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University of Electro-Communications Research and Innovation: Transformable and Multipurpose robotics

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TOKYO, Oct. 18, 2024 /PRNewswire/ — The University of Electro-Communications (UEC) announces the release of the October 2024 issue of its Research and Innovation newsletter. This edition highlights cutting-edge research and innovation, featuring video profiles of faculty members Kohei Kimura (Innovation: Transformable and Multipurpose robotics) and Yuri Shinohara (Research: Advanced analysis of martensite microstructures). The newsletter also presents research by Yoshihiro Nakata on robotics and “food psychology,” and Hideo Isshiki on advancements in “Layer-by-Layer Copper Aluminum Oxide Films for Advanced P-Type Thin Film Transistors.”

The issue further details the successful 6th ASEAN-UEC Workshop on Informatics and Engineering 2024 and President Tano’s visit to VGISC (Vietnam), reflecting UEC’s commitment to fostering international collaboration.

For more information and to access the full newsletter, please visit the links below:

Video Profiles

Kohei Kimura (Innovation)

Transformable and Multipurpose robotics

The research led by Kohei Kimura at the Department of Informatics, Graduate School of Informatics and Engineering, focuses on developing robots with “transformable” and “multipurpose” capabilities. The aim is to create adaptable robots that can change their shape to suit different environments and perform various tasks using a single robotic form.

http://www.ru.uec.ac.jp/randi/video/innovation/

Yuri Shinohara (Research)

Advanced analysis of martensite microstructures based on crystallography and kinematics

Yuri Shinohara focuses her research on metallography and crystallography, particularly the study of martensitic transformation in metallic materials. This non-diffusive crystal structure change is significant for its broad industrial applications. A key example of martensitic transformation is observed in iron, where austenite converts to martensite upon cooling and reverts upon heating. This transformation underlies applications in shape memory alloys (SMAs), such as nickel-titanium (Ni-Ti) alloys, which revert to their original shape upon heating after deformation. Additionally, martensite formation is critical in strengthening materials like martensitic stainless steels used for high-strength fasteners.

http://www.ru.uec.ac.jp/randi/video/research/

Research and Innovation publications

Yoshihiro Nakata‘s pneumatically-driven edible robot

Food Psychology: Moving food sensation

Now, Yoshihiro Nakata from The University of Electro-Communications, Tokyo, and colleagues have developed a moving, edible robot based on gelatin and sugar [1]. Introducing the concept of human–edible robot interaction, they demonstrated that the robot enables controlled experiments probing the human psychology of animated food consumption.

http://www.ru.uec.ac.jp/randi/research-highlights/innovation/

Publication : Yoshihiro Nakata, Midori Ban, Ren Yamaki, Kazuya Horibe, Hideyuki Takahashi, Hiroshi Ishiguro, Exploring the eating experience of a pneumatically-driven edible robot: Perception, taste, and texture, PLoS ONE 19(2), e0296697.

URL:https://journals.plos.org/plosone/article?id=10.1371/journal.pone.0296697
DOI: 10.1371/journal.pone.0296697

Hideo Isshiki’s thin film transistor

Layer-by-layer copper aluminum oxide films for advanced p-type thin film transistors

Most field-effect transistors are of the so-called n-type, meaning that the relevant charge carriers are electrons, which are negatively charged. Transistors in which positively charged ‘holes’ — local electron deficiencies — conduct the current are known as p-type. Generally, electrons are more mobile than holes, which is one of the reasons n-type TFTs are more commonly used. Yet, p-type TFTs are also valuable for complementary MOS(CMOS) system contributing to low power consumption, which is why Isshiki and colleagues aimed to develop a p-type TFT that can be relatively easily manufactured and has good device characteristics.

Publication : Mehdi Ali, Daiki Yamashita, Hideo Isshiki, Growth of CuAlO2 on SiO2 under a layer-by-layer approach conducted by digitally processed DC sputtering and its transistor characteristics, Jpn. J. Appl. Phys. 63, 035502 (2024).

URL : https://doi.org/10.35848/1347-4065/ad2aa5
DOI : 10.35848/1347-4065/ad2aa5

NEWS

6th ASEAN-UEC Workshop on Informatics and Engineering 2024

The UEC ASEAN Research and Education Center held the 6th ASEAN-UEC Workshop on Informatics and Engineering on September 8, 2024, at the Academy of Cryptography Techniques (ACT) in collaboration with the ECTI Association (Thailand) and the Radio and Electronics Association of Vietnam (REV). The annual workshop, launched in 2019, offers ASEAN and UEC students the chance to present at international conferences.

http://www.ru.uec.ac.jp/randi/news/202410_1.html

President Tano’s Visit to VGISC (Vietnam)

On Friday, September 6, 2024, UEC President Tano, accompanied by Dr. Oya, Board Member for International and Public Relations Strategy, and other UEC representatives, visited the Vietnam Government Information Security Commission (VGISC).

http://www.ru.uec.ac.jp/randi/news/202410_2.html

Further information
International Affairs Section
Email: researchexch-k@office.uec.ac.jp
Telephone: 81-(0)-42-443-6723
The University of Electro-Communications
1-5-1 Chofugaoka, Chofu, Tokyo 182-8585
Website: http://www.uec.ac.jp/

About the University of Electro-Communications

The University of Electro-Communications (UEC) in Tokyo is a small, luminous university at the forefront of pure and applied sciences, engineering, and technology research. Its roots trace back to 1918, with a mission to train maritime communication engineers. UEC was officially established as a national university in 1949 and continues to lead innovation in wireless communications, laser science, robotics, informatics, and material science.

With approximately 4,000 students and 350 faculty members, UEC remains a hub for cutting-edge research and collaboration.

 

View original content:https://www.prnewswire.co.uk/news-releases/university-of-electro-communications-research-and-innovation-transformable-and-multipurpose-robotics-302280234.html

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RADCOM to Report Fourth Quarter and Full Year 2024 Results on February 12, 2025

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Management to hold a conference call on the same day at 8:00 AM ET

TEL AVIV, Israel, Jan. 15, 2025 /PRNewswire/ — RADCOM Ltd. (Nasdaq: RDCM) announced today that it will report its financial results for the fourth quarter and full year 2024, which ended December 31, 2024, on Wednesday, 12, February 2025, before the opening of trade on the Nasdaq Stock Market.

RADCOM’s management will hold an interactive conference call on the same day at 8:00 AM Eastern Time (3:00 PM Israel Standard Time) to discuss the results and answer participants’ questions.

A live webcast of the presentation will be available at https://Veidan.activetrail.biz/radcomq4-2024. The webcast will be archived for 90 days following the live presentation.

To join the interactive call, please call one of the following numbers approximately five minutes before the call is scheduled to begin:

From the US (toll-free): +1-866-652-8972
From other locations: +972-3-9180644

A conference call replay will be available the same day on the Company’s investor relations website, www.radcom.com/investor-relations.

For all investor inquiries, please contact:

Investor Relations:
Miri Segal
MS-IR LLC
msegal@ms-ir.com

Company Contact:
Hadar Rahav
CFO
+972-77-7745062
hadar.rahav@radcom.com 

About RADCOM

RADCOM (Nasdaq: RDCM) is the leading expert in 5G ready cloud-native, network intelligence solutions for telecom operators transitioning to 5G. RADCOM Network Intelligence consists of RADCOM Network Visibility, RADCOM Service Assurance, and RADCOM Network Insights. The RADCOM Network Intelligence suite offers intelligent, container-based, on-demand solutions to deliver network analysis from the RAN to the core for 5G assurance. Utilizing automated and dynamic solutions with smart minimal data collection and on-demand troubleshooting and cutting-edge techniques based on machine learning, these solutions work in harmony to provide operators with an understanding of the entire customer experience and allow them to troubleshoot network performance from a high to granular level while reducing storage costs and cloud resource utilization. For more information on how to RADCOMize your network today, please visit www.radcom.com, the content of which does not form a part of this press release.

View original content:https://www.prnewswire.com/news-releases/radcom-to-report-fourth-quarter-and-full-year-2024-results-on-february-12-2025-302351552.html

SOURCE Radcom

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NJFX Welcomes Multinational Bank to Ecosystem Advancing Cloud and AI Connectivity

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WALL TOWNSHIP, N.J., Jan. 15, 2025 /PRNewswire/ — NJFX, the Tier 3 carrier-neutral cable landing station and colocation campus is thrilled to welcome another major multinational bank into its robust ecosystem. This new partnership underscores NJFX’s pivotal role in facilitating secure, efficient, and resilient network strategies for financial organizations.

The latest addition to the NJFX ecosystem represents a leading European financial institution with over 160 years of heritage and a presence spanning 65 countries. The bank’s expertise in Private Banking, Insurance, Global Banking and Investor Solutions, and International Retail, Mobility, and Leasing Services positions it as a critical player in the global economy. Leveraging NJFX’s unique infrastructure, the bank aims to enhance its private and public cloud connectivity and explore advanced AI applications, setting a benchmark for innovation and resilience.

NJFX’s Wall, New Jersey campus is the hub where leading global cloud operators interconnect with transatlantic subsea cables linking Europe, South America, and the Caribbean. By joining NJFX’s, the bank secures unprecedented access to diverse, carrier-neutral pathways, ensuring a “never down” approach to its global operations. NJFX’s ecosystem offers an unique connectivity model guaranteeing transparency and true diversity, aligning with the stringent requirements of the financial market.

“Our ecosystem has always been a cornerstone for industries requiring unparalleled network reliability and global reach,” said Gil Santaliz, Founder and CEO of NJFX. “Welcoming this esteemed financial institution further validates our vision to provide transformative infrastructure that supports not just today’s needs but also tomorrow’s advancements in AI and cloud technologies.”

The collaboration exemplifies NJFX’s commitment to serving the financial sector with cutting-edge connectivity solutions. As NJFX continues to expand its global footprint, this partnership highlights its role in bridging continents and fostering innovation.

About NJFX
NJFX owns and operates a Tier 3 Connectivity Hub offering data center, colocation, and CLS services in Wall, New Jersey. Hosting over 35 global and US operators providing direct transatlantic connectivity to Europe, South America, and the Caribbean. NJFX offers high and low-density colocation solutions with 24/7 support. NJFX provides a carrier-neutral marketplace to operators, content providers, enterprise, financial, and government entities who need network reliability, security, and scalability. The NJFX facility enables diverse connectivity options and ensures cost efficiency by offering direct interconnection without recurring cross-connect fees.

For media inquiries, please contact:
Emily Newman – Director of Marketing
emily@njfx.net

View original content to download multimedia:https://www.prnewswire.com/news-releases/njfx-welcomes-multinational-bank-to-ecosystem-advancing-cloud-and-ai-connectivity-302351133.html

SOURCE NJFX

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GSV Announces the 2025 GSV Cup 50

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CHICAGO and NEW YORK and SAN FRANCISCO, Jan. 15, 2025 /PRNewswire/ — The GSV Cup, presented by Amazon Web Services (AWS) and GSV Ventures, is proud to unveil the 50 most innovative digital learning and workforce skills startups that are poised to revolutionize “PreK to Gray” learning in 2025 and beyond. 

The world’s most innovative digital learning and workforce skills startups.

With the most nominations in GSV Cup history, 1,900+ nominations were evaluated using GSV’s “Five P’s” framework—People, Product, Potential, Predictability, and Purpose—to select the top 50 pre-seed and seed-stage startups advancing innovation across early childhood, K-12, higher education, workforce learning, and adult consumer learning. 

“Startups are the lifeblood of the ASU+GSV community,” said Deborah Quazzo, Managing Partner of GSV Ventures and Co-founder of the ASU+GSV Summit. “The GSV Cup 50 are the brightest stars of tomorrow, enabling Learning at the Speed of Light for educators, workforce leaders, and learners everywhere. We’re proud to recognize these early-stage innovators as they revolutionize learning in the age of AI.” 

The 2025 GSV Cup 50 are Amigo, Atypical AI, Avoca, Axio AI, Bloom App, Boddle, BrightBee, Brisk Teaching, Careerflow.ai, Cerebry, Class Companion, Coconote, Doowii, Ed Machina, Eddi, Ednition, Emversity, Fizz, Flint, Gizmo, Glasp, GrowthSchool, Heeyo, Hoogly, Kollegio, Lightscreen Ai, Ludenso, Lyssn, Masters’ Union, Mentava, Mesa School, mytalents.ai, OutSmart College, Paloma, Praxis AI, Puzzicle, Quizard AI, SchoolAI, Schoolytics, SigIQ, Sizzle AI, Skillfully, Snorkl, Solvely.ai, Stimuler, TAP, Toko, Unriddle, Upsmith, and Woolf.

Of the 50, 78% are US-based, with additional representation from India, Singapore, Norway, Austria, and Australia. The GSV Cup 50 will showcase their innovations at the 16th Annual ASU+GSV Summit, April 6-9, in San Diego, CA.

Learn more here

ABOUT ASU+GSV
Founded in 2011, GSV is a global platform driving education and workforce skills innovation. We believe ALL people deserve equal access to the future and that scaled innovations in “PreK to Gray” learning and skills are crucial to achieving this goal. The GSV platform includes the ASU+GSV Summit, hosted annually in San Diego with 7,000+ attendees; the third annual India-based ASU+GSV & Emeritus Summit; and The AI Show @ ASU+GSV, an immersive exploration of the AI Revolution in education, which welcomed 10,000+ attendees in 2024. GSV Ventures, founded in 2015, is a multi-stage venture fund investing in the most transformational companies across the global “PreK to Gray” landscape.

View original content:https://www.prnewswire.com/news-releases/gsv-announces-the-2025-gsv-cup-50-302351418.html

SOURCE ASU+GSV Summit

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