Technology

Die Bonder Equipment Market to Reach $1861.3 Million, Globally, by 2032 at 10.8% CAGR: Allied Market Research

Published

1 month ago

August 19, 2024

The semiconductor equipment industry has witnessed a gradual increase in the proportion of packaging and testing equipment, with the continuous advancement of advanced packaging. Die bonding plays a crucial role in the post-process of semiconductor manufacturing.

WILMINGTON, Del., Aug. 19, 2024 /PRNewswire/ — Allied Market Research published a report, titled, “Die Bonder Equipment Market by Type (Manual die bonder, Semiautomatic Die Bonder and Fully Automatic Die Bonder), Bonding Technique (Epoxy, Eutectic, UV and Other), and Application (Consumer Electronics, Automotive, Industrial, Telecommunications and Others): Global Opportunity Analysis and Industry Forecast, 2024-2032”. According to the report, the die bonder equipment market was valued at $785.2 million in 2023, and is estimated to reach $1.9 billion by 2032, growing at a CAGR of 10.8% from 2024 to 2032.

Prime determinants of growth

The die bonding process plays a crucial role in semiconductor chip manufacturing. It involves detaching the chip from the carrier and attaching it to the packaging substrate. The quality and efficiency of die bonding significantly influence the chip’s performance and cost. The rise of the Internet of Things (IoT) requires fast data processing, driving the demand for advanced electronic devices. The shift towards autonomous and electric vehicles in the automotive sector also contributes to the growing market. Countries like India and China, experiencing a surge in smartphone usage to affordable Internet rates, are also playing a significant role in sustaining the market. The ability to navigate semiconductor chip shortages and offer cost-effective solutions, along with prioritizing energy efficiency and maintenance, are key elements for success in this market.

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Report coverage & details:

Report Coverage

Details

Forecast Period

2024–2032

Base Year

2023

Market Size in 2023

$785.2 million

Market Size in 2032

$1, 859.8 million

CAGR

9.5 %

No. of Pages in Report

315

Segments Covered

Type, Application, Bonding Technique, and Region

Drivers

Increase in complexity of semiconductor IC designs

Rise in trend towards automation in automobiles

Growth in demand across consumer electronics

Opportunities

Growth in need for 3D semiconductor assembly and packaging

Restraint

High ownership cost and capital intensity

The fully automatic die bonder segment maintains its leadership throughout the forecast period.

Based on type, the fully automatic die bonder segment held the highest market share in 2023. The semiconductor industry’s technological progress and the push for smaller electronic devices make precise and efficient die bonding processes crucial. Fully automated die bonders are a must to keep up with growing production needs for consumer and automotive electronics. Automation not only cuts labor costs and boosts efficiency but also guarantees consistent quality and reliability, vital in fields such as medical devices, aerospace, and automotive. In addition, the intricacy of contemporary chips requires the accuracy provided by fully automated die bonders, effectively minimizing mistakes and minimizing material wastage. These combined factors underscore the increasing significance and need for fully automated die bonders in the field of high-tech manufacturing.

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The Epoxy segment maintains its leadership throughout the forecast period.

Based on bonding technique, the epoxy segment held the highest market share in 2023. Epoxy adhesives have seen significant improvements in performance owing to advancements in material science. These advancements have resulted in enhanced thermal stability, adhesion, and environmental resistance, making epoxy suitable for a wider range of applications. The growth of the electronics and semiconductor industry, fueled by the increasing prevalence and miniaturization of electronic devices, has created a greater need for reliable bonding techniques such as epoxy adhesives. In sectors such as automotive and aerospace, epoxy bonding has a critical role in achieving high-strength and durability, contributing to weight reduction and fuel efficiency. In addition, the expanding renewable energy sector, particularly in solar and wind energy, has further increased the demand for epoxy adhesives. These adhesives are essential for manufacturing durable solar panels and wind turbine blades.

The consumer electronics segment maintains its leadership throughout the forecast period.

Based on application, the consumer electronics segment held the highest market share in 2023. The rise in smart devices such as smartphones, tablets, and wearables demand cutting-edge manufacturing methods, where die bonders play an important role in ensuring accuracy and dependability during semiconductor component assembly. The shift towards smaller sizes and denser packaging in these compact, feature-packed gadgets underscores the importance of utilizing advanced die bonding machinery. Ongoing progress in semiconductor technology, which includes the creation of high-performance, energy-efficient chips, underscores the necessity for precise and effective bonding procedures facilitated by die bonders. Moreover, the increasing demand for consumer electronics results in larger production quantities, with automated die bonder systems allowing manufacturers to expand their operations while upholding high standards of quality and uniformity.

The North America region maintains its leadership throughout the forecast period.

Based on the region, the North America held the highest market share in 2023, North American companies are leading the way in technological innovation, requires the use of precise and efficient die bonders for next-generation semiconductor devices. To strengthen domestic semiconductor manufacturing, government initiatives and investments including the U.S. chips and science act are being implemented, thereby increasing the requirement for efficient die bonding equipment. Furthermore, the automotive and aerospace industries’ growing integration of advanced electronics is fueling the demand for high-precision die bonders. The presence of major semiconductor equipment manufacturers in North America provides easy access to cutting-edge technology and support. A prime example of this escalating demand is Intel’s investment of $20 billion in two new semiconductor factories in Arizona, showcasing the demand for advanced die bonding equipment to facilitate large-scale semiconductor production and innovation.

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Players: –

ASM Pacific TechnologyKulicke & Soffa Industries, Inc.MycronicPalomar TechnologiesWest•Bond, Inc.MicroAssembly Technologies, Ltd.Finetech GmbH & Co. KGTRESKY GmbHHybond Inc.Shibuya Corporation

The report provides a detailed analysis of these key players in the global die bonder equipment market. These players have adopted different strategies such as new product launches, collaborations, expansion, joint ventures, agreements, and others to increase their market share and maintain dominant shares in different regions. The report is valuable in highlighting business performance, operating segments, product portfolio, and strategic moves of market players to showcase the competitive scenario.

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About us:

Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Wilmington, Delaware. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of “Market Research Reports” and “Business Intelligence Solutions.” AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

We are in professional corporate relations with various companies, and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Allied Market Research CEO Pawan Kumar is instrumental in inspiring and encouraging everyone associated with the company to maintain high quality of data and help clients in every way possible to achieve success. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.

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Technology

Uploadcare Unveils New File Uploading Widget, Uploadcare File Uploader v1

Published

56 mins ago

September 24, 2024

Uploadcare’s Latest Innovation Offers Developers a Seamless, Secure and Scalable Solution for Integrating File Uploads Into Any Project

BOSTON, Sept. 24, 2024 /PRNewswire-PRWeb/ — Today, Uploadcare, a leading file management platform and content delivery network, announced the launch of Uploadcare File Uploader v1. Designed to meet the needs of developers building websites and SaaS applications with modern web tools, the file uploading widget provides an efficient and reliable way to integrate scalable and secure file uploads into any project.

“At Uploadcare, we understand that developers need a turnkey file-uploading solution to focus on what matters most: building great products,” said Igor Debatur, CEO of Uploadcare.

Uploadcare File Uploader sets itself apart with a range of key benefits to streamline the development process and enhance the end-user experience:

Easy Integration & Hassle-Free Maintenance: Quickly integrate into any tech stack with the plug-and-play solution that provides code snippets and instructions and ensures stable uploads without ongoing maintenance.Robust Security: Automatically detect inappropriate content and infected files, upholding regulatory compliance and brand integrity. Prevent unauthorized file uploads with signed uploads.Multiple Upload Sources: Support file uploads from up to 14 sources, including popular platforms like Google Drive, Dropbox, Instagram, and more.Built-in Image Editor: Empower users to edit images before upload, including options like cropping, resizing and applying filters.Advanced Accessibility: Maximize customer reach by adopting the interface with out-of-the-box A11Y accessibility options.

“At Uploadcare, we understand that developers need a turnkey file-uploading solution to focus on what matters most: building great products,” said Igor Debatur, CEO of Uploadcare. “Our new file uploader not only speeds up time-to-market but also eliminates the headaches associated with maintaining and securing file uploads, allowing developers to concentrate on their core product.”

To learn more about the latest features of the Uploadcare File Uploader, register for a live webinar on Oct. 10 at 11 a.m. EDT / 5 p.m. CET. Attendees can view a live demonstration, have their questions answered and will automatically be entered in a raffle for a Keychron Q3 Max mechanical keyboard.

For an Uploadcare File Uploader 14-day free trial, visit uploadcare.com/uploader1. To learn about Uploadcare’s offerings, visit uploadcare.com.

About Uploadcare

Uploadcare is a leading file management platform and content delivery network, enabling developers around the world to upload, manage, process, render, optimize and deliver digital content for applications and websites via a powerful suite of APIs. The developer-oriented platform was founded in 2011 by tech enthusiasts experienced in web development and image processing that encountered problems with uploading and file management, who decided to create an all-in-one solution that worked at scale. 13 years later, Uploadcare has grown rapidly, garnering clients like PandaDoc, Buffer, UserTesting, Zapier and more. To learn more about Uploadcare, visit uploadcare.com.

Media Contact

Lilly Carrion, Uploadcare, 1 9546008860, lilly@palmerpublic.com, https://uploadcare.com/

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SOURCE Uploadcare

Technology

Washington Tech Workforce Coalition Forms to Meet the Need for Diverse, Highly Skilled Candidates for In-Demand Tech Jobs

Published

56 mins ago

September 24, 2024

Industry leaders, educators and community organizations invited to join this important initiative

SEATTLE, Sept. 24, 2024 /PRNewswire/ — The Washington Tech Workforce Coalition (WTWC) proudly announces its launch, marking a significant step toward addressing the growing demand for technology roles across multiple industries. The Coalition will hold its first convening on Oct. 29, 2024 from 2-7pm at the AWS Skills Center in Seattle.

The Coalition focuses on creating opportunities for underserved and underrepresented populations while fostering a collaborative space where industry leaders, educators, training partners, community partners, and government agencies work together to meet workforce demands and facilitate job placements. The Coalition’s new website, watechcoalition.org, is the hub of this network where partners can join the Coalition, sign up for committees, read updates, find best practices and track outcomes.

Vision
The Washington Tech Workforce Coalition envisions an enduring ecosystem designed to bridge workforce gaps and advance workers’ skills in Cybersecurity, Data Analytics, IT & Cloud Computing, and Software Development.

Key responsibilities include:

Developing a talent pipeline responsive to industry needs.Closing the skills gap by creating technical and professional skills development programs.Connecting high-quality candidates with internships and full-time jobs to meet employer needs.Building relationships and credibility with workforce system stakeholders.

The Coalition is supported by industry experts AWS and Accenture, led by Computing for All, in collaboration with the Washington Technology Industry Association (WTIA), and committed employers throughout Washington State. These members form the core of the Industry Advisory Committee.

Coalition Partners
The Washington Tech Workforce Coalition includes a network of fourteen placement providers and subrecipients that will help launch 1,000 careers in technology roles by October 2025.

Placement Providers will offer various services, including community and employer engagement, candidate training, support, and job placement. Placement Providers include Ada Developers Academy, CodeDay, Per Scholas, PNW Cyber Challenge Games, Riipen and North Seattle College, Saint Martin’s University (Washington Vets2Tech), and Year Up.

These placement providers join the Coalition’s subrecipients (below) involved in strategic efforts to develop outreach and alignment with underserved communities, education, and employers. Subrecipients include Career Connect Southwest STEM Regional Network, Center of Excellence for Information & Computing Technology (COEICT), Evergreen Goodwill, King Pierce Regional Network / Washington Alliance for Better Schools (WABS), North Central Regional Network, Seattle Jobs Initiative (SJI), and Washington Technology Industry Association (WTIA).

Collectively, these grant partners build and expand training programs and job placement pipelines across the state.

Structure
Initial funding for the Coalition is from the US Department of Commerce Good Jobs Challenge grant. Implementation is through the Washington Jobs Initiative managed by Washington Student Achievement Council (WSAC). Computing for All, a 501(c)(3) technology education nonprofit organization manages the Coalition, building alignment among community, education, and industry partners to align training and job opportunities while uniting and lifting our local economies.  
The launch of the Coalition underscores all the members’ dedication to leveraging resources, applying best practices, and fostering a shared vision for talent development in technology.

For more information on the Coalition and to learn how to get involved, visit watechcoalition.org.

CONTACT: press@watechcoalition.org

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SOURCE Computing for All

Technology

WCG Improves Clinical Trial Adjudication with Enhanced AIMS Solution

Published

56 mins ago

September 24, 2024

PRINCETON, N.J., Sept. 24, 2024 /PRNewswire/ — WCG, the global leader in providing solutions that measurably improve and accelerate clinical research, is excited to announce the latest advancement in the WCG ClinSphere™ platform with the addition of an interactive adjudication model in its Adjudication Information Management System (AIMS®) solution. Specifically designed to simplify and streamline the adjudication process for clinical trials, AIMS improves efficiency, compliance, and data accuracy.

The new interactive adjudication model feature allows adjudication committee members to review all relevant clinical data for a subject within a single interactive screen, making review of lengthy subject data listings a thing of the past. Initially developed for use for adjudication within complex multiple myeloma trials, this application is now optimized for use across any therapeutic area and trial design. It is poised to become the new industry standard for clinical trial adjudication, addressing the growing complexity and volume of trials requiring expert adjudication.

“We are thrilled to offer a solution that not only improves operational efficiency but also ensures accuracy and compliance for clinical trial adjudication,” said Mark McDonald, president, Review Solutions at WCG. “AIMS empowers clinical teams to navigate the adjudication process with ease, allowing for faster decision-making and better trial outcomes.”

Key Features of the Enhancements to WCG’s AIMS Solution:

Interactive Data Review (IDR): A new user interface providing an interactive and intuitive view of clinical trial data across a subject, including automatic data change flags, resulting in increased clarity for adjudicators.

Multi-Record Per Case Adjudication: Review multiple records or data points simultaneously to streamline decision-making and reduce human error.

Real-Time Reporting and Insights: Access real-time reports, ensuring up-to-date adjudication oversight and informed decision-making.

21 CFR Part 11 Compliance: Ensure regulatory compliance with a comprehensive audit trail and built-in validation.

Built-In DICOM Imaging Viewer & Redaction Tools: Facilitate secure and efficient review of medical images and sensitive trial data.

“We recognize the unique challenges sponsors face to meet the adjudication needs of increasingly complex clinical trials,” added McDonald. “AIMS enhances not only the quality of adjudication but also the satisfaction of all stakeholders involved in the trial process.”

To learn more about AIMS, visit https://www.wcgclinical.com/technologies/aims/.

About WCG

WCG is a global leader of solutions that measurably improve and accelerate clinical research. Biopharmaceutical and medical device companies, contract research organizations (CROs), research institutions, and sites partner with us for our unmatched expertise, data intelligence, and purpose-built technology to make informed decisions and optimize study outcomes, while maintaining the highest standards of human participant protection. WCG raises the bar by pioneering new concepts, reimagining processes, fostering compliance and safety, and empowering those who perform clinical trials to accelerate the delivery of medical therapies and devices that improve lives. For more information, please visit wcgclinical.com or follow us on LinkedIn or X @WCGClinical.

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SOURCE WCG