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Wire Bonder Equipment Market to grow by USD 227.5 Million from 2024-2028, AI-powered report by Technavio highlights rising global electronics production as key driver

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NEW YORK, Oct. 7, 2024 /PRNewswire/ — Report on how AI is driving market transformation- The global wire bonder equipment market  size is estimated to grow by USD 227.5 mn from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 3.32%  during the forecast period.  Rising electronics production across world is driving market growth, with a trend towards technological advancements in wire bonding. However, shortage of skilled and trained personnel  poses a challenge. Key market players include Accelonix Ltd., ASMPT Ltd., BE Semiconductor Industries NV, Bergen Group, Cirexx International, Corintech Ltd., DIAS Automation HK Ltd., F and K DELVOTEC Bondtechnik GmbH, F and S BONDTEC Semiconductor GmbH, Hesse GmbH, HYBOND Inc., Kulicke and Soffa Industries Inc., Micro Point Pro Ltd., Palomar Technologies Inc., Powertech Technology Inc., Toray Industries Inc., TPT Wirebonder GmbH and Co. KG, Ultrasonic Engineering Co. Ltd, WestBond Inc., and Yamaha Motor Co. Ltd..

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Forecast period

2024-2028

Base Year

2023

Historic Data

Segment Covered

Product (Ball bonders, Stud-bump bonders, and Wedge bonders), End-user (OSAT and IDM), and Geography (APAC, North America, Europe, South America, and Middle East and Africa)

Region Covered

APAC, North America, Europe, South America, and Middle East and Africa

Key companies profiled

Accelonix Ltd., ASMPT Ltd., BE Semiconductor Industries NV, Bergen Group, Cirexx International, Corintech Ltd., DIAS Automation HK Ltd., F and K DELVOTEC Bondtechnik GmbH, F and S BONDTEC Semiconductor GmbH, Hesse GmbH, HYBOND Inc., Kulicke and Soffa Industries Inc., Micro Point Pro Ltd., Palomar Technologies Inc., Powertech Technology Inc., Toray Industries Inc., TPT Wirebonder GmbH and Co. KG, Ultrasonic Engineering Co. Ltd, WestBond Inc., and Yamaha Motor Co. Ltd.

Key Market Trends Fueling Growth

The wire bonder equipment market is experiencing steady growth due to increasing demand from various industries such as electronics, telecommunications, and automotive. Companies are investing in advanced wire bonding systems to improve production efficiency and product quality. Key players in the market include Kulicke and Soffa Industries, Asahi Techno Co. Ltd, and Yamaichi Electronics. These companies are focusing on innovation and technological advancements to stay competitive. The market is expected to continue growing due to the rising trend of miniaturization in electronic devices. 

The Wire Bonder Equipment Market is witnessing significant growth due to the increasing demand for electrical joining techniques in various industries. Thin wires and heat with pressure or ultrasonic energy are commonly used in this process for joining metallic elements on the pad surface. The semiconductor industry, including chip packing, semiconductor packaging, MEMs packaging, TSV packaging, and 3D chip packaging, heavily relies on wire bonding for fine-pitch applications. Bonding force, fine wires, and submicron accuracy are crucial factors driving the market. Advanced vision systems and high-precision motion systems ensure loop clearance and address wire bonding issues such as unsupported die edges, loop resistance, and forward/reverse bonding in the neck region. Ball bonding, Wedge bonders, and Stud-bump bonders are popular equipment used in the industry. Integrated circuits (ICs) and semiconductor devices, made of copper, aluminum, gold, and silver, require premium packaging solutions from chip manufacturers and OSAT firms. The market caters to various electronics devices and semiconductors, offering both manual and automated ball bonding procedures. 

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Market Challenges

The wire bonder equipment market is experiencing steady growth due to increasing demand from various industries such as electronics, automotive, and telecommunications. Companies are investing in advanced wire bonding technology to improve production efficiency and product quality. Key players in the market include Kulicke and Soffa Industries, ASM Pacific Technology, and Yamaichi Electronics. These companies offer solutions for different applications, including automatic and manual wire bonding, and are expanding their product portfolios to cater to diverse industry needs. The market is expected to continue its growth trajectory, driven by technological advancements and rising demand for miniaturized electronic devices.

The semiconductor bonding equipment market faces challenges in the production of silicon chips and microelectronics. Integrating transistors, resistors, and other components requires advanced technology like micromachining and magnetometers, microphones, gyrometers, sensors, and more. However, manufacturing challenges persist, such as chip shortage and longer assembly cycle times. Automatic bonding machines are essential for interconnecting ICs, but they must accommodate various materials like LTCC packages, direct bonded copper, and gold bonding wires. Thermocompression Bonding, Thermosonic Bonding, and Ultrasonic Bonding are crucial processes, using metals like aluminum and Palladium-coated copper (PCC). Market growth is driven by the increasing demand for sensors (humidity, temperature, pressure), MEMS packaging, and optoelectronic manufacturing. The emergence of electric vehicles further boosts the market, requiring more advanced interconnect solutions. Stud Bonders, Bump Bonders, and Peg Bonders are vital equipment for the optoelectronics system. The industry continues to innovate, addressing challenges and ensuring the production of high-quality components for various industries.

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Segment Overview 

This wire bonder equipment market report extensively covers market segmentation by

Product 1.1 Ball bonders1.2 Stud-bump bonders1.3 Wedge bondersEnd-user 2.1 OSAT2.2 IDMGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa

1.1 Ball bonders-  Ball bonding is a common joining method in the electronics industry, primarily carried out using thermocompression and thermo-sonic bonding techniques. Thermocompression bonding employs heat and pressure above 150 degrees Celsius to create intermetallic bonds. Thermo-sonic bonding combines heat and ultrasonic energy for bond formation. Ball bonder equipment facilitates bonding speeds of over 5-12 wires per second, using gold, copper, or palladium-coated wires. Ideal for fine-pitch applications like BGA, SOP, QFP, MCM hybrids, and wafer-level bumping, this technology’s demand is driven by the growth of the semiconductor industry, particularly in applications requiring high precision and miniaturization.

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Research Analysis

The Wire Bonder Equipment Market refers to the industry that provides equipment used in the electrical joining of thin wires to metallic elements, such as integrated circuits (ICs) and other electronic components. This process involves the application of heat, pressure, and ultrasonic energy to create a reliable electrical connection. The market caters to various bonding techniques including forward and reverse bonding, ball bonding, and wedge bonding, among others. Thin wires made of copper, aluminum, gold, palladium, and other conductive materials are used in this process. The market serves various industries, including microelectronics, semiconductors, mobiles, tablets, and IC devices packaging. Miniaturization is a key trend driving the market, with a focus on developing equipment capable of handling smaller components and thinner wires. Wire bonder equipment is essential for manufacturing MEMs systems, which are increasingly used in various applications. Copper bonding wires are commonly used due to their high conductivity and low cost. The market includes various types of equipment such as Wedge bonders, Stud-bump bonders, and Ball bonders.

Market Research Overview

The Wire Bonder Equipment Market refers to the industry that manufactures and supplies equipment used for electrical joining of thin wires to metallic elements in various applications. This technique involves the application of heat, pressure, and ultrasonic energy to create a reliable connection between the pad surface and the wire. The market caters to the semiconductor industry, including chip packing, semiconductor packaging, MEMs packaging, TSV packaging, and 3D chip packaging. Fine-pitch applications require submicron accuracy, making high-precision motion systems and vision systems essential. Wire bonding issues like loop clearance, unsupported die edges, and loop resistance are addressed through forward and reverse bonding techniques. Various types of bonders, such as Wedge bonders, Stud-bump bonders, and Ball bonders, are used for different applications. Integrated circuits (ICs), semiconductor devices, and microelectromechanical (MEMs) systems are primary consumers. Copper, aluminum, gold, silver, and palladium are commonly used for connection. The market serves various sectors, including electronics, mobiles, tablets, consumer electronics, healthcare, telecommunication, and automotive, with a focus on miniaturization and premium packaging solutions. Semiconductor bonding equipment is crucial for interconnecting ICs and reducing assembly cycle times in optoelectronic manufacturing, LTCC packages, and direct bonded copper applications.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

ProductBall BondersStud-bump BondersWedge BondersEnd-userOSATIDMGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Bossjob introduces AI Photo Generator to elevate career profiles for job seekers

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SINGAPORE, Oct. 8, 2024 /PRNewswire/ — Aimed at strengthening its suite of innovative hiring solutions, Bossjob, the chat-based, Artificial Intelligence (AI)-powered recruitment platform in Southeast Asia (SEA), announces the launch of its latest feature, the AI Headshot Generator, designed to empower job seekers to easily create professional photo and help them stand out in today’s competitive job market.

Bossjob’s AI Headshot Generator enables users to create multiple polished, professional-grade headshots in just ten seconds. Users can easily update their profile picture by selecting a template for males and females that matches their skin tone and race, and can generate their photo by uploading an image or taking a clear front-facing selfie. The tool allows users to store up to five AI-generated images in their database.

The new feature offers users a personalized way to create profile photos using over 14 templates tailored to gender, skin tones, and backgrounds. By using machine learning (ML) to analyze users’ facial features and optimize lighting, composition, and professionalism, the tool generates high-quality images to support users’ job-hunting journey.

The feature is available for free and reflects Bossjob’s commitment to leveraging cutting-edge technology to streamline line recruitment processes through optimized resumes and CVs.

“This new feature aims to help job seekers build a strong personal brand. Research shows that hiring managers often make snap judgments based on first impressions. We provide our users with tools to create standout headshots that can make all the difference in capturing attention,” states Quak Kiat How, Co-founder and COO of Bossjob.

The feature launch aligns with the broader industry shift, as the majority of hiring managers are now open to considering AI-generated resumes. With this new tool, Bossjob enables users not only to thrive in a digital-first job market but also to make a strong impression, elevate their credibility, engage more effectively with employers, and strengthen their personal branding.

“To embrace AI while making the human workforce invaluable, job seekers can continuously leverage emerging technologies, upskill, and swiftly respond to changes in the job market by aligning with new trends,” Quak emphasized.

The Singapore-based recruitment platform recently reached multiple milestones when it surpassed 4 million registered users in the Philippines, achieved recruitment agency status in Japan as well as helped its first Singaporean company expand hiring operations in Malaysia.

Bossjob started in 2018 with its Model Driven Development (MDD) of “mobile + direct chat + AI-matching,” introducing direct chat into the recruitment scene. With the help of AI technologies and big data, the platform recommends highly suitable and active candidates to employers and job opportunities to job seekers.

In January, Bossjob also introduced additional features aimed at simplifying access to international jobs and remote work opportunities. Recruiters in Singapore can connect with talent across Asia, including Malaysia, the Philippines and Japan by selecting the ‘International’ option in posting job openings and targeting specific countries for top talent. Meanwhile, job seekers can select the “Remote Jobs” section, making it easier to browse opportunities that best match their skills and preferences.

For more information about Bossjob and its new AI Photo Generator feature, visit https://go.bossjob.sg/BossjobAI-AvatarGenerator.

About Bossjob

“Find Job. Talk to Boss.”

Launched in 2018, Bossjob is a chat-first career platform for professional hiring in Southeast Asia, modeled after the one thing we need in our daily lives – instant gratification. Bossjob aims to provide speedy communications between talents and bosses to eliminate lengthy, or worse, unanswered, application processes through direct chat. Bossjob positions itself as the chat-first career platform for professional hiring in Southeast Asia with its innovative Model Driven Development (MDD) of “mobile + direct chat + AI-matching,” introducing direct chat into the recruitment scene. With the help of cutting-edge artificial intelligence technologies and big data, the platform recommends highly suitable and active candidates to employers and relevant job opportunities to job seekers. This enhances matching accuracy for both parties, reduces information asymmetry, and improves recruitment efficiency.

Media Contact
Bernie Goh I bernie@bossjob.com 

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SOURCE Bossjob

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EchoStar Mobile and Connected Partner to Deliver Reliable Off-Grid Connectivity

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Partnership Enables Satellite Coverage Across Europe, Facilitating Personal Connectivity and Addressing the Digital Divide in Remote and Off-Grid Regions

DUBLIN and COIMBRA, Portugal, Oct. 8, 2024 /PRNewswire/ — EchoStar Mobile, a leader in satellite communications, and Connected, a startup dedicated to delivering universal, cost-effective narrowband connectivity from space, have announced a strategic partnership to revolutionize off-grid connectivity. This collaboration introduces Connected One, a cutting-edge IoT solution that leverages EchoStar’s satellite technology to bridge connectivity gaps in remote and underserved regions, ensuring users stay connected and safe, even when venturing off the grid.

Under the new three-year agreement, EchoStar Mobile will supply its advanced EM2050 modules to Connected. This integration enhances Connected’s product portfolio by incorporating direct-to-device satellite communications, reducing the need for extensive ground infrastructure and increasing connectivity reliability in the most remote regions through EchoStar’s geostationary satellite network.

Connected One, described as the Ultimate Safety Companion, transforms communication and safety in areas lacking traditional ground networks. This compact, portable device turns any smartphone into a satellite-enabled communication tool, allowing users to stay in touch or request emergency assistance regardless of their location, without the need for expensive handsets or complex technology.

“Our mission at Connected has always been to enhance the accessibility and reliability of basic connectivity, especially in areas where traditional infrastructure is lacking,” said Tiago Rebelo, co-founder and CEO at Connected. “Our partnership with EchoStar Mobile enables us to integrate their robust geostationary satellite network coverage into our Connected One device, providing a reliable solution for maintaining connectivity off-grid, across Europe and soon in the U.S.”

EchoStar Mobile’s EM2050 modules, utilizing LoRa® technology and operating over the licensed S-band spectrum, are central to the functionality of Connected One. By leveraging EchoStar’s geostationary satellite, EchoStar XXI, the device offers extensive coverage across Europe, Connected plans to extend this service to the U.S. by late 2024. This collaboration allows Connected to provide real-time, interference-free communication and location tracking, enhancing user safety and peace of mind in remote areas.

“EchoStar Mobile is dedicated to delivering affordable, high-quality satellite IoT connectivity,” said Telemaco Melia, Vice President and General Manager at EchoStar Mobile. “Our partnership with Connected aligns perfectly with this goal, making critical connectivity accessible in rural and remote areas across Europe and soon the U.S., without the need for extensive infrastructure.”

Connected One is equipped with advanced features to boost safety and connectivity in remote locations. Users can activate emergency alerts with a single press, sending their location to designated contacts. The device connects to smartphones via Bluetooth, allowing custom satellite messaging when cellular networks are unavailable. Additionally, it tracks and updates users’ locations every thirty minutes on interactive maps, all managed through the ‘One Companion’ app. Looking ahead, through the collaboration with EchoStar Mobile, Connected plans to expand coverage to the U.S. and introduce bi-directional messaging for seamless SMS-based replies.

Overall, the partnership between Connected and EchoStar Mobile represents a significant advance in off-grid communication. By combining Connected’s IoT solutions with EchoStar’s satellite technology, the collaboration will revolutionize personal connectivity in remote areas. This joint effort ensures that safety and reliable communication are universally accessible, overcoming traditional barriers and setting new industry standards for connectivity.

About EchoStar Mobile
EchoStar Mobile, an EchoStar (Nasdaq: SATS) company, is a leading provider of satellite-based mobile communications services. The company is dedicated to delivering reliable, efficient, and secure connectivity across Europe and the U.S., enhancing the capabilities of IoT solutions in remote and underserved regions. For more information, visit www.echostarmobile.com.

About Connected
Founded in 2023, Connected is dedicated to providing universal, cost-effective narrowband connectivity from space, aiming to bridge the digital divide and revolutionize how people and industries connect globally. Connected’s innovative solutions are designed to enhance safety, improve quality of life, and unleash new IoT-based business models. For more information, visit www.connected.space.

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SOURCE EchoStar Corporation

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Instantia partners with ION FX for trade execution and risk management

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LONDON, Oct. 8, 2024 /PRNewswire/ — ION, a global leader in trading and workflow automation software, high-value analytics and insights, and strategic consulting to financial institutions, central banks, governments, and corporate organizations, announces that Instantia has selected ION Foreign Exchange (FX) for trade execution, trade management, risk, and settlement management for its FX business.

Australia-based Instantia is a digital FX, risk management, and payments company offering a client-centric way to manage currency exchange, FX strategies, and cross-border payments. The company boasts a leading risk management intelligence tool, providing insights to key business decision-makers.

Instantia chose the ION FX solution for its end-to-end processing functionality of FX cash and derivative products, including trade execution and risk management. Using ION APIs, Instantia developed custom client- and dealer-facing user interfaces to enhance the user experience.

Richard Poulton, CEO at Instantia, says, “We are excited to partner with ION to offer our clients robust FX processing capabilities. This partnership is crucial as it will help us revolutionize FX by consolidating currency hedging positions into a user-friendly interface and expand into other APAC markets.”

Alex Pirmohamed, Chief Product Officer at ION Markets (FX), says, “We are pleased that Instantia chose ION FX for its trade execution and risk management needs. ION Markets FX is strategically positioned to address the diverse needs of FX market participants. The ION FX end-to-end solution uniquely suits institutions providing FX services for cross-border payments, and FX risk management. Our platform’s robust functionality facilitated Instantia’s quick time to market, and we remain dedicated to supporting their ambitious objectives.”

About ION

ION provides mission-critical trading and workflow automation software, high-value analytics and insights, and strategic consulting to financial institutions, central banks, governments, and corporate organizations. Our solutions and services simplify complex processes, boost efficiency, and enable better decision-making. We build long-term partnerships with our clients, helping transform their businesses for sustained success through continuous innovation. For more information, visit https://iongroup.com/ 

About ION Markets

ION Markets provides transformative technology and solutions to financial institutions dealing in equities, fixed income, foreign exchange, cleared derivatives, asset management, and secured funding. Our award-winning end-to-end solutions simplify clients’ operations by automating the entire trade lifecycle, providing tools to manage risk, and maximizing access to liquidity while giving real-time access to critical information required for timely operational decisions and execution on a global scale. For more information, visit https://iongroup.com/markets/

About Instantia

Founded by Richard Poulton (CEO) and Danny Pezeshki (COO), Instantia boldly reimagines how transparency and innovation can reshape the future of the FX market. Its mission is to be a strategic partner for businesses navigating the dynamic world of foreign exchange, offering real-time visibility, control, and the ability to make better business decisions through its technology. Instantia plans to expand into other key markets to make FX options and risk management less complex and transparent, focusing on a superior user experience. For more information, visit https://www.instantia.co/

All product and company names herein may be trademarks of their registered owners.

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SOURCE ION

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