Technology

Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors

Published

7 months ago

June 4, 2024

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology

TOKYO, June 3, 2024 /PRNewswire/ — Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM (NYSE: IBM), today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with a goal of further innovating in this space.

This agreement is part of an international collaboration within the framework of the “Development of Chiplet and Package Design and Manufacturing Technology for 2nm-Generation Semiconductors” project being conducted by Japan’s New Energy and Industrial Technology Development Organization (NEDO) and builds on an existing agreement with IBM for the joint development of 2nm node technology. As part of the agreement, IBM and Rapidus engineers will work in collaboration at IBM’s facilities in North America for R&D and manufacturing of semiconductor packaging for high-performance computer systems.

Over the years, IBM has accumulated R&D and manufacturing technologies for semiconductor packaging for high-performance computer systems. The company also has a wealth of experience with joint development partnerships with Japanese semiconductor manufacturers, as well as manufacturers of semiconductors, package manufacturing equipment, and materials. Rapidus aims to leverage this expertise to quickly establish cutting-edge chiplet packaging technology.

Rapidus President and CEO Dr. Atsuyoshi Koike commented: “Building on our current joint development agreement for 2nm semiconductor technology, we are extremely pleased to officially announce today this partnership with IBM to establish chiplet packaging technology. We will make the most of this international collaboration and pursue initiatives that will allow Japan to play an even more important role in the semiconductor packaging supply chain.”

Darío Gil, SVP and Director of Research at IBM, said: “With decades of innovation in advanced packaging, IBM is honored to expand our collaboration with Rapidus to develop state-of-the-art chiplet technology. Through our agreement, we are committed to supporting the development of the most advanced node production processes, design, and packaging, as well as developing new use cases and supporting the semiconductor workforce.”

About IBM
IBM is a leading provider of global hybrid cloud and AI, and consulting expertise. We help clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. More than 4,000 government and corporate entities in critical infrastructure areas such as financial services, telecommunications and healthcare rely on IBM’s hybrid cloud platform and Red Hat OpenShift to affect their digital transformations quickly, efficiently and securely. IBM’s breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and consulting deliver open and flexible options to our clients. All of this is backed by IBM’s legendary commitment to trust, transparency, responsibility, inclusivity and service. Visit ibm.com for more information.

About Rapidus
Rapidus Corporation aims to develop and manufacture the world’s most advanced logic semiconductors. By developing and providing services to shorten cycle times for design, wafer processes, 3D packaging, and other aspects of semiconductor production, Rapidus creates new industries together with customers. We continue to embrace challenges that contribute to the fulfillment, prosperity, and happiness of people’s lives using semiconductors.

Media contacts:

Kreab K.K. (Japan)
Kunihiko Yasue, Kreab
E-mail: kyasue@kreab.com

Takano Okumoto, Kreab
E-mail: tokumoto@kreab.com

Miki Yagi, Kreab
E-mail: myagi@kreab.com

Breakaway Communications (U.S.)
Devan Gillick, rapidus@breakawaycom.com

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SOURCE Rapidus Corporation

Technology

Agoda Highlights Tokyo as Top Global New Year’s Eve Destination

Published

2 minutes ago

December 26, 2024

SINGAPORE, Dec. 26, 2024 /PRNewswire/ — Digital travel platform Agoda has announced Tokyo as the most popular destination for New Year’s Eve, based on accommodation searches. This marks a shift from last year when Taipei held the top spot. Following Tokyo, the list includes Bangkok, Taipei, Pattaya, and Osaka, showcasing a diverse range of preferences among travelers.

The data highlights a perpetual interest in Tokyo, a city known for its unique blend of tradition and modernity. Travelers are drawn to its vibrant celebrations, cultural experiences, and iconic landmarks. Bangkok and Taipei, too, continue to be favored destinations, offering rich cultural festivities and lively atmospheres. Pattaya and Osaka also make the list, appealing to those seeking beachside celebrations and culinary delights, respectively.

Agoda’s data reveals Tokyo’s prominence not only on a worldwide scale but also within Japan. Domestic accommodation searches have increased by 23%, with Tokyo leading as the preferred destination, followed by Osaka, Kyoto, Yokohama, and Okinawa Main Island. For Japanese traveling abroad, the destinations primarily considered are Taipei, Seoul, Bangkok, Pattaya, and Hong Kong.

Hiroto Ooka, Associate Vice President North Asia at Agoda said: “Tokyo’s rise to the top of Agoda’s New Year’s Eve destination list is a testament to the city’s global appeal. Whether you’re celebrating New Year’s Eve in Tokyo, Osaka, or anywhere else in the world, Agoda is ready to help you find the perfect spot to ring in the New Year.”

As travelers prepare for their New Year’s Eve plans, Agoda offers a comprehensive selection of over 4.5 million holiday properties, more than 130,000 flight routes, and over 300,000 activities, all available for seamless booking. Download the Agoda app for the latest deals or visit agoda.com/deals.

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SOURCE Agoda

Technology

SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs

Published

1 hour ago

December 26, 2024

SINGAPORE, Dec. 25, 2024 /PRNewswire/ — SP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.

Malaysia Expansion: Enhancing Operations and Supporting Growth

The state-of-the-art Senai facility, which opened in October, will enhance the company’s operational resilience to meet growing customer demands in medical devices, industrial machinery, and automotive electronics.

Equipped with advanced automation and strict quality controls, the factory enables SPM to deliver mission-critical products with precision and reliability while supporting Malaysia’s vision of becoming a leader in high-value, high-tech industries.

“This facility reflects our commitment to serving our global customers while participating in a key location of the global supply chain network,” said Jackson Tan, Global Business Development Director of SP Manufacturing. The plant’s capabilities include cable harness assembly, PCB assembly, and box-build solutions.

The Senai facility is equipped with comprehensive manufacturing capabilities, including:

Functional testingIn-circuit testing and automated optical inspection (AOI)State-of-the-art cleaning processesRigorous inspection protocolsRapid prototyping and expert assembly processes

Ideal Jacobs Acquisition: Expanding Capabilities

In a parallel move, SPM also acquired Ideal Jacobs Corporation, which is known for its human-machine interface, printed electronics and die-cut solutions. The move will expand SPM’s engineering capabilities and provide access to a diversified client portfolio, including leading names in the medical, industrial, semiconductor, and telecommunications sectors.

Comprehensive Design Support in the U.S.

SPM continues to provide comprehensive engineering and design services for its U.S. customers using industry-standard software for PCB and electrical design. These services help clients with their new product introductions (NPI), early supplier involvement (ESI), and DFx processes, optimising costs and reducing time to market.

Founded in 2000 and headquartered in Singapore, SP Manufacturing has built its reputation serving mission-critical industries like medical, automotive, and aerospace. The company specialises in cable harnesses, PCB assemblies, and box-build products.

For more information about SP Manufacturing’s latest developments, visit www.sp-manufacturing.com or follow us on LinkedIn.

About SP Manufacturing

SP Manufacturing (SPM), founded in 2000 and headquartered in Singapore, has established itself as a leader in the EMS sector. Serving mission-critical industries such as industrial, medical, automotive, and aerospace, SPM excels in providing comprehensive manufacturing solutions from design to full production, specialising in high-quality cable harnesses, PCB assemblies, and box-build products.

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SOURCE SP Manufacturing

Technology

Casect Launches AI-Enhanced Case Log Platform for Surgeons

Published

4 hours ago

December 25, 2024

SHERIDAN, Wyo., Dec 25, 2024 /PRNewswire/ — Casect, LLC, a medical education technology company, announces the launch of an innovative platform to revolutionize how surgeons and medical professionals document cases. Casect empowers users to track surgical Cases, refine Techniques, organize References, and collaborate with Colleagues — all within a user-friendly, HIPAA-compliant system.

Say goodbye to inefficient notebooks, spreadsheets, and outdated case logs. Casect offers a modern, comprehensive solution tailored to the surgical community, enabling professionals to focus on growth, learning, and excellence in patient care.

A New Era of AI-Powered Case Tracking

Time is critical for surgeons, yet valuable insights are often lost due to outdated documentation methods like handwritten notes or spreadsheets. Casect’s HIPAA-compliant platform, with a no data retention policy for protected health information, uses optional AI to pre-fill case details, analyze uploads, and organize data seamlessly. This transforms hours of documentation into minutes, giving surgeons more time to refine skills and improve patient care.

Casect addresses an unmet need in medical education, residency, fellowship, credentialing, and research. It enables detailed documentation of Cases, Techniques, and References, accessible from any computer or mobile device with a subscription.

Key Features

AI-Assisted Case Entry (Optional): Streamline input with AI or manually add details; supports spreadsheet uploads.Customizable Fields: Track cases your way.Refine Techniques: Create, document, and improve surgical techniques.Multimedia Support: Upload, organize, and access photos, videos, and documents.Organize References: Annotate, markup, and securely store documents and literature.Collaborate Seamlessly: Share cases and techniques effortlessly with colleagues.Analyze and Export: Generate insights through charts or export data as CSV.HIPAA-Compliant: Designed to meet strict HIPAA standards, ensuring the security and confidentiality of protected health information.

Additional Resources

Stay Informed: Unlock a 30-day free trial by signing up for the latest updates on Casect’s launch.Learn More: Discover why Casect is the preferred choice for surgeons at Why Casect?Explore Features: View the Full Feature List.Stay Connected: Follow us on X, Facebook, Instagram, and LinkedIn for updates, tips, and stories. Join the conversation with #MedEd, #CaseLog, and #Casect.

About Casect

Born from decades of tracking cases with stickers, notes, and spreadsheets, Casect empowers surgeons with efficient, comprehensive tools to document cases, collaborate, and drive professional growth. By simplifying the case log, Casect helps surgeons identify trends, enhance skills, and improve patient outcomes. For more information, visit www.casect.com or follow us on X, Facebook, Instagram, and LinkedIn @CasectLLC.

CONTACT: support@casect.com

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SOURCE Casect, LLC