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Optical Interconnect Market size is set to grow by USD 16.80 billion from 2024-2028, Adoption of cloud database boost the market, Technavio

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NEW YORK, July 26, 2024 /PRNewswire/ — The global optical interconnect market size is estimated to grow by USD 16.80 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of 20.62% during the forecast period. Adoption of cloud database is driving market growth, with a trend towards demand for millimeter wave connectivity. However, high cost of optical interconnectors poses a challenge. Key market players include 3M Co., Amphenol Corp., Cisco Systems Inc., Corning Inc., FIBERONE LLC, Fischer Connectors Holding SA, Fujikura Ltd., Fujitsu Ltd., Furukawa Electric Co. Ltd., II VI Inc., InnoLight Technology Ltd., Japan Aviation Electronics Industry Ltd., Lumentum Holdings Inc., Molex LLC, NINGBO LONGXING TELECOMMUNICATIONS EQUIPMENT MANUFACTURING CO. LT, NVIDIA Corp., Radiall SA, Sterlite Technologies Ltd., Sumitomo Electric Industries Ltd., and TE Connectivity Ltd..

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Optical Interconnect Market Scope

Report Coverage

Details

Base year

2023

Historic period

2018 – 2022

Forecast period

2024-2028

Growth momentum & CAGR

Accelerate at a CAGR of 20.62%

Market growth 2024-2028

USD 16804.9 million

Market structure

Fragmented

YoY growth 2022-2023 (%)

16.56

Regional analysis

APAC, North America, Europe, South America, and Middle East and Africa

Performing market contribution

APAC at 62%

Key countries

China, US, South Korea, Japan, and Canada

Key companies profiled

3M Co., Amphenol Corp., Cisco Systems Inc., Corning Inc., FIBERONE LLC, Fischer Connectors Holding SA, Fujikura Ltd., Fujitsu Ltd., Furukawa Electric Co. Ltd., II VI Inc., InnoLight Technology Ltd., Japan Aviation Electronics Industry Ltd., Lumentum Holdings Inc., Molex LLC, NINGBO LONGXING TELECOMMUNICATIONS EQUIPMENT MANUFACTURING CO. LT, NVIDIA Corp., Radiall SA, Sterlite Technologies Ltd., Sumitomo Electric Industries Ltd., and TE Connectivity Ltd.

Market Driver

The global optical interconnect market is anticipated to experience growth due to the increasing demand for high bandwidth applications in 5G networks. ISPs face the challenge of managing 5G wireless backhaul traffic effectively. Two typical network architectures for wireless backhaul traffic are small cell and millimeter wave. The demand for optical interconnect components will rise as they are used to connect millimeter wave connectivity, which is economical and energy-efficient for deploying future 5G networks. The data transmission requirement is expanding rapidly and is expected to continue growing during the forecast period. Millimeter wave connectivity is extensively used in small cell backhaul networks, making it a significant growth opportunity for the optical interconnect market. 

The optical interconnect market is experiencing significant growth due to the increasing demand for efficient data communication solutions. Trends like machine learning and real-time data processing are driving the need for high-bandwidth, low-latency networks. Optical engines and ML/AI networks are at the heart of this transformation. Edge computing and data-intensive technologies require network interconnection solutions that can handle large data traffic. Both single mode fiber and multimode fiber segments are in focus, with single mode fiber leading the way for long-distance data transmissions and high-performance computing applications. 5G networks and the data communication segment are key drivers, particularly in the areas of cloud services, large-scale datacenters, and data storage. Semiconductor companies and infrastructure software solutions are investing heavily in this space. IoT, driverless vehicles, and wireless communication are also contributing to the increased bandwidth requirements. Overall, the optical interconnect market is poised for continued growth in the coming years. 

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Market Challenges

The optical interconnect market offers a range of interconnectors with varying average selling prices (ASP). The price can fluctuate based on factors such as applications, package weight, bandwidth, split ratios, custom wavelength, coupling ratio, sample rate, and channels. Interconnectors with high bandwidths up to ±200 nm and center wavelengths up to 2,000 nm have a higher ASP. These interconnectors are capable of analyzing signals from standard cables like USB, coaxial, and Ethernet, with several automatic measurements. However, the high cost of these interconnectors represents a significant capital expenditure for industries, which could potentially hinder the growth of the global optical interconnect market during the forecast period.The Optical Interconnect Market is experiencing significant growth due to increasing data traffic in cloud storage, deep learning, and hyperscale datacenters. Efficient data communication is crucial for next-generation applications like 5G services, driverless vehicles, smart gaming, and the Internet of Things. Optical interconnect technologies, such as fiber mode, offer higher bandwidth requirements and lower latency compared to copper-based interconnects. However, challenges remain. Alignment and packaging, compatibility, and interoperability are key concerns for datacenter companies. The commercialization of 5G services and high-performance computing demands for big data analytics, artificial intelligence, and high-bandwidth data centers networks. Telecommunications networks and data communication infrastructure require optical interconnect solutions to meet the needs of cloud computing, big data, and fiber optics. To address these challenges, optical interconnect manufacturers must focus on developing innovative solutions that cater to the unique requirements of various industries while ensuring seamless integration with existing infrastructure. Optical interconnect solutions must be designed to meet the evolving needs of next-generation applications and services.

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Segment Overview 

This optical interconnect market report extensively covers market segmentation by  

Fiber Type1.1 Single-mode fiber1.2 Multimode fiberConnectivity 2.1 Rack level2.2 Long-haul level2.3 Chip and board levelProduct Type3.1 Optical transceivers3.2 Connectors3.3 Cable assemblies3.4 OthersGeography 4.1 APAC4.2 North America4.3 Europe4.4 South America4.5 Middle East and Africa

1.1 Single-mode fiber-  Single-mode optical fibers are the most common type of fibers used for long-distance communication in fiber optics. These fibers allow light to travel directly through the core without bouncing at the edges, resulting in less signal deformation and lower attenuation. Single-mode fibers have a small core diameter of 8-9 microns and a larger cladding diameter of 125 microns, reducing reflections and enabling longer transmission distances. Major vendors in this market include Sterlite Technologies Ltd., The 3M Co., and Molex, LLC. Applications of single-mode fibers span across telecommunications, education, CATV companies, military, ships, aerospace, data centers, medical cases, and telemetry. The advantages of single-mode fibers include faster transmission over long distances, lower integrity loss, and cost-effectiveness. The market for single-mode fibers is expanding due to these advantages and the increasing demand for long-distance communication in various industries.

For more information on market segmentation with geographical analysis including forecast (2024-2028) and historic data (2017-2021) – Download a Sample Report

Learn and explore more about Technavio’s in-depth research reports

The global photonics market is experiencing robust growth, driven by advancements in technology and increased demand for high-speed communication and imaging systems. Key sectors include telecommunications, healthcare, and manufacturing, with significant investments in research and development. Major players such as Intel, Bosch, and Nikon are leading innovations in laser technology, optical components, and imaging systems, fueling market expansion and enhancing applications across various industries.

Research Analysis

The optical interconnect market is experiencing significant growth due to the increasing demand for high-speed data transmission in various industries. Cloud computing, big data analytics, artificial intelligence, and high-performance computing are driving the need for advanced optical interconnect technologies. Data centers, telecommunications networks, and IoT are key areas where optical interconnects are finding extensive applications. The market is segmented into multimode fiber and single mode fiber segments based on the type of fiber used. Optical interconnects offer increased bandwidth, making them ideal for short-distance data transmissions in data centers and hyper-scale datacenters. The commercialization of 5G services and the rise of high-efficiency processing in high-performance computing applications are further boosting the market. Alignment and packaging are critical factors influencing the performance and cost of optical interconnects. The market is expected to grow significantly in the coming years due to the increasing demand for high-speed data transmission in various applications, including data center networks, driverless vehicles, and data analytics.

Market Research Overview

The optical interconnect market is experiencing significant growth due to the increasing demand for high-speed data communication in various industries, including cloud computing, big data analytics, artificial intelligence, high-performance computing, and telecommunications networks. Optical interconnect technologies, such as single mode fiber and multi-mode fiber, are becoming essential for next-generation applications and services that require increased bandwidth and real-time data processing. Optical interconnect solutions offer compatibility and interoperability, making them ideal for network interconnection in data centers, hyperscale datacenters, and large-scale cloud service providers. The market is also driven by the commercialization of 5G networks, IoT, and edge computing, which require high-bandwidth, efficient data communication. Optical engines, ML/AI networks, and infrastructure software solutions are key components of optical interconnects, enabling machine learning, real-time data processing, and high-efficiency processing. Copper-based interconnects are being replaced by optical interconnects due to their higher performance and bandwidth capabilities. The data communication segment and data communication applications are the primary drivers of the optical interconnect market. The market is expected to grow significantly in the coming years due to the increasing demand for data-intensive technologies and the need for high-performance networking in various industries.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

Fiber TypeSingle-mode FiberMultimode FiberConnectivityRack LevelLong-haul LevelChip And Board LevelProduct TypeOptical TransceiversConnectorsCable AssembliesOthersGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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HONOR Redefines Mobile AI Solutions with PC powered by Snapdragon, on-device AI Agent and AI Deepfake Detection at IFA 2024

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HONOR, Qualcomm, and Microsoft Redefine Innovations in Mobile AI

BERLIN, Sept. 7, 2024 /CNW/ — Today at IFA 2024, HONOR unveiled three groundbreaking mobile AI Solutions: AI PC powered by Snapdragon® X Elite platforms, AI Agent and AI Deepfake Detection. The launch was accompanied by a thought-provoking panel discussion featuring HONOR CEO George Zhao; Alex Katouzian, Group GM of MCX at Qualcomm Technologies, Inc.; and Mark Linton, VP of Device Partner Sales at Microsoft. Together, they explored the convergence of AI and Snapdragon technology, discussing how these innovations are shaping the future of mobile AI.

“When it comes to mobile computing, AI is not just a buzzword, it’s a revolution,” commented George Zhao, CEO of HONOR Device Co., Ltd. “At HONOR, we’re committed to working with our partners to deliver powerful AI capabilities and seamless connectivity, while protecting our users’ privacy. Through open collaboration with industry leaders, we’re creating devices that empower individuals and redefine what’s possible.”

“At Qualcomm Technologies, we believe the NPU is the key to unlocking the true potential of AI in PCs,” added Alex Katouzian, Group GM of MCX, Qualcomm Technologies, Inc. “The Snapdragon X Elite with its industry-leading NPU performance empowers AI PCs like the HONOR MagicBook Art 14 to deliver next-generation AI experiences. Not only will users see a significant boost in capabilities, but the NPU’s efficiency also translates to longer battery life, allowing users to stay productive for extended periods.”

HONOR MagicBook Art 14 Snapdragon: Redefining PC in the Mobile AI Era
The PC landscape is undergoing a radical transformation, driven by advancements in AI and the rise of Snapdragon platforms. Fueled by HONOR’s platform-level AI capabilities and developed in collaboration with top industry leaders, HONOR MagicBook Art 14 Snapdragon heralds a new era of computing.

Featuring a sleek and compact design, the HONOR MagicBook Art 14 Snapdragon is a marvel of lightweight engineering. It incorporates cutting-edge platform-level AI features alongside robust hardware and software solutions, ensuring unmatched productivity and user experience. It translates the lightweight and slim characteristics of smartphones to laptops, delivering the lightest and slimmest AI PC on the market, weighing approximately 1kg with a slimness of 1cm. Delivering an immersive visual journey, the HONOR MagicBook Art 14 Snapdragon features a captivating 14.6-inch HONOR FullView Touch Display boasting a crystal-clear 3.1K resolution. It also includes an outstanding 97% screen-to-body ratio, the largest among 14-inch laptops. The HONOR MagicBook Art 14 Snapdragon is powered by the Qualcomm Snapdragon X Elite, elevating the computing experience to new heights in terms of power, efficiency, and security.

The HONOR MagicBook Art 14 Snapdragon also enables a smooth transition of Windows applications on X86 to the Windows on Snapdragon architecture. Based on years of research on the ecosystem, HONOR created a Hotspot Library that uses platform-level AI to identify frequently used scenarios and trigger translation optimization efficiently. HONOR has improved 16% of the average boot-up time1 with translation optimization across a diverse array of Windows applications. Currently, HONOR has optimized a total of the Top 14 applications across six major categories, including browsers, online meetings, media, office, social software and tools.

The HONOR MagicBook Art 14 Snapdragon will be soon available in German, France and Italy.  For preorder, please visit HONOR online store now at www.honor.com.

Seamless AI Experiences Elevated by the Power of MagicRing
In the mobile AI era, seamless cross-OS connectivity will truly empower users to unlock AI everywhere. Unlike the manual point-to-point connections in traditional solutions, the HONOR MagicRing allows multiple devices of the same account to automatically connect with low power consumption.

The MagicRing not only connects devices but also connects services across the devices. The solution also enables users to use the same set of keyboard and mouse for multiple devices, receive calls and notifications on a device other than their smartphones, and control the smartphone’s camera on the PC. With the secure and smooth flow of services and information across devices, MagicRing makes multi-device AI experience easier. For example, as one of the typical scenarios of Windows on Snapdragon experience, Cocreator allows users to produce fantastic artwork with simple draws. Powered by MagicRing, users can seamlessly access Cocreator on their HONOR MagicPad 2, drawing AI masterpieces with their Magic-Pencil. In the Meanwhile, they can also use AI Eraser from HONOR Magic V3 on the HONOR MagicBook Art 14 Snapdragon to experience unparalleled levels of convenient mobile AI.

HONOR AI Agent: The First On-device AI Agent for the Open Ecosystem
The HONOR AI Agent is a revolutionary always-on personal assistant designed to enhance and simplify users’ daily lives. By intuitively understanding users’ requests and intentions through language analysis and UI awareness technology, the AI Agent that learns from their habits and device environment can intelligently make decisions across various apps and services. This capability allows it to automate complex tasks. HONOR demonstrated how to find and cancel unwanted app subscriptions across different apps with just a few simple voice commands on their smartphones.

As we look to the future, the HONOR AI Agent is poised to become the cornerstone of mobile AI, and it is anticipated to arrive with the HONOR Magic7 Series later this year in China. This innovation not only signifies a leap in technology but also heralds a new era where AI seamlessly integrates into our daily routines, enhancing everyday productivity and efficiency.

The World’s First On-device AI Deepfake Detection Technology
As the technology behind deepfakes becomes more sophisticated, the potential for misuse, including identity theft and the spread of disinformation, grows significantly. HONOR’s on-device AI Deepfake Detection represents a groundbreaking solution designed to protect users from the increasingly prevalent threat of deepfakes. This innovative detection system employs advanced algorithms to meticulously analyze various elements, including pixel-level synthetic imperfections, border compositing artifacts, inter-frame continuity, consistency in face-to-ear hairstyle, and the positioning of synthetic traces. By examining these characteristics, the technology can accurately identify manipulated content, distinguishing between genuine media and deceptive alterations.

About HONOR 
HONOR is a leading global provider of smart devices. It is dedicated to becoming a global iconic technology brand and creating a new intelligent world for everyone through its powerful products and services. With an unwavering focus on R&D, it is committed to developing technology that empowers people around the globe to go beyond, giving them the freedom to achieve and do more. Offering a range of high-quality smartphones, tablets, laptops and wearables to suit every budget, HONOR’s portfolio of innovative, premium and reliable products enable people to become a better version of themselves.

For more information, please visit HONOR online at www.honor.com or email newsroom@honor.com 

https://community.honor.com/  
https://www.facebook.com/honorglobal/  
https://twitter.com/Honorglobal  
https://www.instagram.com/honorglobal/  
https://www.youtube.com/c/HonorOfficial  

1Data comes from HONOR labs.

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SDAIA to Unveil Key AI Strategies and International Collaborations at Global AI Summit Press Conference

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RIYADH, Saudi Arabia, Sept. 7, 2024 /CNW/ — The Saudi Authority for Data and Artificial Intelligence (SDAIA) will hold a press conference on Sunday, September 8, at the King Abdulaziz International Conference Center. The press conference will highlight key aspects of the upcoming third edition of the Global AI Summit, taking place under the patronage of His Royal Highness Prince Mohammed bin Salman bin Abdulaziz Al Saud, Crown Prince, Prime Minister, and Chairman of SDAIA’s Board of Directors. The summit is scheduled for September 10-12, 2024, and will feature over 300 speakers, attracting global thought leaders, policymakers, and AI experts from more than 100 countries.

The press conference will feature remarks from prominent figures, including H.E. Dr. Abdullah bin Sharaf Alghamdi, President of SDAIA, H.E. Dr. Esam bin Abdullah Alwagait, Director of the National Information Center (NIC), and H.E. Dr. Yaser bin Mohammed Al-Onaizan, CEO of the National Center for AI (NCAI) in SDAIA.

Key topics to be covered during the press conference will include the significance of the Crown Prince’s patronage, the summit’s focus areas, and its anticipated impact on the good of humanity, particularly amid the rapid development of AI technologies. It will also showcase how AI is driving economic growth, creating new sectors and industries, and addressing global challenges. Furthermore, the press conference will spotlight Saudi Arabia’s leadership in promoting responsible AI use and ethics on the international stage, while addressing both the opportunities and challenges AI presents.

For more information about the GAIN Summit, please visit:  https://globalaisummit.org/en/default.aspx   

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SOURCE SDAIA

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More Than a Device: Timekettle Unveils W4 Pro AI Interpreter Earbuds at IFA 2024

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BERLIN, Sept. 7, 2024 /PRNewswire/ — Timekettle, the expert in AI translator earbuds, has unveiled its latest innovation, the W4 Pro AI Interpreter Earbuds, at the International Funkausstellung (IFA) 2024. More than a device, the W4 Pro functions like a personal assistant, catering to the cross-language communication needs when hosting foreign guests, conducting multi-language online meetings, or traveling abroad for business or leisure.

“Interpreter earbuds like the W4 Pro are essential even when phones can be used for translation, because they cater to a more refined and immersive user experience,” said Leal Tian, the CEO of Timekettle. “In cross-language communication, there’s a growing need for meaningful conversations and deeper connections beyond basic translations, especially for business pros, immigrants, and travelers. The W4 Pro meets these needs by allowing natural, hands-free conversations with eye contact, making interactions smoother.”

The W4 Pro caters to diverse communication needs in three distinct modes. The first mode focuses on one-on-one simultaneous interpreting. It features advanced technology that allows for instant translation in a two-way conversational setting. Its dual interpretation system redefines successful communication by allowing two voices to merge into a singular flow. The earbuds also incorporate a triple microphone array that enhances voice recognition and translation accuracy.

For professionals navigating multilingual meetings, the W4 Pro’s Listen & Play mode is an ideal choice. It allows seamless switching between listening and speaking with simultaneous interpretation. Timekettle’s AI Semantic Segmentation ensures rapid sentence parsing, enhancing communication and productivity, while AI Memo provides intelligent post-meeting summaries.

The third mode caters to online interactions such as video calls or streaming foreign media content, ensuring users understand every word with real-time translated subtitles and audio summaries post-meeting or event. In addition, unexpected phone calls in a foreign language are no longer a concern, as the W4 Pro offers one-way assisted translation and real-time transcription subtitles, enabling quick information grasp and efficient conversations.

Understanding the importance of user comfort and efficiency, Timekettle has equipped the W4 Pro with an open-ear design, ensuring prolonged comfort without compromising privacy or hygiene. Additionally, its high-end sound quality enriches every interaction, making it comparable to professional audio systems.

Significant Milestone to “Babel Fish”

Timekettle was inspired by the “Babel Fish,” a magical creature from the sci-fi movie “The Hitchhiker’s Guide to the Galaxy.” “Babel Fish” allows people to understand alien languages. Since its inception, Timekettle has been striving to create a real-life “Babel Fish,” enabling everyone to communicate freely across different languages.

Over the past eight years, Timekettle has revolutionized cross-language cultural communication through a series of innovative products. Initially, Timekettle introduced a handheld translator, which, despite requiring users to press a button and wait, significantly aided in understanding across languages. The evolution continued with the M3 Translator Earbuds, allowing users to listen and respond, though still necessitating manual switching of audio channels.

The breakthrough came with the Timekettle WT2 Edge Simultaneous Translator Earbuds, featuring HybridComm™ technology that enabled two-way, real-time communication. Users could speak and listen simultaneously, making conversations more natural and efficient.

Early this year, Timekettle further advanced its technology to process multiple people’s audio in five different languages simultaneously, pushing the boundaries of cross-language communication.

Each of Timekettle’s technological advancements aims to make cross-language communication as seamless as same-language interactions. And now, the Timekettle W4 Pro AI Interpreter Earbuds enable smooth, effective communication in global business negotiations across languages. Looking forward, Timekettle remains committed to achieving universal communication freedom, continuously enhancing its products to facilitate natural and efficient cross-language interactions.

About Timekettle

Established in 2016, Timekettle is dedicated to advancing cross-language communication through innovative products and solutions. Recognized with numerous international accolades, including the CES Innovation Award, iF Design Award, and Japan Good Design Award, Timekettle’s products have proudly served the needs of cross-language communication in a variety of user scenarios, including abroad-living, traveling, multi-language meetings and classrooms, as well as in manufacturing and logistics, and beyond. Having solidified a user database of more than 400,000, Timekettle continues its journey as the Global No.1 AI Translator Device.

For more information, please visit https://www.timekettle.co/

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