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Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps

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Complete Synopsys 40G UCIe IP Solution Delivers Maximum Bandwidth for Die-to-Die Connectivity in High-Performance AI Data Center Chips

Highlights

Industry’s first complete 40G UCIe IP solution, including controller, PHY, and verification IP, enables fast connectivity between heterogeneous and homogeneous diesSynopsys 40G UCIe PHY IP offers 25% higher bandwidth than the UCIe specification without impact on energy efficiency and silicon footprintIntegrated signal integrity monitors and testability features improve multi-die package reliability and enable in-field monitoring throughout the silicon lifecycleSynopsys 40G UCIe IP is built on a silicon-proven architecture with interoperability success in multiple advanced foundry processes

SUNNYVALE, Calif., Sept. 9, 2024 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced the industry’s first complete UCIe IP solution operating at up to 40 Gbps per pin to address the increased compute performance requirements of the world’s fastest AI data centers. The UCIe interconnect, the de facto standard for die-to-die connectivity, is critical for high-bandwidth, low-latency die-to-die connectivity in multi-die packages, enabling more data to travel efficiently across heterogeneous and homogeneous dies, or chiplets, in today’s AI data center systems. Synopsys’ 40G UCIe IP supports both organic substrate and high-density, advanced packaging technologies to give designers the flexibility to explore the packaging options that best fit their needs. The complete Synopsys 40G UCIe IP solution, including PHY, controller, and verification IP, is a key component of Synopsys’ comprehensive and scalable multi-die solution for fast heterogeneous integration from early architecture exploration to manufacturing. 

“Heterogeneous integration with high-bandwidth die-to-die connectivity gives us the opportunity to deliver new memory chiplets with the efficiency needed for data-intensive AI applications,” said Jongwoo Lee, vice president of the System LSI IP Development Team at Samsung Electronics. “Leveraging Synopsys’ new 40G UCIe IP, we can extend our collaboration to develop industry-leading chiplet solutions for tomorrow’s high-performance data centers.”

“Launching the industry’s first complete 40G UCIe IP solution underscores Synopsys’ continued investment in advancing semiconductor innovation,” said Michael Posner, vice president of IP product management at Synopsys. “Our active contribution to the UCIe consortium has enabled us to deliver a robust UCIe solution that helps our customers successfully develop and optimize their multi-die designs for high-performance AI computing systems.”

Advanced capabilities of the new Synopsys 40G UCIe IP solution include:

Simplified Solution Eases IP Integration: Single reference clock feature simplifies the clocking architecture and optimizes power. For ease of use and integration, the IP speeds-up die-to-die link initialization without the need to load the firmware.Silicon Health Monitoring Enhances Multi-Die Package Reliability: To ensure reliability at the die, die-to-die, and multi-die package levels, Synopsys 40G UCIe IP offers test and silicon lifecycle management (SLM) features. The monitoring, test, and repair IP and integrated signal integrity monitors enable diagnosis and analysis of the multi-die package from in-design to in-field.Successful Ecosystem Interoperability: For on-chip interconnect needs of the latest CPUs and GPUs, Synopsys 40G UCIe IP supports the most popular on-chip interconnect fabrics including AXI, CHI chip-to-chip, streaming, PCI Express, and CXL. For successful interoperability, the IP is compliant with the UCIe 1.1 and 2.0 standards, which Synopsys helps to develop and promote as an active member of the UCIe Consortium.Pre-Verified Design Reference Flow: The combination of Synopsys UCIe IP and Synopsys 3DIC Compiler, a unified exploration-to-signoff platform, is used in Synopsys’ pre-verified design reference flow that includes all the required design collateral such as automated routing flow, interposer studies, and signal integrity analysis.Broad IP Solutions for Multi-Die Designs: In addition to UCIe IP and high-speed SerDes, Synopsys offers HBM3 and 3DIO IP to enable high-capacity memory and 3D packaging.

Availability & Additional Resources

The Synopsys 40G UCIe IP will be available in late 2024 for multiple foundries and processes. 

Web: Synopsys UCIe IP SolutionBlog: Synopsys Introduces Industry’s First 40G UCIe IP Solution to Power High-Performance Multi-Die DesignsBlog: UCIe 2.0 – Setting the Tone for Chiplet Interoperability

About Synopsys
Catalyzing the era of pervasive intelligence, Synopsys, Inc. (Nasdaq: SNPS) delivers trusted and comprehensive silicon to systems design solutions, from electronic design automation to silicon IP and system verification and validation. We partner closely with semiconductor and systems customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com.

Editorial Contact
Kelli Wheeler 
Synopsys, Inc. 
(650) 584-5000
corp-pr@synopsys.com 

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SOURCE Synopsys, Inc.

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For Fourth Year, Everspring Recognized Among Chicago’s Best Places to Work

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January 8, 2025

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Award Recognition Reflects Company’s Continued Momentum, Growth and Innovation in Higher Ed Technology

CHICAGO, Jan. 8, 2025 /PRNewswire/ — Everspring, a rapidly growing force in education technology, today announced its recognition on Built In’s 2025 Best Places to Work Awards, earning a coveted spot on Chicago’s 100 Best Midsize Companies list. This achievement comes at a pivotal moment for Everspring, following the successful launch of its VIA enrollment marketing platform and continued strategic partnerships that enable universities to adapt and thrive in a dynamic higher ed landscape.

“This recognition reflects the extraordinary momentum we’re experiencing at Everspring,” says Beth Hollenberg, CEO of Everspring. “Our team’s innovative spirit and dedication to transforming higher education have created an environment where top talent thrives. As we continue to expand our technology solutions and deepen our university partnerships, this award validates our commitment to fostering a workplace that attracts and retains the industry’s brightest minds.”

The honor arrives as Everspring expands its comprehensive education services with powerful SaaS technology offerings. The company’s recent launch of VIA, its enrollment marketing intelligence platform, exemplifies how Everspring’s growing suite of solutions addresses critical challenges in higher education, from disconnected data to enrollment optimization.

“Being recognized as a Best Place to Work is a testament to these companies’ commitment to building a workplace where individuals and innovation thrive,” says Built In CEO and Founder, Maria Christopoulos Katris. “At Built In, we understand that great companies are powered by great teams, and this achievement showcases their dedication to fostering a culture of growth, inclusivity, and excellence. Congratulations on this well-deserved honor.”

Built In determines the winners of Best Places to Work using company data about compensation and benefits, weighing criteria such as remote and flexible work opportunities, DEI programs, and other people-first cultural offerings that today’s tech professionals value most.

About Built In
Built In is the “always on” recruiting platform that reaches the tech professionals that other leading recruiting platforms don’t. Designed to help companies hire expert tech talent, Built In continuously drives brand awareness with content. Monthly, millions of the industry’s most in-demand global tech professionals visit our site to stay ahead of tech trends and news, learn skills to accelerate their careers, find the right job opportunities and get hired. Thousands of companies, from fast-growing startups to the largest enterprises rely on Built In. www.builtin.com

About Built In’s Best Places to Work
Built In’s annual Best Places to Work program honors companies with the best total rewards packages across the U.S. and in the following tech hubs: Atlanta, Austin, Boston, Chicago, Colorado, Dallas, Houston, Los Angeles, Miami, New York, San Diego, San Francisco, Seattle and Washington DC. Best Places to Work is distinct because its algorithm selects tech companies that build their offerings specifically around what tech professionals value in a workplace. https://employers.builtin.com/best-places-to-work

About Everspring
Everspring is a leading provider of education technology and services solutions for higher education. Our advanced technology, proven marketing approach, and robust faculty support and instructional design services deliver outstanding outcomes for our university partners, powering their success online. Everspring offers a range of full-service turnkey solutions, as well as standalone fee-for-service offerings, and innovative self-service products that enable universities to establish themselves as leaders in the digital delivery of higher education. Based in Chicago, Everspring serves a growing number of colleges and universities nationwide.

Visit www.everspringpartners.com for more information.

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SOURCE Everspring

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HCMF Group Unveils Cutting-Edge Smart Cockpit and Body Mechatronic Systems at CES 2025

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January 8, 2025

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LAS VEGAS, Jan. 8, 2025 /PRNewswire/ — HCMF Group, a global leader in Tier 1 automotive parts and systems, is proud to unveil its groundbreaking advancements in smart cockpit and body mechatronic systems at CES 2025, held from January 7 to January 9. Partnering with industry leaders such as AUO, AGC, Inventec, TMYTEK (TMY Technology Inc.), BenQ Materials, and KINPO GROUP, HCMF is redefining intelligent mobility through transformative innovations and unmatched integration capabilities.

HCMF’s showcase features its integrated vehicle control system, developed with Inventec, which centralizes functionalities onto the front dashboard. This system combines an intuitive user interface, a UWB electronic key, and wireless charging, offering a seamless and futuristic cockpit experience. Also debuting is HCMF’s Micro LED transparent smart window technology, created with AUO and AGC. These high-transparency touch displays are integrated into rear car windows with patented window regulator mechanism, enabling applications such as real-time driving information, AR gaming, personal calendars, and rear-view mirror functions for enhanced convenience and safety.

HCMF’s smart glass solutions, developed with BenQ Materials, deliver privacy and energy efficiency through advanced PDLC 98 black dimming film. These materials block heat and UV rays while providing futuristic aesthetics. Passenger safety takes center stage with the second-generation Child Presence Detection (CPD) system, introduced with TMYTEK. Capable of detecting subtle life signs such as heartbeats and breathing, this system sends real-time alerts to the user’s smartphone, preventing safety risks for children or pets left inside the vehicle.

For rear-seat entertainment, HCMF introduces its foldable 28.6-inch, 32:9 ceiling display featuring JET OPTO’s dual-view single-screen technology. Passengers can view separate content or participate in virtual meetings, redefining in-car leisure and productivity. The company also showcases systems tailored for electric vehicles, such as a front hood automatic opening system and a centralized door control system (DCU) that combines E-latch, radar-based collision avoidance, and automatic opening mechanisms. Additionally, the innovative automatic tailgate system, developed with KINPO GROUP, delivers a user-friendly experience by overcoming traditional design limitations.

Jeffrey Hsi, Chief Innovation Officer of HCMF Group, remarked, “CES 2025 is a pivotal platform for HCMF to showcase its leadership in smart cockpit and body mechatronic systems. We are committed to driving innovation and breakthroughs, advancing automotive technology to deliver safer, more convenient, and enjoyable smart mobility experiences for consumers worldwide.”

HCMF’s participation at CES 2025 underscores its leadership in smart cockpit technologies and collaborative innovation with global partners. From enhancing passenger safety to redefining in-car entertainment and advancing intelligent mobility, HCMF is setting new benchmarks in automotive intelligence and automation. The company remains focused on innovation-driven research and development, delivering future-ready solutions that create value for the global automotive industry and its consumers.

About HCMF Group

HCMF was established in 1961 and as a global automobile Tier 1 system supplier with more than 60 years experience in design and manufacturing. HCMF has around 40 sites globally to provide tailored service to our customers. Our vast knowledge and expertise through years of product experience provide solutions to satisfy our customer needs. We believe strongly in upholding integrity and cooperation to maximize benefits to our customers and partners.

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SOURCE HCMF Group

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DELFI Diagnostics to Participate in J.P. Morgan Healthcare Conference

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7 minutes ago

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January 8, 2025

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Leader in liquid biopsy, cancer screening, and monitoring speaks at largest healthcare investment symposium

BALTIMORE and PALO ALTO, Calif., Jan. 8, 2025 /PRNewswire/ —  DELFI Diagnostics, Inc., developer of accessible blood-based, liquid biopsy tests that deliver a new way to enhance early cancer detection, today announced the company will participate in the upcoming 43rd Annual J.P. Morgan Healthcare Conference in San Francisco.

The company’s management is scheduled to present and participate in a Q&A session on Thursday, January 16, 2025, at 7:30 a.m. PT/10:30 a.m. ET. To learn more about DELFI Diagnostics, visit DELFIDiagnostics.com

About DELFI Diagnostics
DELFI Diagnostics is developing next-generation, blood-based tests that are accurate, accessible, and deliver a new way to help detect cancer. DELFI tests are built to solve the highest-burden population health issues, including in historically underserved demographics, and have the potential to save lives on a global scale. FirstLook Lung, for individuals eligible for lung cancer screening, is our first laboratory-developed screening test and requires a simple blood draw that can be incorporated with routine blood work. The test is based on fragmentomics, the discovery that cancer cells are more chaotic than normal cells and, when they die, leave behind tell-tale patterns and characteristics of cell-free DNA (cfDNA) fragments in the blood. The DELFI platform applies advanced machine-learning technology to whole-genome sequencing data to assess individuals’ cfDNA fragments against populations with and without cancer. FirstLook Lung uses these millions of data points to reliably identify individuals who may have cancer detected through low-dose CT, including early-stage disease, with a negative predictive value of 99.8 percent. This test has not been cleared or approved by the FDA.

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SOURCE DELFI Diagnostics

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