The global advanced packaging market has experienced growth due to several factors such as an increase in demand for miniaturization and expansion of the consumer electronics sector.
Wilmington, Del., Aug. 7, 2024 /PRNewswire/ — Allied Market Research published a report, titled, “Advanced Packaging Market by Type (Flip chip CSP, Flip-chip ball grid array, Wafer level CSP, 2.5D/3D, Fan-out WLP and Others), End user (Consumer electronics, Automotive, Industrial, Healthcare, Aerospace & defense and Others), By (): Global Opportunity Analysis and Industry Forecast, 2024-2032″. According to the report, the advanced packaging market was valued at $48.5 billion in 2023, and is estimated to reach $119.4 billion by 2032, growing at a CAGR of 10.6% from 2024 to 2032.
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130 – Tables58 – Charts250 – Pages
Prime Determinants of Growth
The notable factors positively affecting the advanced packaging market include increasing demand for miniaturization of devices and improved system performance and optimization of advanced packaging. However, problems regarding the high cost of advanced packaging technology hamper market growth. Moreover, emerging trends toward fan-out wafer level packaging are expected to offer huge opportunities for the advanced packaging market.
Report Coverage & Details:
Report Coverage
Details
Forecast Period
2024–2032
Base Year
2023
Market Size in 2023
$48.5 billion
Market Size in 2032
$119.4 billion
CAGR
10.6 %
No. of Pages in Report
250
Segments Covered
Type, End User, and Region.
Drivers
Increasing demand for miniaturizationGrowth in consumer electronics The expansion of IoT applications across various sectors, including industrial, healthcare, and smart homes
Opportunities
The growing adoption of electronic components in automotive applications Growth in Data Centers and Cloud Computing
Restraint
High costs associated with advanced packaging
Segment Highlights
The demand for CSP flip chip ball grid array segment in advanced packaging market is driven by its superior performance characteristics, essential for high-performance and compact electronic devices. FCBGA technology offers excellent electrical and thermal performance, allowing for higher interconnection density, improved signal integrity, and efficient heat dissipation. These features are critical for applications in high-performance computing, mobile devices, and consumer electronics. The increasing demand for miniaturization, enhanced processing power, and energy efficiency in these devices fuel the growth of CSP FCBGA packaging solutions, meeting the evolving requirements of advanced semiconductor applications.
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The demand for the consumer electronics segment in the advanced packaging market is on the rise due to the increasing need for compact, high-performance devices such as smartphones, tablets, wearables, and gaming consoles. Advanced packaging technologies like Fan-Out Wafer-Level Packaging (FOWLP) and Through-Silicon Via (TSV) enable miniaturization, improved power efficiency, and enhanced functionality, which are essential for modern consumer electronics. The rapid adoption of technologies such as 5G, IoT, and AI in these devices further drives the need for sophisticated packaging solutions that support higher processing speeds, better heat dissipation, and greater interconnection density, thus fueling market growth.
Regional Outlook
In Asia-pacific, China attained the highest market share in the advanced packaging market due to strong semiconductor manufacturing infrastructure, substantial investments in research and development, and a strong focus on technological innovation. China is home to major semiconductor foundries and packaging companies that drive advancements in packaging technologies. In addition, the high demand for consumer electronics, automotive electronics, and telecommunication devices in the domestic market fuels the need for advanced packaging solutions. Government support through favorable policies and initiatives to boost the semiconductor industry further propels China’s leadership position in the advanced packaging market.
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Key Players: –
Amkor TechnologyIntel CorporationQualcomm Technologies Inc.Taiwan Semiconductor Manufacturing CompanyIBMMicrochip TechnologyRenesas Electronics CorporationTexas InstrumentsAnalog Devices
The report provides a detailed analysis of these key players in the global advanced packaging market. These players have adopted different strategies such as new product launches, collaborations, expansion, joint ventures, agreements, and others to increase their market share and maintain dominant shares in different regions. The report is valuable in highlighting business performance, operating segments, product portfolio, and strategic moves of market players to showcase the competitive scenario.
Recent Development:
In October 2023, Advanced Semiconductor Engineering Inc. (ASE) announced the launch of its Integrated Design Ecosystem (IDE), a collaborative design toolset optimized to enhance advanced package architecture across its VIPack platform. This innovative approach facilitates a seamless transition from single-die SoC to multi-die disaggregated IP blocks, including chiplets and memory, for integration using 2.5D or advanced fanout structures. The IDE is designed to systematically boost the efficiency and effectiveness of advanced packaging, supporting the evolving demands of semiconductor technology.
Key Benefits For Stakeholders:
This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the advanced packaging market analysis from 2024 to 2032 to identify the prevailing advanced packaging market opportunities.The market research is offered along with information related to key drivers, restraints, and opportunities.Porter’s five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.In-depth analysis of the advanced packaging market segmentation assists to determine the prevailing market opportunities.Major countries in each region are mapped according to their revenue contribution to the global market.Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.The report includes the analysis of the regional as well as global advanced packaging market trends, Advanced Packaging Company List, Advanced Packaging Market Share by Companies, Advanced Packaging Industry Report, Advanced Packaging Sector Analysis, Semiconductor Advanced Packaging, Advanced Packaging Technology key players, market segments, application areas, and market growth strategies.
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Advanced Packaging Market Key Segments:
By Type
Flip chip CSPFlip-chip ball grid arrayWafer level CSP2.5D/3DFan-out WLPOthers
By End User
Consumer electronicsAutomotiveIndustrialHealthcareAerospace & defenseOthers
By Region:
North America (U.S., Canada, and Mexico)Europe (UK, Germany, France, Russia, and Rest of Europe)Asia-Pacific (China, Japan, India, Australia, South Korea, and Rest of Asia-Pacific)Latin America (Brazil, Argentina, and Rest of Latin America)Middle East and Africa (UAE, Saudi Arabia, and Rest of Middle East and Africa)
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Trending Reports in Semiconductor and Electronics Industry:
Semiconductor Packaging Market size is expected to reach $60.44 billion by 2030 from $27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030
Consumer Electronics Packaging Market was valued at $22.1 billion in 2022, and is projected to reach $49.1 billion by 2032, growing at a CAGR of 8.4% from 2023 to 2032
Quad-Flat-No-Lead Packaging Market size was valued at $453.1 million in 2021, and is projected to reach $1.1 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031
Embedded Die Packaging Technology Market was valued at $69.2 million in 2021, and is projected to reach $370.7 million by 2031, growing at a CAGR of 18.3% from 2022 to 2031
Wafer Level Packaging Market size was valued at $4.5 billion in 2020, and is projected to reach $23.6 billion by 2030, growing at a CAGR of 18.8% from 2021 to 2030.
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