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TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems

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Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for system design using advanced silicon processes and the rapidly evolving 3D-IC and silicon photonics packaging technologies

/ Key Highlights

Ansys multiphysics analysis solutions are critical to the successful integration and performance of advanced multi-chip packaging and electronic and photonic co-packaged optics in TSMC’s compact universal photonics engine (COUPE)Ansys’ joint development of design solutions for TSMC’s N2P and A16™ advanced silicon processes ensure power integrity, electromigration reliability, and critical thermal management for compute-heavy applications like high-performance computing (HPC) and artificial intelligence (AI)Ansys collaborated on a new AI-assisted radio frequency (RF) process migration flow that automates circuit designs and improves product performance

PITTSBURGH, Oct. 25, 2024 /PRNewswire/ — Ansys (NASDAQ: ANSS) was recognized at the TSMC 2024 Open Innovation Platform® (OIP) Partner of the Year awards for excellence in design enablement for AI, HPC, and photonics silicon systems. The awards honor TSMC OIP ecosystem partners and their contributions to innovation in next-generation 3D integrated circuit (3D-IC) design and enablement. Ansys received four awards for joint development of design solutions for multiphysics analysis, N2P and A16 power delivery, COUPE enablement, and RF design, optimization, and migration.

TSMC announced the award winners at its annual TSMC OIP Ecosystem Forum, which assembled semiconductor ecosystem partners and customers for a day of industry discussion around technological trends and design solutions. Ansys received the following Joint Development awards:

Multiphysics: TSMC expanded the collaboration with Ansys RedHawk-SC Electrothermal™ thermal and multiphysics signoff platform, incorporating mechanical stress analysis solutions. In addition, TSMC, Ansys, and Synopsys developed an efficient flow to address multiphysics coupling challenges among timing, thermal, and power integrity. The flow seamlessly combines Synopsys’ 3DIC Compiler™ exploration-to-signoff platform with Ansys multiphysics solutions RedHawk-SC Electrothermal and Ansys RedHawk-SC™ power integrity signoff platform for digital and 3D-IC.N2P and A16: Ansys collaborated with TSMC to develop power integrity analysis, electromigration reliability analysis, and critical thermal management solutions for TSMC’s N2P and A16 advanced silicon processes. The flow includes RedHawk-SC, Ansys Totem™ power integrity signoff platform, and RedHawk-SC Electrothermal.COUPE enablement: Ansys and TSMC delivered a high-fidelity multiphysics solution to address design and reliability challenges for the TSMC COUPE integration system. This includes Ansys Zemax OpticStudio™ optical system design and analysis software, Ansys Lumerical™ FDTD advanced 3D electromagnetic FDTD simulation software, RedHawk-SC and Totem signoff platforms for multi-die power integrity signoff, Ansys RaptorX™ silicon optimized electromagnetic (EM) solver for design analysis and modeling for high-frequency EM analysis between dies, and RedHawk-SC Electrothermal for vital thermal management of the multi-die heterogenous system. Additionally, Lumerical allows custom Verilog-A models for electronic photonic circuit simulations, which work seamlessly with the TSMC Modeling Interface (TMI) and are co-designed with TSMC’s Process Design Kit (PDK).RF design migration: Ansys collaborated with Synopsys and TSMC to combine the RaptorX electromagnetic modeling engine with Ansys optiSLang® process integration and design optimization software and Synopsys Custom Compiler and ASO.ai solution to automate the migration and optimization of analog circuits from one silicon process to another — enhancing design efficiency, reliability, and scalability.

“Ansys is a key ecosystem partner that has worked relentlessly alongside TSMC to address our mutual customers’ most complex design challenges,” said Dan Kochpatcharin, head of the ecosystem and alliance management division at TSMC. “The awards celebrate OIP partners like Ansys who strive for excellence in design enablement, working closely with TSMC to accelerate advanced 3D IC design for the next generation of AI innovation.”

“The Ansys multiphysics platform is integral to meeting designers’ stringent design requirements for 3D-IC,” said John Lee, vice president and general manager of electronics, semiconductor, and optics business unit at Ansys. “Without the Ansys multiphysics platform, the chips that are enabling the AI, HPC, and silicon systems growth would take demonstrably longer to develop and validate, and the associated costs would be much higher. Together, Ansys and TSMC push the industry forward by empowering our mutual customers to explore advanced packaging technologies, leverage the speed and power of AI, and enhance product performance and durability.”

/ About Ansys

Our Mission: Powering Innovation that Drives Human Advancement™.

When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.

Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

ANSS–T

/ Contacts

Media             

Mary Kate Joyce

724.820.4368

marykate.joyce@ansys.com 

Investors         

Kelsey DeBriyn

724.820.3927

kelsey.debriyn@ansys.com 

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SOURCE Ansys

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CES 2025: MIFA Yukon– Outdoor Bluetooth speaker with Low-Latency intercoms

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NEWARK, Del., Jan. 9, 2025 /PRNewswire/ — MIFA is a leading innovator in the audio industry field and the latest model Yukon will showcase at CES 2025.It is not only just a speaker with exceptional acoustics; but also boasts unique intercom functionality, making it especially suitable for team communication.

Innovative Walkie Talkie, Efficient Communication without SIM card The low-latency doesn’t rely on cellular networks when you are outdoors. Whether you’re in remote mountain or signal blind spots, ensure stable, low-latency instant communication with your teammates. Its mesh networking technology enables up to 6 devices to connect to each other keeping your team closely connected and communicating at all times, whether it’s a team hike, bike trip, or outdoor camping adventure, offering you the best safety coverage.

Excellent sound quality, immersive enjoyment equipped with large NdFeB magnet composite membrane speakers, combined with Actions DSP algorithm and MIFA Golden Ear Acoustic Team tuning , The Bass Loudness dynamic tracking technology ensures rich bass even at low volumes. Bluetooth V5.3 wireless connection allows for faster and more stable sound transmission, delivering high-quality music playback experience. In addition, the speaker is designed for outdoor use, maintaining clear and delicate sound even in harsh weather conditions. Whether it’s music playback or voice calls, you can enjoy an immersive experience.

Free to Go with Its Lightweight The Yukon is the perfect companion for any outdoor excursion with its light weight. The lightweight design makes outdoor activities easier and more convenient. Whether you hang it on your backpack or put it in your carry-on bag, it won’t weigh you down. This portable and lightweight device offers dual benefits of music and communication, making every trip more enjoyable and freeing.

Sturdy and durable with IP67 dustproof and waterproof rating Yukon adopts patented silicone membrane sealing technology, achieving an IP67 dust and water-proof rating, which enables it to work perfectly in harsh environments like sandstorms and rain. Moreover, it has passed rigorous tests including 48-hour salt spray test, making it resistant to impact, shock, and immersion. Even when exposed to extreme temperatures ranging from -15℃ to 45℃, its performance remains stable, fearlessly supporting you in various outdoor adventures.

Practical lighting illuminates outdoor life Yukon is equipped with high-brightness RGB LED lights, with a maximum brightness of 80Lm, making it suitable for night camping or hiking. The patented light guide technology ensures that the light is evenly distributed, while the yellow ambient circle light is both practical and beautiful, adding a warm touch to outdoor activities at night.

Voice Interaction, Smart and Intelligent Yukon not only supports Bluetooth connection for music and phone calls, but also features a powerful one-click wake-up function for voice assistants. With just a gentle touch, Siri and other intelligent assistants can be activated for easy natural language interaction. It makes playing music, checking information, and navigating a breeze, adding intelligence and ease to your outdoor lifestyle.

Long-lasting battery life: Enjoy uninterrupted fun! With a powerful built-in lithium battery, our device supports continuous usage for up to 10 hours, making it the perfect companion for all-day outdoor activities. Plus, the universal Type-C charging interface allows for convenient charging anytime, ensuring an unforgettable adventure that lasts as long as you do.

Aesthetic and Practical Various Accessories MIFA has designed a series of practical and diverse accessories. The magnetic detachable back clip allows the speaker to be easily secured on backpacks, tents, or other equipment, ensuring that music and intercom functions are always within reach. Equipped with a bicycle mounting adapter, it can be firmly installed on various types of frames, allowing you to enjoy music during your cycling adventures. Additionally, neck and hand straps are provided, suitable for hiking and sports, making it easy to carry and use at any time.

Breakthrough Boundaries, Continuously Innovate. Innovation is the DNA of MIFA. Three years ago, we launched the first-ever camping lantern and speaker combination product, the WildCamping lantern speaker, revolutionizing the outdoor speaker market. Today, we break boundaries yet again with the release of the MIFA Yukon multi-link walkie-talkie Bluetooth speaker, perfectly blending innovation and practicality to offer even more exciting exploration experiences for outdoor enthusiasts. Whether navigating through mountainous terrain or casually hiking outside of the city, MIFA is committed to making outdoor life more thrilling. We applaud every outdoor adventurer from the bottom of our hearts!

Contact Information
Jenny Yin
Marketing Director
Cell/WhatsApp: +86-13590212903
Email: jenny.yin@mifalife.net 

Contact Information
Chanel Yao
International Sales Manager
WhatsApp: +86-15820422237
Email: mifa-sales10@mifalife.net 

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SOURCE MIFA

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Analytic Partners Strengthens Market Position and Enhances Customer Solutions with Analyx Acquisition

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MIAMI, Jan. 10, 2025 /PRNewswire/ — Analytic Partners, a global leader in Commercial Analytics, announced today that it has closed on the acquisition of Analyx®, a marketing analytics software and services company. With multi-national offices in Germany and Poland, Analyx has an impressive customer base of significant European companies with a focus on Germany and Switzerland. This strategic acquisition extends Analytic Partners’ penetration in Europe, and adds significant analytics and software development talent.

The acquisition of Analyx expands Analytic Partners’ ability to deliver Commercial Intelligence to major brands in Germany and throughout Europe. Analyx’s impressive customer roster has enabled the analysis of $5 billion in marketing spend over the last 12 months, with approximately 2,500 scenarios executed by customers over the last several years. The Analyx acquisition builds upon the momentum of its 2024 acquisition of Magic Numbers, a leading analytics firm in the UK, further deepening Analytic Partners’ presence in Europe.

“Analytic Partners is at the forefront of elevating marketing mix modeling by pioneering innovations that deliver a full commercial perspective. Our Commercial Decisioning Platform, GPS-Enterprise, offers decision-making tools to the world’s leading brands,” stated Nancy Smith, President and CEO of Analytic Partners. “The values and mission of the Analyx team, under the leadership of Claudio Righetti & Sascha Stürze, align perfectly with ours. Acquiring Analyx enhances our Commercial Analytics solution, extending it to more global enterprises and creating meaningful synergies that will benefit our European and global customers.”

“Joining Analytic Partners today is climbing the next S-Curve for Analyx! It enables us to further our mission to create value through advanced data science and self-service software for enterprise brands – at a truly global scale,” explained Founder and CPO, Sascha Stürze.

CEO, Claudio Righetti, added, “Joining forces with Analytic Partners aligns to the foundational vision of Analyx: Building and delivering world-class decision-support tools to enterprise customers worldwide. By joining Analytic Partners we can offer our customers a true global presence and expand the range of services offered.”

About Analytic Partners  

Recognized as a leader in both the 2024 Gartner Magic Quadrant for Marketing Mix Modeling Solutions and The Forrester Wave™: Marketing Measurement and Optimization, Q3 2023 report, Analytic Partners provides marketing measurement and Commercial Analytics to Fortune 500 brands around the globe. We provide adaptive solutions for deeper business understanding and right-time planning and optimization – for marketing and beyond. We turn data into expertise so our customers can create powerful connections with their customers and achieve commercial success. For more information, visit analyticpartners.com.

About Analyx  

Analyx® is a European leader in Marketing ROI decision support with offices in Poland, and Germany. It has served 10 of 40 DAX companies and other European multi-nationals in recent years with its advanced data science solution for marketing budget optimization at scale. It combines an experienced data analytics team with industry-experienced consultants providing independent and impartial marketing recommendations to the CMO office. If you’d like to learn more about Analyx®, please visit: analyx.com.

View original content:https://www.prnewswire.com/apac/news-releases/analytic-partners-strengthens-market-position-and-enhances-customer-solutions-with-analyx-acquisition-302347688.html

SOURCE Analytic Partners

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Tianma Introducing Wide Range of Automotive Display Technologies at CES 2025

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Tianma, a leading global manufacturer of flat panel displays, is featuring an expanded portfolio of display technologies for the automotive market at CES, West Hall Meeting Rooms – W323, Las Vegas, Nevada, January 7-10. Highlighted OLED and Micro-LED products include: Dual-Screen Multi-Curved Color-Matched OLED Display; 3D Instrument Cluster; 12.3″ LTPS Mini-LED InvisiVue™ Display; Integrated Reflective Imaging System (IRIS) Panoramic Head-Up Display; and a new Light Field 3D-HUD.

CHINO, Calif., Jan. 9, 2025 /PRNewswire-PRWeb/ — Tianma, a leading global manufacturer of flat panel displays, is featuring an expanded portfolio of display technologies for the automotive market at CES, West Hall Meeting Rooms – W323, Las Vegas, Nevada, January 7-10.

Highlighted OLED and Micro-LED automotive products at CES 2025 include: Dual-Screen Multi-Curved Color-Matched OLED Display; 3D Instrument Cluster; 12.3″ LTPS Mini-LED InvisiVue™ Display; Integrated Reflective Imaging System (IRIS) Panoramic Head-Up Display; and a new Light Field 3D-HUD.

Highlighted OLED and Micro-LED products include: Dual-Screen Multi-Curved Color-Matched OLED Display; 3D Instrument Cluster; 12.3″ LTPS Mini-LED InvisiVue™ Display; Integrated Reflective Imaging System (IRIS) Panoramic Head-Up Display; and a new Light Field 3D-HUD.

Dual-Screen Multi-Curved Color-Matched OLED Display

Tianma’s Dual-Screen Multi-Curved Color-Matched OLED Display, developed in conjunction with Corning, offers unparalleled visual clarity in automotive applications. This innovative true-black display features a unique multi-curvature design, with a left curvature radius of R800mm for optimal driver focus, a middle curvature radius of R1140mm, and a right curvature radius of R2160mm to accommodate the passenger.

The system seamlessly bonds two color-matched 13″ OLED displays to the multi-curve cover glass made possible with Corning® ColdForm™ Technology. The result is a single, continuous screen providing an enhanced visual experience.

Equipped with advanced Stacked Layered OLED Device (SLOD) technology, this display is not only thinner and lighter but also boasts an extended lifespan, making it the perfect choice for modern vehicle interior design.

12.3″ 3D Instrument Cluster

The 12.3″ 3D Instrument Cluster is the industry’s first automotive instrument display screen that employs liquid crystal prism technology to achieve 2D/3D switchable functionality. It is also the first automotive display screen to achieve 500 pixels per inch (PPI). This instrument cluster offers real-time adjustable 3D depth, along with lossless switching between 2D and 3D modes. Additionally, the module adopts Tianma’s own light field rendering technology, providing drivers with a stable, continuous and comfortable 3D visual experience.

12.3″ LTPS High Transmissivity InvisiVue™ Mini-LED

This display features a highly transmissive decorative layer that looks like brushed metal or wood grain in the non-operating state, while the active area of the display is invisible to the user. When the display is turned on, only the image content emerges through the 80% transmissive decorative layer. The combination of a Mini-LED backlight and the high-transmissivity decorative layer yields a high-quality image for improved visual perception and user experience.

Integrated Reflective Imaging System (IRIS) Panoramic-HUD

The IRIS PHUD, independently developed by Tianma with its sophisticated optical path design, precisely projects images to the bottom edge of the vehicle’s windshield. It can adopt a triple-screen or large-size bar-shaped display layout, comprehensively covering the visual range of the driver, the center console area, and the front passenger.

Light Field 3D Head-Up Display (HUD)

The 4.1″ Light Field 3D-HUD is the industry’s first 3D-HUD display product utilizing light field rendering technology. It combines an advanced 3D picture generation unit (PGU) with an augmented reality (AR) HUD platform to provide users with realistic 3D scenes and natural depth perception effects. Compared to traditional 2D images, the 3D-HUD offers a more intuitive and immersive AR experience.

Tianma is hosting visitors at their booth in West Hall Meeting Rooms – W323. More information is also available in the Tianma press kit, accessible online at usa.tianma.com/press

About Tianma America, Inc.

Tianma America (TMA) is the leading provider of small- to medium-size display solutions to the Americas market utilizing advanced technologies and manufacturing resources of the Tianma Group Companies, which includes R&D and manufacturing locations in Chengdu, Wuhan, Xiamen, Wuhu, Shenzhen and Shanghai China. Tianma America technologies can be found in automotive cockpit and rear seat entertainment devices, smartphones, tablet PCs, industrial and medical instrumentation, wearables, home automation, household appliances, and office equipment. Additional applications include test and measurement systems, instrumentation equipment, point-of-sale and ATM systems, gaming systems, global positioning systems, radio-frequency identification devices and barcode scanners.

Tianma America’s technology portfolio comprises: Micro-LED; a-Si, LTPS and Oxide-TFT LCD; rigid, flexible and transparent AM-OLED; 3D, PCAP and In-cell/On-cell integrated touch. With a network of best-in-class distributors and value-added partners, Tianma America provides complete display module solutions for a broad base of customers and applications. For more information, visit us at usa.tianma.com or connect with us on LinkedIn.

The content in this press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.

Media Contact

Dale Maunu, Tianma America, Inc., 1 408-816-7003, dale.maunu@tianma.com, usa.tianma.com

Bill Maurer, Macrovision, 1 215-348-1010, bill@macrovis.com, www.macrovis.com

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SOURCE Tianma America, Inc.

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