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Electronic Paste Market Size to Grow USD 9967.9 Million by 2030 at a CAGR of 9.3% | Valuates Reports

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BANGALORE, India, Sept. 11, 2024 /PRNewswire/ — The global Electronic Paste market is projected to reach USD 9967.9 million by 2030 from an estimated USD 5836.7 million in 2024, at a CAGR of 9.3% during 2024 and 2030.

Electronic Paste Market is Segmented by Type (Conductive Paste, Resistive Paste, Insulation Paste, Others), by Application (Solar Cells, Printed Circuit Board, Touchscreen, LED, Others): Global Opportunity Analysis and Industry Forecast, 2024-2030.

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Major Factors Driving the Growth of Electronic Paste Market:

Due to the growing need for high-performance computing in artificial intelligence applications across all sectors, the market for AI Server GPUs is expanding quickly. GPUs (Graphics Processing Units) are critical for speeding deep learning, neural networks, and large data processing operations as AI workloads become more complicated and data-intensive. The need for AI server GPUs is being further fueled by the growth of edge computing, cloud computing, and AI-driven applications in industries like finance, healthcare, and the automotive industry. In order to satisfy the increasing computing demands of AI servers worldwide, major firms are concentrating on creating GPUs that are both more potent and energy-efficient.

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TRENDS INFLUENCING THE GROWTH OF THE ELECTRONIC PASTE MARKET

In the electronics sector, conductive paste is essential because it ensures electrical contact in a variety of electronic equipment. It is widely used in the production of semiconductors, printed circuit boards (PCBs), sensors, and other components. Better conductivity, thermal stability, and stickiness are required in high-quality conductive paste, which is becoming more and more in demand as electronics become smaller and perform better. The growing use of cutting-edge electronics in sectors including consumer electronics, automotive, and telecommunications is driving up demand for them. The market for electronic paste is anticipated to increase significantly as long as dependable conductive paste is needed, given how the electronics sector develops.

Printed circuit boards, or PCBs, are the structural core that link different parts of almost every electronic device. To provide the required circuits and paths, electronic pastes such as conductive, insulating, and resistive pastes must be applied during PCB fabrication. The need for sophisticated electronic pastes rises in line with the need for higher-density, more complicated PCBs, especially in the automotive, consumer electronics, and telecommunications industries. The market for electronic paste is being driven by the move towards more advanced PCBs, which enable faster speeds and more functionality. Manufacturers are looking for pastes that provide accuracy, dependability, and longevity.

The market for electronic paste is significantly influenced by the solar energy sector, primarily by the use of conductive pastes in the production of solar cells. In order to convert sunlight into electricity, these pastes are employed to form the electrical connections on the surface of solar cells. The rising use of solar power and the global drive towards renewable energy have led to a spike in demand for high-performance conductive pastes. Thin-film technologies and higher-efficiency cell development, among other advancements in solar cell technology, have increased demand for specialty electronic pastes that can improve solar panel durability and efficiency, spurring market expansion.

The market for electronic paste is growing as a result of the growing consumer electronics industry. The need for parts like PCBs, sensors, and displays—all of which depend on electronic pastes—has increased due to the growing popularity of smartphones, tablets, wearable technology, and other electronic devices. In order to fulfill the growing demands of consumers for gadgets with more sophisticated features and improved performance, manufacturers are resorting more and more to premium electronic pastes. More advanced electronic pastes are being developed and adopted as a result of the trend toward miniaturization and the demand for more functionality, which is driving market expansion.

The market for electronic paste is also significantly influenced by the automotive sector, especially in light of the increasing popularity of advanced driver-assistance systems (ADAS) and electric vehicles (EVs). Complex electronic systems, such as high-density PCBs and sensors, are necessary for these technologies, and their production depends on dependable electronic pastes. It is anticipated that the need for electronic pastes with high conductivity, durability, and thermal stability will increase as the automobile sector continues to develop with features like autonomous driving, connectivity, and increased safety. The necessity for sophisticated electronic pastes in automotive applications is further increased by the movement towards greener transportation choices, such as electric vehicles (EVs), which is fueling market expansion.

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ELECTRONIC PASTE MARKET SHARE ANALYSIS

A well-established electronics manufacturing industry and the strong presence of top technological businesses are the main drivers of the electronic paste market in North America. The region’s emphasis on innovation, especially in the automotive, telecommunications, and consumer electronics sectors, creates a sizable need for sophisticated electronic pastes. The industry is further stimulated by the increasing use of renewable energy technology, such solar panels, and electric vehicles (EVs). The government programs supporting green energy and technology developments also play a significant role in the strong expansion of the electronic paste industry in this area.

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Key Players:

ShoeiChemicalIncSumitomo Metal MiningHeraeusChangzhou Fusion New MaterialShandong SinoceraHenkelDKEMGood-ArkGiga Solar MaterialsMitsuboshi BeltingNoritakeShanghai Transcom ScientificFujikura KaseiNippon Chemical IndustrialRuxing Technology

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DISCOVER MORE INSIGHTS: EXPLORE SIMILAR REPORTS!

–  Fine Paste Market

–  The global Emulsion PVC Paste market was valued at USD 2284.4 million in 2023 and is anticipated to reach USD 2974.7 million by 2030, witnessing a CAGR of 3.9% during the forecast period 2024-2030.

–  Solar Electronics Conductive Paste Market

–  The global Lead-Free Solder Paste market was valued at USD 10 million in 2023 and is anticipated to reach USD 16 million by 2030, witnessing a CAGR of 6.5% during the forecast period 2024-2030.

–  Thermally Conductive Grease and Paste Market

–  Unlead Solder Paste Market

–  The global Conductive Silver Paste market was valued at USD 5396 million in 2023 and is anticipated to reach USD 7120.5 million by 2030, witnessing a CAGR of 4.1% during the forecast period 2024-2030.

–  The global Pressure-less Silver Sintering Paste market was valued at USD 93 million in 2023 and is anticipated to reach USD 127 million by 2030, witnessing a CAGR of 4.6% during the forecast period 2024-2030.

–  Anti-paste Paint Market

–  Functional Water-Based Printing Paste Market

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Our team of market analysts can help you select the best report covering your industry. We understand your niche region-specific requirements and that’s why we offer customization of reports. With our customization in place, you can request for any particular information from a report that meets your market analysis needs.

To achieve a consistent view of the market, data is gathered from various primary and secondary sources, at each step, data triangulation methodologies are applied to reduce deviance and find a consistent view of the market. Each sample we share contains a detailed research methodology employed to generate the report. Please also reach our sales team to get the complete list of our data sources.

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DomaCom Appoints Giuseppe Porcelli as Chairman and Secures $2 Million Private Placement

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SYDNEY, Jan. 10, 2025 /PRNewswire/ — DomaCom Limited (ASX:DCL) is pleased to announce two significant developments that will strengthen its leadership and financial position as it advances its fund-first, technology-driven strategy.

Appointment of Giuseppe Porcelli as Non-Executive Chairman

DomaCom has appointed Giuseppe Porcelli as Non-Executive Chairman. Giuseppe is the Founder, Chairman, and CEO of Lakeba Group, a global technology leader renowned for AI-powered, scalable solutions. With extensive expertise in technology-driven investment strategies, his leadership will be instrumental in accelerating DomaCom’s growth, innovation, and investor value creation.

“Giuseppe’s appointment strengthens our leadership team at a pivotal time for DomaCom,” said Darren Younger, CEO of DomaCom. “His experience in driving technological innovation and scaling businesses will support our strategy to enhance investor value and expand our market presence.”

Successful Completion of $2 Million Private Placement

DomaCom has successfully secured a $2 million investment through a private placement from sophisticated investor Martin Groen. The placement involved issuing 142,857,143 fully paid ordinary shares at $0.014 per share, reflecting investor confidence in DomaCom’s strategy and growth potential.

“This investment demonstrates strong confidence in our vision to transform DomaCom into a leading fund-first, technology-driven business,” said Giuseppe Porcelli, Chairman of DomaCom. “The additional option to secure further funding underscores the long-term alignment between DomaCom and our investors. This capital will allow us to accelerate key initiatives, deliver value to our stakeholders, and position the business for sustained growth.”

These developments mark an important step forward in DomaCom’s transformation, reinforcing its commitment to technological innovation, financial growth, and enhanced investor value.

Contact person: Darren Younger, DomaCom CEO
Darren.younger@domacom.com.au 

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SOURCE DomaCom Limited

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GlocalMe Unveils New Brand Identity and Cutting-Edge Innovations at CES 2025

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LAS VEGAS, Jan. 10, 2025 /PRNewswire/ — GlocalMe, a global leader in mobile data connectivity under uCloudlink (NASDAQ: UCL), is proud to announce its participation in CES 2025, the world’s largest technology trade show. This year marks a significant milestone for GlocalMe as it unveils its newly refreshed brand identity and showcases an impressive lineup of innovative products that are set to redefine global connectivity.

With the theme “The Ideal Network of Life,” GlocalMe’s rebranding reflects its dedication to providing seamless, secure, and reliable internet connectivity that feels local, no matter where users are. Powered by its patented Cloud SIM and HyperConn™ technology, the brand emphasizes “Global Connectivity, Local Mindedness,” delivering a borderless yet personalized connection experience for modern digital lifestyles.

“Our new brand identity represents a transformative step in our journey to empower users with effortless and reliable global connectivity,” said Chaohui Chen, CEO of uCloudlink. “At CES 2025, we are thrilled to showcase how our innovative solutions bring the world closer together, delivering technology that feels personal and local, even in a globalized world.”

Spotlight on the GlocalMe Life Series

A major highlight of GlocalMe’s CES 2025 showcase is the GlocalMe Life Series, a collection of advanced products designed to provide secure and convenient connectivity for daily and travel use. With a focus on user convenience and peace of mind, the Life Series empowers users to stay connected effortlessly.

At CES 2025, GlocalMe will pre-launch three new additions to the Life Series:

GPet: The second generation of GlocalMe’s smart global pet tracker, featuring unique 6-tech positioning technologies to ensure the safety and location tracking of pets worldwide. New features, including ‘AI Wellness’ and ‘Pet Interaction,’ will enhance pet health monitoring and strengthen the bond between pets and their owners.UniCord S and UniCord P: Upgraded versions of the UniCord, designed specifically for drivers and remote workers. These devices offer advanced tracking features and provide secure and seamless connectivity during commutes or road trips. The UniCord P boasts upgraded mobile internet specifications, delivering a network experience comparable to a Wi-Fi hotspot.

These new products join the existing Life Series, which includes:

UniCord: The world’s first 3-in-1 multi-functional USB cable, which has been honored with the “CES Breakthrough Award 2025” by Android Authority for its innovative design and functionality.RoamPlug: The world’s only travel adapter with a built-in 4G mobile hotspot.KeyTracker: A global intelligent tracker featuring 6-tech positioning to secure and locate personal belongings with precision.

Introducing HyperConn™ Technology: Seamless Connectivity Redefined

GlocalMe will also debut its revolutionary HyperConn™ mobile Wi-Fi hotspot technology at CES 2025, redefining how users stay connected on the move. Leading this innovation is the MeowGo G40 Pro, a HyperConn™-enabled 4G multi-network mobile Wi-Fi hotspot. Designed for road trip families and remote workers, this device leverages AI-powered network switching to provide uninterrupted internet access by seamlessly connecting to multiple 4G carriers and Wi-Fi providers. This ensures reliable connectivity anywhere in the world, no matter where life takes users.

Experience GlocalMe at CES 2025

From January 7 to 10, 2025, GlocalMe will showcase its new brand identity and innovative product lineup at booth LVCC North Hall #8211. Attendees are invited to experience firsthand how GlocalMe is redefining global connectivity through its cutting-edge products and advanced technologies.

All pre-launched products from CES will be officially available by the end of the first quarter of 2025.

About GlocalMe

GlocalMe is a digital lifestyle brand under Nasdaq-listed technology company uCloudlink (NASDAQ: UCL). With its mission to enable people to ‘Connect and Share without Limitations’, uCloudlink is a leading mobile technology solutions provider that provides a marketplace for mobile data traffic sharing to billions of users in over 200 countries and regions. By using uCloudlink’s patented Cloud SIM technology, mobile users are no longer confined to the service of a single network operator but are opened to a world of connectivity whenever and wherever they are.

For more information, visit www.glocalme.com.

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Reap Receives In-Principle Approval for Major Payment Institution License from Monetary Authority of Singapore

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SINGAPORE, Jan. 9, 2025 /PRNewswire/ — Reap, a leading payment technology provider, is thrilled to announce today that it has received an In-Principle Approval (IPA) from the Monetary Authority of Singapore (MAS) for its application of the Major Payment Institution (MPI) License for its Singapore entity, Reap Singapore.

Obtaining the IPA marks a significant milestone for Reap. Reap is committed to regulatory excellence while continuously enhancing its capabilities and presence in Singapore and the broader Asia Pacific region. While the IPA marks a critical step forward, Reap Singapore remains steadfast in meeting the required conditions for the MPI License. Reap is equally committed to dedicating the necessary resources to support and assist Reap Singapore in achieving this goal. Together, Reap and Reap Singapore will continue to refine its compliance standards and beyond, ensuring it delivers enhanced value and trusted solutions to Singapore and the broader APAC customers.

“At Reap, compliance has always been paramount, not only to safeguard our users but also as a fundamental pillar for growth. Receiving this IPA from the MAS, a globally renowned financial regulator, is incredibly motivating and will be a key driver of secure growth in the region. It fuels our enthusiasm to continue collaborating closely with regulatory bodies to shape a secure and efficient money movement across the region. Reap is also committed to building a strong payment service.” stated Kevin Kang, Co-Founder of Reap.

Singapore is integral to Reap’s mission of enhancing global money movement. Its high regulatory standards and commitment to foster sustainable innovation align seamlessly with Reap’s vision for the future of payment services. This alignment empowers Reap to drive secure and efficient financial flows while delivering exceptional value to its clients and partners.

About Reap

Reap group is a leading global payment technology provider that enables financial connectivity and access for businesses worldwide. By bridging disparate economies, merging technological divides, and connecting key financial players, we are transforming the financial landscape into a more interconnected and interoperable space for efficient money movement.

With corporate cards, payout solutions, and expense management tools, we streamline financial operations and empower businesses to scale. Our APIs enable businesses to embed finance into their own products and services, from issuing Visa cards to facilitating cross-border payments.

Founded in 2018 in Hong Kong, Reap has since expanded to a team of over 100 across the globe, including Singapore. Reap is supported by a strong network of investors, including Acorn Pacific Ventures, Arcadia Funds, HashKey Capital, Hustle Fund, Fresco Capital, Abacus Ventures, and Payment Asia.

For media enquiries, please contact:

Christine Cheuk
Marketing & PR Manager, Reap
christine@reap.global

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SOURCE Reap

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