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Optimizing Amorphous Solid Dispersions: Overcoming Scale-Up Challenges with Next-Generation Technologies, Upcoming Webinar Hosted by Xtalks

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In this free webinar, learn about the challenges in the amorphous solid dispersion (ASD) scale-up process. Attendees will gain insights into the improvements in scalability from next-generation ASD technologies. The featured speakers will share best practices for a successful technology transfer.

TORONTO, Sept. 12, 2024 /PRNewswire-PRWeb/ — As the number of poorly soluble molecules entering the pipeline has increased, the application of amorphous solid dispersions (ASD) development has grown. With the advent of next-generation ASD technologies, like KinetiSol™ Technology, drug developers are setting new standards in scalability, sustainability and performance.

The expert speakers will share their scale-up experiences and perspectives on opportunities to improve technology transfers for ASDs.

Common manufacturing methods for ASDs (e.g., spray drying and hot melt extrusion) can present scale-up challenges such as feed rate and particle size variability between scales; flow and compatibility of the resulting ASD; environmental impact of raw materials during processing and the heterogeneity and stability of the feed solution. These factors can negatively impact product performance and manufacturability.

In this webinar, the expert speakers will share their scale-up experiences and perspectives on opportunities to improve technology transfers for ASDs. They will define best practices for a successful scale-up and a more complete and efficient tech transfer for the commercialization of ASDs.

Register for this webinar today to learn how scale-up challenges faced during the development of ASDs can be overcome.

Join Dr. Justin Keen, PhD, Senior Vice President, Operations, AustinPx; and TJ Highley, MBA, CEO and Board Member, Microsize, for the live webinar on Tuesday, October 1, 2024, at 1pm EDT (10am PDT).

For more information, or to register for this event, visit Optimizing Amorphous Solid Dispersions: Overcoming Scale-Up Challenges with Next-Generation Technologies.

ABOUT XTALKS

Xtalks, powered by Honeycomb Worldwide Inc., is a leading provider of educational webinars and digital content to the global life science, food, healthcare and medical device communities. Every year, thousands of industry practitioners (from pharmaceutical, biotechnology, food, healthcare and medical device companies, private & academic research institutions, healthcare centers, etc.) turn to Xtalks for access to quality content. Xtalks helps professionals stay current with industry developments, regulations and jobs. Xtalks webinars also provide perspectives on key issues from top industry thought leaders and service providers.

To learn more about Xtalks visit https://xtalks.com
For information about hosting a webinar visit https://xtalks.com/why-host-a-webinar/

Media Contact

Vera Kovacevic, Xtalks, +1 (416) 977-6555 x371, vkovacevic@xtalks.com, https://xtalks.com

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Luminys Launches Advanced Suite of Smart Security Products: Pioneering End-to-End Security Solutions

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Introducing AI Network Cameras, LumiCenter, and LumiCloud for a Safer, Smarter, and Fully Integrated Security Ecosystem 

IRVINE, Calif., Nov. 13, 2024 /PRNewswire/ — Luminys Systems Corp (Luminys), a leading provider of smart, sustainable, and connected technology solutions, today announced the launch of its latest suite of security technology products designed for the North American market. The release is scheduled for a public unveiling during the “Luminys Phase 2 Product Launch” webinar on Nov. 15, showcasing an innovative product lineup that meets the modern demands for scalable, intelligent, and compliant security.

The new suite includes an array of network cameras, Network Video Recorders (NVRs), and the LumiCloud platform, a cloud-based Video Surveillance as a Service (VSaaS) solution. These offerings provide businesses with end-to-end security capabilities tailored for smart building and retail applications, reinforcing Luminys’ industry-leading technology and longstanding as a pioneer in the security technology space. The product lineup integrates seamlessly with third-party applications and is compatible with existing Luminys technologies, enabling centralized control through the LumiCloud platform.

Freddy Kuo, chairman of Luminys, commented on the launch: “Our new product suite is designed to empower security professionals with tools for diverse applications to stay ahead in today’s rapidly evolving landscape. By aligning with stringent FCC and NDAA compliance standards and focusing on proactive innovation, Luminys is setting a new standard for comprehensive security solutions in North America.”

Key Product Highlights 

LumiCloud VSaaS Platform: Delivers real-time access, advanced analytics, and scalable cloud storage, enabling centralized management of security systems with customizable alerts and remote monitoring through smartphones and web browsers.LumiCenter Video Management Software (VMS): Seamlessly integrates surveillance cameras and AI-powered analytics, providing real-time object tracking, adaptive bandwidth management, and a fully interactive 3D mapping interface.LumiDeterrent Cameras: Featuring advanced LumiDeterrent technology, these cameras use AI-driven red and blue flashing lights, sound alarms, and full-color video capabilities for enhanced deterrence and 24/7 surveillance, even in low-light conditions.R5 LumiSearch NVR Series: Equipped with AI-driven search functionality, the R5 Series enables rapid identification and tracking across multiple camera feeds and supports long-distance Power over Ethernet (PoE) through Luminys’s proprietary LumiPower technology.

Innovative Technology for Comprehensive Security

This lineup is powered by Luminys’s proprietary technologies, including:

LumiAnalytics for people counting, behavior analysis, and predictive insights.LumiTracking for automatic tracking of people and vehicles, enabling swift responses to potential security issues.LumiLuxSmart for adaptive lighting control, capturing full-color video when motion is detected and switching to infrared in low-activity environments.

Webinar & Availability

This product launch will be live-streamed on Nov. 15 at 10 a.m. PT. Attendees will gain exclusive insights and demonstrations, including the LumiLuxSmart, LumiDeterrent, and LumiColor camera series. To register, please visit here.

Luminys products will be available through certified dealers beginning Nov. 25, 2024, with pricing details and order information accessible via the Luminys MVP portal.

For more information on Luminys’ latest advancements, please visit Luminys Systems Corp.

About Luminys  
Founded in 1984, Luminys Systems Corp. leads the way in helping businesses build smart, sustainable, and secure ecosystems with integrity. Connected solutions and services offer safety, insight, intelligence, and operational efficiency.  

With a focus on ingenuity and exceptional customer support, Luminys delivers future-ready products that adapt to the evolving needs of various industries. As a U.S.-based subsidiary of Foxlink, a global leader in electronics manufacturing, Luminys is trusted by customers and partners worldwide to deliver advanced technology solutions and services shaping a sustainable, smarter future. Learn more at: www.luminyscorp.com.

Media Contact:  
Touchdown PR
386264@email4pr.com

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SOURCE Luminys Systems Corp

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Captello Announces New Partnership with CredsNow to Enhance Lead Capture and Event Engagement Solutions

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Captello has partnered with CredsNow to expand its EventGen platform, integrating on-demand badge design and printing for seamless event management. This collaboration allows organizers to create professional badges before or during events, simplifying branding and lead capture. The partnership aims to improve event efficiency and attendee engagement, enabling organizers to focus more on delivering impactful experiences.

DALLAS, Nov. 13, 2024 /PRNewswire-PRWeb/ — Captello, a leading provider of lead capture and engagement solutions, is thrilled to announce a strategic partnership with CredsNow, a premier cloud design and printing platform specializing in on-demand creation of cards, badges, and passes for events. This collaboration enhances Captello’s existing event management and registration platform, EventGen, integrating seamlessly with CredsNow’s advanced design and printing capabilities to offer a comprehensive solution for event organizers.

“For event organizers, this partnership means less time worrying about logistical complexities and more focus on delivering impactful attendee experiences.” — Candice M. Bakke, Sr. Director of Strategic Global Partnerships at Captello

Through this partnership, CredsNow will integrate its robust card and badge design tools with
EventGen, allowing event organizers to create and print professional-quality badges either
pre-event, via CredsNow service bureau and/or onsite, via CredsNow onsite software. This collaboration not only streamlines the process of badge creation but also enhances the overall event experience by ensuring efficient and secure lead capture, coupled with Captello’s suite of engagement and gamification tools.

“For event organizers, this partnership means less time worrying about logistical complexities and more focus on delivering impactful attendee experiences,” said Candice M. Bakke, Sr. Director of Strategic Global Partnerships at Captello. “By combining our technologies, we empower organizers to seamlessly integrate event registration, engagement, and professional badging.”

CredsNow’s platform offers an intuitive online designer and a straightforward pricing model without minimum order requirements or hidden fees. This ensures that event professionals can design, order, and receive fully branded cards and badges quickly—with next-day shipping options available. They can also use CredsNow’s online platform to activate onsite badge printers and produce the same high quality credentials onsite during an event.

“Captello’s EventGen platform complements our flexible design tools perfectly, offering our clients a turnkey solution for event branding and attendee management,” said Ivan Lazarev, CEO of CredsNow. “This partnership aligns with our mission to provide security and quality in event badging, enhancing the organizer’s ability to maintain control over their branding while leveraging our efficient production capabilities.”

Ryan Schefke, CEO of Captello, also expressed enthusiasm about the partnership’s potential. “Joining forces with CredsNow enables us to broaden our horizons in event technology,” he said. “This is more than a partnership; it’s a pathway to transforming how events manage their engagement and lead capture.”

This strategic alliance is set to redefine customer engagement at events, streamlining the lead capture and branding processes, and setting a new standard in the industry for convenience and efficiency.

About Captello
Captello provides advanced lead capture and engagement solutions, empowering organizations to enhance interactions at events, trade shows, and online. Captello’s tools focus on seamless integration and actionable analytics, helping companies turn event leads into lasting business relationships.

About CredsNow
CredsNow is a cloud-based design and printing platform that enables organizations to create customized cards, badges, and passes on demand. With an intuitive online designer, straightforward pricing, and fast, reliable delivery, CredsNow offers flexible, high-quality branding solutions tailored to businesses of all sizes.

Media Contact

Brad Froese, Captello, 888-399.6430, info@captello.com, www.captello.com

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SOURCE Captello; Captello

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Winbond’s LPDDR4/4X: A Green Solution for the Automotive Industry

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TAICHUNG, Taiwan, Nov. 13, 2024 /PRNewswire/ — Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announces the enhanced LPDDR4/4X DRAM products, specifically designed for the latest generation of automotive applications. These solutions offer significant advancements in power efficiency, performance, and carbon reduction.

The LPDDR4/4X DRAM is the fourth generation of low-power memory solutions, providing power savings without compromising performance. Tailored to meet the rigorous demands of the automotive and industrial sectors, these memory products offer a unique combination of double data rate technology, low power consumption, and design flexibility.

As the automotive industry transitions toward electric and hybrid vehicles, energy efficiency becomes paramount. Winbond’s LPDDR4/4X DRAM solutions contribute to this shift by significantly reducing power consumption, extending battery life, and lower heat generation. Additionally, the technology’s high bandwidth and low latency enable rapid data transfer, supporting the real-time processing needs of modern automotive systems, including advanced driver-assistance systems (ADAS), in-vehicle infotainment, and factory automation systems.

Carbon Reduction Through Innovative Packaging

A key highlight of Winbond’s LPDDR4/4X DRAM is the introduction of the compact 100BGA package, which is 50% smaller than the traditional 200BGA. The reduction in package size directly translates to a 50% decrease in packaging-related carbon emissions, aligning with the industry’s broader sustainability goals.

The 100BGA package is fully backward-compatible with the existing 200BGA Single Die Package (SDP), simplifying the transition for automotive manufacturers. By adjusting the PCBA layout, customers can seamlessly adopt this advanced memory solution without extensive rework, reducing resource consumption.

Enhanced Reliability and Supply Stability

Winbond ensures a stable supply chain for its LPDDR4/4X DRAM products, guaranteeing the long-term support to meet the demands of extended product life cycles in the automotive and industrial industries. Winbond’s commitment to quality and supply chain stability also caters to the needs of consumer markets, particularly in applications such as artificial intelligence (AI), virtual reality (VR), and wearables.

Key Benefits for Automotive Applications:

–  Power Efficiency: LPDDR4/4X DRAM technology lowers power consumption, extending the battery life of electric vehicles (EVs) and reducing heat generation.
–  High Performance: With high bandwidth and low latency, LPDDR4/4X DRAM supports the fast data transfer required for real-time processing in automotive systems.
–  Environmental Sustainability: The 50% reduction in package size from 200BGA to 100BGA leads to a proportional decrease in packaging-related carbon emissions.
–  Design Flexibility: The 100BGA package is backward-compatible with 200BGA, enabling smooth integration and shorter design cycles for automotive manufacturers.
–  Guaranteed Supply: Winbond provides a stable and reliable supply chain, critical for automotive and industrial applications that are characterized by long product life cycles.
–  Internal ECC Circuitry: LPDDR4/4X DRAM is equipped with built-in ECC circuitry to improve single-bit error correction and support superior quality, thereby reducing standby and refresh power consumption while enhancing memory reliability.

“We are excited to offer LPDDR4/4X DRAM solutions that meet the special needs of the automotive sector. By combining power efficiency with superior performance, Winbond’s LPDDR4/4X DRAM products enable electric and hybrid vehicles to meet stringent market demands. At the same time, our innovations in packaging contribute to the industry’s carbon reduction goals, further supporting a sustainable future,” says Winbond.

About Winbond
Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.

Spokesperson
Chih-Chung Chou
Chief Financial Officer
TEL: +886-3-567-8168/+886-987-365-682

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SOURCE Winbond Electronics Corporation

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