, Chairman of Board of Governors of Hong Kong Chu Hai College, Mr Joseph Chan, Chairman of Silk Road Economic Development Research Center, Mr Liu An Ning, Second Secretary of the Commissioner’s Office of China’s Foreign Ministry in the Hong Kong Special Administrative, Mr Alexander Ng, Director of Ng Teng Fong Charitable Foundation and General Manager of Sino Group, Mr Tan Yueheng, Member of Legislative Council and Chairman of the BOCOM International Holdings Company Limited, Ms Jane Zhang, Interim President of Hong Kong Chu Hai College, Professor Thomas Chan, Director of Ng Teng Fong • Sino Group Belt and Road Research Institute of Hong Kong Chu Hai College, Professor Shi Yong of University of Chinese Academy of Sciences, Counsellor of State Council of the People’s Republic of China and Director of CAS Research Center on Fictitious Economy & Data Science, along with near 300 distinguished guests, including prominent business leaders from Hong Kong, mainland China, and overseas, Consul-Generals of Consulates-General in Hong Kong, government officials, entrepreneurs, and academics attended the Forum.

The Hon John KC LEE, Chief Executive of the Hong Kong Special Administrative Region delivered an opening address in video, in which he noted that in recent years, tokenisation technologies have revolutionised the global economy, creating new opportunities for the traditional financial market. The HKMA has launched a wholesale CBDC initiative called Project Ensemble this year, by leveraging advanced tokenisation technology. At present the Project has entered the Sandbox stage in August, with a focus on transactions involving tokenised assets. HKSAR Government will continue to capitalise on the growing influence of this key technology in the financial realm. He expressed his confidence that Hong Kong’s robust financial Infrastructure will support the financial services sectors to fully adapt to this new wave of digital economy, amidst the large array of opportunities offered by the digital “silk road”. In so doing, Hong Kong will consolidate its position as an international financial centre, and bring new development opportunities to other Belt and Road economies.

In his opening address Mr Christopher Hui noted that the Belt and Road initiative is more than just a platform for infrastructure and trade. It is a vision for global connectivity and shared prosperity. As we integrate digital innovation into this framework, the opportunities for economic transformation and cooperation are boundless. From providing world-class financial and professional services to advancing the adoption of cutting-edge technologies, Hong Kong stands ready to contribute to the continued success of the Belt and Road Initiative. He encourages all participants to seize these emerging opportunities, foster meaningful partnerships and work together to build a more interconnected, inclusive and prosperous future for all.

Mrs Regina Ip gave welcome remarks and highlighted the significant progress achieved in the Belt and Road Initiative (BRI) over the last ten years. Apart from the remarkable expansion of BRI membership, substantive achievements in infrastructural development and trade among BRI members also call for increased cross-border payment settlement under the digital economy. It is therefore timely to explore the prospects of digital economy and examine the challenges and opportunities in payment settlement facing us under the BRI. She acknowledged the strong support from venue sponsors, Sino Group and Ng Teng Fong Charitable Foundation and all guests at the end of her remarks.

Professor Shi Yong delivered a keynote speech on the “Prospect of Digital Economy under the Belt & Road Initiative and Its Impact on Mainland China and Hong Kong“, in which he stressed the strategic importance of digital economy to the development of BRI and he added that over the past 10 years since the launch of BRI in 2023, with the support of the central government, Hong Kong has actively responded to the BRI, strived to serve the needs of the country with its own strengths and become an active participant and contributor and beneficiary in the construction of the Belt and Road. Hong Kong will further consolidate its own advantages and enhance its competitiveness in the process of fully promoting the “digital industrialization” and “industrial digitization” of BRI members.

Mr LAM Kwong Siu on behalf of the main organisers expressed his gratitude to all participants of the forum. He said the BRI is entering its next golden decade and Hong Kong is facing a once-in-a-lifetime opportunity to play a crucial role in promoting Belt and Road and Digital Silk Road. We believe as we accelerate the development of the Digital Silk Road and the Silk Road of Innovation, more opportunities for cooperation will be created.

The panel discussion was divided into two sessions, respectively “Cross-Border Payments Fuelling the Accelerated Growth of Global E-Commerce” and “the Development and Implementation of Web 3.0 in Hong Kong“. The first session was moderated by Ms Julia Charlton, Managing Partner of Charltons, panelists included Dr Shen Jianguang, Vice President and Chief Economist of JD.com, Mr Ronan Zhong, Vice President of LianLian Global, Mr Esmond Lee, Deputy Branch Manager of Euroclear Bank Hong Kong Branch and Mr Herbert Siu, CFO of Payment Cards Group Limited together explored the critical role that cross-border payments play in driving the global e-commerce. In the second session moderated by Mr Joseph Chan, the Chairman of Silk Road Economic Development Research Center, Mr Ivan Chan, Co-Founder & COO of Web3.0 Technology Limited, Mr Furuzonfar Zehni, Partner and Portfolio Manager of Fresco Capital, Mr Marco Lim, Web3 Partner of Solowin Holdings and Professor James Lei, Secretary General of the Institute of Web3.0 Hong Kong joined the session and delved into the development and implementation of Web 3.0 in Hong Kong, the challenges facing, and the strategies employed to navigate through them.

The organizers have been consistently holding BRI forums on specialized topics related to global BRI development trends since 2017, as one of the leading pioneers in promoting BRI and Hong Kong’s commitment in integrating into the overall development of mainland China.

 

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SOURCE Silk Road Economic Development Research Center

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NICE Recovery Systems Partners with Norwegian Alpine Ski Team – Team Telenor to Elevate Performance and Recovery on the World Stage

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BOULDER, Colo., Dec. 11, 2024 /PRNewswire/ — NICE Recovery Systems, a leader in recovery and performance technology, is proud to announce its sponsorship of the Norwegian Alpine Ski Team – Team Telenor. This partnership will provide Norway’s top alpine athletes with NICE’s best-in-class recovery solutions, including the NICE1 Iceless Cold + Compression Therapy System, supporting their performance throughout the 2024/2025 World Cup season and beyond.

As the Strategic Partner and Preferred Supplier of Recovery Products for Norwegian Alpine Ski Team – Team Telenor, NICE Recovery Systems is committed to advancing recovery solutions for elite athletes. This collaboration underscores the critical role recovery plays in competitive sports, enabling the Norwegian team to achieve peak performance while highlighting NICE’s innovative technology.

“Recovery is no longer a luxury for elite athletes; it’s a necessity,” said Michael Ross, CEO of NICE Recovery Systems. “We are honored to partner with the Norwegian Alpine Ski Team, whose dedication to excellence aligns with our mission to provide unmatched performance and recovery solutions.”

“We are excited to partner with NICE Recovery Systems and bring their top-tier recovery technology to our team,” said Claus Ryste, Sports Director, Norwegian Alpine Ski Team – Team Telenor. “This collaboration ensures our athletes have the best tools for recovery during a demanding season, and from our experience, the best alternative when injuries occur. We look forward to the support this partnership will provide at the highest level.”

A Partnership Built for Champions

Through this partnership, Norwegian Alpine Ski Team – Team Telenor athletes will incorporate NICE products into their training and competition recovery routines. The partnership kicks off during the Birds of Prey World Cup at Beaver Creek, Colorado (Dec 6-15), where Norwegian Alpine Ski Team – Team Telenor will use NICE products to recover between races.

About NICE Recovery Systems

Based in Boulder, CO, NICE Recovery Systems is dedicated to the uncompromising pursuit of the highest quality recovery and performance technology. With a commitment to innovation and expert-informed design, NICE products empower users to recover smarter, faster, and better. Learn more at www.nicerecovery.com.

About the Norwegian Alpine Ski Team – Team Telenor

Norwegian Alpine Ski Team – Team Telenor represents Norway’s elite alpine skiers, competing on the world’s biggest stages, including the FIS Alpine Ski World Cup and the Winter Olympics. Known as the “Attacking Vikings,” the team is a symbol of excellence and dedication in the sport of alpine skiing.

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SOURCE NICE Recovery Systems

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OCLC is among Computerworld’s ‘Best Places to Work in IT’ for the 16th year

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Global library technology leader ranked second overall among midsize global organizations, first in DEI strategies, and first in benefits

DUBLIN, Ohio, Dec. 11, 2024 /PRNewswire/ — OCLC, the leading library technology and research organization, has been named among Computerworld’s Best Places to Work in IT 2025. This is the 16th time OCLC has been named a top workplace for information technology professionals by Computerworld.

OCLC was ranked second overall for midsize employers (1,001 to 4,999 employees). The recognition is part of the prestigious IT publication’s annual selection of the Best Places to Work in IT. In past years, the survey had been offered only to U.S.-based companies, but for the last three years Computerworld has included organizations worldwide.

“It’s a great honor to be recognized among the top IT workplaces in Computerworld’s global survey,” said Skip Prichard, OCLC President and CEO. “This recognition reflects our ongoing efforts to create a culture in which our associates can excel. I’m often told that our associates come to OCLC because of our mission, and they stay because of the people and culture. It’s our talented, dedicated team that makes OCLC such an exceptional place to work.”

Headquartered in Dublin, Ohio, OCLC provides state-of-the-art technologies and services, research, and community programs to libraries of all types and sizes. Together, thousands of OCLC member libraries in more than 100 countries support access to the world’s collected knowledge. WorldCat, the world’s most comprehensive online resource for finding library materials, is among many services provided by OCLC. Anyone can search the collections of thousands of libraries through WorldCat.org.

“OCLC is an inclusive workplace where different experiences and viewpoints are represented in our work on behalf of libraries and their users worldwide,” said Tammi Spayde, OCLC Chief HR Officer. “We know that diverse views create the best services. Our goal is to provide an environment where people thrive professionally, while enjoying the benefits they need to succeed outside of work.”

In addition to placing second overall in the midsize category, OCLC placed first for its DEI strategies, first for exceptional benefits, sixth for IT growth, and seventh for remote/hybrid work experience.

“Our global IT teams are responsible for systems and services that libraries, researchers, students, and lifelong learners depend on 24 hours a day, seven days a week, worldwide,” said Bart Murphy, OCLC Chief Technology and Information Officer. “We employ a great combination of IT professionals who are committed to our mission and are eager to grow their careers with a world-class information technology leader.”

More about careers at OCLC is on the OCLC website.

For more information: Contact Bob Murphy at murphyb@oclc.org or +1-614-761-5136

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SOURCE OCLC

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E2IP’s Edge AI Sensing Platform with Machine Vision. An ST Micro based Edge AI platform

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MONTRÉAL, Dec. 11, 2024 /PRNewswire/ – Today, we are excited to announce the launch of the E2IP Edge AI Sensing Platform (EAISP), our platform for developers, engineers, and early adopters eager to explore the next frontier of intelligent Edge AI computing. EAISP enables intelligence to be added to devices at the edge, unleashing the real power of smart devices. Powered by the ST Microelectronics AI MCU processor, the STM32N6, EAISP is designed to bring unparalleled AI-powered general sensing and machine vision capabilities to cross vertical applications on edge devices.

The Edge AI Sensing Platform combines high-performance machine vision with robust edge AI processing, delivering real-time insights and enabling smarter decision-making directly on the device. With its seamless integration of machine learning and support of AI algorithms, this platform is built to handle demanding applications in medical, security, industrial automation, smart cities, and more. The platform is designed for situations where time (low latency), efficiency (low power and reduced data transmissions), security (no transmission of sensing data) all matter; extremely compact and power-efficient to deploy, EAISP minimizes the data that needs to be stored and transmitted — enabling low-latency, real-time decision-making at the device level.

Key Features:

STM32N6-Based Architecture: Powered by the latest STM32N6 microcontroller, providing exceptional processing power, energy efficiency, and a proprietary NPUReal-Time Edge AI Processing: Process data locally with low latency to provide faster insightsMachine Vision Integration: Built-in support for computer vision, enabling real-time object recognition, motion tracking, and intelligent scene understandingScalable Whether you’re developing a smart factory, autonomous vehicle system, or AI-enhanced surveillance network, the platform is designed to scale for diverse applications

Why Early Adopters Should Take Notice:

Innovation at the Edge: Leverage powerful AI models and machine vision at the edge, reducing reliance on centralized computing resources and enhancing privacyFuture-Proof and Flexible: The EdgeAI Sensing Platform allows users to future-proof their designs with an ecosystem that supports both hardware and software advancementsLow Latency, High Efficiency: With edge-based processing, latency is minimized, allowing for near real time inferencing —critical for applications requiring split-second decision-makingEasy Development: Development tools and models from STM32Cube.ai make it easier than ever to get started with AI-powered sensing and machine vision without requiring deep expertise in hardware design

“We are excited to deliver a platform that accelerates AI innovation at the Edge for general sensing and machine vision applications,” said Eric St-Jacques, CEO at e2ip technologies. “EaiSP’s combination of processing power, energy efficiency, and AI capabilities, along with support for development tools and services offers an unprecedented opportunity for early adopters to lead the way in smart, AI-powered solutions, by adding intelligence at the edge where sensors operate.”

Availability:

Developed in partnership with Siana-Systems, the first version of the Edge AI Sensing Platform with Machine Vision will be available for purchase in January of 2025 and demonstrated at CES in the ST Pavillion.

Contact us to learn about our Early Adopter Program.

About E2IP TECHNOLOGIES

Smart Structural Surfaces™ and Devices. We create new possibilities through fundamental research in embedded system architectures, material sciences, printed electronics, and advanced manufacturing processes. Our Innovations reduce the eco footprint of the global electronics industry, add intelligence and simplify how we all interact with electronic systems in our everyday lives. E2IP is the HMI, IIoT and now Edge AI partner to global market leaders of the world’s most demanding markets. For more information, visit our website www.e2ip.com 

About ST

At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.

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SOURCE E2IP Technologies

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