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2024 MWC Shanghai | H3C Fully Demonstrates New Achievements in Intelligent Computing, Accelerating the Construction of a New Intelligent Era

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SHANGHAI, June 29, 2024 /PRNewswire/ — From June 26 to 28, 2024, the Mobile World Congress Shanghai (MWC Shanghai) grandly opened at the New International Expo Center. Themed “Future First,” this year’s conference focused on cutting-edge topics such as “5G and Beyond,” “AI Economy,” and “Manufacturing DX.” Under the theme “Dedication, For A Smarter Future”, H3C comprehensively showcased its innovative products and solutions in the fields of “Cloud-Network-Security-Computing-Storage-Terminal,” as well as the practical outcomes of AI technology applications across various industries.

During the exhibition, H3C’s booth attracted close attention from domestic carriers and industry customers, as well as overseas customers and partners from Spain, Turkey, KSA, Mexico, Vietnam, Thailand, Indonesia, and the Philippines. They delved deep into H3C’s full-stack technical strength and its successful cases and practical experiences in the global market.

Computing Power × Connectivity: Unleashing the Infinite Potential of AIGC

Amidst the explosive growth in computing power demand, H3C, through technological innovation, has achieved a deep integration of diversified computing power and standardized connectivity, breaking the “invisible barriers” within AIGC infrastructure. This allows for more flexible scheduling and release of computing power, providing more efficient and stable support for model training and inference.

LinSeer Intelligent Computing Solution: H3C fully demonstrated the industry-leading LinSeer Intelligent Computing solution, fully leveraging the multiplying effect of “computing power x connectivity.” Anchoring the “1+N” large-scale model strategy (LinSeer private large-scale model + N selected ecological large-scale models), it accelerates the formation of new quality productive forces across various industries.

Multi-Heterogeneous Computing Power: Facing the continuous growth in computing power demand from generative AI, H3C introduced the new multi-heterogeneous computing power platforms H3C UniServer R5330 G7 and H3C UniServer R5500 G7. With multiple advantages such as diverse heterogeneity, powerful computing capacity, flexible architecture, and strong scalability, these platforms provide robust support for different AI workloads, contributing to the high-quality development of the digital economy.

The AMPHA Computing Power Platform 3.0: Centered around “computing power as service,” the platform achieves efficient utilization of computing resources through unified intelligent scheduling of heterogeneous computing power, AI full-cycle development services, and large-scale intelligent computing center operations management. Supporting the scheduling of unified computing power across large-scale clusters and compatible with various architecture acceleration cards, it significantly enhances resource utilization. Additionally, it provides AI full-cycle development services from data processing to application deployment, accelerating the practical application of AI technologies.

Intelligent Computing Center Network: Aimed at AI large-scale model training scenarios, H3C’s end-to-end collaborative intelligent computing network solution features large-scale networking capabilities, highly efficient computing communication, and superior operational capabilities. With an advanced DDC (Distributed Data Center) architecture, it offers innovative zero-congestion lossless solutions, enhancing computing communication efficiency. H3C also teamed up with China Mobile to launch the industry-leading Global Scheduling Ethernet (GSE) solution, jointly creating a new intelligent computing network. H3C showcased the world’s first single-chip 51.2T 800G CPO silicon photonics switch, capable of supporting an AIGC cluster size exceeding 32,000 nodes and improving GPU computational efficiency by 25%, ensuring maximum AIGC cluster computational performance.

Wide Area Computing Network: Addressing the computational power needs of customers across various scales and industries, H3C has built a high-speed, low-cost, computational power-adapted “computational power highway” by upgrading 400G ports and incorporating computational power factors into routing algorithms. Additionally, it launched service-based computational power private lines, providing elastic, differentiated computational power transmission services for sudden large-scale computational power demands, enabling on-demand construction and significantly enhancing the cost-effectiveness and service flexibility of government and enterprise customers, promoting the inclusive supply of computational power resources.

Converged Edge Cloud Network: H3C provides critical technical support for the business transformation of To C/To H/To B through computational power sinking to build ecological platforms, attracting multiple businesses to settle at the edge. On the cloud side, edge application servers adopt a modular design, enhancing GPU inference capabilities, adapting to various environments, and ensuring green and efficient delivery. On the network side, the edge cloud gateway’s control-separation design and large-capacity high-density characteristics support multi-business offloading, achieving cloud-edge collaborative optimization.

AI × Future: Building a New Intelligent Era

During the exhibition, H3C fully showcased its innovative technologies and applications in the AIGC field. Based on the “AI for All” industry empowerment strategy, H3C actively supports the practical application of AI technology in various industries, creating a more intelligent world.

Rooted in the needs of the AIGC era, H3C, in collaboration with ecosystem partners, established the Hangzhou Turing Town AIGC Intelligent Computing Center, promoting the LinSeer private large-scale model in the Ningxia Hui Autonomous Region, Hangzhou, Zhengzhou, and other locations, as well as pilot applications in several large enterprises. The AIGC LinSeer integrated machine showcased on-site serves as the smallest unit for implementing large-scale model applications, helping various industry users quickly realize model privatization delivery.

In deepening government-enterprise cooperation, H3C relies on its layout in cutting-edge technologies such as computational power networks and deterministic networks, helping carriers achieve computational-network integration and cloud-network integration, jointly creating competitive scenario-based solutions. By integrating full-chain resources, H3C collaborates with carriers to provide solutions for key areas such as public sector, healthcare, education, and enterprises, promoting the digital transformation of industry development and social governance.

Digital Life Within Reach

H3C brought the latest products and solutions from its commercial and intelligent terminal series to the scene, providing users with a seamless digital life experience through innovative technology and leading product experiences in key areas such as smart homes, smart education, and smart healthcare. Among them, the brand-new FTTR series solution revolutionizes the network experience for homes and businesses.

Furthermore, H3C also showcased a deeply integrated, experience-prioritized, secure and reliable, and intelligently empowered digital workspace. Through mobile cloud computers and innovative “cloud + software + terminal” solutions, H3C intuitively delivers to users in desktop form, enabling them to enjoy instant cloud computer services anytime, anywhere with just one terminal, meeting diverse scenario needs.

As a trusted core strategic partner for carriers, H3C deeply participates in the cloud infrastructure and network construction of the three major carriers and collaborates with them to fully engage in fields such as smart cities, intelligent manufacturing, smart education, and smart healthcare, creating a series of industry benchmark projects and contributing to the construction of “Digital China.” Looking to the future, H3C will adhere to the philosophy of “Dedication, For A Smarter Future,” deeply engaging in AIGC technology innovation and application expansion. In the new round of technological revolution and industrial transformation, H3C will continue to create value for customers in collaboration with partners, jointly building a more intelligent, efficient, and beautiful future.

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SOURCE H3C

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TCL CSOT Showcases Industry-First IJP OLED Family Bucket Across All Form Factors at SID Display Week 2025

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SAN JOSE, Calif., May 18, 2025 /PRNewswire/ — TCL CSOT, a global leader in advanced display technologies, made a commanding appearance at SID Display Week 2025, the premier global summit for the display industry. Reinforcing its leadership in Inkjet Printing OLED (IJP OLED), TCL CSOT unveiled the latest innovations from its APEX platform – highlighted by a comprehensive IJP OLED family bucket. This full-category lineup demonstrates the company’s unmatched capabilities in scaling IJP OLED across all mainstream form factors and advancing both its industrialization and ecosystem development.

World’s First IJP OLED Mobile Display (6.5″)

At the forefront of mobile innovation, TCL CSOT debuted a 6.5-inch IJP OLED smartphone panel, marking a significant milestone in the IJP OLED space. Dubbed the “True Color Screen,” it features a Real RGB pixel structure with a resolution of 824×1833, delivering 326 PPI – equivalent to 460 PPI in Pentile. With 99% DCI-P3 color coverage, a native contrast ratio of 1,000,000:1, and a lightning-fast 0.1ms response time, the display offers brilliant image fidelity and performance. Additionally utilizing a 3μm printing precision, the panel incorporates a 460nm low blue light eye-care display feature.

4K 120Hz IJP OLED Monitor Display (27″)

Featuring advanced IJP OLED technology, TCL CSOT’s 27-inch monitor delivers stunning 4K ultra-HD visuals with precise, vivid colors thanks to its stripe RGB pixel arrangement and wide color gamut. A 120Hz refresh rate ensures smooth motion, while the 3-sided bezel-less design offers an expansive, immersive experience for both professional work and entertainment.

World’s First IJP OLED Pad Display (14″)

Expanding into productivity and creativity segments, TCL CSOT unveiled the “Lingyun Display,” a 14-inch tablet panel representing a breakthrough in portable OLED. With a resolution of 1920×1200 and 99% DCI P3 RGB color gamut, it is engineered for professional-grade visuals. Inkjet printing technology allows for a 30% boost in pixel density through micron-level deposition. An anti-glare surface, ultra-thin 0.2mm cover glass, and stylus-ready interaction round out the premium feature set. With an RGB stripe layout and advanced algorithms, the panel achieves minimal aliasing and rich grayscale accuracy calibrated to Gamma 2.2.

World’s First Oxide IJP OLED Notebook Display (14″)

In the notebook category, TCL CSOT showcased the first-ever 14-inch oxide IJP OLED notebook panel. This innovation merges oxide TFT backplane advantages – such as lower power consumption and faster response – with the visual brilliance of OLED. Offering a 2.8K high-resolution canvas and a contrast ratio over 1,000,000:1, the display enables precise color output and power-efficient operation. The inkjet manufacturing process further enhances material efficiency and supports scalable, eco-conscious production, setting a new standard for next-gen mobile computing displays.

From 6.5″ to 65″: The Industry’s First Full IJP OLED Family Bucket

With a full-spectrum portfolio that includes smartphones, tablets, laptops, rollable displays, and TVs, TCL CSOT has become the first manufacturer to commercialize a complete family bucket of IJP OLED products. As a pioneer in mass production and a consistent driver of technological breakthroughs, TCL CSOT continues to lead the global push toward scalable, sustainable, and high-performance printed OLED innovation.

About TCL CSOT

Established in 2009, TCL China Star Optoelectronics Technology Co., Ltd. (TCL CSOT) is a leading global innovator in display technologies. Its LCD, OLED, and MLED solutions power applications across TVs, smartphones, tablets, laptops, monitors, automotive systems, VR/XR, and commercial displays. With continuous investment in R&D and a strong global supply ecosystem, TCL CSOT is committed to shaping the future of display technology with intelligent, energy-efficient, and user-centric innovations. As part of TCL’s Worldwide Olympic Partnership, TCL CSOT is proud to deliver display solutions that elevate experiences on the global stage.

 

View original content to download multimedia:https://www.prnewswire.com/news-releases/tcl-csot-showcases-industry-first-ijp-oled-family-bucket-across-all-form-factors-at-sid-display-week-2025-302458526.html

SOURCE TCL China Star Optoelectronics Technology

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TCL CSOT Unveils APEX Platform Innovations to Elevate Display Experiences at SID Display Week 2025

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SAN JOSE, Calif., May 19, 2025 /PRNewswire/ — TCL CSOT, a global leader in advanced display technologies, made a commanding appearance at SID Display Week 2025, the premier global summit for the display industry. Reinforcing the strength of its APEX high-end innovation platform – built on four pillars: Amazing – Pleasant Display Experience, Protective – Reliable Vision Health, Eco-friendly – Sustainable Green and Low-carbon, X – Unlimited Future Imagination – the company unveiled a comprehensive portfolio of next-generation displays that redefine user experience, sustainability, and form factor possibilities across scenarios.

Amazing Display Experience: Elevating Visual Immersion

TCL CSOT presented a series of groundbreaking displays designed to deliver outstanding visual clarity, color precision, and immersive form factors – advancing the frontier of what users can see and feel:

World’s Highest Image Quality LCD TV Display (98″)
This 98-inch large-screen LCD TV achieves cinema-grade picture quality by combining an ultra-wide 178° viewing angle with an ultra-low reflectance rate of just 0.8%. Powered by a proprietary RGB Mini-LED backlight system, it delivers a 95% coverage of the BT.2020 color gamut, delivering stunning color depth for a premium home theater experience.

World’s First Mass Production CUP OLED Notebook Display (14″)
This 14-inch OLED panel features an industry-leading 98% screen-to-body ratio made possible through TCL CSOT’s proprietary Camera Under Panel (CUP) technology. With a 4K resolution (3840×2400), 120Hz refresh rate, and full-spectrum color gamut coverage (100% DCI-P3, and Adobe RGB), it delivers professional-grade visual performance.

World’s First Ultra-Wide Color Gamut OLED Mobile Display (6.36″)
With advanced OLED structural design and optimized materials, this is the world’s first FMM OLED mobile display that achieves 95% BT.2020 ultra-wide color gamut coverage (CIE 1931), ensuring exceptional visual excellence for next-generation smartphones.

Protective Vision Health: Designed for Visual Wellbeing

Prioritizing eye-care, TCL CSOT introduced innovations for healthier visual experiences:

World’s First Natural-Spectrum Slim Pad Display (12.1″)
This industry-first LCD tablet display replicates the full visible spectrum of natural sunlight with a 50% natural light ratio – more than double that of conventional displays. The display helps provide a more comfortable viewing experience for extended screen use.

Eco-Friendly Innovation: Driving Sustainable Display Performance

TCL CSOT showcased its continued leadership in energy-efficient design, bringing forward low-power display technologies that balance high performance with environmental responsibility:

World’s First Lowest Power Consumption PLP OLED Mobile Display (6.96″)
This mobile OLED screen achieves a 45% reduction in EL power consumption through advanced panel design and a next-generation high-transmittance color filter. With full BT.2020 color gamut coverage (up to 92%) and seamless IR sensor integration, it ensures high display fidelity while extending device battery life.

World’s Lowest Power LTPO Notebook Display (14.5″)
This LTPO panel transitions seamlessly from 0.3Hz to 120Hz depending on user activity. In static content scenarios, it enables a deep sleep state with power usage as low as 240mW, effectively doubling battery life.

Unlimited Future Imagination: Redefining the Possibilities of Display

Expanding the potential of visual technology beyond conventional formats, TCL CSOT continues to pioneer new paradigms in intelligent design, modularity, and spatial integration:

World’s Narrowest Splicing Dual-Curved Display (23.6″)
Designed for next-generation automotive cockpits, the dual 23.6-inch Mini-LED curved displays offer a seamless 1.0mm panel-to-panel gap, with integrated local dimming zones (9589*2). A hidden wood-grain visual layer blends harmoniously with vehicle interiors, balancing functionality and aesthetics with an ultra-wide color gamut for an immersive driving interface.

APEX Innovation Platform: Enabling the Next Leap in Intelligent Display Experiences

TCL CSOT’s full-spectrum showcase at SID 2025 illustrates how the APEX innovation platform is redefining what’s possible across every dimension of display: stunning visual quality, trusted vision protection, low-carbon energy performance, and future-facing form innovation. APEX continues to serve as the company’s blueprint for next-generation breakthroughs, enabling smarter, more sustainable, and more human-centric display solutions.

About TCL CSOT
Established in 2009, TCL China Star Optoelectronics Technology Co., Ltd. (TCL CSOT) is a leading global innovator in display technologies. Its LCD, OLED, and MLED solutions power applications across TVs, smartphones, tablets, laptops, monitors, automotive systems, VR/XR, and commercial displays. With continuous investment in R&D and a strong global supply ecosystem, TCL CSOT is committed to shaping the future of display technology with intelligent, energy-efficient, and user-centric innovations. As part of TCL’s Worldwide Olympic Partnership, TCL CSOT is proud to deliver display solutions that elevate experiences on the global stage.

 

SOURCE TCL China Star Optoelectronics Technology

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MiTAC Computing Showcases Strategic AI and Cloud Infrastructure Partnership with AMD at COMPUTEX 2025

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TAIPEI, May 19, 2025 /PRNewswire/ — MiTAC Computing Technology Corporation, a leading server platform designer and manufacturer and a subsidiary of MiTAC Holdings Corporation (TSE:3706), will spotlight its long-term collaboration with AMD at COMPUTEX 2025 (Booth M1110). The two companies will jointly present a broad portfolio of next-generation server platforms powered by AMD EPYC™ processors and AMD Instinct™ GPUs, highlighting their shared commitment to advancing scalable, energy-efficient infrastructure for AI, HPC, cloud-native, and enterprise environments.

A Strategic Milestone: Over Two Decades of Innovation

Since introducing its first AMD-based dual-socket server motherboard in 2002, MiTAC—through its TYAN brand—has cultivated a strong, enduring ecosystem partnership with AMD. This collaboration has enabled MiTAC to consistently deliver high-performance, AMD-powered platforms that meet the evolving demands of modern data centers.

“At MiTAC Computing, we are proud to extend our partnership with AMD as we continue developing advanced, scalable, and energy-efficient server platforms,” said Rick Hwang, President of MiTAC Computing Technology Corp. “By integrating AMD’s latest EPYC™ 9005 and 4005 series processors, AMD Instinct™ MI325X GPUs, and the upcoming MI350 series GPUs and platforms, we’re enabling our global customers to unlock new capabilities in AI infrastructure and high-performance computing.”

AI & HPC Innovation: Built to Accelerate

MiTAC G8825Z5
An 8U powerhouse optimized for intensive AI and HPC use cases. Featuring dual AMD EPYC™ 9005 Series processors and support for up to 8 AMD Instinct™ MI325X GPUs, it offers massive compute density and up to 6TB of DDR5-6400 memory, ideal for large-scale AI model training and scientific computing.

TYAN TN85-B8261
A 2U dual-socket GPU server supporting up to four dual-slot GPUs. Equipped with 24 DDR5-6400 RDIMM slots and tool-less NVMe storage carriers, it delivers high-speed throughput and flexibility for deep learning and HPC environments.

MiTAC C2820Z5
An OCP-powered direct liquid-cooled, high-density 2OU 4-node platform tailored for energy-efficient HPC workloads. Powered by dual AMD EPYC™ 9005 processors, it offers enhanced thermal performance and scalability, ideal for next-gen AI clusters.

Cloud-Ready Infrastructure: Optimized for Scale-Out

MiTAC M2810Z5
A 2U 4-node single-socket server built for high-density cloud computing. Each node supports up to 3TB DDR5-6400 memory and four E1.S drives, enabling fast, scalable deployments in hyperscale environments.

TYAN HG68-B8016
A 6U multi-node platform designed for cloud gaming and compute-heavy workloads. It includes five single-socket nodes using AMD EPYC™ 4005 Series processors, each with DDR5-5600 memory and NVMe storage, maximizing efficiency for cloud-native operations.

Enterprise-Grade Platforms: High IOPS, Scalable Storage

MiTAC TS70A-B8056
A 2U single-socket server built for enterprise storage and virtualization. Supporting up to 26 NVMe U.2 drive bays, 24 DDR5-5200 DIMM slots, and dual PCIe 5.0 expansion slots, it’s ideal for data-intensive workloads like software-defined storage and database acceleration.

One MiTAC Strategy: End-to-End Solutions

MiTAC Computing’s integrated “One MiTAC” strategy unites its server hardware expertise with MiTAC Information Technology’s software integration capabilities. By combining AMD’s CPU and GPU platforms with MiTAC’s full-stack design and deployment capabilities, the companies jointly deliver complete AI and data center solutions across government, transportation, finance, and hyperscale industries.

Whether it’s overcoming challenges in AI cluster deployment or supporting mission-critical enterprise systems, MiTAC Computing and AMD are enabling customers to scale efficiently and innovate faster.

A Shared Vision for the Future

Looking ahead, MiTAC Computing and AMD are focused on driving further innovation in AI infrastructure, HPC cluster scaling, cloud-native system design, and energy-efficient computing. With upcoming support for AMD Instinct™ MI350 GPUs for liquid cooling, MiTAC Computing is preparing for the next wave of high-performance AI deployments.

Visit MiTAC Computing at COMPUTEX 2025 – Booth M1110

Experience MiTAC Computing’s full AMD-powered product lineup and talk with solution experts.
Explore more: https://www.mitaccomputing.com/en/campaign/computex2025

AMD, the AMD Arrow logo,  AMD Instinct, EPYC and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

About MiTAC Computing Technology Corporation

MiTAC Computing Technology Corp., a subsidiary of MiTAC Holdings, delivers comprehensive, energy-efficient server solutions backed by industry expertise dating back to the 1990s. Specializing in AI, HPC, cloud, and edge computing, MiTAC Computing employs rigorous methods to ensure uncompromising quality not just at the barebone level but more importantly, at the system and rack levels—where true performance and integration matter most. This commitment to quality at every level sets MiTAC Computing apart from others in the industry. The company provides tailored platforms for hyperscale data centers, HPC, and AI applications, guaranteeing optimal performance and scalability.

With a global presence and end-to-end capabilities—from R&D and manufacturing to global support—MiTAC Computing offers flexible, high-quality solutions designed to meet unique business needs. Leveraging the latest advancements in AI and liquid cooling, along with the recent integration of Intel DSG and TYAN server products, MiTAC Computing stands out for its innovation, efficiency, and reliability, empowering businesses to tackle future challenges.

Visit our corporate website: https://www.mitaccomputing.com/

SOURCE MiTAC Computing Technology Corp.

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