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Semiconductor Advanced Packaging Market size to increase by USD 29.33 Billion between 2024 to 2029, Market Segmentation by Device, Technology, Geography , Technavio

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NEW YORK, Jan. 6, 2025 /PRNewswire/ — The global semiconductor advanced packaging market size is estimated to grow by USD 29.33 billion from 2025 to 2029, according to Technavio. The market is estimated to grow at a CAGR of over 9.8% during the forecast period. The report provides a comprehensive forecast of key segments below- 

Segmentation Overview

Device 1.1 Analog and mixed ICs1.2 MEMS and sensors1.3 Logic and memory devices1.4 Wireless connectivity devices1.5 CMOS image sensorsTechnology 2.1 Flip chip2.2 FI WLP2.3 2.5D/3D2.4 FO WLPGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa

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1.1 Fastest growing segment:

The Semiconductor Advanced Packaging Market experiences steady growth due to the increasing demand for modern electronic components with enhanced performance and functionality. Advanced packaging solutions, such as Flip-Chip, Embedded-Die, Fan-Out WLP, and FO WLP, are essential for the proliferation of Analog and Mixed ICs in communication, consumer electronics, automotive, and other industries. These packaging types address the challenges of interconnection lengths, signal delays, and high-speed applications, including 5G technology, interactive gaming elements, and high-frequency applications. Advanced packaging also supports miniaturization of devices, enabling the integration of RFID, MEMS, Power devices, AI, Machine Learning, and Deep Learning in various sectors, including the Industrial sector. Chip packaging innovations, such as Thin Wafers and Wafer-Level Packaging (WLP), are crucial for semiconductor IC manufacturing, enabling the production of advanced components for various applications.

Analyst Review

The Semiconductor Advanced Packaging Market is experiencing significant growth due to the increasing demand for compact, high-performance, and high-speed technologies in various sectors. Key technologies driving this market include Flip-chip CSP (Chip Scale Packaging), Wafer-level CSP (Chip Scale Packaging), and Fan-Out WLP (Wafer-Level Packaging). These advanced packaging solutions enable miniaturization, enhanced reliability, and improved thermal management for power devices and computing components. The IoT (Internet of Things) and AI (Artificial Intelligence) technologies, including Machine Learning and Deep Learning, are major contributors to this market’s expansion in the industrial sector. Advanced packaging industry innovations, such as process nodes and energy-efficient solutions, are essential for delivering high computing power and high-speed signals. Power devices and programmable logic controllers also benefit from these advancements, ensuring optimal performance and energy efficiency.

Market Overview

The Semiconductor Advanced Packaging Market is experiencing significant growth due to the increasing demand for miniaturization, higher performance, and lower power consumption in electronic devices. The market consists of various packaging technologies such as Flip Chip, Wafer Level Packaging, and 3D Packaging. These technologies enable semiconductor devices to be more compact, efficient, and reliable. The market is driven by the consumer electronics industry, automotive, and industrial sectors. The use of advanced packaging in applications like AI, IoT, and 5G is also fueling market growth. Companies like Intel, Samsung, and Micron are major players in the Semiconductor Advanced Packaging Market. The market is expected to continue its upward trend due to the ongoing miniaturization trend and the increasing adoption of advanced technologies in various industries.

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 Key Topics Covered:

1 Executive Summary
 2 Market Landscape
 3 Market Sizing
 4 Historic Market Size
 5 Five Forces Analysis
 6 Market Segmentation
 7 Customer Landscape
 8 Geographic Landscape
 9 Drivers, Challenges, and Trends
10 Venodr Landscape
11 Vendor Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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TOTAL PLAY ANNOUNCES DEBT EXCHANGE OFFER FOR UP TO US$870 MILLION

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—The offer contemplates the exchange of up to US$600 million of Existing Notes and the subscription of up to an additional US$270 million in cash—

 —At the time of launch, holders of more than 50% of the Existing Notes have signed Transaction Support Agreements—

MEXICO CITY, Jan. 7, 2025 /PRNewswire/ — Total Play Telecomunicaciones, S.A.P.I. de C.V. (“Total Play”), Mexico’s leading telecommunications company, which offers internet access, pay TV and telephony services, through one of the largest 100% fiber optic networks in the country, announced today, under the coordination of the investment banks Barclays and Jefferies, the launch of an exchange offer to holders of the US$600 million senior notes due 2028 with an interest rate of 6.375% (the “Existing Notes”) to be exchanged for new Senior Secured Notes due 2032 and with an interest rate of 11.125% (the “New Notes”). 

The exchange offer of the New Notes announced today, considers making the exchange at par, has an amortization schedule with quarterly principal payments between 2029 and 2032, and offers an annual interest rate of 11.125%. The issuance contemplates guarantee of both cash flow and fiber optics network.

The exchange considers that all holders of the Existing Notes, together, must subscribe US$270 million in additional cash1.

At the time of launch, holders of more than 50% of the Existing Notes—Cerberus Capital Management, L.P., Afore Azteca, Aviva Investors Global Services, LTD (UK) and Amundi Asset Management U.S. Inc., among others—have signed Transaction Support Agreements and commit to subscribe their respective pro rata additional share of the new notes as outlined in the exchange offer.  The company’s improved financial prospects, increased free cash flow generation and important market share were cited as reasons for recent credit rating upgrades granted by Moody’s and Fitch.  The exchange will further improve Total Play’s liquidity profile and extend its debt maturities.

With this operation, the company demonstrates its flexibility and financial discipline that have generated operational efficiency and exceptional results, which give it the ability to access sophisticated long-term financial markets.

The company believes that, together with its increasing cash flow generation, the exchange results in a business plan – for the short and medium terms – that is fully funded for Total Play. In this context, the company’s management will focus on driving value creation through its operations with increased efficiency, and on generating solid financial results, for the benefit of all its investors.

The New Notes will be listed and registered on the Singapore Exchange (SGX). The terms and conditions of the exchange offer are available in the Exchange Offer and Consent Solicitation Memorandum dated January 7, 2025.

About Total Play

Total Play is a leading Triple Play provider in Mexico that, thanks to the widest direct-to-home fiber optic network in the country, offers entertainment and technologically advanced services with the highest quality and speed in the market. For the latest news and updates about Total Play, visit: www.totalplay.com.mx. Total Play is a Grupo Salinas company (www.gruposalinas.com), a group of dynamic, fast-growing, and technologically advanced companies focused on creating economic value through market innovation and goods and services that improve standards of living; social value to improve community well-being; and environmental value by reducing the negative impact of its business activities. Created by Mexican entrepreneur Ricardo B. Salinas (www.ricardosalinas.com), Grupo Salinas operates as a management development and decision forum for the top leaders of member companies. Each of the Grupo Salinas companies operates independently, with its own management, board of directors, and shareholders. Grupo Salinas has no equity holdings. The group of companies shares a common vision, values, and strategies for achieving rapid growth, superior results, and world-class performance.

Except for historical information, the matters discussed in this press release are concepts about the future that involve risks and uncertainty that may cause actual results to differ materially from those projected. Other risks that may affect Total Play and its subsidiaries are presented in documents sent to the securities authorities.

The New Notes have not been, and will not be registered under the U.S. Securities Act of 1933, as amended, or the securities laws of any State of the United States or other jurisdiction, and the New Notes may not be offered or sold within the United States or to, or for the account of benefit of, U.S. persons (as such term is defined in Regulation S under the U.S. Securities Act of 1933, as amended), except pursuant to an exemption from, or in a transaction not subject to, the registration requirements of the U.S. Securities Act of 1933, as amended, and applicable laws of other jurisdictions.

 Investor Relations:

 

Bruno Rangel

Rolando Villarreal

+ 52 (55) 1720 9167

+ 52 (55) 1720 9167

jrangelk@totalplay.com.mx

rvillarreal@totalplay.com.mx

 

Press Relations:

 

Luciano Pascoe

Tel. +52 (55) 1720 1313 ext. 36553

lpascoe@gruposalinas.com.mx

1 Assuming 100% participation of the holders of the Existing Notes.

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SOURCE Total Play Telecomunicaciones, S.A.P.I. de C.V.

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CAS Holdings Welcomes Patrick McDermott as Chief Revenue Officer and President

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CAS Holdings, Inc. has appointed Patrick McDermott as Chief Revenue Officer and President. With extensive experience from B&R Industrial Automation, he will drive strategic growth and enhance revenue initiatives. McDermott aims to deliver innovative automation solutions while strengthening industry partnerships, supporting the company’s commitment to sustainable growth.

FRANKLIN, Mass., Jan. 7, 2025 /PRNewswire/ — CAS Holdings, Inc., a leader in providing complete automation solutions, is excited to announce the appointment of Patrick McDermott as Chief Revenue Officer and President. With a strong background in the automation industry, McDermott is poised to drive strategic growth and enhance the organization’s revenue-generating initiatives.

Patrick joins CAS Holdings from B&R Industrial Automation, where he served for 18 years and as President of the Americas Region for the past 6 years. His leadership there has been marked by significant achievements in sales and operational strategies. Prior to his tenure at B&R, Patrick held engineering leadership positions with both an OEM machine builder and another industrial automation supplier.

“We are thrilled to welcome Pat to the CAS team,” said Carol Flack, Interim CEO of CAS.  “This strategic appointment underscores our commitment to driving sustainable growth and enhancing revenue across all business segments. With Pat’s leadership and deep industry experience, we are confident in our ability to unlock new opportunities, optimize our sales strategies, and maximize value for our clients and shareholders alike.”

In his new role, McDermott will oversee all revenue generation efforts and collaborate with the team to strengthen partnerships with industry leaders. His strategic vision will guide CAS Holdings in delivering innovative solutions that meet the evolving needs of its customers.

“I am honored to join CAS Holdings at such an exciting time,” said McDermott. “I look forward to working with the talented team here to drive growth through automation solutions and help our customers differentiate through innovation.”

Patrick holds a B.S. and M.S. from the University of Illinois at Urbana-Champaign, specializing in digital control systems.

For more information about CAS Holdings and its services, please visit https://www.casholdings.us/.

About Complete Automation Solutions Holdings

About CAS Holdings, Inc.
Complete Automation Solutions Holdings (CAS Holdings) is dedicated to empowering industrial automation companies, including those in the packaging industry, to achieve optimal efficiency and success. With a diverse portfolio encompassing industrial distribution, panel building and assembly, system integration, and robotics, CAS Holdings provides comprehensive packaging machines and solutions tailored to meet industry needs. The company prioritizes strong partnerships, expert engineering, and innovative solutions, ensuring sustainable practices and continuous improvement. CAS Holdings envisions a future where its transformative automation solutions redefine industry standards and drive growth. Committed to transparency and collaboration, CAS Holdings aims to be the most trusted partner in the automation sector.

Press Contact:

Claudia Chery
508.838.1347
https://i-automation.com/

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SOURCE CAS Holdings, Inc.

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RICTOR Unveils the World’s First Amphibious Passenger Flying Motorcycle, Equipped with Automatic Route Planning and Takeoff/Landing System

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LAS VEGAS, Jan. 7, 2025 /PRNewswire/ — In recent years, the rapid advancement of technology and the growing demand for diversified travel options have brought eVTOL technology into the spotlight of the mobility sector. Amidst this innovation wave, RICTOR has emerged as a formidable player with robust innovation capabilities and a visionary approach to comprehensive air, land, and sea mobility solutions.

RICTOR, as an international brand incubated by KUICKWHEEL, focuses on the smart mobility field and is committed to providing users with more convenient, efficient, and eco-friendly mobility solutions. At the 2025 CES in Las Vegas, RICTOR showcased its all-terrain mobility products, and the launch of the Skyrider X1 flying motorcycle attracted widespread attention from global audiences, becoming the star exhibit of the show.

Skyrider X1: Redefining “Future Mobility”

The Skyrider X1, RICTOR’s latest breakthrough in the eVTOL field, elevates the concept of “future mobility” to unprecedented heights. RICTOR envisions a near future where personal flight is no longer an unreachable dream but an accessible reality.

This flying motorcycle represents a revolutionary leap in passenger aviation. Designed as an amphibious vehicle, it seamlessly combines land and air functionality, offering users the ultimate freedom in driving experiences. Its multi-functional personal vehicle design features:

4-axis, 8-propeller system for enhanced stability.Carbon fiber composite and aviation-grade aluminum materials for unmatched durability and performance.A maximum flight speed of 100 km/h and a flight duration of up to 40 minutes.A 50 kW onboard DC charging station, ensuring worry-free journeys.

Smart Technology for a Seamless Experience

The Skyrider X1 excels in intelligence, featuring:

Automatic route planning to identify optimal flight paths based on set destinations.Real-time weather and environmental adaptability, automatically adjusting altitude, speed, and direction for efficient and safe travel.Automated take-off and landing functions, simplifying the flight process by allowing pilots to set destinations while the vehicle handles the rest.Manual control options for pilots who prefer hands-on operation, including joystick functionality, catering to diverse user preferences.

Safety as a Priority

Safety is paramount in the Skyrider X1’s design. It includes:

Triple-redundant flight control systems, ensuring safe operation even if an engine fails.BMS battery safety protection and an integrated emergency parachute for comprehensive safety assurance.

Accessibility and Affordability

Compared to existing low-altitude flying products, the Skyrider X1 stands out with its lightweight build, enhanced flexibility, and competitive pricing. By balancing high performance with affordability, RICTOR brings the joy of flying within reach for more users.

A Visionary Future

RICTOR is paving the way for a future where flying becomes part of everyday life, empowering individuals to reach new heights and horizons. With the Skyrider X1 as a testament to its innovation, RICTOR continues to rewrite the narrative of smart mobility, proving that the sky is no longer the limit.

RICTOR: Soaring Beyond Horizons, Transforming the Future.

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SOURCE RICTOR

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