Connect with us

Technology

Texas Instruments signs preliminary agreement to receive up to $1.6 billion in CHIPS and Science Act proposed funding for semiconductor manufacturing in Texas and Utah

Published

on

NEWS HIGHLIGHTS:

The U.S. Department of Commerce has proposed up to $1.6 billion for TI in direct funding through the CHIPS and Science Act to support three 300mm semiconductor wafer fabs under construction in Texas and Utah.TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury’s Investment Tax Credit for qualified U.S. manufacturing investments.The company also expects to receive $10 million in proposed funding for workforce development, as it creates over 2,000 new TI jobs and thousands of indirect jobs for construction, suppliers and supporting industries.

LEHI, Utah, and SHERMAN, Texas, Aug. 16, 2024 /PRNewswire/ — Texas Instruments (TI) (Nasdaq: TXN) and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms for up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to support three 300mm wafer fabs already under construction in Texas and Utah. In addition, TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury’s Investment Tax Credit for qualified U.S. manufacturing investments. The proposed direct funding, coupled with the investment tax credit, would help TI provide a geopolitically dependable supply of essential analog and embedded processing semiconductors.

“The historic CHIPS Act is enabling more semiconductor manufacturing capacity in the U.S., making the semiconductor ecosystem stronger and more resilient,” said Haviv Ilan, president and CEO of Texas Instruments. “Our investments further strengthen our competitive advantage in manufacturing and technology as we expand our 300mm manufacturing operations in the U.S. With plans to grow our internal manufacturing to more than 95% by 2030, we’re building geopolitically dependable, 300mm capacity at scale to provide the analog and embedded processing chips our customers will need for years to come.”

Building geopolitically dependable capacity for analog and embedded processing chips 

Since its founding more than 90 years ago, TI has been advancing technology, pioneering the transition from vacuum tubes to transistors and then to integrated circuits. Today, TI is the largest U.S. analog and embedded processing semiconductor manufacturer. TI chips are essential in nearly every type of electronic device, from cars with advanced safety and intelligence systems to life-saving medical equipment and smart appliances that make homes safer and more efficient.

The proposed direct funding under the CHIPS Act would support TI’s investment of more than $18 billion through 2029, which is part of the company’s broader investment in manufacturing. This proposed direct funding will support three new wafer fabs, two in Sherman, Texas, (SM1 and SM2) and one in Lehi, Utah (LFAB2), specifically to:

Construct and build the SM1 cleanroom and complete pilot line for first production;Construct and build the LFAB2 cleanroom for first production; andConstruct the SM2 shell.

These connected, multi-fab sites benefit from shared infrastructure, talent and technology sharing, and a strong network of suppliers and community partners. They will produce semiconductors in 28nm to 130nm technology nodes, which provide the optimal cost, performance, power, precision and voltage levels required for TI’s broad portfolio of analog and embedded processing products.

“With this proposed investment from the Biden-Harris Administration in TI, a global leader of production for current-generation and mature-node chips, we would help secure the supply chain for these foundational semiconductors that are used in every sector of the U.S. economy, and create tens of thousands of jobs in Texas and Utah,” said U.S. Secretary of Commerce Gina Raimondo. “The CHIPS for America program will supercharge American technology and innovation and make our country more secure – and TI is expected to be an important part of the success of the Biden-Harris Administration’s work to revitalize semiconductor manufacturing and development in the U.S.”

Building a stronger workforce

With a long history of supporting its employees to build long-term, successful careers, TI is also investing in building its future workforce. TI will create more than 2,000 company jobs across its three new fabs in Texas and Utah, along with thousands of indirect jobs for construction, suppliers and supporting industries.

“We are proud to work with Texas Instruments as they build new semiconductor fabs in Sherman and solidify Texas as the best state for semiconductors. Texas Instruments invented the microchip in Texas, and we are honored to be home to TI’s semiconductor manufacturing facilities in Dallas, Richardson and Sherman,” said Texas Gov. Greg Abbott. “With this latest project, TI is building on its more than 90-year legacy in Texas and adding thousands of good-paying jobs for Texans to manufacture critically important technology.”

“By investing in semiconductor manufacturing, we are helping secure this vulnerable supply chain, boosting our national security and global competitiveness, and creating new jobs for Texans,” said U.S. Sen. John Cornyn. “The chipmaking capabilities these resources will enable at Texas Instruments will help the U.S. reclaim its leadership role in the critically important semiconductor industry, and I look forward to seeing more Texas-led advancements in the years to come.”

In order to build a future-ready workforce, TI is enhancing the skills of current employees, expanding internships and creating pipeline programs with a focus on building electronic and mechanical skills. TI has robust engagements with 40 community colleges, high schools and military institutions across the U.S. to develop future semiconductor talent.

Utah is thrilled that Texas Instruments is expanding its manufacturing presence in the Silicon Slopes, furthering the impact Utahns have on critical semiconductor technology,” said Utah Gov. Spencer Cox. “This investment in semiconductor manufacturing not only creates more jobs, but also brings supply chains back to the United States.”

“This proposed CHIPS funding will further support Texas Instruments’ investment in its new semiconductor fab in Lehi —and enhance Utah’s vital role in our national defense and economic success,” said U.S. Senator Mitt Romney. “I was an original sponsor of the CHIPS and Science Act—which made today’s announcement possible—because in order to compete on the world stage, we must continue to promote innovation, foster scientific talent, and expand research here at home. Texas Instruments’ expanded operations will help make the United States more self-reliant for chips essential to our national security and economy.”

Building sustainable manufacturing

TI has a long-standing commitment to responsible, sustainable manufacturing and environmental stewardship. As part of this commitment, TI continually invests in its fabrication processes and equipment to reduce energy, material and water consumption, and greenhouse gas (GHG) emissions.

The company’s 300mm wafer fabs will be entirely powered by renewable electricity. Additionally, all of TI’s new 300mm fabs are designed to meet LEED Gold standards for structural efficiency and sustainability. TI’s 300mm manufacturing facilities bring advantages in reducing waste and improving water and energy consumption per chip.

TI semiconductors are and will increasingly play a critical role in helping reduce the impact on the environment, helping customers create smaller, more efficient and cost-effective technology solutions that in turn drive continued innovation in electrification and the expanded usage of renewable energy.

Learn more:

TI CHIPS Act press kit (includes images, video b-roll, fact sheet)TI Sherman, TX, press kitTI Lehi, UT, press kit

Notice regarding forward-looking statements

This release includes forward-looking statements intended to qualify for the safe harbor from liability established by the Private Securities Litigation Reform Act of 1995. These forward-looking statements generally can be identified by phrases such as TI or its management “believes,” “expects,” “anticipates,” “foresees,” “forecasts,” “estimates” or other words or phrases of similar import. Similarly, statements herein that describe TI’s business strategy, outlook, objectives, plans, intentions or goals also are forward-looking statements. All such forward-looking statements are subject to certain risks and uncertainties that could cause actual results to differ materially from those in forward-looking statements.

See Item 1A of TI’s most recent Form 10-K for a detailed discussion of risk factors that could cause results to differ materially from the forward-looking statements. The forward-looking statements included in this release are made only as of the date of this release, and we undertake no obligation to update the forward-looking statements to reflect subsequent events or circumstances. If we do update any forward-looking statement, you should not infer that we will make additional updates with respect to that statement or any other forward-looking statement.

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.

 

View original content to download multimedia:https://www.prnewswire.com/news-releases/texas-instruments-signs-preliminary-agreement-to-receive-up-to-1-6-billion-in-chips-and-science-act-proposed-funding-for-semiconductor-manufacturing-in-texas-and-utah-302224237.html

SOURCE Texas Instruments

Continue Reading
Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *

Technology

For Fourth Year, Everspring Recognized Among Chicago’s Best Places to Work

Published

on

By

Award Recognition Reflects Company’s Continued Momentum, Growth and Innovation in Higher Ed Technology

CHICAGO, Jan. 8, 2025 /PRNewswire/ — Everspring, a rapidly growing force in education technology, today announced its recognition on Built In’s 2025 Best Places to Work Awards, earning a coveted spot on Chicago’s 100 Best Midsize Companies list. This achievement comes at a pivotal moment for Everspring, following the successful launch of its VIA enrollment marketing platform and continued strategic partnerships that enable universities to adapt and thrive in a dynamic higher ed landscape.

“This recognition reflects the extraordinary momentum we’re experiencing at Everspring,” says Beth Hollenberg, CEO of Everspring. “Our team’s innovative spirit and dedication to transforming higher education have created an environment where top talent thrives. As we continue to expand our technology solutions and deepen our university partnerships, this award validates our commitment to fostering a workplace that attracts and retains the industry’s brightest minds.”

The honor arrives as Everspring expands its comprehensive education services with powerful SaaS technology offerings. The company’s recent launch of VIA, its enrollment marketing intelligence platform, exemplifies how Everspring’s growing suite of solutions addresses critical challenges in higher education, from disconnected data to enrollment optimization.

“Being recognized as a Best Place to Work is a testament to these companies’ commitment to building a workplace where individuals and innovation thrive,” says Built In CEO and Founder, Maria Christopoulos Katris. “At Built In, we understand that great companies are powered by great teams, and this achievement showcases their dedication to fostering a culture of growth, inclusivity, and excellence. Congratulations on this well-deserved honor.”

Built In determines the winners of Best Places to Work using company data about compensation and benefits, weighing criteria such as remote and flexible work opportunities, DEI programs, and other people-first cultural offerings that today’s tech professionals value most.

About Built In
Built In is the “always on” recruiting platform that reaches the tech professionals that other leading recruiting platforms don’t. Designed to help companies hire expert tech talent, Built In continuously drives brand awareness with content. Monthly, millions of the industry’s most in-demand global tech professionals visit our site to stay ahead of tech trends and news, learn skills to accelerate their careers, find the right job opportunities and get hired. Thousands of companies, from fast-growing startups to the largest enterprises rely on Built In. www.builtin.com

About Built In’s Best Places to Work
Built In’s annual Best Places to Work program honors companies with the best total rewards packages across the U.S. and in the following tech hubs: Atlanta, Austin, Boston, Chicago, Colorado, Dallas, Houston, Los Angeles, Miami, New York, San Diego, San Francisco, Seattle and Washington DC. Best Places to Work is distinct because its algorithm selects tech companies that build their offerings specifically around what tech professionals value in a workplace. https://employers.builtin.com/best-places-to-work

About Everspring
Everspring is a leading provider of education technology and services solutions for higher education. Our advanced technology, proven marketing approach, and robust faculty support and instructional design services deliver outstanding outcomes for our university partners, powering their success online. Everspring offers a range of full-service turnkey solutions, as well as standalone fee-for-service offerings, and innovative self-service products that enable universities to establish themselves as leaders in the digital delivery of higher education. Based in Chicago, Everspring serves a growing number of colleges and universities nationwide.

Visit www.everspringpartners.com for more information.

View original content to download multimedia:https://www.prnewswire.com/news-releases/for-fourth-year-everspring-recognized-among-chicagos-best-places-to-work-302345978.html

SOURCE Everspring

Continue Reading

Technology

HCMF Group Unveils Cutting-Edge Smart Cockpit and Body Mechatronic Systems at CES 2025

Published

on

By

LAS VEGAS, Jan. 8, 2025 /PRNewswire/ — HCMF Group, a global leader in Tier 1 automotive parts and systems, is proud to unveil its groundbreaking advancements in smart cockpit and body mechatronic systems at CES 2025, held from January 7 to January 9. Partnering with industry leaders such as AUO, AGC, Inventec, TMYTEK (TMY Technology Inc.), BenQ Materials, and KINPO GROUP, HCMF is redefining intelligent mobility through transformative innovations and unmatched integration capabilities.

HCMF’s showcase features its integrated vehicle control system, developed with Inventec, which centralizes functionalities onto the front dashboard. This system combines an intuitive user interface, a UWB electronic key, and wireless charging, offering a seamless and futuristic cockpit experience. Also debuting is HCMF’s Micro LED transparent smart window technology, created with AUO and AGC. These high-transparency touch displays are integrated into rear car windows with patented window regulator mechanism, enabling applications such as real-time driving information, AR gaming, personal calendars, and rear-view mirror functions for enhanced convenience and safety.

HCMF’s smart glass solutions, developed with BenQ Materials, deliver privacy and energy efficiency through advanced PDLC 98 black dimming film. These materials block heat and UV rays while providing futuristic aesthetics. Passenger safety takes center stage with the second-generation Child Presence Detection (CPD) system, introduced with TMYTEK. Capable of detecting subtle life signs such as heartbeats and breathing, this system sends real-time alerts to the user’s smartphone, preventing safety risks for children or pets left inside the vehicle.

For rear-seat entertainment, HCMF introduces its foldable 28.6-inch, 32:9 ceiling display featuring JET OPTO’s dual-view single-screen technology. Passengers can view separate content or participate in virtual meetings, redefining in-car leisure and productivity. The company also showcases systems tailored for electric vehicles, such as a front hood automatic opening system and a centralized door control system (DCU) that combines E-latch, radar-based collision avoidance, and automatic opening mechanisms. Additionally, the innovative automatic tailgate system, developed with KINPO GROUP, delivers a user-friendly experience by overcoming traditional design limitations.

Jeffrey Hsi, Chief Innovation Officer of HCMF Group, remarked, “CES 2025 is a pivotal platform for HCMF to showcase its leadership in smart cockpit and body mechatronic systems. We are committed to driving innovation and breakthroughs, advancing automotive technology to deliver safer, more convenient, and enjoyable smart mobility experiences for consumers worldwide.”

HCMF’s participation at CES 2025 underscores its leadership in smart cockpit technologies and collaborative innovation with global partners. From enhancing passenger safety to redefining in-car entertainment and advancing intelligent mobility, HCMF is setting new benchmarks in automotive intelligence and automation. The company remains focused on innovation-driven research and development, delivering future-ready solutions that create value for the global automotive industry and its consumers.

About HCMF Group

HCMF was established in 1961 and as a global automobile Tier 1 system supplier with more than 60 years experience in design and manufacturing. HCMF has around 40 sites globally to provide tailored service to our customers. Our vast knowledge and expertise through years of product experience provide solutions to satisfy our customer needs. We believe strongly in upholding integrity and cooperation to maximize benefits to our customers and partners.

View original content to download multimedia:https://www.prnewswire.com/news-releases/hcmf-group-unveils-cutting-edge-smart-cockpit-and-body-mechatronic-systems-at-ces-2025-302345908.html

SOURCE HCMF Group

Continue Reading

Technology

DELFI Diagnostics to Participate in J.P. Morgan Healthcare Conference

Published

on

By

Leader in liquid biopsy, cancer screening, and monitoring speaks at largest healthcare investment symposium

BALTIMORE and PALO ALTO, Calif., Jan. 8, 2025 /PRNewswire/ —  DELFI Diagnostics, Inc., developer of accessible blood-based, liquid biopsy tests that deliver a new way to enhance early cancer detection, today announced the company will participate in the upcoming 43rd Annual J.P. Morgan Healthcare Conference in San Francisco.

The company’s management is scheduled to present and participate in a Q&A session on Thursday, January 16, 2025, at 7:30 a.m. PT/10:30 a.m. ET. To learn more about DELFI Diagnostics, visit DELFIDiagnostics.com

About DELFI Diagnostics
DELFI Diagnostics is developing next-generation, blood-based tests that are accurate, accessible, and deliver a new way to help detect cancer. DELFI tests are built to solve the highest-burden population health issues, including in historically underserved demographics, and have the potential to save lives on a global scale. FirstLook Lung, for individuals eligible for lung cancer screening, is our first laboratory-developed screening test and requires a simple blood draw that can be incorporated with routine blood work. The test is based on fragmentomics, the discovery that cancer cells are more chaotic than normal cells and, when they die, leave behind tell-tale patterns and characteristics of cell-free DNA (cfDNA) fragments in the blood. The DELFI platform applies advanced machine-learning technology to whole-genome sequencing data to assess individuals’ cfDNA fragments against populations with and without cancer. FirstLook Lung uses these millions of data points to reliably identify individuals who may have cancer detected through low-dose CT, including early-stage disease, with a negative predictive value of 99.8 percent. This test has not been cleared or approved by the FDA.

View original content to download multimedia:https://www.prnewswire.com/news-releases/delfi-diagnostics-to-participate-in-jp-morgan-healthcare-conference-302344795.html

SOURCE DELFI Diagnostics

Continue Reading

Trending