Connect with us

Technology

Semiconductor Chip Packaging Market to Grow by USD 993.4 Billion from 2024-2028, Driven by Increased Investment in Fabrication Facilities and AI-Powered Market Evolution – Technavio

Published

on

NEW YORK, Oct. 17, 2024 /PRNewswire/ — Report on how AI is driving market transformation – The Global Semiconductor Chip Packaging Market  size is estimated to grow by USD 993.4 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 37.32%  during the forecast period. Growing investment in fabrication facilities is driving market growth, with a trend towards growing investments in lower technology node. However, high initial investment  poses a challenge – Key market players include 3M Co., Amkor Technology Inc., Applied Materials Inc., ASE Technology Holding Co. Ltd., ASMPT Ltd., ChipMOS TECHNOLOGIES INC., Foundaries Inc., Jiangsu Changdian Technology Co. Ltd., Kulicke and Soffa Industries Inc., Microchip Technology Inc., nepes Corp., Powertech Technology Inc., Skywater Technology, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Tokyo Electron Ltd., Unisem M Berhad, UTAC Holdings Ltd., and Veeco Instruments Inc..

AI-Powered Market Evolution Insights. Our comprehensive market report ready with the latest trends, growth opportunities, and strategic analysis- View your snapshot now

Forecast period

2024-2028

Base Year

2023

Historic Data

2018 – 2022

Segment Covered

Packaging (3DIC TSV stacks, 2.5D interposers, Flip-chip wafer bumping, FO WLP/SiP, and Others), End-user (OSATs and IDMs), and Geography (APAC, North America, Europe, South America, and Middle East and Africa)

Region Covered

APAC, North America, Europe, South America, and Middle East and Africa

Key companies profiled

3M Co., Amkor Technology Inc., Applied Materials Inc., ASE Technology Holding Co. Ltd., ASMPT Ltd., ChipMOS TECHNOLOGIES INC., GlobalFoundaries Inc., Jiangsu Changdian Technology Co. Ltd., Kulicke and Soffa Industries Inc., Microchip Technology Inc., nepes Corp., Powertech Technology Inc., Skywater Technology, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Tokyo Electron Ltd., Unisem M Berhad, UTAC Holdings Ltd., and Veeco Instruments Inc.

Key Market Trends Fueling Growth

Semiconductor manufacturers are continuously innovating to meet the increasing demand for smaller, more powerful, and energy-efficient semiconductors. To achieve this, they are investing heavily in research and development to identify new technologies, such as FinFET and FD-SOI, for producing ICs with smaller process nodes. Moore’s law, which predicts the number of transistors in an integrated circuit will double approximately every two years, is driving this trend. FinFET and FD-SOI technologies are gaining popularity for their advantages in power consumption, performance, and scalability. FinFET is widely used in 14/16 nm nodes, offering greater density, lower power consumption, and higher performance. FD-SOI technology, used in 10/12 nm nodes, provides a balanced power-performance trade-off and ultra-low power consumption at 0.4V operation. The semiconductor industry is responding by building new fabrication facilities to support the production of ICs based on these lower technology nodes. For instance, Taiwan Semiconductor Manufacturing announced in June 2021 its plan to build an advanced semiconductor fab in the US. The growth in investment in semiconductor manufacturing facilities is expected to fuel the demand for semiconductor chip packaging designed specifically for semiconductor wafers, driving the market’s growth during the forecast period. 

The semiconductor chip packaging market is experiencing significant growth due to trends in defense sector spending and the military’s increasing reliance on advanced semiconductor components for defense electronics. IC packaging materials, such as encapsulation resins, leadframes, and thermal interface materials, are in high demand for densifying integrated circuits in military applications. Additionally, the consumer electronics sector, including laptops, smartwatches, and smartphones, is driving demand for miniaturization and advanced packaging solutions like Small Outline Packages and Surface Mount Technology. The 5G revolution and the rise of autonomous vehicles are also fueling growth in this market. Electronics manufacturing hubs are investing in digitalization trends, machine learning, and foreign investments to stay competitive. Advanced packaging technologies like System in Package, 3D packaging, and Organic Substrates are essential for meeting the demands of emerging technologies like Artificial Intelligence, Internet of Things, and Autonomous Driving. However, challenges like product obsolescence, intellectual property concerns, outsourcing, testing processes, and the need for electrical insulation and mechanical support persist. The market is also witnessing the adoption of advanced bonding wire and encapsulation resins for enhanced performance and reliability. 

Insights on how AI is driving innovation, efficiency, and market growth- Request Sample!

Market Challenges

The semiconductor chip packaging market is experiencing significant changes due to the increasing demand for compact Integrated Circuits (ICs) and the emergence of advanced packaging solutions like Through-Silicon Vias (TSV), stacked packaging, and Micro-Electromechanical Systems (MEMS) packaging. Manufacturers are investing heavily in new equipment to produce these compact ICs, leading to higher manufacturing costs. The complex manufacturing process, longer production time, and increased risk of defects further add to the expenses. Rapid technological advancements in the semiconductor industry necessitate the use of efficient equipment, increasing the total cost of ownership. Consequently, many companies are adopting a fabless model, reducing the potential customer base for semiconductor chip packaging vendors. Despite the high initial investment, these challenges are expected to hinder market growth during the forecast period.

The semiconductor packaging market is experiencing significant growth due to the increasing demand for advanced technologies in consumer electronics, such as smartphones and tablets. Key sectors driving this growth include electric vehicles, autonomous driving, artificial intelligence, Internet of Things, and advanced packaging. Challenges in semiconductor packaging include miniaturization, thermal and electrical performance, and advanced technologies like System in Package, 3D packaging, organic substrates, and advanced encapsulation resins. Traditional packaging methods like ceramic packages, bonding wire, and die attach materials face competition from advanced techniques like Flip Chip. The aerospace and defense industry, telecommunications market, smart manufacturing, and high-frequency applications also contribute to the market’s growth. Additionally, sectors like automotive electronics, automotive electronics, and wearable technology require advanced packaging solutions for power densities, thermal management, and signal integrity. The market is also impacted by regulations like Production Linked Incentive and the need for electromagnetic interference and electromagnetic compatibility in various applications.

Insights into how AI is reshaping industries and driving growth- Download a Sample Report

Segment Overview 

This semiconductor chip packaging market report extensively covers market segmentation by

Packaging 1.1 3DIC TSV stacks1.2 2.5D interposers1.3 Flip-chip wafer bumping1.4 FO WLP/SiP1.5 OthersEnd-user 2.1 OSATs2.2 IDMsGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa

1.1 3DIC TSV stacks-  The Semiconductor Chip Packaging Market is experiencing significant growth due to the increasing demand for advanced functionalities, improved performance, and cost reduction. Three-Dimensional Interconnect (3DIC) Through-Silicon Via (TSV) technology is a crucial solution for high-end memory applications, heterogeneous interconnection with CMOS Image Sensors (CIS), micro-electromechanical systems (MEMS), sensors, radio frequency (RF) filters, and performance applications. The popularity of TSV platforms is driven by their ability to increase integration and performance. In the future, TSV technology is expected to be used for applications such as photonics and light-emitting diode (LED) function integration. This trend is anticipated to boost the demand for 3DIC TSV stacks, thereby driving the growth of the Semiconductor Chip Packaging Market during the forecast period.

Download complimentary Sample Report to gain insights into AI’s impact on market dynamics, emerging trends, and future opportunities- including forecast (2024-2028) and historic data (2018 – 2022) 

Research Analysis

The Semiconductor Chip Packaging Market encompasses the design, manufacturing, and integration of semiconductor devices into various electronic systems. The market is driven by the increasing demand for consumer electronics, particularly smartphones and tablets, as well as the growing adoption of electric vehicles and autonomous driving technologies. Advanced packaging techniques, such as fan-out wafer level packaging and 2.5D/3D packaging, are gaining popularity due to their ability to increase power densities and improve thermal management in high frequency applications, high performance computing, data processing, and artificial intelligence. Advanced packaging materials, including advanced encapsulation resins, electrical insulation, mechanical support, leadframes, and sensor technologies, play a crucial role in ensuring signal integrity and reliability. Additionally, the market is expanding into new areas such as automotive electronics, advanced driver assistance systems, laptops, smartwatches, and advanced semiconductor components. Integrated cooling mechanisms are becoming increasingly important to address the thermal challenges of these advanced systems.

Market Research Overview

The Semiconductor Chip Packaging Market encompasses various technologies and materials used to protect and connect semiconductor devices in consumer electronics, automotive, aerospace, telecommunications, and other industries. Advanced packaging techniques, such as System in Package (SiP), 3D packaging, and Organic Substrates, are driving innovation in miniaturization, thermal management, and electrical performance. Key applications include smartphones, tablets, electric vehicles, autonomous driving, and the Internet of Things (IoT). Advanced technologies like Artificial Intelligence (AI), Machine Learning (ML), and High Performance Computing (HPC) require advanced semiconductor components and packaging materials for optimal thermal and electrical performance. Traditional packaging methods, such as Ceramic Packages and Die Attach materials, continue to play a role in specific applications, while new materials like advanced encapsulation resins and thermal interface materials offer improved performance and reliability. The market is influenced by trends like smart manufacturing, high frequency applications, and digitalization, as well as challenges like product obsolescence, intellectual property concerns, and testing processes. Emerging applications include autonomous vehicles, 5G, and wearable technology, while industries like defense and military electronics continue to drive demand for advanced semiconductor components and packaging materials. Production-Linked Incentives and Foreign Investments are shaping the market landscape, with electronics manufacturing hubs in Asia, Europe, and North America leading the way.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

Packaging3DIC TSV Stacks2.5D InterposersFlip-chip Wafer BumpingFO WLP/SiPOthersEnd-userOSATsIDMsGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

View original content to download multimedia:https://www.prnewswire.com/news-releases/semiconductor-chip-packaging-market-to-grow-by-usd-993-4-billion-from-2024-2028–driven-by-increased-investment-in-fabrication-facilities-and-ai-powered-market-evolution—technavio-302278826.html

SOURCE Technavio

Continue Reading
Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *

Technology

LITEON Debuts Integrated AI Cloud Server Rack Solutions Powered by NVIDIA at 2024 OCP Summit

Published

on

By

Pioneering Green Data Centers with Five Key Technologies: Power Supplies, Liquid Cooling, Racks, Software, and Systems

AI. Revolutionized. Green Resilience.

SAN JOSE, Calif., Oct. 17, 2024 /PRNewswire/ — LITEON Technology (2301.tw) is participating in the 2024 OCP Global Summit ( Open Compute Project ) in San Jose, USA, from October 15 to 17. Under the theme “AI. Revolutionized. Green Resilience,” LITEON will debut its new “Integrated AI cloud server rack solution.” This solution combines LITEON’s five key technologies: high-performance power supplies compliant with ORV3 standards, comprehensive liquid cooling systems, integrated mechanical design, intelligent power management software, and hardware-software system integration. Additionally, LITEON will showcase power supplies, racks, and liquid cooling systems compatible with NVIDIA architectures at the event. These include support for the NVIDIA GB200 NVL72 platform with a high-efficiency power system and NVIDIA MGX™ with modular system design racks, as well as liquid-to-liquid and liquid-to-air cooling solutions from LITEON. These innovations aim to enhance high-performance computing capabilities, efficient energy management, and cooling performance in data centers during the AI era, helping customers achieve low-carbon green data center energy management goals and creating comprehensive high-end AI computing system solutions.

Anson Chiu, the president of LITEON, states: “The AI-driven era has already transformed lifestyles and industries. Leveraging our deep technical expertise in high-end cloud server power supplies, LITEON integrates five key core capabilities: power, cooling, racks, software, and systems. This showcases LITEON’s comprehensive autonomous design and development technology. We continue to create sustainable and high-performance integrated server rack solutions, helping our customers achieve sustainable operations in green data centers, and pioneering a revolutionary new landscape in the AI field.”

“LITEON COOLING,” LITEON’s comprehensive liquid cooling solution, brings revolutionary changes to the cooling systems of green data centers, meeting the high-performance AI computing needs of data centers. At this event, LITEON showcases five liquid cooling series products. These include a fanless design 5600W Cold Plate Power Supply Unit with titanium-level efficiency, a liquid-to-liquid multi-intelligent in-row CDU 600kW,, liquid-to-liquid 120kW in-rack CDU compatible with the NVIDIA GB200 NVL72 platform, and liquid-to-air 140kW sidecar with the highest heat exchange efficiency, also compatible with the NVIDIA GB200 NVL72 architecture. These solutions offer flexible combinations for customers to meet various field and application needs, overcoming the limitations of traditional air cooling, significantly improving cooling efficiency, and enabling data centers to maintain high-performance workloads while reducing energy and carbon footprint consumption, creating more environmentally friendly green resilient data centers.

At this OCP exhibition, LITEON also showcases integrated cabinet power systems and solutions. These provide 97.5% high-density power conversion efficiency to meet the high-performance computing applications of AI servers. Additionally, LITEON’s self-developed intelligent power management system (PMC) offers customers digital management and remote real-time monitoring to assist decision-making, along with a robust power backup system featuring high-efficiency lithium battery backup power (BBU). Supported by intelligent power management software, it visualizes energy consumption patterns to ensure data center reliability.

LITEON integrates the advantages of five core energy management technologies, combining mechanical design, power system solutions, thermal management technology, and hardware-software integration capabilities. Paired with revolutionary server liquid cooling solutions, the integrated server rack design provides customers with rapid deployment in data center applications, committing to the advanced development of green resilient data centers.

For more information about LITEON’s power and liquid cooling solutions of green data center, please visit : https://www.liteon.com/en/solutions/green-data-center

LITEON’s Booth of OCP 2024 Information :

Date: October 15 – 17, 2024Location: San Jose McEnery Convention CenterBooth No.: C17-18Contact: Simon.Ong@liteon.com

View original content to download multimedia:https://www.prnewswire.com/news-releases/liteon-debuts-integrated-ai-cloud-server-rack-solutions-powered-by-nvidia-at-2024-ocp-summit-302279996.html

SOURCE LITEON Technology

Continue Reading

Technology

Taobao Malaysia Kicks Off 11.11 Sale, First Time in Both Chinese and English

Published

on

By

Exciting early-bird perks await new and existing Malaysian users

KUALA LUMPUR, Malaysia, Oct. 18, 2024 /PRNewswire/ — The highly-anticipated Taobao 11.11 Sale (“11.11”) is back, set to be bigger and more inclusive for Malaysian consumers. With the theme “Shop As Far As You Can Think,” this year’s festival promises attractive offers and an unparalleled shopping experience made even more accessible through Taobao’s beta English Interface, introduced in September to complement the Chinese version.

Starting from 21 October, 8pm, Malaysian shoppers can indulge in a month-long celebration of exciting promotions, enticing instant discounts and chances to grab daily free shipping vouchers worth RM21, discovering exceptional bargains on a wide range of products across participating brands and merchants, from home essentials and fashion items to electronics accessories and more.  

Jess Lew, Country Manager for Tmall Taobao World, Malaysia, said, “We are thrilled to bring Taobao’s 11.11 Sale back to Malaysian consumers and enhance it to be bigger and better than ever. Our commitment is to create a shopping experience that is not only enjoyable but also tailored to the unique needs of local shoppers. With the beta English Interface now available, it has never been easier for everyone in Malaysia to immerse themselves in the excitement of this global shopping festival and discover all that Taobao has to offer.”

The festival kicks off with an early first sales window, running from 20:00:00 on 21 October to 23:59:59 on 24 October 2024, allowing shoppers ample time to check out their shopping cart items to enjoy early-bird 11.11 savings and early arrivals. The second phase will then follow, starting from 20:00:00 on 31 October and running until 23:59:59 on 11 November, where consumers enjoy extended promotional offers to secure their ideal products for the upcoming Christmas and Chinese New Year seasons.

Malaysia was one of the only two markets, alongside Singapore, where Taobao has rolled out a beta English Interface. Featuring artificial intelligence (AI)-powered translations, the new interface aims to bridge language barriers and provide non-Chinese-speaking Malaysian users with the opportunity to enjoy the platform’s diverse offerings in a seamless, user-friendly experience.

“We hope more Malaysian users will leverage this opportunity to shop for anything that comes to mind during this 11.11. Coupled with free shipping, shoppers can have their parcels delivered to their doorsteps in as fast as one week with our robust end-to-end logistics infrastructure,” added Lew.

To mark this year’s 11.11, Taobao Malaysia has curated a series of attractive promotions designed to give Malaysian consumers more ways to save:

Everyday Free Shipping: Stand a chance to grab free shipping vouchers daily at 10am worth RMB35 (equivalent to RM21) throughout the 11.11 period with no minimum spend.Buy More, Save More: Get a platform-wide discount of RMB50 for every RMB300 spent (equivalent to RM29 off for every RM170 spent).Surprise Instant Discounts: Check out daily at 8pm from 21 to 24 October to unlock an instant discount of up to RM300.Daily Promo Codes: Stand a chance to snag promo codes worth up to RMB111 (equivalent to RM66), released daily at 9pm on Taobao Malaysia’s Facebook and Instagram.New User Perks: New Taobao app users can claim exclusive benefits worth up to RM90, including:3 x Free shipping vouchers worth RMB105 (equivalent to RM65) in totalRMB30 off with a minimum spend of RMB31 (equivalent to RM18 off with a minimum spend of RM19)Service fee waiver of up to RMB15 (equivalent to RM10)Free return on first order (for West Malaysia only)

Additionally, Taobao Malaysia users making purchases with one of the following credit cards provided by third-party financial institutions can enjoy an instant discount of up to RM80 during the selected promotional periods:

31 October to 3 November; 10 to 11 November, 8PMCIMB: RM25 off with a minimum spend of RM180RHB: RM38 off with a minimum spend of RM250 OR RM50 off with a minimum spend of RM500PBB: RM30 off with a minimum spend of RM300 OR RM80 off with a minimum spend of RM600

Only on 31 October, 10AMRHB: RM25 off with a minimum spend of RM250

Only on 8 November, 10AMPBB: RM20 off with a minimum spend of RM200

The Taobao app is available to download for FREE on both the Apple App Store and Google Play Store. For more details on Taobao Malaysia’s 11.11 promotions, please stay tuned for updates on the Taobao Malaysia Facebook, Instagram and TikTok social media channels or visit the Taobao app.

* The platform rules will prevail over the specific promotion details.

About Taobao Malaysia
Taobao Malaysia aims to facilitate convenient shopping on Taobao and Tmall for consumers in Malaysia. Through the Taobao app, Malaysian shoppers can access billions of products, complete with logistics, payment and other services and offers tailored to their individual market needs. Taobao Malaysia is part of Alibaba International Digital Commerce Group.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/taobao-malaysia-kicks-off-11-11-sale-first-time-in-both-chinese-and-english-302280001.html

SOURCE Taobao Malaysia

Continue Reading

Technology

Sennheiser launches the MD 421 Kompakt – an appropriately named, compact version of legendary all-rounders, the MD 421 and MD 421-II

Published

on

By

“Anything. This is the mic for that.”

SINGAPORE, Oct. 18, 2024 /PRNewswire/ — They say that if you’ve heard music, you are most likely to have heard the MD 421, a Sennheiser microphone featured in countless award-winning performances and productions over the past six decades. Now Sennheiser launches the MD 421 Kompakt, an incredibly versatile microphone that delivers the same legendary performance, but in a truly multipurpose package — including a completely redesigned mounting clip. The MD 421 Kompakt features a cardioid pick-up pattern and remarkable dynamic range, delivering crystal-clear sound reproduction in live sound and recording applications.

“The MD 421 is an incredibly versatile microphone. Since its inception in 1960, it excelled as a studio and a vocal microphone, but was also used a lot in broadcasting, where it appeared with many celebrities of the time. Today, its successor, the MD 421-II, which launched in 1998, is an all-rounder for multipurpose miking and well known to be used on drums, guitar cabs and horns,” says Bertram Zimmermann, Manager Live Sound & Studio. “It works on anything, capturing the sound source with precision, detail, and rich sound.”

“With the MD 421 Kompakt, we’re offering the same legendary sound and ability to handle high sound pressure levels, but with an incredibly compact form factor,” adds Jimmy Landry, Category Marketing Manager MI.

Compact design, same great sound

To give the MD 421 microphone its compact dimensions all while retaining the large-diaphragm capsule and the pristine sound of the much bigger MD 421-II, the bass roll-off switch was eliminated. “While this feature made total sense when the MD 421 was designed, and was carried over to the MD 421-II, this functionality has long since been taken over by mixing desks and DAWs,” says Zimmermann. “Omitting the switch allowed us to create a relatively small microphone body, making the Kompakt an ideal tom mic, but also a versatile tool for any recording or live application.”

Sound-wise, the MD 421 Kompakt delivers the same detailed and authentic reproduction of the sound source that the MD 421 and MD 421-II have become famous for. The microphone’s frequency response of 30 Hz to 17 kHz faithfully reproduces both high and low frequencies, with a bass tube ensuring an accurate and extended low-end response. The sound is rich and full-bodied, and incredibly clear and detailed at the same time.

The MD 421 Kompakt also provides effective feedback rejection, and is able to handle exceptionally high sound pressure levels even in demanding environments.

New clip

The clip of the MD 421 Kompakt has been entirely redesigned, and is now part of the microphone housing for easy, worry-free mounting. “The clip is the one thing that users have always criticised,” remarks Landry. “The new clip is an integral part of the mic, and the optional drum clamp securely screws into this clip, ensuring fail-safe mounting on drums.”

Rugged all around

The MD 421 Kompakt is designed to withstand the rigours of touring and heavy studio use. It features a rugged frame with a stainless-steel basket, and a gold-plated XLR-3 connector. A protective inner chassis enclosure reduces the exposure to dust and humidity.

Availability and pricing

The MD 421 Kompakt is available now for EUR 279 (MSRP), the version for drums comes complete with an MZH drum clamp and retails at EUR 299 (MSRP). The MZH drum clamp included with the drum version is also available separately for EUR 19 (MSRP). The MD 421-II will remain in the portfolio alongside the MD 421 Kompakt.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/sennheiser-launches-the-md-421-kompakt–an-appropriately-named-compact-version-of-legendary-all-rounders-the-md-421-and-md-421-ii-302280009.html

SOURCE Sennheiser Electronic Asia Pte Ltd

Continue Reading

Trending