MONTRÉAL, April 11, 2025 /CNW/ – Videotron has been ranked the most respected telecommunications provider in Québec for the 19th time since 2006 in Léger’s 2025 Reputation survey. This signal distinction spanning two decades confirms Videotron’s status as a flagship of Québec’s economy and underscores its unwavering commitment to service excellence and its ability to maintain strong customer relationships in a highly competitive market.

“This stellar result, which honours us year after year, demonstrates the strength of our customer-centric business model,” said Pierre Karl Péladeau, President and CEO of Quebecor. “I am very gratified to see the efforts of our teams across Québec recognized in this way. They work tirelessly to deliver a distinctive customer experience and innovative solutions to the millions of people who choose Videotron. We are committed to maintaining the standards of excellence for which we are known, and to pursuing our mission of providing quality telecommunications services at fair prices for all.”

Click here to view the results of Léger’s 2025 Reputation survey

Long list of distinctions

This recognition extends the impressive list of outstanding results recently achieved by Videotron and its sister brand Fizz:

Videotron emerged as the telecommunications provider with the best in-store experience in Québec in Léger’s WOW 2025 study;In the same study, Fizz held its position as the Canadian leader in online experience for the sixth year in a row;In its latest annual report, the CCTS* reported a 38% increase in complaints for the telecommunications industry as a whole but complaints about Videotron showed an exceptional decline for the third consecutive year, falling by 14%, and complaints about Fizz were down 2%.

Click here to view the results of Leger’s 2025 WOW Digital study

* Commission for Complaints for Telecom-television Services

About Videotron

Videotron, a wholly owned subsidiary of Quebecor Media Inc., is an integrated communications company engaged in television, entertainment, Internet access, wireline telephone and mobile telephone services. Videotron is Canada’s fourth strong and competitive national mobile carrier. As of December 31, 2024, Videotron and Freedom had a combined total of 4,138,200 mobile lines. Videotron is also a leader in new technologies with its Helix home entertainment and management platform, and is the Québec leader in high-speed Internet access. As of December 31, 2024, Videotron had 1,294,400 subscribers to its television service, 1,732,600 subscribers to its Internet service, and 608,900 connections to its wireline telephony service. In Léger’s 2025 Reputation survey, Videotron was ranked the most respected telecom provider in Québec for the 19th time since 2006.

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SOURCE Videotron Ltd.

BANGALORE, India, April 11, 2025 /PRNewswire/ — Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image Sensor (CIS), NAND, DRAM, High Bandwidth Memory (HBM)).

The Global Market for Hybrid Bonding Technology was valued at USD 164 Million in the year 2024 and is projected to reach a revised size of USD 756 Million by 2031, growing at a CAGR of 24.7% during the forecast period.

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Major Factors Driving the Growth of Hybrid Bonding Technology Market:

The Hybrid Bonding Technology Market is transitioning from early‑adopter phase to high‑growth mainstream adoption. Capacity announcements, multi‑year equipment backlogs, and expanding design‑win pipelines signal robust double‑digit revenue growth through the forecast horizon. As heterogeneous integration becomes indispensable for AI, 5G, automotive autonomy, and ultra‑high‑resolution imaging, hybrid bonding emerges as the de facto interconnect standard, eclipsing micro‑bump and TSV‑centric approaches. Continued process refinements and cost reductions will open mid‑tier and IoT segments, further enlarging addressable demand. Overall, hybrid bonding stands poised to redefine advanced packaging economics and performance benchmarks, anchoring a vibrant ecosystem of materials, tools, and service providers.

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TRENDS INFLUENCING THE GROWTH OF THE HYBRID BONDING TECHNOLOGY MARKET:

Wafer‑to‑wafer hybrid bonding is emerging as a pivotal manufacturing step because it enables full‑surface metal‑oxide interconnects that virtually eliminate the parasitic resistance and capacitance associated with‑silicon vias. By stacking fully processed wafers with nanometer‑level alignment accuracy, manufacturers can co‑integrate logic, memory, photonic, and sensor layers into one monolithic three‑dimensional package, delivering massive bandwidth and lower energy per bit. These measurable system advantages have made wafer‑to‑wafer architectures indispensable for high‑performance computing, mobile processors, and AI accelerators, spurring capacity expansions by foundries and OSATs. Equipment vendors are likewise benefiting, booking orders for plasma activation tools, bonding aligners, and cluster systems. The resulting cycle of demand, investment, and ecosystem maturation propels sustained, robust growth in the Hybrid Bonding Technology Market worldwide today.

Die‑to‑wafer hybrid bonding unlocks heterogeneous integration by allowing known‑good die from disparate process nodes to be placed precisely onto a target wafer, eliminating costly yield penalties linked with full wafer stacking. This pick‑and‑place flexibility lets designers mix advanced logic, high‑density memory, and specialty analog functions inside a single 3D package, tailoring performance while shrinking footprint. The approach is particularly attractive for chiplet architectures powering data‑center GPUs, network switches, and AI accelerators where interposer limitations bottleneck bandwidth. As system companies embrace the chiplet paradigm, demand for die‑to‑wafer processes is skyrocketing, prompting capital spending on bond aligners, plasma cleaners, and metrology. Collaborative standards such as UCIe reinforce ecosystem confidence, amplifying orders. Consequently, die‑to‑wafer adoption expands revenue within the Hybrid Bonding Technology Market.

CMOS Image Sensors (CIS) are driving a share of hybrid bonding demand because the technology dramatically improves pixel‑level interconnect density, enabling smaller pitch, higher resolution, and superior signal‑to‑noise ratios. By hybrid‑bonding the photodiode wafer to a dedicated logic wafer, manufacturers separate light‑sensitive and processing functions, maximizing fill factor while embedding advanced AI engines beneath each pixel. This architecture is essential for smartphone cameras, automotive ADAS modules, security systems, and emerging AR/VR devices that require multi‑megapixel performance without thermal or power penalties. Major CIS foundries in Japan, South Korea, and Taiwan are investing heavily in hybrid bonding lines, negotiating long‑term supply agreements with handset and automotive OEMs. Their outlays translate into expanding tool shipments, bolstering Hybrid Bonding Technology Market growth trajectories.

Data‑center operators and cloud service providers are deploying ever‑larger AI training clusters and exascale supercomputers that crave higher memory bandwidth, lower latency, and reduced power consumption. Traditional 2.5D interposers and wire‑bonded packages cannot keep pace with the throughput requirements of transformer models and graph analytics. Hybrid bonding overcomes these bottlenecks by providing direct copper‑to‑copper interconnects at pitches below ten microns, allowing logic and HBM stacks to exchange terabytes per second while staying within stringent energy budgets. As hyperscalers commit billions to next‑gen accelerators, they push chip suppliers toward aggressive adoption roadmaps, thereby amplifying equipment, material, and service revenues across the Hybrid Bonding Technology ecosystem worldwide. The virtuous demand cycle intensifies competition and innovation momentum further.

Consumers expect thinner smartphones, smartwatches, and augmented reality glasses that deliver desktop‑class functionality without sacrificing battery life. Achieving such compactness requires stacking logic, memory, RF front‑ends, and power management circuits vertically rather than expanding the PCB footprint. Hybrid bonding enables this architecture by allowing fine‑pitch interconnects between heterogeneous wafers and dies, eliminating the height penalties of micro‑bumps. OEM roadmaps from Silicon Valley to Shenzhen explicitly reference hybrid bonding for next‑generation application processors and camera modules, triggering early production ramps at foundries. Component miniaturization also frees board area for larger batteries and novel sensors, creating additional differentiation. Consequently, handset competition acts as a persistent catalyst that widens the addressable Hybrid Bonding Technology Market, boosting volume shipments.

Automotive OEMs are integrating lidar, radar, high‑resolution cameras, and domain controllers to achieve advanced driver‑assistance and eventual autonomous operation. These sensor arrays generate enormous data streams that must be processed in real‑time under harsh thermal and vibration conditions. Hybrid bonding facilitates compact, ruggedized 3D stacks that combine logic, memory, and sensor dies, improving bandwidth and reducing latency while maintaining reliability. Government safety regulations such as Euro NCAP and China NCAP push adoption of ADAS features, creating predictable, multi‑year demand for high‑performance automotive semiconductors. Tier‑1 suppliers consequently sign capacity reservations with foundries, driving equipment purchases for hybrid bonding lines and reinforcing market growth.

 Initial hybrid bonding lines suffered from particle‑induced voids and alignment errors, but iterative advances in plasma activation chemistry, wafer‑handling robotics, and in‑line inspection have driven dramatic yield gains. Higher yields translate directly into lower cost‑per‑connection, making hybrid bonding economically competitive with micro‑bump solutions at high volumes. OSATs now advertise greater than 99 percent bonding yield for both wafer‑to‑wafer and die‑to‑wafer flows, convincing cautious fabless customers to convert existing 2.5D programs. As unit costs fall, hybrid bonding becomes viable for mid‑range mobile and IoT chips, expanding the addressable market. Continuous process optimization therefore serves as a reinforcing growth driver, unlocking new design‑win opportunities.

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HYBRID BONDING TECHNOLOGY MARKET SHARE:

Asia‑Pacific dominates the Hybrid Bonding Technology Market, led by Taiwan’s advanced‑node foundries, South Korea’s memory giants, and Japan’s CMOS image‑sensor specialists. China is rapidly scaling domestic capacity through state‑backed programs, while Southeast Asia’s OSAT clusters in Singapore and Malaysia add assembly breadth. North America follows, buoyed by U.S. logic IDMs and government‑funded packaging pilot lines. Europe leverages research institutes and automotive demand, whereas Israel anchors niche aerospace and defense applications.

Key Companies:

IntelApplied MaterialsHuaweiEV Group (EVG)SUSS MicroTecAdeia

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DISCOVER MORE INSIGHTS: EXPLORE SIMILAR REPORTS!

–          Hybrid Bonding Equipment Market was valued at USD 123 Million in the year 2023 and is projected to reach a revised size of USD 618 Million by 2030, growing at a CAGR of 24.7% during the forecast period.

–          Wafer Hybrid Bonding Equipment Market was valued at USD 164 Million in the year 2024 and is projected to reach a revised size of USD 756 Million by 2031, growing at a CAGR of 24.7% during the forecast period.

–          Wafer Bonding Equipment Market was valued at USD 321 Million in the year 2024 and is projected to reach a revised size of USD 449 Million by 2031, growing at a CAGR of 5.0% during the forecast period.

–          Hybrid Wedge Bonders market was valued at USD 54 Million in 2023 and is anticipated to reach USD 70 Million by 2030, witnessing a CAGR of 3.0% during the forecast period 2024-2030.

–          Chip Bonding Adhesive Market was valued at USD 355 Million in the year 2023 and is projected to reach a revised size of USD 510 Million by 2030, growing at a CAGR of 5.3% during the forecast period.

–          Optical Bonding Service Market

–          Temporary Bonding and Debonding Systems Market

–          Wafer Bond Alignment System Market was valued at USD 249 Million in the year 2023 and is projected to reach a revised size of USD 423 Million by 2030, growing at a CAGR of 7.9% during the forecast period.

–          Die Bonding Materials Market

–          Automotive Glass Bonding Market

–          Bonding Wire for Semiconductor Packaging Market

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SALT LAKE CITY, April 11, 2025 /PRNewswire/ — FatPipe, Inc. FatPipe, Inc. (“FatPipe” or the “Company”), a pioneer in enterprise-class, application-aware, secure software-defined wide area network (“SD-WAN”) solutions that provide the highest levels of reliability, security, and optimization for Wide Area Networks (WANs), today announced its Total Security 360 product designed to provide advanced network security, cybersecurity, and real-time network and security monitoring.

FatPipe Total Security 360 offers a single stack solution that includes SD-WAN, NextGen firewall, and cybersecurity, all in one package. FatPipe design reduces the complexity involved in cybersecurity deployment, making it easy for the customer to understand and deploy cybersecurity besides reducing their insurance costs.

FatPipe provides proactive monitoring and timely alerts for swift threat detection and response. The consolidated, single-pane-of-glass view of network and cybersecurity eliminates the need for multiple dashboards thus delivering better visibility and situation awareness.

Dr. Ragula Bhaskar, CEO commented, “Fatpipe’s single stack architecture takes the mystery and complexity out of cybersecurity while providing it at an affordable price to SMBs”.

About FatPipe, Inc.

FatPipe pioneered the concept of software-defined wide area networking (SD-WAN) and hybrid WANs that eliminate the need for hardware and software or cooperation from ISPs and allows companies and service providers to control multi-link network traffic. FatPipe currently has 12 U.S. patents related to multipath, software-defined networking. FatPipe products are sold by 200+ resellers worldwide. For more information, visit www.fatpipe.com. Follow us on Twitter @FatPipe_Inc.

Company Contact Info

IR.Press@fatpipeinc.com

Media Contacts

RedChip Contact
Dave Gentry
RedChip Companies, Inc.
1.800.RED.CHIP (733-2447)
Dave@redchip.com 

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SOURCE FatPipe Networks