NEW YORK, Aug. 6, 2024 /PRNewswire/ — The global semiconductor assembly and testing services (SATS) market size is estimated to grow by USD 19.31 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of 6.59% during the forecast period. Rising sales of iot devices is driving market growth, with a trend towards advances in SATS. However, intense competition in sats industry poses a challenge. Key market players include Amkor Technology Inc., Aptasic SA, ASE Technology Holding Co. Ltd., ChipMOS TECHNOLOGIES INC., DPA Components International, Flexitallic Group, Formosa Advanced Technologies Co. Ltd., GlobalFoundaries Inc., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., Koninklijke Philips N.V., Micross Inc., Ose Corp., Powertech Technology Inc., Rochester Electronics LLC, Teledyne Technologies Inc., Tianshui Huatian Technology Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., and Walton Advanced Engineering Inc..
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Semiconductor Assembly And Testing Services (SATS) Market Scope
Report Coverage
Details
Base year
2023
Historic period
2018 – 2022
Forecast period
2024-2028
Growth momentum & CAGR
Accelerate at a CAGR of 6.59%
Market growth 2024-2028
USD 19310.4 million
Market structure
Fragmented
YoY growth 2022-2023 (%)
6.18
Regional analysis
APAC, North America, Europe, South America, and Middle East and Africa
Performing market contribution
APAC at 76%
Key countries
South Korea, Taiwan, China, US, and Japan
Key companies profiled
Amkor Technology Inc., Aptasic SA, ASE Technology Holding Co. Ltd., ChipMOS TECHNOLOGIES INC., DPA Components International, Flexitallic Group, Formosa Advanced Technologies Co. Ltd., GlobalFoundaries Inc., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., Koninklijke Philips N.V., Micross Inc., Ose Corp., Powertech Technology Inc., Rochester Electronics LLC, Teledyne Technologies Inc., Tianshui Huatian Technology Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., and Walton Advanced Engineering Inc.
Market Driver
The semiconductor assembly and testing services (SATS) market has experienced significant growth due to advancements in chip packaging technologies. One such innovation is 3D IC packaging, which allows for miniaturized ICs and the stacking of intelligence centers, addressing space constraints. Organic-substrate-interposer technology is also popular due to its cost-effectiveness compared to silicon interposers. Another technology, TSV or silicon-via-interconnection, is used for creating 3D packages and integrated 3D circuits, enabling increased performance and reduced product costs. TSVs are also utilized in complementary metal-oxide semiconductor (CIS) image sensors, allowing for reduced form factors and high-density interconnects. These advancements are anticipated to fuel the expansion of the global SATS market in the forecast period.
The Semiconductor Assembly and Testing Services (SATS) market is experiencing significant trends in the electronics industry. With the rise of network connectivity in various applications, there is an increasing demand for semiconductor components in smart homes, smart television sets, smartphones, tablets, telecommunication, and 5G technologies. Outsourcing SATS to service providers ensures operational efficiency and cost savings. Advanced packaging technologies, such as wire bonding and 3D semiconductor assemblies, enhance product quality and reliability. Power efficiency and resistance to thermal cycling are crucial for the production of power-efficient devices and safety systems. Reliability testing, including burn-in and accelerated stress testing, is essential for ensuring the longevity and dependability of semiconductor components and chipsets (ICs). The automotive industry is also embracing semiconductors for automotive electronics and systems, requiring stringent certifications. Semiconductor manufacturing, including wafer fabrication factories, must maintain prudence and flexibility to adapt to process complexity and the paradigm shift towards miniaturization and higher integration. The semiconductor industry’s focus on quality and reliability is driving innovation in chip design, chipsets, cloud services, and 5G technology for wireless networks.
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Market Challenges
The Semiconductor Assembly and Testing Services (SATS) industry is a highly competitive and capital-intensive market. Consolidation among players over the last decade improved cost performance, but the industry faces challenges from shortening product lifecycles and advancing technology. Additionally, rising energy prices and volatile commodity costs add to the pressures. Most SATS businesses are located in emerging economies with low labor costs and limited use of advanced manufacturing techniques. While front-end silicon wafer manufacturers adopt lean techniques and digitalization, backend SATS businesses lag in these implementations. Lean manufacturing minimizes waste and increases efficiency, while IoT enhances operational efficiency and reduces delivery times. The global SATS market has a few major players accounting for over half the revenue, leaving smaller companies with low economies of scale and impacting their margins and growth. R&D costs are significant in the SATS market, enabling major players to invest in proprietary processes and designs, creating a challenge for smaller competitors. Further competition may come from pure-play foundries and IDMs expanding into SATS, potentially intensifying market competition and hindering growth during the forecast period.The Semiconductor Assembly and Testing Services (SATS) market faces several challenges in today’s technology landscape. With the rise of 3D semiconductor assemblies and the integration of 5G technologies into 5G wireless networks, advanced packaging technologies are in high demand. Automotive electronics and systems require specialized testing for certifications, such as conductivity and emission reduction, for use in electrification and fuel efficiency. Chip design and IC chipset assembly for consumer electronics, computing industry, communication industry, and industrial applications require accelerated stress testing and electrical characterization. Environmental testing, including burn-in and conductivity, is crucial for reliability in various applications. Additionally, industry standards for data transfer speeds, low thermal ratings, and encapsulation are essential for the manufacturing of chipsets (ICs) and electronic components in cloud services, entertainment systems, navigation, and the Internet of Things. Metals and insulators play a vital role in the fabrication process, ensuring efficient production and high-quality products.
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Segment Overview
This semiconductor assembly and testing services (sats) market report extensively covers market segmentation by
Application 1.1 Communication1.2 Computing and networking1.3 Industrial1.4 Consumer electronics1.5 Automotive electronicsService Type2.1 Assembly services2.2 Testing servicesGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa
1.1 Communication- Semiconductor Assembly and Testing Services (SATS) play a vital role in the communication segment by providing essential components and services for the production of communication devices. In this sector, semiconductor components, including ICs, power amplifiers, and filters, are necessary for signal amplification, filtering, and modulation, which are crucial for data and voice transmission over networks. SATS contribute significantly to the manufacturing of communication devices by supplying high-quality components and offering testing services to ensure compliance with industry standards. Communication devices such as smartphones, radios, modems, and routers require rigorous testing and quality assurance to meet regulatory bodies’ safety, performance, and quality standards, such as the Federal Communications Commission (FCC) and the International Organization for Standardization (ISO). Moreover, SATS offer customization services for communication devices, designing customized ICs and modifying existing components to optimize their performance with the device. Quality assurance is a top priority for SATS, ensuring devices meet durability, reliability, and functionality requirements. The communication segment’s growth in Internet of Things (IoT) devices and wireless communication technology necessitates the use of advanced semiconductor components. SATS provide components supporting these technologies, including ICs, sensors, and modules, and offer testing services to ensure their proper functionality and adherence to required standards. Overall, the above factors are expected to fuel the growth of the global SATS market through the communication segment during the forecast period.
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Learn and explore more about Technavio’s in-depth research reports
The global Semiconductor Market is set for significant growth, driven by advancements in technology and increasing demand across various sectors. Key segments include consumer electronics, automotive, and industrial applications. The global Semiconductor Advanced Packaging Market is also expanding rapidly, with innovative packaging technologies enhancing performance and reliability. This market’s growth is fueled by the rising complexity of semiconductor devices and the need for miniaturization. Both markets are expected to witness robust growth due to technological advancements and evolving consumer needs.
Research Analysis
The Semiconductor Assembly and Testing Services (SATS) market encompasses the processes and services involved in the production of integrated circuits and chipsets. These processes include conductivity testing, where the conductivity of conductors and insulators is measured using metals and resistance. SATS plays a crucial role in the semiconductor manufacturing industry, ensuring the quality and reliability of advanced packaging technologies used in various applications. SATS is essential for the production of power-efficient devices, such as those used in mobile devices, Internet of Things (IoT) applications, automotive electronics, and electrification systems. Advanced testing techniques, including electrical characterization and environmental testing, are employed to ensure the optimal performance of these devices. SATS also plays a significant role in the development of new technologies, such as 3D semiconductor assemblies, 5G technology, and cloud services. The market is driven by the growing demand for miniaturization, power efficiency, and high-speed connectivity in various industries. The focus on producing smaller, more reliable, and more efficient semiconductor components is a key trend in the SATS market.
Market Research Overview
The Semiconductor Assembly and Testing Services (SATS) market encompasses various processes and services essential to the production of semiconductor components. These services include 3D semiconductor assemblies, advanced packaging technologies, and electrical characterization. The market caters to numerous industries, such as automotive electronics, communication, and computing, driven by the paradigm shift towards 5G technologies and the Internet of Things. SATS involve processes like die preparation, wafer fabrication, and IC chipset assembly, as well as testing services such as burn-in, reliability, and environmental testing. The market also focuses on outsourcing and industry standards to ensure product quality and operational efficiency. Semiconductor components, including chipsets (ICs), conductors, insulators, and metals, undergo various stages of fabrication and packaging, including encapsulation, electrification, and thermal cycling. The market caters to diverse applications, from consumer electronics like mobile devices, smartphones, tablets, and smart television sets to industrial applications and safety systems. SATS providers offer services to various sectors, including automotive systems, computing industry, information technology, and telecommunication, ensuring prudence and flexibility in meeting their clients’ needs. The market’s growth is fueled by the demand for power-efficient devices, low thermal ratings, and high data transfer speeds, making it a crucial player in the semiconductor manufacturing landscape.
Table of Contents:
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation
ApplicationCommunicationComputing And NetworkingIndustrialConsumer ElectronicsAutomotive ElectronicsService TypeAssembly ServicesTesting ServicesGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa
7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix
About Technavio
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SOURCE Technavio