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Wire Bonder Equipment Market to grow by USD 227.5 Million from 2024-2028, AI-powered report by Technavio highlights rising global electronics production as key driver

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NEW YORK, Oct. 7, 2024 /PRNewswire/ — Report on how AI is driving market transformation- The global wire bonder equipment market  size is estimated to grow by USD 227.5 mn from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 3.32%  during the forecast period.  Rising electronics production across world is driving market growth, with a trend towards technological advancements in wire bonding. However, shortage of skilled and trained personnel  poses a challenge. Key market players include Accelonix Ltd., ASMPT Ltd., BE Semiconductor Industries NV, Bergen Group, Cirexx International, Corintech Ltd., DIAS Automation HK Ltd., F and K DELVOTEC Bondtechnik GmbH, F and S BONDTEC Semiconductor GmbH, Hesse GmbH, HYBOND Inc., Kulicke and Soffa Industries Inc., Micro Point Pro Ltd., Palomar Technologies Inc., Powertech Technology Inc., Toray Industries Inc., TPT Wirebonder GmbH and Co. KG, Ultrasonic Engineering Co. Ltd, WestBond Inc., and Yamaha Motor Co. Ltd..

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Forecast period

2024-2028

Base Year

2023

Historic Data

Segment Covered

Product (Ball bonders, Stud-bump bonders, and Wedge bonders), End-user (OSAT and IDM), and Geography (APAC, North America, Europe, South America, and Middle East and Africa)

Region Covered

APAC, North America, Europe, South America, and Middle East and Africa

Key companies profiled

Accelonix Ltd., ASMPT Ltd., BE Semiconductor Industries NV, Bergen Group, Cirexx International, Corintech Ltd., DIAS Automation HK Ltd., F and K DELVOTEC Bondtechnik GmbH, F and S BONDTEC Semiconductor GmbH, Hesse GmbH, HYBOND Inc., Kulicke and Soffa Industries Inc., Micro Point Pro Ltd., Palomar Technologies Inc., Powertech Technology Inc., Toray Industries Inc., TPT Wirebonder GmbH and Co. KG, Ultrasonic Engineering Co. Ltd, WestBond Inc., and Yamaha Motor Co. Ltd.

Key Market Trends Fueling Growth

The wire bonder equipment market is experiencing steady growth due to increasing demand from various industries such as electronics, telecommunications, and automotive. Companies are investing in advanced wire bonding systems to improve production efficiency and product quality. Key players in the market include Kulicke and Soffa Industries, Asahi Techno Co. Ltd, and Yamaichi Electronics. These companies are focusing on innovation and technological advancements to stay competitive. The market is expected to continue growing due to the rising trend of miniaturization in electronic devices. 

The Wire Bonder Equipment Market is witnessing significant growth due to the increasing demand for electrical joining techniques in various industries. Thin wires and heat with pressure or ultrasonic energy are commonly used in this process for joining metallic elements on the pad surface. The semiconductor industry, including chip packing, semiconductor packaging, MEMs packaging, TSV packaging, and 3D chip packaging, heavily relies on wire bonding for fine-pitch applications. Bonding force, fine wires, and submicron accuracy are crucial factors driving the market. Advanced vision systems and high-precision motion systems ensure loop clearance and address wire bonding issues such as unsupported die edges, loop resistance, and forward/reverse bonding in the neck region. Ball bonding, Wedge bonders, and Stud-bump bonders are popular equipment used in the industry. Integrated circuits (ICs) and semiconductor devices, made of copper, aluminum, gold, and silver, require premium packaging solutions from chip manufacturers and OSAT firms. The market caters to various electronics devices and semiconductors, offering both manual and automated ball bonding procedures. 

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Market Challenges

The wire bonder equipment market is experiencing steady growth due to increasing demand from various industries such as electronics, automotive, and telecommunications. Companies are investing in advanced wire bonding technology to improve production efficiency and product quality. Key players in the market include Kulicke and Soffa Industries, ASM Pacific Technology, and Yamaichi Electronics. These companies offer solutions for different applications, including automatic and manual wire bonding, and are expanding their product portfolios to cater to diverse industry needs. The market is expected to continue its growth trajectory, driven by technological advancements and rising demand for miniaturized electronic devices.

The semiconductor bonding equipment market faces challenges in the production of silicon chips and microelectronics. Integrating transistors, resistors, and other components requires advanced technology like micromachining and magnetometers, microphones, gyrometers, sensors, and more. However, manufacturing challenges persist, such as chip shortage and longer assembly cycle times. Automatic bonding machines are essential for interconnecting ICs, but they must accommodate various materials like LTCC packages, direct bonded copper, and gold bonding wires. Thermocompression Bonding, Thermosonic Bonding, and Ultrasonic Bonding are crucial processes, using metals like aluminum and Palladium-coated copper (PCC). Market growth is driven by the increasing demand for sensors (humidity, temperature, pressure), MEMS packaging, and optoelectronic manufacturing. The emergence of electric vehicles further boosts the market, requiring more advanced interconnect solutions. Stud Bonders, Bump Bonders, and Peg Bonders are vital equipment for the optoelectronics system. The industry continues to innovate, addressing challenges and ensuring the production of high-quality components for various industries.

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Segment Overview 

This wire bonder equipment market report extensively covers market segmentation by

Product 1.1 Ball bonders1.2 Stud-bump bonders1.3 Wedge bondersEnd-user 2.1 OSAT2.2 IDMGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa

1.1 Ball bonders-  Ball bonding is a common joining method in the electronics industry, primarily carried out using thermocompression and thermo-sonic bonding techniques. Thermocompression bonding employs heat and pressure above 150 degrees Celsius to create intermetallic bonds. Thermo-sonic bonding combines heat and ultrasonic energy for bond formation. Ball bonder equipment facilitates bonding speeds of over 5-12 wires per second, using gold, copper, or palladium-coated wires. Ideal for fine-pitch applications like BGA, SOP, QFP, MCM hybrids, and wafer-level bumping, this technology’s demand is driven by the growth of the semiconductor industry, particularly in applications requiring high precision and miniaturization.

Download complimentary Sample Report to gain insights into AI’s impact on market dynamics, emerging trends, and future opportunities- including forecast (2024-2028) and historic data ( – ) 

Research Analysis

The Wire Bonder Equipment Market refers to the industry that provides equipment used in the electrical joining of thin wires to metallic elements, such as integrated circuits (ICs) and other electronic components. This process involves the application of heat, pressure, and ultrasonic energy to create a reliable electrical connection. The market caters to various bonding techniques including forward and reverse bonding, ball bonding, and wedge bonding, among others. Thin wires made of copper, aluminum, gold, palladium, and other conductive materials are used in this process. The market serves various industries, including microelectronics, semiconductors, mobiles, tablets, and IC devices packaging. Miniaturization is a key trend driving the market, with a focus on developing equipment capable of handling smaller components and thinner wires. Wire bonder equipment is essential for manufacturing MEMs systems, which are increasingly used in various applications. Copper bonding wires are commonly used due to their high conductivity and low cost. The market includes various types of equipment such as Wedge bonders, Stud-bump bonders, and Ball bonders.

Market Research Overview

The Wire Bonder Equipment Market refers to the industry that manufactures and supplies equipment used for electrical joining of thin wires to metallic elements in various applications. This technique involves the application of heat, pressure, and ultrasonic energy to create a reliable connection between the pad surface and the wire. The market caters to the semiconductor industry, including chip packing, semiconductor packaging, MEMs packaging, TSV packaging, and 3D chip packaging. Fine-pitch applications require submicron accuracy, making high-precision motion systems and vision systems essential. Wire bonding issues like loop clearance, unsupported die edges, and loop resistance are addressed through forward and reverse bonding techniques. Various types of bonders, such as Wedge bonders, Stud-bump bonders, and Ball bonders, are used for different applications. Integrated circuits (ICs), semiconductor devices, and microelectromechanical (MEMs) systems are primary consumers. Copper, aluminum, gold, silver, and palladium are commonly used for connection. The market serves various sectors, including electronics, mobiles, tablets, consumer electronics, healthcare, telecommunication, and automotive, with a focus on miniaturization and premium packaging solutions. Semiconductor bonding equipment is crucial for interconnecting ICs and reducing assembly cycle times in optoelectronic manufacturing, LTCC packages, and direct bonded copper applications.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

ProductBall BondersStud-bump BondersWedge BondersEnd-userOSATIDMGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Youdao Dictionary Pen Unveils at CES 2025, Showcasing Cutting-Edge AI Innovations and Applications in Education

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LAS VEGAS, Jan. 10, 2025 /PRNewswire/ — Youdao, a leading intelligent learning company in China, is showcasing its AI-equipped smart device, the Youdao Dictionary Pen X7 series, at the International Consumer Electronics Show (CES 2025).This event showcases the strength of ‘Chinese AI’ in the field of educational technology to a global audience.

The Youdao booth attracted significant attention at the exhibition. The showcased Youdao Dictionary Pen X7 series features proprietary applications, including Hi Echo and Mr. P AI Tutor, which are based on the ‘Zi Yue’ educational large language model. It also provides offline translation capabilities through an edge-side large language model, drawing many users to experience the products.

During the exhibition, Youdao was invited to participate in the Microsoft Greater China offline event at CES 2025. Renlei Liu, Senior Vice President of Youdao, attended a high-level roundtable discussion. Alongside representatives from tech companies such as Microsoft, TCL, Lenovo, and TimeKettle, they explored AI innovation and the globalization of consumer electronics in China.

Renlei Liu stated that large language models possess exceptional natural language processing and interaction capabilities. Leveraging its extensive experience in the language and learning sectors, Youdao launched China’s first educational large language model, ‘Zi Yue’, in 2023. Based on this model, Youdao upgraded all of its software and hardware products and introduced a series of proprietary educational applications, including the digital human language coach, AI Document Q&A, and transcription services for international students.

Renlei Liu said, ‘We believe that before the emergence of truly super applications based on large language models, various companies are exploring vertical fields and specific scenarios, much like the early days of China’s mobile internet, when killer applications had not yet emerged and internet companies were innovating within vertical scenarios. There are many similarities between the era of large models and the mobile internet era, and we are actively experimenting as well’.

Youdao has also applied the reasoning and knowledge Q&A capabilities of the large language model to academic learning scenarios, launching the AI comprehensive inquiry learning assistant, Mr. P AI Tutor. It integrates the large language model and RAG (Retrieval-Augmented Generation) technology, enhancing the AI’s understanding of subject knowledge and the quality of its outputs. It offers guided explanations, multi-turn interactive heuristic teaching, and comprehensive Q&A support across all grades and subjects, addressing many issues in home tutoring scenarios.

Renlei Liu stated that Youdao is actively promoting the application of the “Zi Yue” educational large language model in various scenarios and has conducted a comprehensive AI upgrade of its business products to better meet users’ learning needs. As a result, Youdao’s AI subscription service has achieved rapid growth for seven consecutive quarters.

With the continuous development of large language model applications, improving the efficiency of AI research and development and application has become a key factor in industry competition. In response, Youdao has proposed a solution to harness the capabilities of smaller model applications. Renlei Liu pointed out that general large language models often aim for “large and comprehensive,” but the expansion of model size also leads to increased training and operational costs. For specific scenarios and tasks that require quick response times, using smaller models on the edge can facilitate more effective targeted training, enhance precision, and provide a better user experience.

The AI dictionary pen, equipped with a dedicated educational model can provide high-quality content and functional services, ensuring that it remains focused on learning purposes and is not used for entertainment or other applications. At the same time, by utilizing a smaller model on the edge for localized operation, it supports offline use, thereby avoiding disruptions from the network environment.

Renlei Liu stated that smaller models focus on high-quality vertical applications, which can continuously enhance user experience and build professional technical advantages through flexible and efficient training and iteration. Exploring the application of edge models in more specific scenarios is an important direction for Youdao’s development in AI technology.

In fact, Youdao has already made significant progress in the exploration of edge models. Based on its self-developed “Zi Yue” educational large language model, Youdao has developed the industry’s first edge large language model and applied it to the newly launched X7 series of dictionary pens. This dictionary pen features offline large language model translation capabilities, achieving translation results comparable to those of online NMT (Neural Machine Translation), greatly enhancing the accuracy and fluency of language learning.

As a star product in Youdao’s smart devices lineup, the Youdao Dictionary Pen X7 series has truly become an AI large language model dictionary pen. It is equipped with two proprietary applications of the first educational large language model, “Zi Yue” in China: the AI All-Subject Tutor, Mr. P AI Tutor, and the digital human language coach, Hi Echo, while also providing AI intelligent learning features such as AI essay refinement.

The Youdao Dictionary Pen X7 received an enthusiastic response from users upon its launch. It quickly became the best-selling product in the thousand-yuan price range, surpassing 30,000 units sold. During the 2024 Nov 11th Shopping Festival in China, the Youdao Dictionary Pen X7 Pro topped several industry rankings on major e-commerce platforms, marking the fifth consecutive year that Youdao dictionary pens have held the top position for sales in the same category across both JD.com and Tmall.

This time, Youdao showcased the Dictionary Pen X7 series at CES 2025, receiving widespread recognition on an international stage.

Focusing on AI + education, Youdao will continue to increase its investment in the research and development of edge model applications, promoting the implementation of large language models in more educational scenarios to provide learners with a better learning experience through efficient educational products.

About Youdao, Inc. 

Youdao, Inc. (NYSE: DAO) is a leading intelligent learning company in China focused on using technology to provide educational content, applications, and solutions for learners of all ages. Founded in 2006 as part of NetEase, Inc. (NASDAQ: NTES; HKEX: 9999), Youdao offers a wide range of online courses, interactive learning apps, and smart learning devices.

For more information, please visit: http://ir.youdao.com & https://smart.youdao.com/en/.

CONTACT: youdaopr@rd.netease.com  

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SOURCE Youdao

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HTX 2025 Outlook: Five Sectors to Look Forward to, and How Trump’s Policy Will Affect Crypto Industry

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SINGAPORE, Jan. 10, 2025 /PRNewswire/ — The year 2024 marks a significant chapter in the history of the crypto industry, where we witnessed continuous breakthroughs in blockchain technology, surges in Bitcoin price, and a gradually more open regulatory environment, with cryptocurrencies gaining increasing recognition from the mainstream. As 2025 unfolds, HTX, the world’s leading digital asset exchange, has released its latest report, HTX 2024 Global Web3 Blockchain Ecosystem Review and 2025 Outlook, which provides forward-looking insights into the development prospects of the crypto industry.

Key Sectors for 2025

In the report, HTX highlighted five key sectors that showed encouraging progress last year, and will continue to closely monitor these areas in 2025.

Bitcoin Ecosystem

In 2024, Bitcoin‘s market dominance kept increasing, solidifying its position as the core asset, with spot ETFs acting as liquidity channels, and U.S. listed companies such as MicroStrategy (MSTR) serving as the vehicles to absorb unlimited dollar liquidity.

As a result, it is increasingly essential to further develop Bitcoin‘s ecosystem and enhance capital utilization efficiency. With strong support from macro markets and infrastructure support, a further surge in Bitcoin demand over the next two years is well-anticipated.

Infrastructure

Infrastructure remained a cornerstone in 2024’s crypto investments and funding. The synergy between capital and technology has driven the rapid development of Layer 1, Layer 2,  and middleware projects, among others.

Layer 1 solutions, in particular, now represent the focal point of technical development and exploration within the crypto space, and it is expected to remain a priority for development resources and capital investment in the future.

Meme Coins

The Meme coin sector emerged as a hotspot in 2024, fostering community consensus while integrating with fields like DeFi and GameFi to create new use cases. As the crypto market environment grows increasingly favorable, more retail investors are expected to enter the market, positioning Meme projects as vital channels for capital inflows.

AI

In 2024, the intersection of Crypto and AI sector has been driving the exploration of several segmented fields, the hottest one of which is AI agents. In the future, AI agents will gradually become personal butlers and assistants for users, serving them with comprehensive capabilities. Over time, they may develop unique cultures and religions.

This deep integration of AI and encryption technology is a groundbreaking evolution that is unattainable within Web2 and cannot be achieved by Web3 relying solely on encryption technology.

TON Ecosystem

Attributable to Telegram’s hundreds of millions of users and robust technical support, the TON ecosystem achieved significant milestones in various fields, pioneering the monetization of Web2 social applications through crypto. Moving into 2025, it needs to explore and find new business models to improve user retention and identify its next growth curve.

Donald Trump Effect: Bitcoin Strategic Reserve Worth Anticipating

The report also discusses the potential impact of crypto-friendly policies that could arise after Donald Trump takes office. Two important bills, the FIT21 Act and the Bitcoin Strategic Reserve Act, are likely to pass more quickly thanks to him.

The FIT21 Act aims to create a clear legal framework for token issuance and trading by classifying tokens as digital assets or digital commodities, transferring the regulatory responsibilities of many blockchain projects from the SEC to the CFTC, and introducing a safe harbor mechanism. This would help standardize and promote the healthy growth of the entire industry.

The Bitcoin Strategic Reserve Act, aligning with Trump’s campaign promises, if passed, would mark Bitcoin‘s transition from a niche asset to a nationally recognized reserve asset, greatly enhancing its legitimacy and recognition. It may also prompt other countries to adopt similar measures to further advance Bitcoin‘s global recognition and application.

The Act was submitted to Congress for deliberation on August 4, 2024, and referred to the Senate Banking Committee for review. Trump is well-positioned to push this bill through. Meanwhile, several U.S. states have already proposed their own Bitcoin Strategic Reserve bills. By 2025, Bitcoin as a strategic reserve may become a reality.

Additionally, under Trump’s presidency, the SAB121 Act is likely to be repealed, allowing traditional financial institutions to hold cryptocurrencies on their balance sheets, further accelerating the institutionalization of crypto assets and contributing to the overall maturity of the crypto market. The SEC’s application criteria of the Howey Test may also be relaxed, increasing the likelihood of more spot crypto ETFs being approved and more public listings of crypto companies.

Meanwhile, the report also provides a comprehensive summary of 2024, looking back on the key events that had a major impact on the crypto industry while summing up what HTX had achieved over the last year.

To learn more, please visit: https://square.htx.com/htx-2024-global-web3-blockchain-ecosystem-review-and-2025-outlook/ 

About HTX

Founded in 2013, HTX has evolved from a virtual asset exchange into a comprehensive ecosystem of blockchain businesses that span digital asset trading, financial derivatives, research, investments, incubation, and other businesses.

As a world-leading gateway to Web3, we harbor global capabilities that enable us to provide users with safe and reliable services.

Our growth strategy – “Global Expansion, Thriving Ecosystem, Wealth Effect, Security & Compliance”, underpins our commitment to providing quality services and values to virtual asset enthusiasts worldwide.

Contact Details

Ruder Finn Asia
htx@ruderfinn.com 

Company Website
https://www.htx.com

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SOURCE HTX

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ZWSOFT 2024 Year in Review: Empowering Sustainable Innovation

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GUANGZHOU, China, Jan. 10, 2025 /PRNewswire/ — 2024 marked a transformative year for ZWSOFT, driven by its new mission: Empowering Sustainable Innovation. The ZWSOFT team took significant steps to drive innovation, foster collaboration, and deliver lasting value for customers, partners, and the global community.

From refining its all-in-one CAx solutions to fostering a thriving global ecosystem and nurturing talents, 2024 was a year of significant achievements and meaningful impact.

Refining All-in-One CAx Solutions for Global Professionals

In 2024, ZWSOFT unveiled the latest generation of its flagship products: ZWCAD 2025, ZW3D 2025, ZWCAD MFG 2025, PHOENICS 2025, and CADbro 2025. These releases introduced 45+ new features and 3,800+ enhancements, including powerful 3D capabilities, motion simulation, and AI-driven tools—all designed to deliver exceptional performance and empower professionals across industries.

These enhancements empower over 1.4 million users across 90+ countries, contributing to a 97.4% customer satisfaction rate in the company’s annual customer satisfaction survey. Throughout 2024, ZWCAD consistently earned recognition as a Leader and ranked among the top five in G2’s General-Purpose CAD category, solidifying its reputation as a reliable choice for designers and engineers worldwide.

Building Win-Win Partnerships for Greater Impact

ZWSOFT continued to build a vibrant global ecosystem based on collaboration, innovation, and shared success. The company’s flagship conference, ZWorld 2024, and prominent industry events such as Hannover Messe provided valuable platforms to connect with professionals worldwide and exchange insights on sustainable solutions for the AEC and manufacturing industries.

ZWSOFT further strengthened its global presence with five ZCON events held in Indonesia, Saudi Arabia, United Arab Emirates, Japan, and Vietnam, fostering stronger partnerships and unlocking new growth opportunities in key markets.

Collaboration remains at the core of ZWSOFT’s ecosystem. In 2024, the company partnered with over 260 global developers to deliver 300+ third-party applications and 430+ industry-specific solutions, tailored to address the unique needs of professionals across various industries.

Empowering Talents for a Sustainable Future

ZWSOFT’s commitment to nurturing future professionals and fostering innovation remained strong in 2024. The company collaborated with eight universities, providing software, equipment, and scholarships to support students and educators. The 2024 ZWSOFT CAD Competition attracted over 7,000 participants from 700+ universities, inspiring the next generation of designers and engineers.

ZWSOFT also continued to invest in its global workforce by launching the Overseas New Employee Training Program to help new team members integrate and thrive. Additionally, the company celebrated its people-first culture through ZWSOFT Family Day, bringing employees and their families together to foster a sense of community and recognize their contributions.

As 2025 begins, ZWSOFT remains committed to its mission of empowering sustainable innovation for businesses and individuals worldwide. With the strong foundation built in 2024, the company is poised to drive further progress, strengthen partnerships, and create a more sustainable future alongside its customers, partners, and employees.

Visit ZWSOFT’s 2024 Year in Review to learn more about the milestones that shaped an exceptional year.

About ZWSOFT

ZWSOFT aims to provide reliable all-in-one CAx (CAD/CAE/CAM) solutions for designers and engineers worldwide and enables them to streamline complex design workflows at a fair and reasonable price. Since ZWSOFT’s inception in 1998, over 1.4 million customers from more than 90 countries have chosen our products and solutions to solve their design challenges. Among the list are the world’s most innovative companies across various industries, including Saint-Gobain, LG, and Ericsson.

Website: https://www.zwsoft.com/ 

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SOURCE ZWSOFT CO., LTD. (Guangzhou)

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