Connect with us

Technology

China Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report 2023 Featuring 11 Automotive Power Supply Providers and 7 Automotive Power Supply Chip Suppliers

Published

11 months ago

on

DUBLIN, Feb. 15, 2024 /PRNewswire/ — The “Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report, 2023” report has been added to ResearchAndMarkets.com’s offering.

Automotive power supply and IC: Chinese chips are promising in the evolution from physical integration to system integration

As the core component of a new energy vehicle, automotive power supply is mainly used to convert the electric energy of the power battery into the voltage and current suitable for the vehicle, and also provides stable power support for the electrical equipment inside the vehicle. The surging new energy vehicle sales spur the boom of automotive power supply market.

OBCs, DC/DC converters and PDUs in automotive power supply can be independent components or integrated systems. As per the product structure of mainstream suppliers in recent two years, the proportion of independent components is declining sharply, while the shipments of ‘two-in-one’, ‘three-in-one’ and ‘all-in-one’ integrated forms are jumping.

All-in-one solution from physical integration to system integration

The integration trend of automotive power supply is clear, and OBCs, DC/DC converters and PDUs are further integrated with electric drive and ECU. FinDreams Powertrain, Changan NE, Huawei Digital Power, etc. are all promoting the all-in-one electric drive assembly integrated with OBCs. The mode of high integration can save space, reduce weight and improve the overall efficiency.

In the future, the ‘all-in-one’ integrated solution will evolve from mechanical hardware integration to power components integration, and deeply integrate software with the backend to form a control domain for the drive system – fully combining battery data, electric drive data, charging data, etc., evolving towards the power domain controller.

Huawei: the hyper-converged ‘ten-in-one’ power domain module launched in April 2023 pioneers chip integration, power integration, function integration and domain controller integration to reduce the BOM by 40% and the number of chips by 60%, thus improving the development efficiency of automakers by 30%. In addition, it enables more concise layout of the front cabin of vehicles, releases more interior space and provides better comfort experiences for occupants.

ST: ST New Energy Vehicle Innovation Center has built a range of system solutions based on Stella series, including the 22kW Stellar E-based OBC-DC/DC combined solution and the Stella P-based all-in-one powertrain domain controller.

The all-in-one powertrain domain controller is based on ST’s latest Stellar P series automotive MCU, and integrates the following components: main drive inverter, vehicle control unit (VCU), battery management unit (BMU) motherboard, on-board charger (OBC) and DC/DC converter. The highly integrated solution improves power density, reduces the number of high/low-voltage connectors, and optimizes the cost of hardware BOM and software development and maintenance.

Localization is promising in the upstream supply chain of automotive power supply.

Silicon carbide is widely used in automotive power supply products.

Conventional silicon-based power semiconductors can only limitedly improve the efficiency and power density of automotive power supply, while SiC power devices have advantages in on-resistance, blocking voltage and junction capacitance, and are rapidly introduced in high-end new energy electric vehicles.

OBCs and DC/DC converters have started wide adoption of SiC devices, for instance, PFC diodes are replaced by SiC SBDs, or DC/DC primary circuit MOS tubes of OBCs are substituted by SiC MOS, and all-SiC solution is expected to enter the stage of mass application soon. So far, BYD, Tesla, Hyundai, Jaguar Land Rover, Geely, Renault, SAIC Volkswagen and Nissan among others have used the third-generation SiC semiconductor devices in automotive power supply.

Infineon: In June 2023, Infineon presents its new generation of 1200 V CoolSiCT MOSFETs in TO263-7 for automotive applications. The automotive-graded silicon carbide (SiC) MOSFET generation offers high power density and efficiency, enables bi-directional charging and significantly reduces system cost in on-board charging (OBC) and DC-DC applications. In addition, the 1200 V CoolSiC family member offers best-in-class switching performance through 25% lower switching losses and lowers the SiC MOSFET junction temperature by 25%, compared to the first generation.

The pace of homemade automotive power supply MCUs in China replacing imported counterparts quickens.

At present, major automotive power supply IC vendors are working to improve product performance to meet ever higher requirements.

TI: In the existing automotive power supply system, customers often have high requirements for high efficiency and better thermal performance. Both OBCs and communication power supply products are getting smaller, and the switching frequency is also becoming higher, posing bigger EMI challenges. In March 2023, TI introduced standalone active electromagnetic interference (EMI) filter integrated circuits (ICs), enabling engineers to implement smaller, lighter EMI filters, to enhance system functionality at reduced system cost while simultaneously meeting EMI regulatory standards.

The new portfolio of stand-alone active EMI filter ICs can sense and cancel common-mode EMI by as much as 30 dB at frequencies between 100 kHz and 3 MHz in single- and three-phase AC power systems. This capability enables designers to reduce the size of chokes by 50%, compared to purely passive filter solutions.

Currently, ST and TI’s solutions prevail in the automotive power supply market, especially TI’s C2000 series chips that are still seen in popular electric models, such as Xpeng P7, and are used by mainstream OBC/DC-DC suppliers such as Shinry Technologies and Zhejiang EV-Tech as the main control chips.

In the recent two years, Chinese main control chip suppliers have stood a chance to replace foreign counterparts with the products made in China. Domestic suppliers have accelerated their layout in the field of main control chips, and are developing from basic OBC and DC-DC applications to all-in-one dynamic domains.

Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report, 2023 highlights the following:

Automotive power supply (technology trends, market size, products & solutions, etc.);On-board charger (OBC) (product structure, technology development trends, market size, structure of main suppliers, price trend, etc.);DC/DC converter (technology trends, market size, competitive landscape, cost structure, main solutions, etc.);Power distribution unit (PDU) (product structure, technology trends, market size, competitive landscape, cost structure, solutions of main suppliers, etc.);Main automotive power supply components (MCU, power supply IC, relay, PFC converter, etc.) (product structure, main suppliers and products, etc.);Main automotive power supply suppliers (product line, technology layout, product price, main customers, market position, etc.).

Key Topics Covered:

1. Automotive Power Supply Industry Development
1.1 Development Status of China New Energy Vehicle Industry
1.2 Overview of New Energy Vehicle Power Supply Products
1.3 Development Trend of Automotive Power Supply Technology
1.4 Automotive Power Supply Market Size and Share
1.5 Automotive Power Supply Cost, Price and Supply Chain
1.6 Automotive Power Supply Suppliers and Product Solutions

2. Automotive On-board Charger (OBC) Technology and Market
2.1 OBC Overview
2.2 Development Trend of OBC Technology
2.3 OBC Market Size and Share
2.4 OBC Cost, Price and Supply Chain
2.5 OBC Suppliers and Product Solutions
2.6 Main Suppliers of New Energy Passenger Car OBC

3. DC/DC Converter Technology and Market
3.1 DC/DC Converter Overview
3.2 Development Trend of DC/DC Technology
3.3 DC/DC Market Size and Share
3.4 DC/DC Cost, Price and Supply Chain
3.5 DC/DC Suppliers and Product Solutions

4. Power Distribution Unit (PDU) Technology and Market
4.1 PDU Product Overview
4.2 Development Trend of PDU Technology
4.3 PDU Market Size and Share
4.4 PDU Cost, Price and Supply Chain
4.5 PDU Suppliers and Product Solutions

5 Research on Vehicle Power Supply Chain (Chips, Components)
5.1 Analysis of Vehicle Power Supply Solution
5.2 Key Technology of Vehicle Power Supply: MCU
5.3 Key Technology of Automotive Power Supply: Power Chip
5.4 Key Technology of Automotive Power Supply: Isolation Chip
5.5 Key Technology of Automotive Power Supply: silicon carbide
5.6 Key Technology of Automotive Power Supply: relay
5.7 Key Technology of Automotive Power Supply PFC converter

6. Automotive Power Supply Providers
6.1 Shenzhen VMAX New Energy Co., Ltd.
6.2 FinDreams Powertrain
6.3 Zhejiang EV-Tech Co., Ltd.
6.4 Tesla (Sanmina Corporation)
6.5 Shinry Technologies
6.6 Tiecheng Information Technology Co., Ltd.
6.7 Zhuhai Enpower Electric Co., Ltd.
6.8 KOSTAL
6.9 Shanghai Huawei Digital Energy Technology Co., Ltd.
6.10 Meta System (Chongqing) (Shenzhen Deren Electronic )
6.11 Valeo

7. Automotive Power Supply Chip Suppliers
7.1 ST
7.2 TI
7.3 NXP
7.4 OnSemiconductor
7.5 ChipON
7.6 SemiDrive
7.7 Silergy

For more information about this report visit https://www.researchandmarkets.com/r/xer5pl

About ResearchAndMarkets.com

ResearchAndMarkets.com is the world’s leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.

Media Contact:

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com 

For E.S.T Office Hours Call +1-917-300-0470
For U.S./CAN Toll Free Call +1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716

Logo: https://mma.prnewswire.com/media/539438/Research_and_Markets_Logo.jpg

 

View original content:https://www.prnewswire.com/news-releases/china-automotive-power-supply-obcdcdcpdu-and-integrated-circuits-ic-industry-report-2023-featuring-11-automotive-power-supply-providers-and-7-automotive-power-supply-chip-suppliers-302063229.html

SOURCE Research and Markets

Related Topics:
Continue Reading
Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *

Technology

DomaCom Appoints Giuseppe Porcelli as Chairman and Secures $2 Million Private Placement

Published

14 minutes ago

on

January 10, 2025

By

SYDNEY, Jan. 10, 2025 /PRNewswire/ — DomaCom Limited (ASX:DCL) is pleased to announce two significant developments that will strengthen its leadership and financial position as it advances its fund-first, technology-driven strategy.

Appointment of Giuseppe Porcelli as Non-Executive Chairman

DomaCom has appointed Giuseppe Porcelli as Non-Executive Chairman. Giuseppe is the Founder, Chairman, and CEO of Lakeba Group, a global technology leader renowned for AI-powered, scalable solutions. With extensive expertise in technology-driven investment strategies, his leadership will be instrumental in accelerating DomaCom’s growth, innovation, and investor value creation.

“Giuseppe’s appointment strengthens our leadership team at a pivotal time for DomaCom,” said Darren Younger, CEO of DomaCom. “His experience in driving technological innovation and scaling businesses will support our strategy to enhance investor value and expand our market presence.”

Successful Completion of $2 Million Private Placement

DomaCom has successfully secured a $2 million investment through a private placement from sophisticated investor Martin Groen. The placement involved issuing 142,857,143 fully paid ordinary shares at $0.014 per share, reflecting investor confidence in DomaCom’s strategy and growth potential.

“This investment demonstrates strong confidence in our vision to transform DomaCom into a leading fund-first, technology-driven business,” said Giuseppe Porcelli, Chairman of DomaCom. “The additional option to secure further funding underscores the long-term alignment between DomaCom and our investors. This capital will allow us to accelerate key initiatives, deliver value to our stakeholders, and position the business for sustained growth.”

These developments mark an important step forward in DomaCom’s transformation, reinforcing its commitment to technological innovation, financial growth, and enhanced investor value.

Contact person: Darren Younger, DomaCom CEO
Darren.younger@domacom.com.au 

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/domacom-appoints-giuseppe-porcelli-as-chairman-and-secures-2-million-private-placement-302347645.html

SOURCE DomaCom Limited

Continue Reading

Technology

GlocalMe Unveils New Brand Identity and Cutting-Edge Innovations at CES 2025

Published

14 minutes ago

on

January 10, 2025

By

LAS VEGAS, Jan. 10, 2025 /PRNewswire/ — GlocalMe, a global leader in mobile data connectivity under uCloudlink (NASDAQ: UCL), is proud to announce its participation in CES 2025, the world’s largest technology trade show. This year marks a significant milestone for GlocalMe as it unveils its newly refreshed brand identity and showcases an impressive lineup of innovative products that are set to redefine global connectivity.

With the theme “The Ideal Network of Life,” GlocalMe’s rebranding reflects its dedication to providing seamless, secure, and reliable internet connectivity that feels local, no matter where users are. Powered by its patented Cloud SIM and HyperConn™ technology, the brand emphasizes “Global Connectivity, Local Mindedness,” delivering a borderless yet personalized connection experience for modern digital lifestyles.

“Our new brand identity represents a transformative step in our journey to empower users with effortless and reliable global connectivity,” said Chaohui Chen, CEO of uCloudlink. “At CES 2025, we are thrilled to showcase how our innovative solutions bring the world closer together, delivering technology that feels personal and local, even in a globalized world.”

Spotlight on the GlocalMe Life Series

A major highlight of GlocalMe’s CES 2025 showcase is the GlocalMe Life Series, a collection of advanced products designed to provide secure and convenient connectivity for daily and travel use. With a focus on user convenience and peace of mind, the Life Series empowers users to stay connected effortlessly.

At CES 2025, GlocalMe will pre-launch three new additions to the Life Series:

GPet: The second generation of GlocalMe’s smart global pet tracker, featuring unique 6-tech positioning technologies to ensure the safety and location tracking of pets worldwide. New features, including ‘AI Wellness’ and ‘Pet Interaction,’ will enhance pet health monitoring and strengthen the bond between pets and their owners.UniCord S and UniCord P: Upgraded versions of the UniCord, designed specifically for drivers and remote workers. These devices offer advanced tracking features and provide secure and seamless connectivity during commutes or road trips. The UniCord P boasts upgraded mobile internet specifications, delivering a network experience comparable to a Wi-Fi hotspot.

These new products join the existing Life Series, which includes:

UniCord: The world’s first 3-in-1 multi-functional USB cable, which has been honored with the “CES Breakthrough Award 2025” by Android Authority for its innovative design and functionality.RoamPlug: The world’s only travel adapter with a built-in 4G mobile hotspot.KeyTracker: A global intelligent tracker featuring 6-tech positioning to secure and locate personal belongings with precision.

Introducing HyperConn™ Technology: Seamless Connectivity Redefined

GlocalMe will also debut its revolutionary HyperConn™ mobile Wi-Fi hotspot technology at CES 2025, redefining how users stay connected on the move. Leading this innovation is the MeowGo G40 Pro, a HyperConn™-enabled 4G multi-network mobile Wi-Fi hotspot. Designed for road trip families and remote workers, this device leverages AI-powered network switching to provide uninterrupted internet access by seamlessly connecting to multiple 4G carriers and Wi-Fi providers. This ensures reliable connectivity anywhere in the world, no matter where life takes users.

Experience GlocalMe at CES 2025

From January 7 to 10, 2025, GlocalMe will showcase its new brand identity and innovative product lineup at booth LVCC North Hall #8211. Attendees are invited to experience firsthand how GlocalMe is redefining global connectivity through its cutting-edge products and advanced technologies.

All pre-launched products from CES will be officially available by the end of the first quarter of 2025.

About GlocalMe

GlocalMe is a digital lifestyle brand under Nasdaq-listed technology company uCloudlink (NASDAQ: UCL). With its mission to enable people to ‘Connect and Share without Limitations’, uCloudlink is a leading mobile technology solutions provider that provides a marketplace for mobile data traffic sharing to billions of users in over 200 countries and regions. By using uCloudlink’s patented Cloud SIM technology, mobile users are no longer confined to the service of a single network operator but are opened to a world of connectivity whenever and wherever they are.

For more information, visit www.glocalme.com.

Photo – https://mma.prnewswire.com/media/2595181/GlocalMe.jpg 

View original content:https://www.prnewswire.co.uk/news-releases/glocalme-unveils-new-brand-identity-and-cutting-edge-innovations-at-ces-2025-302347677.html

Continue Reading

Technology

Reap Receives In-Principle Approval for Major Payment Institution License from Monetary Authority of Singapore

Published

1 hour ago

on

January 10, 2025

By

SINGAPORE, Jan. 9, 2025 /PRNewswire/ — Reap, a leading payment technology provider, is thrilled to announce today that it has received an In-Principle Approval (IPA) from the Monetary Authority of Singapore (MAS) for its application of the Major Payment Institution (MPI) License for its Singapore entity, Reap Singapore.

Obtaining the IPA marks a significant milestone for Reap. Reap is committed to regulatory excellence while continuously enhancing its capabilities and presence in Singapore and the broader Asia Pacific region. While the IPA marks a critical step forward, Reap Singapore remains steadfast in meeting the required conditions for the MPI License. Reap is equally committed to dedicating the necessary resources to support and assist Reap Singapore in achieving this goal. Together, Reap and Reap Singapore will continue to refine its compliance standards and beyond, ensuring it delivers enhanced value and trusted solutions to Singapore and the broader APAC customers.

“At Reap, compliance has always been paramount, not only to safeguard our users but also as a fundamental pillar for growth. Receiving this IPA from the MAS, a globally renowned financial regulator, is incredibly motivating and will be a key driver of secure growth in the region. It fuels our enthusiasm to continue collaborating closely with regulatory bodies to shape a secure and efficient money movement across the region. Reap is also committed to building a strong payment service.” stated Kevin Kang, Co-Founder of Reap.

Singapore is integral to Reap’s mission of enhancing global money movement. Its high regulatory standards and commitment to foster sustainable innovation align seamlessly with Reap’s vision for the future of payment services. This alignment empowers Reap to drive secure and efficient financial flows while delivering exceptional value to its clients and partners.

About Reap

Reap group is a leading global payment technology provider that enables financial connectivity and access for businesses worldwide. By bridging disparate economies, merging technological divides, and connecting key financial players, we are transforming the financial landscape into a more interconnected and interoperable space for efficient money movement.

With corporate cards, payout solutions, and expense management tools, we streamline financial operations and empower businesses to scale. Our APIs enable businesses to embed finance into their own products and services, from issuing Visa cards to facilitating cross-border payments.

Founded in 2018 in Hong Kong, Reap has since expanded to a team of over 100 across the globe, including Singapore. Reap is supported by a strong network of investors, including Acorn Pacific Ventures, Arcadia Funds, HashKey Capital, Hustle Fund, Fresco Capital, Abacus Ventures, and Payment Asia.

For media enquiries, please contact:

Christine Cheuk
Marketing & PR Manager, Reap
christine@reap.global

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/reap-receives-in-principle-approval-for-major-payment-institution-license-from-monetary-authority-of-singapore-302347620.html

SOURCE Reap

Continue Reading

Trending