Connect with us

Technology

Hybrid Bonding Technology Market to Reach USD 756 Million by 2031, Driven by Demand for AI, 5G, and High-Performance Computing | Valuates Reports

Published

on

BANGALORE, India, April 11, 2025 /PRNewswire/ — Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image Sensor (CIS), NAND, DRAM, High Bandwidth Memory (HBM)).

The Global Market for Hybrid Bonding Technology was valued at USD 164 Million in the year 2024 and is projected to reach a revised size of USD 756 Million by 2031, growing at a CAGR of 24.7% during the forecast period.

Claim Your Free Report: https://reports.valuates.com/request/sample/QYRE-Auto-26A11376/Global_Hybrid_Bonding_Technology_Market 

Major Factors Driving the Growth of Hybrid Bonding Technology Market:

The Hybrid Bonding Technology Market is transitioning from early‑adopter phase to high‑growth mainstream adoption. Capacity announcements, multi‑year equipment backlogs, and expanding design‑win pipelines signal robust double‑digit revenue growth through the forecast horizon. As heterogeneous integration becomes indispensable for AI, 5G, automotive autonomy, and ultra‑high‑resolution imaging, hybrid bonding emerges as the de facto interconnect standard, eclipsing micro‑bump and TSV‑centric approaches. Continued process refinements and cost reductions will open mid‑tier and IoT segments, further enlarging addressable demand. Overall, hybrid bonding stands poised to redefine advanced packaging economics and performance benchmarks, anchoring a vibrant ecosystem of materials, tools, and service providers.

Unlock Insights: View Full Report Now! https://reports.valuates.com/market-reports/QYRE-Auto-26A11376/global-hybrid-bonding-technology

TRENDS INFLUENCING THE GROWTH OF THE HYBRID BONDING TECHNOLOGY MARKET:

Wafer‑to‑wafer hybrid bonding is emerging as a pivotal manufacturing step because it enables full‑surface metal‑oxide interconnects that virtually eliminate the parasitic resistance and capacitance associated with‑silicon vias. By stacking fully processed wafers with nanometer‑level alignment accuracy, manufacturers can co‑integrate logic, memory, photonic, and sensor layers into one monolithic three‑dimensional package, delivering massive bandwidth and lower energy per bit. These measurable system advantages have made wafer‑to‑wafer architectures indispensable for high‑performance computing, mobile processors, and AI accelerators, spurring capacity expansions by foundries and OSATs. Equipment vendors are likewise benefiting, booking orders for plasma activation tools, bonding aligners, and cluster systems. The resulting cycle of demand, investment, and ecosystem maturation propels sustained, robust growth in the Hybrid Bonding Technology Market worldwide today.

Die‑to‑wafer hybrid bonding unlocks heterogeneous integration by allowing known‑good die from disparate process nodes to be placed precisely onto a target wafer, eliminating costly yield penalties linked with full wafer stacking. This pick‑and‑place flexibility lets designers mix advanced logic, high‑density memory, and specialty analog functions inside a single 3D package, tailoring performance while shrinking footprint. The approach is particularly attractive for chiplet architectures powering data‑center GPUs, network switches, and AI accelerators where interposer limitations bottleneck bandwidth. As system companies embrace the chiplet paradigm, demand for die‑to‑wafer processes is skyrocketing, prompting capital spending on bond aligners, plasma cleaners, and metrology. Collaborative standards such as UCIe reinforce ecosystem confidence, amplifying orders. Consequently, die‑to‑wafer adoption expands revenue within the Hybrid Bonding Technology Market.

CMOS Image Sensors (CIS) are driving a share of hybrid bonding demand because the technology dramatically improves pixel‑level interconnect density, enabling smaller pitch, higher resolution, and superior signal‑to‑noise ratios. By hybrid‑bonding the photodiode wafer to a dedicated logic wafer, manufacturers separate light‑sensitive and processing functions, maximizing fill factor while embedding advanced AI engines beneath each pixel. This architecture is essential for smartphone cameras, automotive ADAS modules, security systems, and emerging AR/VR devices that require multi‑megapixel performance without thermal or power penalties. Major CIS foundries in Japan, South Korea, and Taiwan are investing heavily in hybrid bonding lines, negotiating long‑term supply agreements with handset and automotive OEMs. Their outlays translate into expanding tool shipments, bolstering Hybrid Bonding Technology Market growth trajectories.

Data‑center operators and cloud service providers are deploying ever‑larger AI training clusters and exascale supercomputers that crave higher memory bandwidth, lower latency, and reduced power consumption. Traditional 2.5D interposers and wire‑bonded packages cannot keep pace with the throughput requirements of transformer models and graph analytics. Hybrid bonding overcomes these bottlenecks by providing direct copper‑to‑copper interconnects at pitches below ten microns, allowing logic and HBM stacks to exchange terabytes per second while staying within stringent energy budgets. As hyperscalers commit billions to next‑gen accelerators, they push chip suppliers toward aggressive adoption roadmaps, thereby amplifying equipment, material, and service revenues across the Hybrid Bonding Technology ecosystem worldwide. The virtuous demand cycle intensifies competition and innovation momentum further.

Consumers expect thinner smartphones, smartwatches, and augmented reality glasses that deliver desktop‑class functionality without sacrificing battery life. Achieving such compactness requires stacking logic, memory, RF front‑ends, and power management circuits vertically rather than expanding the PCB footprint. Hybrid bonding enables this architecture by allowing fine‑pitch interconnects between heterogeneous wafers and dies, eliminating the height penalties of micro‑bumps. OEM roadmaps from Silicon Valley to Shenzhen explicitly reference hybrid bonding for next‑generation application processors and camera modules, triggering early production ramps at foundries. Component miniaturization also frees board area for larger batteries and novel sensors, creating additional differentiation. Consequently, handset competition acts as a persistent catalyst that widens the addressable Hybrid Bonding Technology Market, boosting volume shipments.

Automotive OEMs are integrating lidar, radar, high‑resolution cameras, and domain controllers to achieve advanced driver‑assistance and eventual autonomous operation. These sensor arrays generate enormous data streams that must be processed in real‑time under harsh thermal and vibration conditions. Hybrid bonding facilitates compact, ruggedized 3D stacks that combine logic, memory, and sensor dies, improving bandwidth and reducing latency while maintaining reliability. Government safety regulations such as Euro NCAP and China NCAP push adoption of ADAS features, creating predictable, multi‑year demand for high‑performance automotive semiconductors. Tier‑1 suppliers consequently sign capacity reservations with foundries, driving equipment purchases for hybrid bonding lines and reinforcing market growth.

 Initial hybrid bonding lines suffered from particle‑induced voids and alignment errors, but iterative advances in plasma activation chemistry, wafer‑handling robotics, and in‑line inspection have driven dramatic yield gains. Higher yields translate directly into lower cost‑per‑connection, making hybrid bonding economically competitive with micro‑bump solutions at high volumes. OSATs now advertise greater than 99 percent bonding yield for both wafer‑to‑wafer and die‑to‑wafer flows, convincing cautious fabless customers to convert existing 2.5D programs. As unit costs fall, hybrid bonding becomes viable for mid‑range mobile and IoT chips, expanding the addressable market. Continuous process optimization therefore serves as a reinforcing growth driver, unlocking new design‑win opportunities.

Claim Yours Now! https://reports.valuates.com/api/directpaytoken?rcode=QYRE-Auto-26A11376&lic=single-user

HYBRID BONDING TECHNOLOGY MARKET SHARE:

Asia‑Pacific dominates the Hybrid Bonding Technology Market, led by Taiwan’s advanced‑node foundries, South Korea’s memory giants, and Japan’s CMOS image‑sensor specialists. China is rapidly scaling domestic capacity through state‑backed programs, while Southeast Asia’s OSAT clusters in Singapore and Malaysia add assembly breadth. North America follows, buoyed by U.S. logic IDMs and government‑funded packaging pilot lines. Europe leverages research institutes and automotive demand, whereas Israel anchors niche aerospace and defense applications.

Key Companies:

IntelApplied MaterialsHuaweiEV Group (EVG)SUSS MicroTecAdeia

Purchase Regional Report: https://reports.valuates.com/request/regional/QYRE-Auto-26A11376/Global_Hybrid_Bonding_Technology_Market 

SUBSCRIPTION

We have introduced a tailor-made subscription for our customers. Please leave a note in the Comment Section to know about our subscription plans.

DISCOVER MORE INSIGHTS: EXPLORE SIMILAR REPORTS!

–          Hybrid Bonding Equipment Market was valued at USD 123 Million in the year 2023 and is projected to reach a revised size of USD 618 Million by 2030, growing at a CAGR of 24.7% during the forecast period.

–          Wafer Hybrid Bonding Equipment Market was valued at USD 164 Million in the year 2024 and is projected to reach a revised size of USD 756 Million by 2031, growing at a CAGR of 24.7% during the forecast period.

–          Wafer Bonding Equipment Market was valued at USD 321 Million in the year 2024 and is projected to reach a revised size of USD 449 Million by 2031, growing at a CAGR of 5.0% during the forecast period.

–          Hybrid Wedge Bonders market was valued at USD 54 Million in 2023 and is anticipated to reach USD 70 Million by 2030, witnessing a CAGR of 3.0% during the forecast period 2024-2030.

–          Chip Bonding Adhesive Market was valued at USD 355 Million in the year 2023 and is projected to reach a revised size of USD 510 Million by 2030, growing at a CAGR of 5.3% during the forecast period.

–          Optical Bonding Service Market

–          Temporary Bonding and Debonding Systems Market

–          Wafer Bond Alignment System Market was valued at USD 249 Million in the year 2023 and is projected to reach a revised size of USD 423 Million by 2030, growing at a CAGR of 7.9% during the forecast period.

–          Die Bonding Materials Market

–          Automotive Glass Bonding Market

–          Bonding Wire for Semiconductor Packaging Market

DISCOVER OUR VISION: VISIT ABOUT US!

Valuates offers in-depth market insights into various industries. Our extensive report repository is constantly updated to meet your changing industry analysis needs.

Our team of market analysts can help you select the best report covering your industry. We understand your niche region-specific requirements and that’s why we offer customization of reports. With our customization in place, you can request for any particular information from a report that meets your market analysis needs.

To achieve a consistent view of the market, data is gathered from various primary and secondary sources, at each step, data triangulation methodologies are applied to reduce deviance and find a consistent view of the market. Each sample we share contains a detailed research methodology employed to generate the report. Please also reach our sales team to get the complete list of our data sources.

GET A FREE QUOTE
Valuates Reports
sales@valuates.com
For U.S. Toll-Free Call 1-(315)-215-3225
WhatsApp: +91-9945648335
Website: https://reports.valuates.com
Blog: https://valuatestrends.blogspot.com/
Pinterest: https://in.pinterest.com/valuatesreports/
Twitter: https://twitter.com/valuatesreports
Facebook: https://www.facebook.com/valuatesreports/
YouTube: https://www.youtube.com/@valuatesreports6753
https://www.facebook.com/valuateskorean
https://www.facebook.com/valuatesspanish
https://www.facebook.com/valuatesjapanese
https://valuatesreportspanish.blogspot.com/
https://valuateskorean.blogspot.com/
https://valuatesgerman.blogspot.com/
https://valuatesreportjapanese.blogspot.com/ 

Logo: https://mma.prnewswire.com/media/1082232/Valuates_Reports_Logo.jpg

 

View original content:https://www.prnewswire.co.uk/news-releases/hybrid-bonding-technology-market-to-reach-usd-756-million-by-2031-driven-by-demand-for-ai-5g-and-high-performance-computing–valuates-reports-302426561.html

Continue Reading
Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *

Technology

Carro brings back award-winning ‘No Drama’ ads to celebrate 10 years of revolutionary car buying and selling services for customers

Published

on

By

Carro brings back ‘No Drama’, their award-winning ad series which parodies drama cliches to highlight its trustworthy, reliable, and transparent practicesThe 2-part campaign will reveal a second film in June Their 2023 ‘No Drama’ campaign garnered more than 38 million views and took home six awards at the YouTube Works Awards Southeast Asia

SINGAPORE, May 19, 2025 /PRNewswire/ — Carro, Asia Pacific’s largest and fastest-growing online used car platform, is celebrating thousands of satisfied customers in Asia Pacific since 10 years of inception, in a new campaign that spotlights their drama-free and seamless car buying and selling experience. A second Hong Kong crime genre ad will be released in June.

 

Produced by Carro’s in-house team and fully shot in South Korea, the first ‘No Drama’ ad takes us back to the Joseon Dynasty where even the king cannot escape conniving tricksters who are trying to persuade him to sell off his trusty ride for a fraction of what it’s worth. How will Carro save the kingdom from ruins?

Carro’s ‘No Drama’ series first launched in 2023 in the form of 3 short films that tapped into typical drama cliches to juxtapose the drama-free nature of buying a Carro Certified car that is As Good As New. The campaign went viral with more than 38 million views in total, and earned Carro six awards at the YouTube Works Awards Southeast Asia, including the Overall Winner for “The Big Bang Southeast Asia” category.

Carro Chief Marketing Officer Katherine Teo says, We’ve heard what our customers have said over the last 10 years: that selling their car can be stressful, complicated and long drawn. That’s why we keep our processes transparent and stress-free, and all the drama they see will only be from our ads – no matter whether they’re selling to us or buying a Carro Certified car that is As Good As New. Comedy remains a great medium for us to tell our story and we are so excited to be able to deliver our message in a manner that is entertaining and fresh.”

Carro offers a 100% transparent and convenient process that allows customers to begin their car-selling journey online at carro.co. In markets like Hong Kong and Malaysia, customers don’t even have to leave their home as Carro staff take the inspection and quotation processes right to their homes.

“At Carro, we take pride in setting a new standard of transparency and trust in the used car industry. Our commitment to providing 100% clear quotations and straightforward processes ensures that our customers feel confident and cared for at every step, even if it means appearing at their doorstep,” says Carro Chief Operating Officer Chua Zi Yong. “With the understanding that every market is unique, we are deeply committed to delivering the Carro experience in a way that is not only convenient and worry-free, but also truly resonates with what our customers value and need.”

Since its founding in 2015, Carro has been building its proprietary technologies and tapping into AI solutions to revolutionise the car ownership experience. Carro has grown from a Singaporean used car marketplace to Asia Pacific’s No. 1 used car online marketplace spanning 7 markets, complete with a strong in-house ecosystem that includes financing options, insurance offerings and aftersales services. The company also started selling brand new cars in Singapore, with plans to roll out this product line in other selected markets.

The ad is running in Singapore, Malaysia, Indonesia, Japan and Hong Kong. Look forward to No Drama Part 2 in June 2025, and head over to carro.co for all your car needs.

About Carro

Founded in 2015, Carro is Asia Pacific’s largest online used car marketplace. By offering a trustworthy and transparent experience, Carro transforms the traditional way of buying and selling cars through proprietary pricing algorithms, AI-enabled capabilities, and innovative technological solutions. As of March 2025, Carro has started selling Brand New cars in Singapore.

Headquartered in Singapore, the unicorn startup has raised over S$700 million from Softbank Vision Fund and several sovereign funds. It recorded its best ever full-year positive EBITDA of S$43 million in FY2024. Together with its subsidiaries and business lines, Carro is supported by more than 5,000 employees across Asia Pacific:

Carro, Asia Pacific’s largest online used marketplace with a strong key presence Singapore, Malaysia, Indonesia and Thailand, and a recent expansion into Japan, Taiwan, and Hong KongCarro Care Powered by Jardine & Cycle, Carro’s in-house refurbishment and after-sales servicing capabilitiesGenie Financial Services, a next-generation fintech automotive financing provider in Singapore, Malaysia, Indonesia and ThailandMPM Rent, leading mobility solutions company in Indonesia specialising in leasing / fleet financing transportation servicesInnorithm, a next-generation fleet management solutions company leveraging state-of-the art IoT and machine learningKaidee, Thailand’s largest online shopping and classifieds platform

For more information, please visit: www.carro.co.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/carro-brings-back-award-winning-no-drama-ads-to-celebrate-10-years-of-revolutionary-car-buying-and-selling-services-for-customers-302458539.html

SOURCE Carro

Continue Reading

Technology

Akamai Cloud Helps Eliminate Egress Costs for IRIAM

Published

on

By

Keeping real-time performance while lowering infrastructure costs

TOKYO, May 19, 2025 /PRNewswire/ — Akamai Technologies GK has succeeded in reducing the outbound communication costs (egress costs) for the streaming servers of IRIAM Inc. to almost zero through its cloud service, Akamai Cloud. The move to Akamai Cloud has also contributed to reducing the overall cost of the streaming servers from one-third to less than one-tenth of the total cost of the cloud infrastructure.

IRIAM’s key feature is its community-oriented structure, with close engagement between live streamers (who stream their content using the live-streaming platform) and listeners. To create streams that simulate talking face-to-face, IRIAM created a communication environment that prioritizes real-time performance and minimizes communication lag as much as possible. IRIAM aims to constrain lag to 0.1 seconds, and has independently developed and operates a communication method called the motion-live method.

As the number of users increases and the business grows, however, IRIAM’s network costs are increasing. Network costs accounted for more than one-third of the cost of using cloud infrastructure. These network costs were becoming an issue, and after Akamai started offering cloud services, IRIAM reviewed the Akamai Cloud offerings, and realized that Akamai was able to resolve the issue.

The result of migrating streaming servers to the Akamai Cloud that was most appreciated by IRIAM was the cost savings from Akamai’s proprietary pricing structure, which includes network usage fees as part of the server instance usage fees.

For example, an entry-class “Shared 4 GB” instance has no network transfer charge for up to 2 terabytes. In IRIAM’s case, outbound communication per server is limited to staying within 2 terabytes, so virtually all streaming servers can be operated with the only real cost being the server instance. Even if the limit is exceeded, the extra cost is extremely low, at US$0.005 per 1 GB (as of April 2025).

The amount of network traffic used on the previous cloud was 200 terabytes per month, costing hundreds of thousands of dollars a year. Moving to Akamai Cloud has removed these costs from IRIAM’s fees. Since then, network traffic has increased to approximately 300 terabytes per month as IRIAM’s services have grown, but all traffic still operates within the free quota that comes with each streaming service instance.

After the migration, the network costs as part of the entire infrastructure were reduced from one-third to almost zero, and IRIAM’s streaming server usage fees were reduced by approximately 50% on top of that.

In addition to the cost savings, IRIAM also highly praised the ease of migration and the service stability.

Akamai Cloud also supports API management, allowing the migration to be completed by simply switching the streaming server to the Akamai Cloud while maintaining the existing virtual machine management mechanism as is. CPU and memory utilization is stable and transmission errors on the network are rarely observed.    

IRIAM launched its service in the United States in November 2024. The attentive support and the fast response times are attractive features of the service, and its stability and reliability, coupled with the ease of global deployment, make it a great help for IRIAM’s future business developments in the United States.

Hirokazu Higuma, Managing Director of Akamai, said, “We’re pleased that IRIAM Inc., who have created a new culture on the internet, has adopted Akamai Cloud. We will continue to support IRIAM’s further business growth, starting with their global expansion. Akamai serves its customers more by delivering ever faster, safer, and more stable internet solutions, and by empowering and safeguarding people’s online lives.”

Read the Akamai Cloud product brief to learn more.

About Akamai
Akamai is the cybersecurity and cloud computing company that powers and protects business online. Our market-leading security solutions, superior threat intelligence, and global operations team provide defense in depth to safeguard enterprise data and applications everywhere. Akamai’s full-stack cloud computing solutions deliver performance and affordability on the world’s most distributed platform. Global enterprises trust Akamai to provide the industry-leading reliability, scale, and expertise they need to grow their business with confidence. Learn more at akamai.com and akamai.com/blog, or follow Akamai Technologies on X and LinkedIn.

CONTACT: Akamai PR, akamaiPR@akamai.com 

View original content:https://www.prnewswire.com/apac/news-releases/akamai-cloud-helps-eliminate-egress-costs-for-iriam-302458602.html

SOURCE Akamai Technologies, Inc.

Continue Reading

Technology

AnX Robotica Unveils NaviCam XS, NaviCam XST, and ESView 3.0 at DDW 2025 to Exceptional Industry Response

Published

on

By

PLANO, Texas, May 19, 2025 /PRNewswire/ — AnX Robotica, a leader in robotic capsule endoscopy and advanced GI diagnostics, proudly announced the successful launch of NaviCam XS, NaviCam XST, and ESView 3.0 during Digestive Disease Week (DDW) 2025. The unveiling drew exceptional interest, with clinicians, researchers, and industry professionals visiting the AnX Robotica booth to witness the next evolution in GI visualization technology.

AnX Robotica Showcases Breakthrough GI Technologies at DDW 2025

NaviCam XS, the latest addition to the NaviCam platform, introduces a capsule that is 44% smaller by volume than standard small bowel capsules, designed for enhanced patient comfort and easier ingestion without compromising on image quality or diagnostic reliability. This next-generation capsule further advances the possibilities of capsule endoscopy.

Alongside NaviCam XS, NaviCam XST made its debut, offering real-time esophageal visualization through a tethered capsule design. With ESView RT Display, clinicians can seamlessly navigate the esophagus without the need for sedation, providing an ideal solution for evaluating conditions such as reflux, and esophageal varices in real-time.

AnX Robotica also showcased ESView 3.0, the most advanced version of its software platform to date. With an intuitive interface, enhanced image clarity, and streamlined workflow, ESView 3.0 allows for faster interpretation, real-time annotation, and seamless report generation—enabling physicians to optimize diagnostic efficiency and patient outcomes.

“The response at DDW 2025 has been overwhelmingly positive,” said Stu Wildhorn, Vice President of Marketing and Product Management at AnX Robotica. “The enthusiasm from clinicians around NaviCam XS, XST, and ESView 3.0 underscores the market’s demand for non-invasive, high-resolution GI visualization. These innovations are not just advancing technology; they are setting a new standard for patient care.”

The high-traffic booth at DDW served as a launchpad for these technologies, with live demonstrations, hands-on sessions, and presentations that highlighted the precision, ease of use, and clinical impact of the new products. Attendees expressed strong interest in how these solutions can redefine both diagnostic efficiency and patient experience.

AnX Robotica remains committed to pushing the boundaries of capsule endoscopy and GI diagnostics, adding to its growing portfolio, which includes NaviCam SB with ProScan™, MotiliCap, NaviCam Colon*, IntraMarX, and VibraBot.

*Colon Capsule is not available in the United States

View original content to download multimedia:https://www.prnewswire.com/news-releases/anx-robotica-unveils-navicam-xs-navicam-xst-and-esview-3-0-at-ddw-2025-to-exceptional-industry-response-302457084.html

SOURCE AnX Robotica

Continue Reading

Trending