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Ventana Announces 2025 Shipments of Veyron V2 Platform with Broad Market Adoption

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Leading Hyperscalers and HPC Customers Embrace the Open, Scalable, Standards-Based Veyron V2 Accelerated Compute Platform to Power AI, Data Center, and Emerging Workloads

CUPERTINO, Calif., Oct. 21, 2024 /PRNewswire/ — Ventana Micro Systems Inc., a leader in high-performance RISC-V platforms, today announced that Veyron V2, its flagship accelerated compute platform, will begin shipping in 2025 to address the growing demands of data centers for AI and domain-specific computing. With commitments from leading hyperscalers and HPC customers in the Americas, Europe, and Asia, Ventana’s Veyron V2 platform is gaining traction as the industry’s most powerful scalable RISC-V compute platform.

To meet with the Ventana team and learn more about Veyron V2 during the RISC-V Summit in Santa Clara, please email info@ventanamicro.com or visit us at our presentations throughout the event.

Veyron V2: A Scalable Platform to Accelerate AI and More

The Veyron V2 platform builds on Ventana’s RISC-V leadership by offering accelerated compute capabilities that empower customers to innovate and accelerate AI and domain-specific applications. With the flexibility to integrate accelerators and third-party IP, Veyron V2 helps organizations achieve unmatched performance and energy efficiency across applications, including data center, automotive, client and intelligent edge.

“Our Veyron V2 platform isn’t just a high-performance CPU—it’s a foundation for scalable, accelerated compute solutions that enable AI and other next-generation workloads,” said Balaji Baktha, Founder and CEO of Ventana.

Ventana at the RISC-V Summit: Where to Find Us

Join Ventana at the RISC-V Summit in Santa Clara from October 21-23 and learn more about our platform solutions at the following sessions:

“Sailing Toward a Single Source of Truth”Speakers: Paul Clarke (Ventana) & Derek Hower (Qualcomm)Date: Mon., Oct. 21Time: 12:00 (noon)Location: Grand Ballroom H (Level 1)”Privileged Software Horizontal Committee Annual Update”Speaker: Anup Patel (Ventana)Date: Mon., Oct. 21Time: 3:00pmLocation: Theater (Level 2)Reception Presentation: “Market Adoption of RISC-V in Data Center and HPC”Balaji Baktha, Founder & CEO, VentanaDate: Tue., Oct. 22Time: 5:30pmLocation: Exhibit Hall A”RISC-V ACPI Is Ready for Server Platforms”Speakers: Sunil V. L. & Himanshu Chauhan (Ventana)Date: Wed., Oct. 23Time: 11:50amLocation: Grand Ballroom H (Level 1)”RISC-V RAS Error-Record Register Interface (RERI)”Speaker: Greg Favor, CTO, VentanaDate: Wed., Oct. 23Time: 2:15pmLocation: Grand Ballroom H (Level 1)Keynote Panel: “The Future of High Performance Computing is RISC-V”Speaker: Travis Lanier, Chief Product Officer, VentanaDate: Wed., Oct. 23Time: 3:55pmLocation: Mission City Ballroom B2-B5 (Level 1)

Platform Features of Veyron V2: Driving Innovation and Scalability

Performance Leadership Across Architectures:
Veyron V2 delivers the highest-performance RISC-V CPU, designed to compete head-to-head with the latest x86 and Arm processors, giving customers an open and flexible alternative for high-performance workloads.RVA23 Compatibility and Advanced Virtualization:
Full support for the RVA23 profile enables cutting-edge hypervisor capabilities to optimize workload management in virtualized environments.AI-Optimized Compute with Vector and Matrix Units:
Equipped with a high-performance vector unit and integrated matrix math acceleration, Veyron V2 is built to excel in AI workloads and other compute-intensive applications.Modular Design for Accelerated Innovation:
Customers can integrate domain-specific acceleration such as AI into the Veyron platform, enabling tailored solutions for data center, automotive, client and intelligent edge applications.Reduced Time-to-Market and Cost:
Leveraging Ventana’s UCIe-based chiplet architecture, Veyron V2 enables up to 75% cost savings and accelerates time-to-market by up to two years for solutions integrating domain specific acceleration.Open and Extensible Ecosystem:
Built on the RISE ecosystem initiative, Veyron V2 platform ensures easy integration of third-party solutions and accelerators, providing unmatched flexibility without vendor lock-in.

About Ventana Micro Systems
Headquartered in Cupertino, Ventana Micro Systems was founded in 2018 to revolutionize the processor market by offering high-performance, extensible and secure compute chiplets based on RISC-V’s open architecture. Ventana is a member of the RISC-V International Board of Directors and its Technical Steering Committee. To learn more about Ventana visit the Web, X, YouTube, and LinkedIn.

All trademarks and product names are the property of their respective companies.

Media Contact:
Gary Bird
831.888.9011
ventana@43pr.com

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SOURCE Ventana Micro

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ZTO to Announce Third Quarter Financial Results of 2024 on November 19, 2024 U.S. Eastern Time

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SHANGHAI, Oct. 22, 2024 /PRNewswire/ — ZTO Express (Cayman) Inc. (NYSE: ZTO and SEHK: 2057) (“ZTO” or the “Company”), a leading and fast-growing express delivery company in China, today announced that it will release its unaudited financial results for the third quarter ended September 30, 2024 after the U.S. market closes on November 19, 2024.

ZTO’s management team will host an earnings conference call at 7:30 P.M. U.S. Eastern Time on Tuesday, November 19, 2024, which is 8:30 A.M. Beijing Time on Wednesday, November 20, 2024.

Dial-in details for the earnings conference call are as follows:

United States:

1-888-317-6003

Hong Kong:

800-963-976

Singapore:   

800-120-5863

Mainland China:

4001-206-115

International:

1-412-317-6061

Passcode:

0501133

A replay of the conference call may be accessible through November 26, 2024 by dialing the following numbers: 

United States:   

1-877-344-7529

International:

1-412-317-0088

Canada:

855-669-9658

Passcode:

1609584

A live and archived webcast of the conference call will also be available at the Company’s investor relations website at http://zto.investorroom.com.

About ZTO Express (Cayman) Inc.

ZTO Express (Cayman) Inc. (NYSE: ZTO and SEHK: 2057) (“ZTO” or the “Company”) is a leading and fast-growing express delivery company in China. ZTO provides express delivery service as well as other value-added logistics services through its extensive and reliable nationwide network coverage in China.

ZTO operates a highly scalable network partner model, which the Company believes is best suited to support the significant growth of e-commerce in China. The Company leverages its network partners to provide pickup and last-mile delivery services, while controlling the mission-critical line-haul transportation and sorting network within the express delivery service value chain.

For more information, please visit http://zto.investorroom.com.

For investor inquiries, please contact:

Investor Relations
Tel: (86) 21 5980 4508
Email: ir@zto.com

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SOURCE ZTO Express (Cayman) Inc.

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Hisense’s Overseas Annual Revenue Surpasses $12.2 Billion USD

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Hisense Group Announces New Goals for the Future at 55th Anniversary

QINGDAO, China, Oct. 22, 2024 /CNW/ — Hisense, a leading brand in global consumer electronics and home appliances, announced a remarkable milestone with its overseas business revenue surpassing $12.2 billion USD in the fiscal year of 2023. This significant achievement was revealed at the Group’s 55th-anniversary celebrations, at which the company also unveiled its ambitious future goals.

Over the past five years, Hisense has significantly expanded its global footprint and achieved breakthroughs in technological foundation. The company’s acquisition of SanDen Corporation and development of AI picture quality chips were catalysts for growth, enabling Hisense to enter new markets and enhance its technological capabilities. As a result, Hisense’s overseas revenue has more than doubled since 2019, while in 2023 Hisense Group’s revenue surpassed $28.7 billion USD.

At the celebration event, Hisense Group Chairman, Mr. Jia Shaoqian, delivered the speech “Faithful as in the Beginning, Creating the Future”, introducing future goals, including becoming a high-quality development model by leveraging industrial clusters; transitioning towards green and low-carbon operations; expanding its global reach through transformation from China-centric to a truly global management model; and establishing a world-class enterprise and global brand.

“We continue to strengthen our core competitiveness in technology and products, leverage strong appeal in cross-cultural integration, and enhance global competitiveness in building a brand matrix,” emphasized Mr. Jia. “Hisense will persist in developing our own brands, aiming for the high-end market in resolutely striving to become world-class!”

With a focus on innovation, Hisense has dedicated approximately 5% of its annual revenue to R&D, with 30% of that investment directed towards pre-research. By prioritizing user needs and customer satisfaction, Hisense ensures that its products and technologies serve users and create value.

Hisense has established a strong global presence with 36 industrial parks and production bases, 30 R&D centers, and 64 overseas offices, forming a “5+1” network covering Europe, the Americas, ASEAN, the Middle East, Africa, and China. To drive growth, Hisense is accelerating its manufacturing footprint globally. In Africa, the company is establishing new production facilities, while in ASEAN and Latin America, Hisense is increasing localizing production and research capabilities. This strategic expansion will enable Hisense to better serve customers and strengthen its global competitive position.

With the vision of building a “Century-old Company”, Hisense is committed to ongoing improvements in corporate governance. By benchmarking against global best practices, fostering board diversity, and implementing a more robust structure, the company aims to enhance its governance level and accelerate its journey towards becoming a world-class enterprise.

About Hisense

Hisense is a leading global home appliance and consumer electronics brand and official partner of the UEFA EURO 2024™. According to Omdia, Hisense ranked No. 2 globally for TV shipments and No. 1 in 100″ TVs in both 2023 and H1 2024. The company has expanded quickly to operate in more than 160 countries and specializes in multi-media goods, home appliances, and intelligent IT information.

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SOURCE Hisense

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HSG Laser Boosts European Presence with Advanced Technologies and Comprehensive Service Network at EuroBLECH 2024

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HANOVER, Germany, Oct. 22, 2024 /PRNewswire/ — At EuroBLECH, HSG Laser, a global leader in metal shaping equipment and automation solutions, unveils its ambitious European growth strategy. This plan encompasses the launch of cutting-edge industry solutions and commitment to active engagement through local events. Aligned with the fair’s theme, “The Power of Productivity”, HSG showcases three advanced cutting technologies designed to elevate productivity and drive growth for its global customers.

Over the past six years, HSG has cultivated a strong presence in the German market, earning customer trust through dedicated local services. The Düsseldorf headquarters, a vital hub for sales, after-sales support, and logistics, features a showroom and well-stocked warehouse with a broad range of products and spare parts for fast delivery.

With an installation base of over 25,000 machines across more than 100 countries, HSG has gained a strong reputation in the global market by offering high-quality equipment at competitive prices.

GV: A Cutting-Edge 2D Laser Cutting Solution

After making its debut in the U.S. market, the GV model gains significant attention at the German fair. Equipped with a powerful 60kW fiber laser, this system can cut materials up to 10cm thick at speeds up to 400% faster than conventional 12kW machines. The GV integrates seamlessly into existing product lines and features an optional automation Tower for material handling, presenting an ideal choice for manufacturers aiming to maximize productivity at low cost.

X: Optimized Laser Cutting Machine for Space Efficiency

HSG also displays the X model, engineered to maximize processing efficiency within a minimal footprint. With a maximum linkage speed of 120m/min and acceleration of 1.5G, the machine delivers outstanding performance in a compact format, ideal for facilities with limited floor space. Safety remains a top priority, as the X model features a fully enclosed structure, optical density glass to shield against laser radiation, and enhanced safety measures to protect operators.

TX: Ultimate Solution for Heavy-Duty Tube Cutting

For industries including steel construction and bridge building, HSG’s TX offers unmatched capabilities. It processes heavy-duty tubes such as round tubes up to 36cm in diameter and 12m in length with precision, supported by HSG’s self-developed 3+1 Twin Chucks clamping system that minimizes waste and enhances cutting accuracy.

By presenting its state-of-the-art cutting technologies, HSG reaffirms its commitment to the European market, and to support its clients in achieving their manufacturing objectives.

View original content:https://www.prnewswire.co.uk/news-releases/hsg-laser-boosts-european-presence-with-advanced-technologies-and-comprehensive-service-network-at-euroblech-2024-302282455.html

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