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Fan-Out Wafer Level Packaging Market size is set to grow by USD 5.52 billion from 2024-2028, increased demand for compactly designed electronics to boost the market growth, Technavio

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NEW YORK, June 19, 2024 /PRNewswire/ — The global fan-out wafer level packaging market  size is estimated to grow by USD 5.52 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 23.77%  during the forecast period.  Increased demand for compactly designed electronics is driving market growth, with a trend towards increasing adoption of semiconductor ics in automobiles. However, increased production costs because of warpage  poses a challenge. Key market players include Amkor Technology Inc., ASE Technology Holding Co. Ltd., Deca Technologies Inc., Infineon Technologies AG, Jiangsu Changdian Technology Co. Ltd., nepes Corp., Nordson Corp., NXP Semiconductors NV, Onto Innovation Inc., Panasonic Holdings Corp., Powertech Technology Inc., Renesas Electronics Corp., Singapore Semiconductor Industry Association, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., Winbond Electronics Corp., Yield Engineering Systems, and Yole Developpement SA.

Get a detailed analysis on regions, market segments, customer landscape, and companies – Click for the snapshot of this report

Forecast period

2024-2028

Base Year

2023

Historic Data

2018 – 2022

Segment Covered

Technology (High density and Standard density), Type (200 mm, 300 mm, and Panel), and Geography (APAC, North America, Europe, South America, and Middle East and Africa)

Region Covered

APAC, North America, Europe, South America, and Middle East and Africa

Key companies profiled

Amkor Technology Inc., ASE Technology Holding Co. Ltd., Deca Technologies Inc., Infineon Technologies AG, Jiangsu Changdian Technology Co. Ltd., nepes Corp., Nordson Corp., NXP Semiconductors NV, Onto Innovation Inc., Panasonic Holdings Corp., Powertech Technology Inc., Renesas Electronics Corp., Singapore Semiconductor Industry Association, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., Winbond Electronics Corp., Yield Engineering Systems, and Yole Developpement SA

Key Market Trends Fueling Growth

The automotive industry’s shift from mechanical and hydraulic systems to electronic or hybrid alternatives, driven by the rise of autonomous cars, is fueling the demand for semiconductor ICs and sensors. This trend is leading to the increased adoption of FOWLP (Fan-Out Wafer Level Packaging) technology in the automotive sector. Major car manufacturers like Audi, General Motors, and Tesla are investing in ICs and sensors for advanced driver assistance systems (ADAS) and autonomous vehicles. FOWLP offers high material density, greater I/O points, and improved reliability, making it the preferred packaging solution for automotive ICs. Safety regulations and the need for smart automotive solutions are also driving the demand for MEMS sensors, further boosting the FOWLP market. 

The Fan-Out Wafer Level Packaging (FO-WLP) market is experiencing significant growth, driven by the increasing demand for smaller, more efficient semiconductor devices. Memory and logic semiconductors are the primary applications for FO-WLP technology. The use of FO-WLP in power management and sensor applications is also on the rise. The trend towards higher integration and miniaturization in electronics is fueling the adoption of FO-WLP. The technology offers several advantages, including reduced power consumption, improved reliability, and increased design flexibility. The future looks bright for FO-WLP, with continued innovation and advancements expected in this dynamic market. 

Research report provides comprehensive data on impact of trend. For more details- Download a Sample Report

Market Challenges

The FOWLP market faces challenges due to warpage issues, which increase production costs. Warpage is a distortion in the molded part’s surface, leading to wafer deformation and wastage. Differential shrinkage, thermal expansion mismatches, and post-processing steps are common causes. These issues result in higher manufacturing and packaging costs for ICs, potentially hindering market growth.The Fan-Out Wafer Level Packaging (FO-WLP) market faces several challenges. One challenge is the complexity of the technology, which requires precise chip placement and interconnect design. Another challenge is the high cost of FO-WLP compared to traditional packaging methods. Additionally, the need for high yield and reliability in FO-WLP is crucial for mass production. Furthermore, the integration of different materials and processes in FO-WLP can be difficult, requiring advanced manufacturing techniques. Lastly, the increasing demand for smaller form factors and higher performance in electronic devices puts pressure on the FO-WLP industry to continuously innovate and improve.

For more insights on driver and challenges – Download a Sample Report

Segment Overview 

This fan-out wafer level packaging market report extensively covers market segmentation by

Technology 1.1 High density1.2 Standard densityType 2.1 200 mm2.2 300 mm2.3 PanelGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa

1.1 High density-  The Fan-Out Wafer Level Packaging (FO-WLP) market is experiencing significant growth due to the increasing demand for miniaturization and higher integration in semiconductor devices. FO-WLP technology enables the direct connection of dies to the substrate, reducing the number of interconnects and improving overall performance. Companies such as Samsung, Micron, and SK Hynix are leading the market with their innovative FO-WLP solutions. This technology is particularly beneficial for memory and logic applications, leading to its widespread adoption in the consumer electronics and automotive industries.

For more information on market segmentation with geographical analysis including forecast (2024-2028) and historic data (2018 – 2022)  – Download a Sample Report

Research Analysis

The Fan-Out Wafer Level Packaging (FO-WLP) market is experiencing significant growth in various sectors, including consumer electronics and advanced electronics. FO-WLP is a semiconductor-based technology that enables footprint-sensitive devices, such as smartphones, smartwatches, and laptops, to incorporate high-performing ICs with minimal increase in size and weight. This technology utilizes advanced packaging methods, such as PoP (Package-on-Package) and memory-on-logic solutions, to enhance the functionality of consumer electronics. FO-WLP also addresses thermal issues by employing wafer-level packaging and wafer-level processes. The IC packaging technology reduces manufacturing costs and enables heterogeneous integration and panel level technology in ultra-thin portable devices. FO-WLP is revolutionizing the consumer electronics sector by enabling the production of high-performing, compact devices.

Market Research Overview

The Fan-Out Wafer Level Packaging (FO-WLP) market refers to the technology and process of integrating various semiconductor devices onto a single wafer using wafer-level packaging techniques. This packaging method offers several advantages such as reduced interconnect resistance, improved reliability, and enhanced system performance. The FO-WLP market caters to various applications including memory, logic, and sensor technologies. The technology is gaining popularity due to the increasing demand for miniaturization, higher integration density, and the need for advanced packaging solutions in the electronics industry. The market is expected to grow significantly in the coming years due to the increasing adoption of FO-WLP in advanced semiconductor applications. The process involves various techniques such as redistribution layer (RDL) formation, wafer bonding, and final packaging. The market is driven by factors such as the increasing demand for high-performance and power-efficient semiconductor devices, the miniaturization trend in the electronics industry, and the growing adoption of advanced packaging solutions.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

TechnologyHigh DensityStandard DensityType200 Mm300 MmPanelGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Technology

VAS Community and Evander Reed Introduce Member Progress Tracker

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VAS Community, under the leadership of Evander Reed, announces the rollout of a new Member Progress Tracker feature, enabling users to visualize their learning, participation, and contributions within the platform.

NEW YORK, May 24, 2025 /PRNewswire-PRWeb/ — VAS Community, led by founder Evander Reed, today introduced its latest feature: the Member Progress Tracker. Designed to enhance user awareness, motivation, and long-term engagement, the new tool provides members with a clear overview of their personal journey within the VAS Community platform.

The Progress Tracker captures key activity metrics such as learning milestones, participation in community events, peer contributions, and completed modules. It is structured to help members reflect on their growth over time, reinforce consistent engagement, and celebrate meaningful achievements.

Key features of the Member Progress Tracker include:

Learning Path Visualization: Displays completed courses, saved materials, and topic engagement history.

Community Participation Log: Chronicles involvement in discussions, live sessions, and interest groups.

Recognition Timeline: Highlights milestones such as anniversaries, featured contributions, and community acknowledgments.

Custom Goals Interface: Allows members to set personal objectives and monitor progress within the platform environment.

Evander Reed emphasized the intent behind the development:

“Personal growth deserves to be seen, not just felt. This feature reinforces our belief that every step in a member’s journey has value and visibility.”

The Progress Tracker reflects VAS Community‘s broader effort to prioritize user experience and foster self-directed development. It also supports the platform’s ongoing mission to create an ecosystem where users are empowered to learn, connect, and lead with purpose.

The new feature is available immediately to all registered members and can be accessed through the main user dashboard. VAS Community plans to integrate additional data points and visual elements in future updates, including comparative insights and community impact summaries.

This release follows several recent platform enhancements aimed at improving navigation, personalization, and regional engagement. As VAS Community enters its next stage of development, tools like the Member Progress Tracker will play a central role in deepening user connection and sustaining long-term platform value.

Disclaimer: The information provided in this press release is not a solicitation for investment, nor is it intended as investment advice, financial advice, or trading advice. It is strongly recommended you practice due diligence, including consultation with a professional financial advisor, before investing in or trading cryptocurrency and securities.

Media Contact

Matthew Price, VAS Community, 1 724-795-2484, service@thevascommunity.com, https://thevascommunity.com/

View original content to download multimedia:https://www.prweb.com/releases/vas-community-and-evander-reed-introduce-member-progress-tracker-302463937.html

SOURCE VAS Community

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Club Offers Released on May 25, 2025

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NEW YORK, May 24, 2025 /PRNewswire/ — Travelzoo® (NASDAQ: TZOO), the club for travel enthusiasts, announces the release of Club Offers for Club Members.

Rigorously vetted and negotiated for us travel enthusiasts in Germany:

199 €—LUXURY HOTEL IN DAVOS 3 days in one of Switzerland’s most fashionable places, the setting of Thomas Mann’s novel The Magic Mountain. The 5-star hotel is located directly on the promenade. Club members save 47–54 percent compared to the hotel website.

AB 379 €—TUSCANY: 6 DAYS WITH WINE TASTING & 3 COOKING COURSES
Apartments of at least 92 square meters, surrounded by cypresses and vineyards. Club members receive daily breakfast plus a 3-course candlelight dinner.

119 €—4*-HOTEL IN PARIS INCL. SEINE CRUISE, REGULAR 472 € A 2-night stay in the Saint-Germain-des-Prés district, once a meeting place for Sartre and Picasso. Just 15 minutes on foot from the Louvre and including breakfast.

99 €—NEW LUXURY HOTEL IN BUDAPEST, -72%
Located in the middle of the UNESCO-protected old town is this 5-star superior hotel. Condé Nast Traveller magazine lists it as one of the best hotels in Budapest. The “bold design” is particularly highlighted.

139 €—3 DAYS BLACK FOREST WITH HALF BOARD
4-star superior hotel with panoramic views of the countryside. Half board with organic products and access to the spa with thermal pool is included. Club members save 39–66 percent compared to the original price.

FROM 599 €—SWITZERLAND TRIP WITH GLACIER EXPRESS & HOTELS 4-day train journey in 1st class from and to Germany. Including 4-star hotels in Zermatt and St. Moritz as well as a ride on the panoramic train Glacier Express.

Some offers have limited inventory and are subject to availability.

Are you a travel enthusiast? Join the club today: https://travelzoo.com

About Travelzoo
We, Travelzoo®, are the club for travel enthusiasts. We reach 30 million travelers. Club Members receive Club Offers personally reviewed by our deal experts around the globe. We have our finger on the pulse of outstanding travel, entertainment, and lifestyle experiences. We work in partnership with thousands of top travel suppliers—our long-standing relationships give us access to irresistible deals.

Travelzoo is a registered trademark of Travelzoo. All other names are trademarks and/or registered trademarks of their respective owners.

Media Contact:

Mara Zatti 
+49 30 3119 7514
mzatti@travelzoo.com

View original content to download multimedia:https://www.prnewswire.com/news-releases/club-offers-released-on-may-25-2025-302464758.html

SOURCE Travelzoo

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Huawei ICT Competition 2024-2025 Global Final Concludes: AI Empowers Education Transformation and ICT Talent Development

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SHENZHEN, China, May 24, 2025 /PRNewswire/ — The Closing & Awards Ceremony of the Huawei ICT Competition 2024–2025 Global Final was successfully held today in Shenzhen. In its 9th edition, the event has reached a record-breaking scale this year, attracting over 210,000 students and instructors from more than 2,000 colleges and universities in over 100 countries and regions. Following national and regional competitions, 179 teams from 48 countries and regions made it to the Global Final.

Through intense competition across three major tracks, Practice, Innovation, and Programming, top honors were awarded to 18 outstanding teams from 9 countries: China, Algeria, Brazil, Philippines, Morocco, Nigeria, Serbia, Tanzania, and Singapore.

The Grand Prize winners of the Innovation Competition were teams from the Bulacan State University in the Philippines, Beijing University of Technology in China, Faculty of Technical Sciences Čačak of the University of Kragujevac in Serbia, and the Faculty of Sciences and Techniques of Errachidia – Moulay Ismail University in Morocco.

In the Practice Competition – Network Track, Grand Prizes were awarded to teams from the Shenzhen Institute of Information Technology in China, Instituto Federal do Tocantins in Brazil, Federal University of Technology Minna in Nigeria, and a joint team from Dar es Salaam Institute of Technology, University of Dar es Salaam, and University of Dodoma in Tanzania.

In the Practice Competition – Cloud Track, Grand Prize winners included teams from iACADEMY in the Philippines, University of Batna 2 and the Higher National School of Computer Science Algiers in Algeria, Tianjin University of Technology and Education in China, and Singapore University of Social Sciences.

In the Practice Competition – Computing Track, the Grand Prizes went to teams from Guilin University of Electronic Technology in China, Federal University of Technology Minna in Nigeria, University of Bejaia and Higher National School of Computer Science SBA in Algeria, and Cebu Institute of Technology – University in the Philippines.

The Grand Prize in the Programming Competition was awarded to a team from Shenzhen Polytechnic University in China.

To recognize outstanding contributions beyond technical excellence, the competition also presented special honors. The Women in Tech Award was granted to four all-female teams from Brazil, Saudi Arabia, Germany, and Kenya. The Green Development Award went to a team from Ghana. The Most Valuable Instructor Award recognized 18 distinguished instructors from 10 countries – China, Algeria, Bangladesh, Brazil, Egypt, Indonesia, Iraq, Nigeria, Hungary, and Türkiye – for their contributions to ICT education.

In his opening speech, Ritchie Peng, Director of the ICT Strategy & Business Development Dept at Huawei, mentioned, “To achieve the goal of learning through competition and inspiring innovation through competition, we have continuously evolved the design of competition topics. The Practice Competition aligns with our vision for an Intelligent World 2030 and encourages students to master cloud computing, big data, and AI to drive social progress. The Innovation Competition focuses on green development and digital inclusion, motivating participants to solve real-world challenges in sectors like agriculture, healthcare, and education through ICT.”

As digital transformation is accelerating globally, the demand for skilled professionals in fields such as AI, big data, and cybersecurity continues to grow. However, the shortage of talent in these critical areas is becoming increasingly evident. To help tackle this challenge, the Huawei ICT Competition features multiple tracks — including Practice, Innovation, and Programming — alongside initiatives such as industry-academia collaboration and tailored curriculum development. These efforts aim to equip students with in-demand skills and foster the next-generation tech talent who will stand out in an increasingly intelligent and digital world.

During this year’s competition, Huawei also hosted the AI Accelerating Education Transformation Summit, where experts explored the pivotal role of AI in smart education. In addition, Huawei officially announced the AI Capability of the Huawei ICT Academy Intelligent Platform, making it easier and more efficient for educators and students to use. This marks another step forward in advancing educational digitalization.

For more details about the Huawei ICT Competition, visit us at https://www.huawei.com/minisite/ict-competition-2024-2025-global/en/index.html.

SOURCE Huawei

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