BEIJING, Oct. 25, 2024 /PRNewswire/ –Chindata Group officially unveiled its latest innovation, the AI Data Center Total Solution 2.0, at the 2024 China Computing Power Conference. Designed to meet the growing demands of artificial intelligence (AI) workloads, the solution addresses critical challenges such as high-density cabinets, hyperscale facilities, and heterogeneous computing environments.

The launch took place during the Data Center Technology Innovation and Transformation Forum, co-hosted by Chindata Group and the China Academy of Information and Communications Technology (CAICT). Held at the same conference, the forum brought together industry leaders from CAICT, China Telecom, Intel, Baidu, Alibaba Cloud, Inspur, Seagate Technology, and others to explore the latest advancements in intelligent computing and IT infrastructure for the AI era.

Addressing Evolving Demands in AI Workloads

The sharp rise in power consumption among GPUs and servers has led to data center clusters scaling beyond hundreds of megawatts. These trends present new challenges for traditional data center operations. As a leading data center operator, Chindata Group has developed a proactive strategy to address the increasing demand for computing power.

The AI Data Center Total Solution 2.0 incorporates advanced prefabrication and modular building models, the innovative “X-Power” power system, the “X-Cooling” cooling solutions, and an AI-driven comprehensive operation and maintenance platform. This state-of-the-art solution is designed to support the accelerated growth of artificial intelligence and ensure high-quality and flexible business operations for customers.

Key Features of AI Data Center Total Solution 2.0

1.     Flexible Prefabrication and Modular Construction: Prefabrication and modular construction models are capable of being arranged and manufactured in various stages, which allows for the agile deployment of business operations while accommodating a wide range of hardware configurations, including CPUs and different types of AI accelerators. This modularity improves IT performance per square unit and addresses the growing high-density requirements of AI technologies. This solution delivers a fast, efficient response to the need for high computing power in the era of large models and general artificial intelligence (AGI). Utilizing this construction methodology, a hyperscale project can be completed and handed over to the client within 6 months in China, and within 8 months across the rest of the Asia-Pacific region.

2.     X-Power Modular Power System: The upgraded “X-Power” system integrates over ten traditional components of power distribution into six primary modules: substations, generators, medium voltage units, low voltage units, batteries, and IT support equipments. These modules can be deployed in phases according to specific needs, allowing for flexible and scalable expansion. By reducing complexity, this system enhances power efficiency and accelerates the delivery of hyperscale facilities while maintaining the highest quality standards. The X-Power system is capable of supporting server cabinets with power densities of up to 132kW, providing robust power capacity for the most demanding AI and high-performance computing.

3.     X-Cooling Solutions: The “X-Cooling” solutions offer comprehensive cooling systems that combine air cooling, liquid cooling, and hybrid cooling methods to address the high-density demands of AI-ready data centers. With capabilities ranging from cabinet power densities of 8kW to 150kW, and achieving a PUE as low as 1.10 with immersive liquid cooling, this solution integrates multiple cooling technologies and products, adapting to architectural, environmental, and geographical constraints.

As traditional air cooling methods reach their limits in high-density environments, there is an increasing demand for liquid cooling in hyperscale data centers. In response, Chindata has initiated the development of industry standards for cold plate liquid cooling systems in China, leveraging the experience gained from developing and deploying X-Cooling solutions. These standards will ensure quality control throughout the lifecycle of the systems.

4.     AI-Driven Operations and Maintenance: Chindata’s integrated monitoring platform, combined with its data center operational management system, enables more automated and standardized management processes. By incorporating AI-driven solutions, the platform optimizes the control of critical systems, particularly the cooling systems, ensuring maximum efficiency and reliability. Chindata continues to refine its operation and maintenance protocols to meet the evolving demands of AI data centers.

Industry Leadership in AI Infrastructure

Zhang Binghua, Chief Technology Officer at Chindata Group, commented on the launch:

“The rise of AI is fundamentally transforming the landscape of data center technologies. Chindata has always been committed to leading technological innovation, focusing on modularity, integration, and advanced prefabrication. With the AI Data Center Total Solution 2.0, we are well-positioned to meet the diverse computing needs of the AI era, ensuring the efficient translation of electrical energy into computational power.”

About Chindata Group

Chindata Group is a leading carrier-neutral hyperscale data center solutions provider in the Asia-Pacific region, pioneering next-generation hyperscale data centers in China, India, and Southeast Asia. The company offers end-to-end services across the facility lifecycle, including planning, investment, design, construction, and operation. With a robust international development team, Chindata is expanding its data center clusters in Malaysia, India, and Thailand, and seeking further business opportunities in emerging markets across Asia-Pacific.

For media inquiries, please contact: media@Chindatagroup.com

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SOURCE Chindata Group

SHENZHEN, China, Oct. 25, 2024 /PRNewswire/ — Elegoo, a rapidly developing brand in global smart manufacturing, is excited to announce its participation at Formnext 2024, one of the world’s largest exhibitions for additive manufacturing. From November 19-22, 2024, in Frankfurt, Germany, Elegoo will present its latest advancements in resin and FDM 3D printing and unveil initiatives promoting inclusivity beyond the industry.

Elegoo’s exhibit will feature the highly anticipated FDM flagship, Centauri Carbon, along with new products and Elegoo’s first software. These innovations underscore Elegoo’s mission to make 3D printing more accessible and versatile for both professionals and hobbyists.

Elegoo will also host several leading voices in the 3D printing community, who will deliver speeches on a variety of topics throughout the four-day event. Additionally, a special roundtable at its booth will spotlight the experiences of female designers and creators at the intersection of 3D printing and fashion. Plus, Elegoo’s first fan gathering in Europe will take place at a separate venue in Frankfurt during the exhibition, bringing together friends from across the continent.

Elegoo’s leadership team, including Kevin Wang, VP and Co-founder, Coco Lee, Brand Director, and Chris Liu, Sales Director, will be available at the booth to share the company’s latest innovations and their vision for the future of 3D printing.

For more information or to schedule a discussion with the Elegoo team, please contact marketing@elegoo.com. You may also visit Elegoo official website and social media platforms, including Facebook, Instagram, X (Twitter), YouTube, TikTok, Discord and Reddit.

Date: November 19-22, 2024
Venue: Messe Frankfurt Exhibition Center
Booth: Hall 12.1-F01

About Elegoo
Founded in 2015, Elegoo is a rapidly developing brand in the global smart manufacturing industry, specializing in R&D, manufacturing, and sales of consumer-grade 3D printers, laser engravers, STEM kits, and other smart technology products. Located in Shenzhen, the Silicon Valley of China, the company has sold millions of products to nearly 90 countries and regions. In 2023, the company’s total sales revenue reached approximately 200 million USD, with close to 700 employees and nearly 25,000 square meters of office and manufacturing area. With a focus on programming and 3D printing technology, Elegoo provides unique and smart creation spaces for diverse consumers to enhance personalized experiences.

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SOURCE ELEGOO

Empowering Multinational Workforce and Streamlining Global HR Operations

SAN JOSE, Calif., Oct. 25, 2024 /PRNewswire/ — empinfo Inc., a leading provider of employment verification solutions, is proud to announce the launch of another innovative solution to optimize HR operations: A fully automated employment letter generation solution, specifically designed for international employees. This new feature, available directly within empinfo’s employment verification platform, sets a new industry standard for global HR operations and will be offered for no additional cost to empinfo’s employer clients.

empinfo clients can now use this unique feature to easily create and customize employment letters for international employees, which supports multi-language and multi-currency functionality—without the need for additional implementation. Additionally, employees worldwide can directly access and download a copy of their employment letters anytime through the employees’ self-service dashboards.

Jag Puttanna, CEO at empinfo, expressed his excitement about the launch, stating, “No other provider in our industry offers this value-added solution. We are thrilled to introduce this unique feature as part of our ongoing mission to automate back-office tasks for employers, now expanding support for their global workforce.”

Initially launched for U.S. based employees, this feature now extends to employees across the globe, addressing a critical need for multinational organizations. It has been highly anticipated by clients and fills many key gaps in global HR operations.

Key Benefits of empinfo’s Employment Letter Solution:

Free for Employer Clients: Available at no cost to clients using empinfo’s employment and income verification solutions.

Customizable Solutions: Employment letters can be personalized to meet the unique requirements of multi-national organizations, with options to tailor letters for employees at a global level or localized for specific countries or regions.

Multi-Language and Multi-Currency Compatibility: HR teams can generate employment letters in various languages and currencies, ensuring alignment with local business practices and compliance needs.

Seamless Global Access: Employees can effortlessly access their employment letters through a self-service dashboard without the need to create traditional login credentials, offering “password-less” access for convenience and efficiency.

This revolutionary feature streamlines HR processes to manage employment letter requests for US and international employees, providing greater flexibility, efficiency, and support for global businesses.

About empinfo

empinfo provides nationwide coverage to verify people’s employment & income information to help lenders, pre-employment screeners, government agencies, landlords, and other authorized verifiers seeking to credential the applicants, online and 24×7. It helps employers outsource and automate the inbound employment/income verification process to reduce their administrative burden, mitigate the privacy risks of dealing with unknown 3rd party verifiers and provide a better experience for their employees.   

Trusted by employers and employees, empinfo is the most secure employment and income verification platform with innovative products for both enterprises and small and mid-sized businesses (SMBs.) With empinfo, organizations automate the continuous stream of inbound employment and income verifications, freeing up internal resources to focus on strategic business priorities while mitigating compliance risk and eliminating interactions with unknown third-party requestors such as lenders, pre-employment screeners, government agencies, landlords, and other.

For more information about empinfo, visit www.empinfo.com.

For media inquiries, please contact:

Anir Pradhan
anir.pradhan@empinfo.com
800-274-9694

#HRConference #empinfo #HR #Payroll #verifications #voe #voi

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SOURCE EmpInfo, Inc.