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IDTechEx Discusses Co-Packaged Optics (CPO) Packaging Technology Trends and Market Trajectory

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BOSTON, July 24, 2024 /PRNewswire/ — Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64×400 Gbps or 32×800 Gbps pluggable optical transceiver modules. However, these high-speed modules, within their current form factors, pose significant challenges. Issues include the required densities of electrical and optical connectors, as well as escalating power consumption.

To achieve next-generation optical engines supporting 800 Gbps and beyond per module, the communication rate must double to at least 100 Gbps per lane. This increase introduces substantial signal integrity issues across the switch socket, motherboard, and edge connector, leading to heightened power dissipation at SerDes interfaces. In future Ethernet switching, these signal integrity problems may cause I/O power consumption to exceed that of the switch core. Additionally, the integration density of standard pluggable modules is limited by the QSFP/OSFP form factor, necessitating advanced thermal management solutions not yet widely available.

Co-Packaged Optics (CPO) presents a promising solution to these challenges. Unlike traditional pluggable models, CPO integrates optical modules directly onto the switch ASIC substrate, reducing electrical reach and effectively addressing signal integrity issues. This approach has gained traction among major data centers. However, optimizing the packaging strategy for CPO remains a topic of ongoing industry discussion and development. IDTechEx’s latest report, “Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts“, explores these advancements in CPO technology and packaging techniques enabling its adoption.

The importance of advanced semiconductor packaging technologies for Co-Packaged Optics (CPO)

The integration of CPO in data centers aims to boost I/O bandwidth and reduce energy consumption. The way photonic integrated circuits (PICs) are combined with electronic integrated circuits (EICs) and switch ICs, can significantly influence the areal and edge bandwidth density, as well as packaging parasitics. These factors directly affect the transceiver’s I/O bandwidth and energy efficiency, meaning improper integration can negate the advantages of silicon photonics.

For CPO, the integration of photonic and electronic components can be achieved through various methods, each with unique advantages and challenges. The most advanced, and still in the R&D phase, is the 3D monolithic integration. This embeds photonic components within an existing electronic process node with minimal alterations, co-locating active photonics and driving electronics within the same die. This reduces parasitics and simplifies packaging by eliminating the need for interface pads and bumps. However, monolithic integration typically uses older CMOS nodes, resulting in suboptimal photonic performance and higher energy consumption. Despite these limitations, it offers minimal impedance mismatch and simplified packaging.

Conversely, 2D integration places the PIC and EIC side by side on a PCB, connected by wire bonds or flip-chip. This method is straightforward and cost-effective, but introduces significant parasitic inductance, limiting aggregate I/O due to single-edge connections. While 2D integration is easy to package, the reliance on wire bonds constrains the transceiver bandwidth and increases energy consumption, making it less efficient for high-performance applications.

3D hybrid integration offers a more advanced solution by placing the EIC on top of the PIC, via various advanced semiconductor packaging technologies including Through-Si-Via (TSV), high density fan-out, Cu-Cu hybrid bonding, and active photonic interposer, significantly reducing parasitics. The use of advanced semiconductor packaging technologies in 3D integration allows for dense pitch capabilities, enhancing performance. However, thermal dissipation remains a challenge, as the heat generated by the EIC can impact the PIC, necessitating advanced thermal management solutions. Despite these thermal challenges, 3D hybrid integration achieves higher performance due to minimized packaging parasitics.

2.5D integration serves as a compromise, with both the EIC and PIC flip-chipped onto a passive interposer with TSVs. This approach maintains manageable parasitics and dense pitch capabilities similar to 3D integration but adds complexity with the need for interposer traces. While 2.5D integration balances performance, cost, and fabrication turnaround, it incurs higher parasitics than 3D hybrid integration.

In summary, each integration method presents trade-offs between performance, complexity, and cost, with the choice based on specific application requirements and constraints.

Co-Packaged Optics (CPO) market trajectory

According to IDTechEx, the Co-Packaged Optics (CPO) market is projected to exceed $1.2 billion by 2035, growing at a robust CAGR of 28.9% from 2025 to 2035. CPO network switches are expected to dominate revenue generation, driven by each switch potentially incorporating up to 16 CPO PICs. Optical interconnects for AI systems will constitute approximately 20% of the market, with each AI accelerator typically utilizing one optical interconnect PIC to meet increasing demands for high-speed data processing and communication in advanced computing applications.

IDTechEx’s latest report, “Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts”, offers extensive exploration into the latest advancements within Co-Packaged Optics technology. The report delves deep into key technical innovations and packaging trends, providing a comprehensive analysis of the entire value chain. It thoroughly evaluates the activities of major industry players and delivers detailed market forecasts, projecting how the adoption of CPO will reshape the landscape of future data center architecture.

Central to the report is the recognition of advanced semiconductor packaging as the cornerstone of Co-Packaged Optics technology. IDTechEx places significant emphasis on understanding the potential roles that various semiconductor packaging technologies may play within the realm of CPO.

Key aspects of the report include:

Market Dynamics: Examination of key players such as Nvidia, Broadcom, Cisco, Ranovus, and Intel, and the forces shaping the CPO landscape.Innovations in CPO Design: Exploration of advanced CPO designs and their implications for enhancing data center efficiency and shaping future architecture.Semiconductor Packaging Breakthroughs: Insight into the latest advancements in semiconductor packaging, including 2.5D and 3D technologies, and their role in enabling CPO innovation.Optical Engines: Analysis of the drivers behind CPO’s performance and efficiency advantages.CPO for AI Interconnects: Exploration of how optical I/O can address the limitations of copper connections in AI applications, improving efficiency, latency, and data rates.CPO for Switches: Assessment of the potential 25% efficiency gains in high-performance network switches through CPO integration.Challenges and Solutions: Critical review of obstacles to CPO adoption and strategies to overcome them.Future Analysis: Predictions and insights into the next generation of CPO and its anticipated impact on the industry.

The report is based on extensive research and interviews with industry experts and provides valuable insights for anyone interested in gaining a strategic understanding of Co-Packaged Optics’ role in advancing the future of data centers and AI technology.

Market Forecasts:10-year Data Center Population Cumulative Forecast10-year AI Accelerator Unit Shipments Forecast10-year CPO Interconnect for AI (Optical I/O) Unit Shipments Forecast10-year CPO Interconnect for AI (Optical I/O) Market Revenue Forecast10-year CPO-enabled Network Switch Unit Shipments Forecast10-year CPO-enabled Network Switch Market Revenue Forecast10-year Total CPO Market Revenue

For more information on this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/CPO.

For the full portfolio of related research available from IDTechEx please see www.IDTechEx.com/Research/Semiconductors.

About IDTechEx

IDTechEx provides trusted independent research on emerging technologies and their markets. Since 1999, we have been helping our clients to understand new technologies, their supply chains, market requirements, opportunities and forecasts. For more information, contact research@IDTechEx.com or visit www.IDTechEx.com

Media Contact: 
Charlotte Martin 
Subscriptions Marketing Manager
press@IDTechEx.com 
+44(0)1223 812300

Social Media Links: 
X: https://www.twitter.com/IDTechEx 
LinkedIn: https://www.linkedin.com/company/idtechex/ 

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Closer China-ASEAN cooperation boosts regional high-quality development

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NANNING, China, Sept. 28, 2024 /PRNewswire/ — A news report from Beijing Review:

Viet Nam’s aromatic Trung Nguyen coffee, Malaysia’s Musang King durian, Thailand’s fragrant jasmine rice and Laos’ refreshing beer—what do they all have in common?

The answer is they’ve all made an entrance into the vast Chinese market through the China-ASEAN Expo (CAEXPO), earning rave reviews from delighted consumers.

On September 24, the 21st CAEXPO and China-ASEAN Business and Investment Summit kicked off in Nanning, Guangxi Zhuang Autonomous Region. Like a foodie’s fantasy come true and a business bonanza wrapped into one, the expo promised not just to tantalize taste buds but also to turbocharge trade ties between China and its Southeast Asian neighbors.

In addressing the opening ceremony, Chinese Vice Premier Ding Xuexiang said interactions between China and ASEAN have served as the most successful and dynamic model of cooperation in the Asia-Pacific region, and are a vivid example of the building of a community with a shared future for humanity.

Along with the flourishing ties, the expo has become an important supplement to the 10 Plus One cooperation framework between China and ASEAN, providing strong support for regional high-quality development, Luo Yongkun, Deputy Director of the Institute of Southeast Asia and Oceania Studies at the China Institutes of Contemporary International Relations, told Beijing Review.

The expo has been standing as a testament to the enduring friendship, cooperation and shared prosperity between China and ASEAN countries over the years, Kao Kim Hourn, Secretary General of ASEAN, said at the opening ceremony, adding that since its inception in 2004, the event has evolved into an important platform for dialogue, cooperation and development, covering sectors such as infrastructure, agriculture, technology, education and tourism.

China considers ASEAN a priority in its neighborhood diplomacy and a key region in high-quality Belt and Road cooperation,” Ding said. “ASEAN countries, on their part, see in China a trustworthy and close partner.”

The shared values of peace, cooperation and mutual respect between China and ASEAN form the foundation of their partnership, Vongsey Vissoth, Deputy Prime Minister of Cambodia, said, adding he believes that the two sides can achieve more fruitful results through their cooperation in trade and economy, with the China-ASEAN Free Trade Area bringing new opportunities.

China has been ASEAN’s largest trading partner for 15 consecutive years, while ASEAN has been China’s top trading partner since 2020. The cumulative two-way investment has exceeded $400 billion, according to China’s Ministry of Commerce.

The CAEXPO has made important contributions to the economic integration between ASEAN and China, facilitating investment flows and cross-border economic opportunities, laying the foundation for building a more connected, resilient and dynamic region, Kao said.

In 2010, the China-ASEAN Free Trade Area was officially launched, opening a channel for ASEAN enterprises to gain more efficient and convenient access to the Chinese market.

China’s Vice Minister of Commerce Li Fei said mutually beneficial cooperation between China and ASEAN countries has reached new levels.

Bilateral economic and trade cooperation has continued to upgrade over the years, with positive progress achieved in negotiations for version 3.0 of the China-ASEAN Free Trade Area, he added.

As early as 2015, China and ASEAN initiated the construction of the China-ASEAN Information Harbor to cultivate new drivers of economic development. Today, nearly 20 projects across nine ASEAN countries in fields such as digital government, digital industries and new communications have been conducted under the framework, Luo said.

“We need to leverage the harbor to promote digital connectivity and information sharing, and work for a digital Silk Road,” Ding said in his speech.

At this year’s CAEXPO, a new section was conducted to highlight strategic emerging industries, showcasing the latest progresses and technologies in fields such as digital technology, new energy and intelligent connected vehicles.

Leading Chinese green technology companies are also working closely with ASEAN enterprises and investing in new facilities to produce innovative and locally adapted products, contributing to ASEAN’s green transition.

The ongoing efforts to advance the China-ASEAN Free Trade Area 3.0 will lead to a broader opening up in investment and services trade, Lei Xiaohua, a researcher with the Southeast Asia Research Institute at the Guangxi Academy of Social Sciences, said, adding that the CAEXPO will be endowed with a new mission in future regional industrial and supply chain cooperation.

View original content:https://www.prnewswire.com/apac/news-releases/closer-china-asean-cooperation-boosts-regional-high-quality-development-302261693.html

SOURCE Beijing Review

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American Solar Energy Society Launches National Solar Tour App for Attendees

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BOULDER, Colo., Sept. 28, 2024 /PRNewswire/ — The American Solar Energy Society (ASES) has launched the brand-new National Solar Tour App, now available for download on both the Apple App Store and Google Play Store. This cutting-edge app is designed to enhance the experience for attendees of the National Solar Tour, providing a streamlined way to explore and engage with solar and other clean energy installations and sustainable technologies across the country.

The National Solar Tour is the largest grassroots solar event in the United States, connecting thousands of people to learn about solar energy and sustainable solutions from those who live and work with it every day. The showcase weekend traditionally takes place the first weekend in October but is held virtually throughout the year. The new app will make attending the tour even more accessible and interactive for clean energy enthusiasts wanting to learn more about solar energy.

Key Features of the National Solar Tour App:

Interactive Map: Easily browse the ASES National Solar Tour map to find examples of the many types of solar energy and other energy-saving technology near you.RSVP to In-Person Tours: Conveniently RSVP to in-person events and plan your tour stops.Seamless Navigation: Effortlessly navigate to tour sites using your favorite maps app.

“This app opens new doors for clean energy supporters to connect with solar innovations firsthand,” says Carly Rixham, Executive Director of the American Solar Energy Society. “It’s designed to create an engaging experience for tour attendees and make the discovery of local solar projects even more accessible and exciting.”

The app is only intended for National Solar Tour attendees. Tour hosts should continue managing their site and event listings through the existing web portal at map.nationalsolartour.org.

Whether you’re a homeowner curious about installing solar panels or a business interested in adopting clean energy solutions, the National Solar Tour App will guide you to events and installations that inspire sustainable action.

Download the App Today:

Apple App Store: Download for iOSGoogle Play Store: Download for Android

For more information, visit nationalsolartour.org and follow us on social media for updates. The main showcase weekend is October 4-6, but tours take place all throughout the year and can be found on the National Solar Tour Map.

About American Solar Energy Society
The American Solar Energy Society (ASES) is a leading nonprofit advocating for sustainable living and 100% renewable energy. Since 1954, ASES has worked to accelerate the transition to a renewable energy economy through education, policy advocacy, and community events, including the annual National Solar Tour, annual National Solar Conference, and Solar Today Magazine.

Contact Information
For media inquiries, please contact:
solartour@ases.org
303-443-3130
Website: https://www.ases.org

 

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SOURCE American Solar Energy Society

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DIGITIMES Asia: Qualcomm circles Intel for takeover: biting off more than it can chew?

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TAIPEI, Sept. 28, 2024 /PRNewswire/ — The Wall Street Journal reported that Qualcomm has approached Intel for a potential takeover, a story later verified by CNBC. While the news initially sparked a 3% rally in Intel’s share price, significant doubts remain about the feasibility of such a deal.

According to the news report from the technology-focused media DIGITIMES Asia, a takeover could offer strategic value for Qualcomm, but the complexities of acquiring a company of Intel’s size and stature raise numerous questions. Here are the key challenges Qualcomm would need to overcome to make the deal successful:

Regulatory approval

One of the most significant obstacles is likely to be regulatory scrutiny. Given Intel’s size and market position in the semiconductor industry, antitrust authorities in multiple jurisdictions would carefully evaluate any acquisition. Concerns about market monopolization could lead to regulatory pushback or even prevent the merger altogether.

The semiconductor industry is heavily regulated, and any significant changes to the structure or operations of Intel’s foundry could attract scrutiny from antitrust authorities. Qualcomm would need to ensure that any divestitures or restructuring do not violate competition laws, particularly given Intel’s prominent position in the market.

Some argue that Qualcomm’s takeover bid could survive the competition law review because Intel is facing financial difficulties, and the two companies do not compete in the same market spaces, except for PC CPUs. However, the deal would still need to go through reviews in other countries, including China, whose passive disapproval led to the failure of Intel’s acquisition of Tower Semiconductor.

Intel’s internal resistance

Intel’s management may resist a takeover, particularly if they believe the company can turn its fortunes around independently. Qualcomm’s bid could face significant challenges if Intel’s leadership does not support the acquisition or sees it as strategically disadvantageous.

Market reaction, stakeholder support, and existing industry relationships

The success of a bid often relies on the reactions of shareholders and market stakeholders. If Intel’s shareholders see more value in maintaining independence or if there is skepticism about the strategic fit of Qualcomm acquiring Intel, this could lead to difficulties in securing the necessary support for the acquisition.

Qualcomm may need to navigate Intel’s existing relationships with its customers, partners, and suppliers, especially if those entities are concerned about the implications of a takeover.

For example, Intel’s foundry business may have existing contracts with third-party clients, including the recently announced AWS deal. If Qualcomm decides to scale back or eliminate this segment, it could lead to legal disputes or loss of revenue from already established contracts, impacting Qualcomm’s cash flow.

Financial viability

Qualcomm would need to ensure that it has the financial resources to make a competitive bid for Intel while also addressing any existing debts or liabilities Intel carries. According to Qualcomm’s financial report for the third quarter of its fiscal 2024, the three months to June 23, the company had only US$7.8 billion in cash and cash equivalents at its disposal and just over US$23 billion in total assets.

With Intel’s market value around US$93 billion, a stock-for-stock transaction is most likely for the takeover. However, Qualcomm would have to convince investors and financial institutions of the potential profitability of the acquisition, considering Intel’s financial struggles with its foundry business.

Strategic and operational alignment

The takeover offers Qualcomm numerous benefits, including a vast portfolio of intellectual properties (IPs), a significant market share in the PC chip market, and an accelerated entry into edge AI computing, a promising area for future growth.

However, merging two large organizations with distinct cultures and operational methods always presents significant challenges. Qualcomm would need to develop a comprehensive integration plan to address potential disruptions and ensure a smooth transition.

While Qualcomm’s bid to acquire Intel could theoretically provide a significant advantage in the competitive semiconductor landscape, several formidable challenges stand in the way. The success of the takeover would depend on a favorable regulatory environment, the response of Intel’s management and shareholders, solid financial backing, and a well-defined strategy that highlights the expected benefits of the consolidation.

Given the complexities involved, predicting whether Qualcomm’s bid would succeed is challenging, and it could ultimately require careful negotiation, strategic planning, and a willingness to adapt to the responses of various stakeholders.

Original link: https://www.digitimes.com/news/a20240922VL200.html

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SOURCE DIGITIMES ASIA

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