Connect with us

Technology

VIA Labs Announces Immediate Availability of VL605 USB-C to HDMI 2.1 Protocol Converter with USB PD EPR Support

Published

on

TAIPEI, May 28, 2024 /PRNewswire/ —  VIA Labs, Inc. (VLI), a leading supplier of USB4®, SuperSpeed USB, USB Power Delivery Controllers, and now Display Controllers, today announced the start of mass production and immediate availability for the VIA Labs VL605 USB-C® to HDMI 2.1 Protocol Converter. The VL605 Protocol Converter achieved USB-IF certification for USB Power Delivery 3.1 with support for Extended Power Range (EPR) and HDMI 2.1 FRL certification and is now listed on the USB-IF Integrator’s List under TID: 10462.

VIA Lab VL605 is an innovative single-chip USB-C to HDMI 2.1 Protocol Converter supporting modern display features and a highly integrated, low-power design. It’s optimized for USB-C video dongles and multifunction docks and integrates a two-port USB PD 3.1 controller that supports pass-through charging at up to 240W when EPR is enabled. A single VL605 can convert a DisplayPort input to HDMI 2.1 at up to 8K@60Hz or 4K@240Hz while simultaneously charging the connected host. VL605 supports HDR and is compatible with Adaptive Sync from the DisplayPort standard and AMD’s FreeSync technology, seamlessly converting these into HDMI 2.1’s VRR (Variable Refresh Rate). Products incorporating VL605 can enhance gaming experiences with higher quality and smoother visuals while expanding peripheral connectivity and enjoying faster charging.

As mainstream home game consoles and computer hosts increasingly support HDMI 2.1, many displays with HDMI 2.1 enhancements such as higher resolution and refresh rate, VRR, and HDR support have emerged. HDMI 2.1 offers up to 48Gbps of bandwidth, which is a dramatic improvement over HDMI 2.0’s 18Gbps, and this allows HDMI 2.1 to handle higher 4K refresh rates such as 120Hz, 144Hz, and even up to 240Hz with Display Stream Compression (DSC). The VRR feature of HDMI 2.1 can dynamically adjust the refresh rate based on game conditions, improving smoothness while minimizing screen tearing and perceived input lag. 

VL605’s integrated DisplayPort receiver supports HBR3 data rates, up to 32.4Gbps in 4-lane mode. The HDMI source supports both FRL and TMDS modes with peak bandwidths of 48Gbps and 18Gbps, respectively. It also supports RGB and YCbCr color formats and surround sound audio with up to 8 channels of LPCM at 192kHz in addition to various other compressed audio formats. The VL605 has a built-in DSC decoder and supports Autonomous Mode and Source-Controlled Mode as outlined in the latest DisplayPort 2.1 specification, providing signal sources with enhanced control capabilities. Additionally, VL605 can perform secure FW updates and avoid malicious firmware code attacks by leveraging the built-in security engine supporting ECDSA verification.

Wayne Chang, Director of PM at VIA Labs, underlines the VL605’s adaptability. “DisplayPort and HDMI are the industry’s leading video standards and are intertwined with the USB-C ecosystem. When combined with VLI’s diverse USB Hub controllers, the VL605 can create a multitude of USB-C multifunction dock applications with USB PD charge-through function at different USB speeds, enabling a wide range of products. Future demand for VL605’s capabilities is bright. As the latest mobile chips from Apple, Qualcomm, and MediaTek introduce hardware ray tracing capabilities, AAA games are being adapted for mobile platforms. With the VL605’s dual USB PD ports and HDMI 2.1 output capabilities, a mobile phone can not only serve as a handheld gaming device but also seamlessly transition into a gaming console at home. It can charge the phone while projecting to a large 4K/8K TV screen, supporting a new gaming experience.”

VIA Labs VL605 Availability

The VL605 USB-C to HDMI 2.1 Protocol Converter is available now and is shipping in quantity. For information, please contact your local VIA Labs sales representative or send an email to sales@via-labs.com

For more information about the VIA Labs VL605, please visit:

https://www.via-labs.com/product_show.php?id=123

VIA Labs Exhibition Information

Computex Taipei 2024

Date: June 4-7, 2024

Location: Nangang Exhibition Hall, Hall 1, Taipei, Taiwan

Booth: VIA Labs, Inc. at USB-IF Community (N0607a)

About VIA Labs, Inc.

VIA Labs, Inc. (VLI) is a leading supplier of USB4®, SuperSpeed USB and USB Power Delivery Controllers, based on the latest USB-IF Standards. A subsidiary VIA Technologies, Inc., VLI leverages its expertise in analog circuit design, high-speed serial interfaces, and systems integration to create a rich product portfolio that includes USB Host, Hub, and Device controllers in addition to USB PD and charging controllers. VIA Labs, Inc. has demonstrated technology and industry leadership through Standards Development and bringing newly developed USB Technologies to market. www.via-labs.com

NOTE

USB-C® and USB4® are trademarks of USB Implementers Forum.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/via-labs-announces-immediate-availability-of-vl605-usb-c-to-hdmi-2-1-protocol-converter-with-usb-pd-epr-support-302156393.html

SOURCE VIA Labs, Inc.

Continue Reading
Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *

Technology

For Fourth Year, Everspring Recognized Among Chicago’s Best Places to Work

Published

on

By

Award Recognition Reflects Company’s Continued Momentum, Growth and Innovation in Higher Ed Technology

CHICAGO, Jan. 8, 2025 /PRNewswire/ — Everspring, a rapidly growing force in education technology, today announced its recognition on Built In’s 2025 Best Places to Work Awards, earning a coveted spot on Chicago’s 100 Best Midsize Companies list. This achievement comes at a pivotal moment for Everspring, following the successful launch of its VIA enrollment marketing platform and continued strategic partnerships that enable universities to adapt and thrive in a dynamic higher ed landscape.

“This recognition reflects the extraordinary momentum we’re experiencing at Everspring,” says Beth Hollenberg, CEO of Everspring. “Our team’s innovative spirit and dedication to transforming higher education have created an environment where top talent thrives. As we continue to expand our technology solutions and deepen our university partnerships, this award validates our commitment to fostering a workplace that attracts and retains the industry’s brightest minds.”

The honor arrives as Everspring expands its comprehensive education services with powerful SaaS technology offerings. The company’s recent launch of VIA, its enrollment marketing intelligence platform, exemplifies how Everspring’s growing suite of solutions addresses critical challenges in higher education, from disconnected data to enrollment optimization.

“Being recognized as a Best Place to Work is a testament to these companies’ commitment to building a workplace where individuals and innovation thrive,” says Built In CEO and Founder, Maria Christopoulos Katris. “At Built In, we understand that great companies are powered by great teams, and this achievement showcases their dedication to fostering a culture of growth, inclusivity, and excellence. Congratulations on this well-deserved honor.”

Built In determines the winners of Best Places to Work using company data about compensation and benefits, weighing criteria such as remote and flexible work opportunities, DEI programs, and other people-first cultural offerings that today’s tech professionals value most.

About Built In
Built In is the “always on” recruiting platform that reaches the tech professionals that other leading recruiting platforms don’t. Designed to help companies hire expert tech talent, Built In continuously drives brand awareness with content. Monthly, millions of the industry’s most in-demand global tech professionals visit our site to stay ahead of tech trends and news, learn skills to accelerate their careers, find the right job opportunities and get hired. Thousands of companies, from fast-growing startups to the largest enterprises rely on Built In. www.builtin.com

About Built In’s Best Places to Work
Built In’s annual Best Places to Work program honors companies with the best total rewards packages across the U.S. and in the following tech hubs: Atlanta, Austin, Boston, Chicago, Colorado, Dallas, Houston, Los Angeles, Miami, New York, San Diego, San Francisco, Seattle and Washington DC. Best Places to Work is distinct because its algorithm selects tech companies that build their offerings specifically around what tech professionals value in a workplace. https://employers.builtin.com/best-places-to-work

About Everspring
Everspring is a leading provider of education technology and services solutions for higher education. Our advanced technology, proven marketing approach, and robust faculty support and instructional design services deliver outstanding outcomes for our university partners, powering their success online. Everspring offers a range of full-service turnkey solutions, as well as standalone fee-for-service offerings, and innovative self-service products that enable universities to establish themselves as leaders in the digital delivery of higher education. Based in Chicago, Everspring serves a growing number of colleges and universities nationwide.

Visit www.everspringpartners.com for more information.

View original content to download multimedia:https://www.prnewswire.com/news-releases/for-fourth-year-everspring-recognized-among-chicagos-best-places-to-work-302345978.html

SOURCE Everspring

Continue Reading

Technology

HCMF Group Unveils Cutting-Edge Smart Cockpit and Body Mechatronic Systems at CES 2025

Published

on

By

LAS VEGAS, Jan. 8, 2025 /PRNewswire/ — HCMF Group, a global leader in Tier 1 automotive parts and systems, is proud to unveil its groundbreaking advancements in smart cockpit and body mechatronic systems at CES 2025, held from January 7 to January 9. Partnering with industry leaders such as AUO, AGC, Inventec, TMYTEK (TMY Technology Inc.), BenQ Materials, and KINPO GROUP, HCMF is redefining intelligent mobility through transformative innovations and unmatched integration capabilities.

HCMF’s showcase features its integrated vehicle control system, developed with Inventec, which centralizes functionalities onto the front dashboard. This system combines an intuitive user interface, a UWB electronic key, and wireless charging, offering a seamless and futuristic cockpit experience. Also debuting is HCMF’s Micro LED transparent smart window technology, created with AUO and AGC. These high-transparency touch displays are integrated into rear car windows with patented window regulator mechanism, enabling applications such as real-time driving information, AR gaming, personal calendars, and rear-view mirror functions for enhanced convenience and safety.

HCMF’s smart glass solutions, developed with BenQ Materials, deliver privacy and energy efficiency through advanced PDLC 98 black dimming film. These materials block heat and UV rays while providing futuristic aesthetics. Passenger safety takes center stage with the second-generation Child Presence Detection (CPD) system, introduced with TMYTEK. Capable of detecting subtle life signs such as heartbeats and breathing, this system sends real-time alerts to the user’s smartphone, preventing safety risks for children or pets left inside the vehicle.

For rear-seat entertainment, HCMF introduces its foldable 28.6-inch, 32:9 ceiling display featuring JET OPTO’s dual-view single-screen technology. Passengers can view separate content or participate in virtual meetings, redefining in-car leisure and productivity. The company also showcases systems tailored for electric vehicles, such as a front hood automatic opening system and a centralized door control system (DCU) that combines E-latch, radar-based collision avoidance, and automatic opening mechanisms. Additionally, the innovative automatic tailgate system, developed with KINPO GROUP, delivers a user-friendly experience by overcoming traditional design limitations.

Jeffrey Hsi, Chief Innovation Officer of HCMF Group, remarked, “CES 2025 is a pivotal platform for HCMF to showcase its leadership in smart cockpit and body mechatronic systems. We are committed to driving innovation and breakthroughs, advancing automotive technology to deliver safer, more convenient, and enjoyable smart mobility experiences for consumers worldwide.”

HCMF’s participation at CES 2025 underscores its leadership in smart cockpit technologies and collaborative innovation with global partners. From enhancing passenger safety to redefining in-car entertainment and advancing intelligent mobility, HCMF is setting new benchmarks in automotive intelligence and automation. The company remains focused on innovation-driven research and development, delivering future-ready solutions that create value for the global automotive industry and its consumers.

About HCMF Group

HCMF was established in 1961 and as a global automobile Tier 1 system supplier with more than 60 years experience in design and manufacturing. HCMF has around 40 sites globally to provide tailored service to our customers. Our vast knowledge and expertise through years of product experience provide solutions to satisfy our customer needs. We believe strongly in upholding integrity and cooperation to maximize benefits to our customers and partners.

View original content to download multimedia:https://www.prnewswire.com/news-releases/hcmf-group-unveils-cutting-edge-smart-cockpit-and-body-mechatronic-systems-at-ces-2025-302345908.html

SOURCE HCMF Group

Continue Reading

Technology

DELFI Diagnostics to Participate in J.P. Morgan Healthcare Conference

Published

on

By

Leader in liquid biopsy, cancer screening, and monitoring speaks at largest healthcare investment symposium

BALTIMORE and PALO ALTO, Calif., Jan. 8, 2025 /PRNewswire/ —  DELFI Diagnostics, Inc., developer of accessible blood-based, liquid biopsy tests that deliver a new way to enhance early cancer detection, today announced the company will participate in the upcoming 43rd Annual J.P. Morgan Healthcare Conference in San Francisco.

The company’s management is scheduled to present and participate in a Q&A session on Thursday, January 16, 2025, at 7:30 a.m. PT/10:30 a.m. ET. To learn more about DELFI Diagnostics, visit DELFIDiagnostics.com

About DELFI Diagnostics
DELFI Diagnostics is developing next-generation, blood-based tests that are accurate, accessible, and deliver a new way to help detect cancer. DELFI tests are built to solve the highest-burden population health issues, including in historically underserved demographics, and have the potential to save lives on a global scale. FirstLook Lung, for individuals eligible for lung cancer screening, is our first laboratory-developed screening test and requires a simple blood draw that can be incorporated with routine blood work. The test is based on fragmentomics, the discovery that cancer cells are more chaotic than normal cells and, when they die, leave behind tell-tale patterns and characteristics of cell-free DNA (cfDNA) fragments in the blood. The DELFI platform applies advanced machine-learning technology to whole-genome sequencing data to assess individuals’ cfDNA fragments against populations with and without cancer. FirstLook Lung uses these millions of data points to reliably identify individuals who may have cancer detected through low-dose CT, including early-stage disease, with a negative predictive value of 99.8 percent. This test has not been cleared or approved by the FDA.

View original content to download multimedia:https://www.prnewswire.com/news-releases/delfi-diagnostics-to-participate-in-jp-morgan-healthcare-conference-302344795.html

SOURCE DELFI Diagnostics

Continue Reading

Trending