Technology

Supermicro Adds New Max-Performance Intel-Based X14 Servers, Delivering the Industry’s Broadest Range of Workload-Optimized Systems for AI, HPC, Cloud, and Edge

Published

4 hours ago

September 24, 2024

More than 15 Product Families of Completely Upgraded Servers Optimized for Maximum Performance or Efficiency, Featuring Next-Generation GPU Support, Higher-Bandwidth Memory, 400GbE Networking, E1.S and E3.S Drives, and Direct-to-Chip Liquid Cooling Support, and are Based on the New Intel® Xeon® 6900 Series Processors with P-Cores and Intel Xeon 6700 Series Processors with E-cores

SAN JOSE, Calif., Sept. 24, 2024 /PRNewswire/ — Supermicro, Inc. (NASDAQ: SMCI) a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, today adds new maximum performance GPU, multi-node, and rackmount systems to the X14 portfolio, which are based on the Intel Xeon 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP). The new industry-leading selection of workload-optimized servers addresses the needs of modern data centers, enterprises, and service providers. Joining the efficiency-optimized X14 servers leveraging the Xeon 6700 Series Processors with E-cores launched in June 2024, today’s additions bring maximum compute density and power to the Supermicro X14 lineup to create the industry’s broadest range of optimized servers supporting a wide variety of workloads from demanding AI, HPC, media, and virtualization to energy-efficient edge, scale-out cloud-native, and microservices applications.

“Supermicro X14 systems have been completely re-engineered to support the latest technologies including next-generation CPUs, GPUs, highest bandwidth and lowest latency with MRDIMMs, PCIe 5.0, and EDSFF E1.S and E3.S storage,” said Charles Liang, president and CEO of Supermicro. “Not only can we now offer more than 15 families, but we can also use these designs to create customized solutions with complete rack integration services and our in-house developed liquid cooling solutions.”

Approved customers can obtain early access to complete, full-production systems via Supermicro’s Early Ship Program or for remote testing with Supermicro JumpStart.

These new Supermicro X14 systems feature completely re-designed architectures, including all-new 10U and multi-node form factors that support next-generation GPUs and higher CPU core densities, updated memory slot configurations with 12 memory channels per CPU and new MRDIMMs, which provide up to 37% better memory bandwidth compared to DDR5 DIMMs.

The new Supermicro X14 family comprises a number of new systems —several of which are completely new architectures—in three distinct, workload-specific categories:

GPU-optimized platforms designed for pure performance and enhanced thermal capacity to support the latest technology and highest-wattage GPUs. System architectures are built from the ground up for large-scale AI training, LLMs, generative AI, 3D media, and virtualization applications.High compute-density multi-nodes including all-new FlexTwin™,SuperBlade®, and GrandTwin®, which leverage resources such as shared power and cooling to increase efficiency, as well as direct-to-chip liquid cooling on specific models to maximize density without compromising on performance.Market-proven Supermicro Hyper rackmounts combine single or dual socket architectures with flexible I/O and storage configurations in traditional form factors to help enterprises and data centers scale up and out as their workloads evolve.

Supermicro’s new max-performance X14 systems support the new Intel Xeon 6900 series processors with P-cores, while X14 efficiency-optimized systems support the Intel Xeon 6700 series processors with E-cores, which launched in June 2024. These systems will also offer socket compatibility with the upcoming Intel Xeon 6900 series processors with E-cores and Intel Xeon 6700 series processors with P-cores in Q1’25 to provide an additional dimension of flexibility when optimizing systems for either performance-per-core or performance-per-watt.

“For the first time, Intel is offering two distinct, workload-optimized families of Xeon processors in the same generation, each designed to deliver specific performance and efficiency profiles that can shorten time-to-results, revolutionize compute, power and rack density, maximizing ROI for modern data centers,” said Ryan Tabrah, VP and GM of Xeon Products at Intel. “With the new additions, Supermicro will be able to provide their customers with even more choice with the introduction of these new performance optimized CPUs for AI and compute-intensive workloads.”

When configured with Intel Xeon 6900 series processors with P-cores, Supermicro systems support new FP16 instructions on the built-in Intel® AMX accelerator to further enhance AI workload performance. These systems include 12 memory channels per CPU with support for both DDR5-6400 and MRDIMMs up to 8800MT/s, CXL 2.0, and feature more extensive support for high-density, industry-standard EDSFF E1.S and E3.S NVMe drives.

Supermicro Liquid Cooling Solutions

Complementing this expanded X14 product portfolio are Supermicro’s rack-scale integration and liquid cooling capabilities. With an industry-leading global manufacturing capacity, extensive rack-scale integration and testing facilities, and a comprehensive suite of management software solutions, Supermicro designs, builds, tests, validates, and delivers complete data center solutions at any scale in a matter of weeks.

Supermicro offers a complete in-house developed liquid cooling solution including cold plates for CPUs, GPUs, memory, Cooling Distribution Units, Cooling Distribution Manifolds, hoses, connectors, and cooling towers. Liquid cooling is easily included in rack-level integrations to increase system efficiency, reduce instances of thermal throttling, and lowers both the TCO and Total Cost to the Environment (TCE) of data center deployments.

New Supermicro max-performance X14 systems featuring Intel Xeon 6900 series processors with P-cores include:

GPU-optimized – The highest performance Supermicro X14 systems designed for large-scale AI training, large language models (LLMs), generative AI and HPC, and supporting eight of the latest-generation SXM5 and SXM6 GPUs. These systems are available in air-cooled or liquid-cooled configurations.

PCIe GPU – Designed for maximum GPU flexibility, supporting up to 10 double-width PCIe 5.0 accelerator cards in a thermally-optimized 5U chassis. These servers are ideal for AI inferencing, media, collaborative design, simulation, cloud gaming, and virtualization workloads.

Intel® Gaudi® 3 AI Accelerators – Supermicro also plans to deliver the industry’s first AI server based on the Intel Gaudi 3 accelerator hosted by Intel Xeon 6 processors. The system is expected to increase efficiency and lower the cost of large-scale AI model training and AI inferencing. The system features eight Intel Gaudi 3 accelerators on an OAM universal baseboard, six integrated OSFP ports for cost-effective scale-out networking, and an open platform designed to use a community-based, open-source software stack, requiring no software licensing costs.

SuperBlade® – Supermicro’s X14 6U high-performance, density-optimized, and energy-efficient SuperBlade maximizes rack density, with up to 100 servers and 200 GPUs per rack. Optimized for AI, HPC, and other compute-intensive workloads, each node features air cooling or direct-to-chip liquid cooling to maximize efficiency and achieve the lowest PUE with the best TCO, as well as connectivity up to four integrated Ethernet switches with 100G uplinks and front I/O supporting a range of flexible networking options up to 400G InfiniBand or 400G Ethernet per node.

FlexTwin™ – The new Supermicro X14 FlexTwin architecture is purpose-built for HPC, cost-efficient, and designed to provide maximum compute power and density in a multi-node configuration with up to 24,576 performance cores in a 48U rack. Optimized for HPC and other compute-intensive workloads, each node features direct-to-chip liquid cooling only to maximize efficiency and reduce instances of CPU thermal throttling, as well as HPC low latency front and rear I/O supporting a range of flexible networking options up to 400G per node.

Hyper – X14 Hyper is Supermicro’s flagship rackmount platform designed to deliver the highest performance for demanding AI, HPC, and enterprise applications, with single or dual socket configurations supporting double-width PCIe GPUs for maximum workload acceleration. Both air cooling and direct-to-chip liquid cooling models are available to facilitate the support of top-bin CPUs without thermal limitations and reduce data center cooling costs while also increasing efficiency.

Also, now shipping are Supermicro’s X14 efficiency-optimized systems featuring Intel Xeon 6700 series processors with E-cores:

SuperBlade® – Supermicro’s high-performance, density-optimized, and energy-efficient multi-node platform optimized for AI, Data Analytics, HPC, Cloud, and Enterprise workloads. Available as a 6U enclosure with 10 or 5 nodes, or an 8U enclosure with 20 or 10 nodes, one rack can feature up to 34,560 Xeon compute cores.

Hyper – Flagship performance rackmount servers designed for scale-out cloud workloads, with storage & I/O flexibility that provides a custom fit for a wide range of application needs.

CloudDC – All-in-one platform for cloud data centers, based on the OCP Data Center Modular Hardware System (DC-MHS) with flexible I/O and storage configurations and dual AIOM slots (PCIe 5.0; OCP 3.0 compliant) for maximum data throughput.

Petascale Storage – Industry-leading all-flash storage density and performance with EDSFF E1.S and E3.S drives, allowing unprecedented capacity and performance in a 1U or 2U chassis.

WIO – Offers flexible I/O configurations in a cost-effective architecture to enable optimization of acceleration, storage, and networking alternatives to accelerate performance, increase efficiency and find the perfect fit for specific enterprise applications.

BigTwin® – 2U 2-Node or 2U 4-Node platform providing superior density, performance, and serviceability with dual processors per node and hot-swappable tool-less design. These systems are ideal for cloud, storage, and media workloads with new models, including E3.S drive support for superior density and throughput.

GrandTwin® – Purpose-built for single-processor performance and memory density, featuring front (cold aisle) hot-swappable nodes and front or rear I/O for easier serviceability. Now available with E1.S drives for better storage density and throughput.

Hyper-E – Delivers the power and flexibility of our flagship Hyper family optimized for deployment in edge environments. Edge-friendly features include a short-depth chassis and front I/O, making Hyper-E suitable for edge data centers and telco cabinets. These short-depth systems support up to 3 high-performance GPU or FPGA cards.

Edge/Telco – High-density processing power in compact form factors optimized for telco cabinet and Edge data center installation. Optional DC power configurations and enhanced operating temperatures up to 55° C (131° F).

About Super Micro Computer, Inc.

Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions provider with server, AI, storage, IoT, switch systems, software, and support services. Supermicro’s motherboard, power, and chassis design expertise further enable our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Taiwan, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names, and trademarks are the property of their respective owners.

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Technology

Uploadcare Unveils New File Uploading Widget, Uploadcare File Uploader v1

Published

53 mins ago

September 24, 2024

Uploadcare’s Latest Innovation Offers Developers a Seamless, Secure and Scalable Solution for Integrating File Uploads Into Any Project

BOSTON, Sept. 24, 2024 /PRNewswire-PRWeb/ — Today, Uploadcare, a leading file management platform and content delivery network, announced the launch of Uploadcare File Uploader v1. Designed to meet the needs of developers building websites and SaaS applications with modern web tools, the file uploading widget provides an efficient and reliable way to integrate scalable and secure file uploads into any project.

“At Uploadcare, we understand that developers need a turnkey file-uploading solution to focus on what matters most: building great products,” said Igor Debatur, CEO of Uploadcare.

Uploadcare File Uploader sets itself apart with a range of key benefits to streamline the development process and enhance the end-user experience:

Easy Integration & Hassle-Free Maintenance: Quickly integrate into any tech stack with the plug-and-play solution that provides code snippets and instructions and ensures stable uploads without ongoing maintenance.Robust Security: Automatically detect inappropriate content and infected files, upholding regulatory compliance and brand integrity. Prevent unauthorized file uploads with signed uploads.Multiple Upload Sources: Support file uploads from up to 14 sources, including popular platforms like Google Drive, Dropbox, Instagram, and more.Built-in Image Editor: Empower users to edit images before upload, including options like cropping, resizing and applying filters.Advanced Accessibility: Maximize customer reach by adopting the interface with out-of-the-box A11Y accessibility options.

“At Uploadcare, we understand that developers need a turnkey file-uploading solution to focus on what matters most: building great products,” said Igor Debatur, CEO of Uploadcare. “Our new file uploader not only speeds up time-to-market but also eliminates the headaches associated with maintaining and securing file uploads, allowing developers to concentrate on their core product.”

To learn more about the latest features of the Uploadcare File Uploader, register for a live webinar on Oct. 10 at 11 a.m. EDT / 5 p.m. CET. Attendees can view a live demonstration, have their questions answered and will automatically be entered in a raffle for a Keychron Q3 Max mechanical keyboard.

For an Uploadcare File Uploader 14-day free trial, visit uploadcare.com/uploader1. To learn about Uploadcare’s offerings, visit uploadcare.com.

About Uploadcare

Uploadcare is a leading file management platform and content delivery network, enabling developers around the world to upload, manage, process, render, optimize and deliver digital content for applications and websites via a powerful suite of APIs. The developer-oriented platform was founded in 2011 by tech enthusiasts experienced in web development and image processing that encountered problems with uploading and file management, who decided to create an all-in-one solution that worked at scale. 13 years later, Uploadcare has grown rapidly, garnering clients like PandaDoc, Buffer, UserTesting, Zapier and more. To learn more about Uploadcare, visit uploadcare.com.

Media Contact

Lilly Carrion, Uploadcare, 1 9546008860, lilly@palmerpublic.com, https://uploadcare.com/

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SOURCE Uploadcare

Technology

Washington Tech Workforce Coalition Forms to Meet the Need for Diverse, Highly Skilled Candidates for In-Demand Tech Jobs

Published

53 mins ago

September 24, 2024

Industry leaders, educators and community organizations invited to join this important initiative

SEATTLE, Sept. 24, 2024 /PRNewswire/ — The Washington Tech Workforce Coalition (WTWC) proudly announces its launch, marking a significant step toward addressing the growing demand for technology roles across multiple industries. The Coalition will hold its first convening on Oct. 29, 2024 from 2-7pm at the AWS Skills Center in Seattle.

The Coalition focuses on creating opportunities for underserved and underrepresented populations while fostering a collaborative space where industry leaders, educators, training partners, community partners, and government agencies work together to meet workforce demands and facilitate job placements. The Coalition’s new website, watechcoalition.org, is the hub of this network where partners can join the Coalition, sign up for committees, read updates, find best practices and track outcomes.

Vision
The Washington Tech Workforce Coalition envisions an enduring ecosystem designed to bridge workforce gaps and advance workers’ skills in Cybersecurity, Data Analytics, IT & Cloud Computing, and Software Development.

Key responsibilities include:

Developing a talent pipeline responsive to industry needs.Closing the skills gap by creating technical and professional skills development programs.Connecting high-quality candidates with internships and full-time jobs to meet employer needs.Building relationships and credibility with workforce system stakeholders.

The Coalition is supported by industry experts AWS and Accenture, led by Computing for All, in collaboration with the Washington Technology Industry Association (WTIA), and committed employers throughout Washington State. These members form the core of the Industry Advisory Committee.

Coalition Partners
The Washington Tech Workforce Coalition includes a network of fourteen placement providers and subrecipients that will help launch 1,000 careers in technology roles by October 2025.

Placement Providers will offer various services, including community and employer engagement, candidate training, support, and job placement. Placement Providers include Ada Developers Academy, CodeDay, Per Scholas, PNW Cyber Challenge Games, Riipen and North Seattle College, Saint Martin’s University (Washington Vets2Tech), and Year Up.

These placement providers join the Coalition’s subrecipients (below) involved in strategic efforts to develop outreach and alignment with underserved communities, education, and employers. Subrecipients include Career Connect Southwest STEM Regional Network, Center of Excellence for Information & Computing Technology (COEICT), Evergreen Goodwill, King Pierce Regional Network / Washington Alliance for Better Schools (WABS), North Central Regional Network, Seattle Jobs Initiative (SJI), and Washington Technology Industry Association (WTIA).

Collectively, these grant partners build and expand training programs and job placement pipelines across the state.

Structure
Initial funding for the Coalition is from the US Department of Commerce Good Jobs Challenge grant. Implementation is through the Washington Jobs Initiative managed by Washington Student Achievement Council (WSAC). Computing for All, a 501(c)(3) technology education nonprofit organization manages the Coalition, building alignment among community, education, and industry partners to align training and job opportunities while uniting and lifting our local economies.  
The launch of the Coalition underscores all the members’ dedication to leveraging resources, applying best practices, and fostering a shared vision for talent development in technology.

For more information on the Coalition and to learn how to get involved, visit watechcoalition.org.

CONTACT: press@watechcoalition.org

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SOURCE Computing for All

Technology

WCG Improves Clinical Trial Adjudication with Enhanced AIMS Solution

Published

53 mins ago

September 24, 2024

PRINCETON, N.J., Sept. 24, 2024 /PRNewswire/ — WCG, the global leader in providing solutions that measurably improve and accelerate clinical research, is excited to announce the latest advancement in the WCG ClinSphere™ platform with the addition of an interactive adjudication model in its Adjudication Information Management System (AIMS®) solution. Specifically designed to simplify and streamline the adjudication process for clinical trials, AIMS improves efficiency, compliance, and data accuracy.

The new interactive adjudication model feature allows adjudication committee members to review all relevant clinical data for a subject within a single interactive screen, making review of lengthy subject data listings a thing of the past. Initially developed for use for adjudication within complex multiple myeloma trials, this application is now optimized for use across any therapeutic area and trial design. It is poised to become the new industry standard for clinical trial adjudication, addressing the growing complexity and volume of trials requiring expert adjudication.

“We are thrilled to offer a solution that not only improves operational efficiency but also ensures accuracy and compliance for clinical trial adjudication,” said Mark McDonald, president, Review Solutions at WCG. “AIMS empowers clinical teams to navigate the adjudication process with ease, allowing for faster decision-making and better trial outcomes.”

Key Features of the Enhancements to WCG’s AIMS Solution:

Interactive Data Review (IDR): A new user interface providing an interactive and intuitive view of clinical trial data across a subject, including automatic data change flags, resulting in increased clarity for adjudicators.

Multi-Record Per Case Adjudication: Review multiple records or data points simultaneously to streamline decision-making and reduce human error.

Real-Time Reporting and Insights: Access real-time reports, ensuring up-to-date adjudication oversight and informed decision-making.

21 CFR Part 11 Compliance: Ensure regulatory compliance with a comprehensive audit trail and built-in validation.

Built-In DICOM Imaging Viewer & Redaction Tools: Facilitate secure and efficient review of medical images and sensitive trial data.

“We recognize the unique challenges sponsors face to meet the adjudication needs of increasingly complex clinical trials,” added McDonald. “AIMS enhances not only the quality of adjudication but also the satisfaction of all stakeholders involved in the trial process.”

To learn more about AIMS, visit https://www.wcgclinical.com/technologies/aims/.

About WCG

WCG is a global leader of solutions that measurably improve and accelerate clinical research. Biopharmaceutical and medical device companies, contract research organizations (CROs), research institutions, and sites partner with us for our unmatched expertise, data intelligence, and purpose-built technology to make informed decisions and optimize study outcomes, while maintaining the highest standards of human participant protection. WCG raises the bar by pioneering new concepts, reimagining processes, fostering compliance and safety, and empowering those who perform clinical trials to accelerate the delivery of medical therapies and devices that improve lives. For more information, please visit wcgclinical.com or follow us on LinkedIn or X @WCGClinical.

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SOURCE WCG