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Semiconductor IP Market size is set to grow by USD 2.71 billion from 2024-2028, complex chip designs and use of multi-core technologies to boost the market growth, Technavio

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NEW YORK, June 18, 2024 /PRNewswire/ — The global semiconductor IP market  size is estimated to grow by USD 2.71 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 7.47%  during the forecast period. Complex chip designs and use of multi-core technologies is driving market growth, with a trend towards emergence of nanophotonic ICs. However, reuse of semiconductor IP  poses a challenge. Key market players include Achronix Semiconductor Corp., Advanced Micro Devices Inc., Alphawave IP Group plc, Arm Ltd., Arteric Inc., Cadence Design Systems Inc., CAST Inc., CEVA Inc., Dolphin Design SAS, Dream Chip Technologies GmbH, eMemory Technology Inc., Faraday Technology Corp., Imagination Technologies Ltd., Lattice Semiconductor Corp., Perceptia Devices Australia, Rambus Inc., Siemens AG, Synopsys Inc., VeriSilicon Microelectronics Shanghai Co. Ltd., and videantis GmbH.

Get a detailed analysis on regions, market segments, customer landscape, and companies – Click for the snapshot of this report

Forecast period

2024-2028

Base Year

2023

Historic Data

2018 – 2022

Segment Covered

End-user (Fabless semiconductor companies, IDMs, and Foundries), Application (Mobile computing devices, Consumer electronics, Automotive, Industrial automation, and Others), Form Factor (Processor IP, Physical IP, and Digital IP), and Geography (North America, APAC, Europe, South America, and Middle East and Africa)

Region Covered

North America, APAC, Europe, South America, and Middle East and Africa

Key companies profiled

Achronix Semiconductor Corp., Advanced Micro Devices Inc., Alphawave IP Group plc, Arm Ltd., Arteric Inc., Cadence Design Systems Inc., CAST Inc., CEVA Inc., Dolphin Design SAS, Dream Chip Technologies GmbH, eMemory Technology Inc., Faraday Technology Corp., Imagination Technologies Ltd., Lattice Semiconductor Corp., Perceptia Devices Australia, Rambus Inc., Siemens AG, Synopsys Inc., VeriSilicon Microelectronics Shanghai Co. Ltd., and videantis GmbH

Key Market Trends Fueling Growth

The semiconductor IP market is experiencing growth due to the integration of nanophotonic structures in electronic devices. These structures enable the development of miniaturized semiconductor devices with higher integration densities, high-density optoelectronic ICs for optical fiber communication, and flexible electronics circuits. IBM is a leading vendor in this space, having developed low-cost, commercially available electronic-photonic ICs. The adoption of nanophotonic technology for transistor development, such as carbon nanotube transistors, is increasing design complexity and driving innovation in memory chip layout design. The global nanophotonic IC market is expected to reach USD79.42 million by 2021, growing at a CAGR of 14.51%. 

The Semiconductor Intellectual Property (IP) market is experiencing significant growth due to the increasing demand for advanced technologies. Chip companies require efficient and effective IP cores for their designs. Memory IP, such as SRAM and ROM, is a major segment in this market. Processors, connectivity IP, and interface IP are also key areas of focus. The trend towards miniaturization and higher performance is driving the need for new and innovative IP solutions. Companies like Intellectual Property (IP) providers offer a wide range of IP cores for various applications. These IP cores are essential for the design and development of modern electronic systems. The IP market is competitive, with many players vying for market share. However, those who can provide high-quality, reliable, and cost-effective IP solutions will thrive in this market. 

Research report provides comprehensive data on impact of trend. For more details- Download a Sample Report

Market Challenges

The semiconductor industry faces significant challenges with third-party IP usage, leading to extensive IP reuse over the past 15 years. Companies often lack proper methods to manage and track IP cores, including crucial RTL data and licensing metadata. This oversight can result in unintentional IP reuse, causing financial penalties and legal issues. Few companies prioritize IP block management, leaving many vulnerable to IP violations. Instances of unintentional IP reuse include new design teams mistakenly using third-party IP and engineers unaware of IP agreement terms. Annual IP reuse increases financial liability for companies at risk of IP violations. Proper IP management is essential to mitigate these challenges and ensure the semiconductor IP market’s growth.The semiconductor IP market faces several challenges in today’s technology landscape. Intellectual property (IP) providers must keep up with the rapid advancements in technology, such as the increasing complexity of designs and the need for smaller, more power-efficient chips. Technologies like FinFET and 7nm processes require new and innovative IP solutions. Additionally, the growing importance of security and reliability in semiconductor designs presents a challenge for IP providers. Cost and time-to-market pressures also loom large, making it essential for IP providers to offer flexible licensing models and efficient design integration. Competition from both established players and new entrants adds to the complexity of the market. Overall, the semiconductor IP market requires providers to be agile, innovative, and responsive to meet the evolving needs of the industry.

For more insights on driver and challenges – Download a Sample Report

Segment Overview 

This semiconductor ip market report extensively covers market segmentation by

End-user 1.1 Fabless semiconductor companies1.2 IDMs1.3 FoundriesApplication 2.1 Mobile computing devices2.2 Consumer electronics2.3 Automotive2.4 Industrial automation2.5 OthersForm Factor3.1 Processor IP3.2 Physical IP3.3 Digital IPGeography 4.1 North America4.2 APAC4.3 Europe4.4 South America4.5 Middle East and Africa

1.1 Fabless semiconductor companies-  In the semiconductor industry, fabless companies opt for third-party IP licenses to minimize manufacturing overheads and reduce design time. This approach saves fabless companies an average of USD90-190 million and cuts down designing time by half, compared to in-house processor development. Notable companies, including Actions Semiconductor, Allwinner Technology, Marvell, AMD, Broadcom, MediaTek, Microchip, Rambus, Qualcomm, Xilinx, and Realtek, have adopted this strategy to meet OEM requirements and bring semiconductor devices to market more efficiently. The use of third-party IPs is projected to continue growing in the forecast period.

For more information on market segmentation with geographical analysis including forecast (2024-2028) and historic data (2018 – 2022)  – Download a Sample Report

Research Analysis

The Semiconductor IP market plays a crucial role in system design, enabling the creation of various electronic devices in sectors such as telecommunications, automotive, consumer electronics, industrial devices, and emerging technologies. Chip design processes involve significant development expenses, making IP cores an essential component for operational efficiency and cost-effectiveness. SoC designs incorporate processors, memory modules, analog circuits, and interface modules from IP providers. Collaboration between semiconductor manufacturers and IP providers is essential for innovation, product launches, and time-to-market advantages. Design efficiency, chip reliability, and performance are key considerations in the selection of IP cores. Intellectual property protection is essential to prevent patent infringement and maintain a competitive edge in research and development. Market expansion in various sectors drives the demand for semiconductor IP solutions.

Market Research Overview

The Semiconductor Intellectual Property (IP) market refers to the buying and selling of pre-designed and tested semiconductor IP cores and blocks. These IP cores and blocks include digital signal processing (DSP) cores, memory interfaces, and processor cores, among others. The semiconductor IP market caters to various industries such as automotive, consumer electronics, industrial, and telecommunications. The market is driven by the increasing demand for miniaturization, cost reduction, and time-to-market considerations in semiconductor design. The semiconductor IP market also offers benefits such as reduced design risk, faster time-to-market, and lower development costs. The market is expected to grow significantly due to the increasing adoption of advanced technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT).

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

End-userFabless Semiconductor CompaniesIDMsFoundriesApplicationMobile Computing DevicesConsumer ElectronicsAutomotiveIndustrial AutomationOthersForm FactorProcessor IPPhysical IPDigital IPGeographyNorth AmericaAPACEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Siemon Announces Optical Patching Solutions for GenAI Networks Using NVIDIA Accelerated Computing

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Siemon announces it is offering its full range of optical patching solutions to work specifically with NVIDIA AI infrastructure for generative AI networks.

WATERTOWN, Conn., Sept. 22, 2024 /PRNewswire-PRWeb/ — The Siemon Company, a global leader in network infrastructure solutions, today announced it is offering its full range of optical patching solutions to work specifically with NVIDIA AI infrastructure for generative AI networks. Large complex GPU clusters can benefit from using structured cabling patch panels versus point-to-point cabling. Siemon acts as a trusted advisor to customers by providing expert advice and best practice recommendations for design & deployment of NVIDIA AI Infrastructure.

“Siemon is very familiar with NVIDIA reference architectures and has worked with many customers to design and deploy NVIDIA clusters… Siemon offers a full range of AI-ready fiber cabling, DAC, and AOC solutions that support 400G, 800G, and 1.6T applications.”

As part of the solution integration, Siemon has joined the NVIDIA Partner Network (NPN) as a Solution Advisor Consultant. NPN Solution Advisor Consultants provide consultation services and expert advice to customers looking to implement NVIDIA-based solutions or technologies. Siemon joins the network to offer its expertise in addressing the unique infrastructure and cabling challenges presented by accelerated computing.

NVIDIA optical reach specifications are calculated assuming two optical patch panels are used in the link and assuming each employ two optical connectors, which makes for a total allowance of four optical connectors in the link. The Siemon optical patching solutions meet NVIDIA requirements and provide customers with flexibility and ease of management.

Media Contact

Brian Baum, Siemon, 1 8609454200, brian_baum@siemon.com

View original content:https://www.prweb.com/releases/siemon-announces-optical-patching-solutions-for-genai-networks-using-nvidia-accelerated-computing-302254640.html

SOURCE Siemon

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AMSimpkins & Associates Awarded Wisconsin Technical Purchasing Consortium Contract RFB 25-002TP – for Identity Verification Solutions

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AMSimpkins & Associates has been awarded the Wisconsin Technical Colleges Purchasing Consortium (WTC-PC) contract for Identity Verification Solutions. This partnership includes providing their advanced S.A.F.E. (Student Application Fraudulent Examination) platform to 16 Wisconsin technical colleges, enhancing security and safeguarding against fraudulent student applications. With a focus on higher education, AMSA aims to support these institutions in maintaining the integrity of their admissions processes and preventing identity fraud. This collaboration underscores AMSA’s commitment to delivering innovative solutions tailored for the education sector.

ATLANTA, Sept. 22, 2024 /PRNewswire-PRWeb/ — AMSimpkins & Associates is proud to announce its selection by the Wisconsin Technical College System Purchasing Consortium (WTC-PC) to provide Identity Verification Solutions through the S.A.F.E. platform. The WTC-PC comprises 16 independent, publicly funded two-year technical colleges across Wisconsin, including Blackhawk Technical College, Chippewa Valley Technical College, Fox Valley Technical College, and Milwaukee Area Technical College, among others.

“We are honored by the Wisconsin Technical College Consortium’s trust in AMSA. This partnership further emphasizes our commitment to providing secure, innovative identity verification solutions that support the needs of educational institutions in protecting their students and operations.”

With a focus on preventing identity fraud, AMSimpkins & Associates’ comprehensive solutions will strengthen the security measures across admissions, enrollment, and financial aid processes, ensuring secure verification and compliance with federal and state regulations. S.A.F.E. will now support Wisconsin’s higher education system, offering its cutting-edge technology to streamline operations and safeguard student data.

“We are honored by the Wisconsin Technical College Consortium’s trust in AMSimpkins & Associates,” said Maurice Simpkins, President and Founder. “This partnership further emphasizes our commitment to providing secure, innovative identity verification solutions that support the needs of educational institutions in protecting their students and operations.”

As part of this agreement, AMSimpkins & Associates will deliver comprehensive services, including system integration, training, and ongoing support to ensure seamless implementation. S.A.F.E.’s capabilities are designed to evolve with growing threats of fraudulent activities, keeping institutions one step ahead in securing student identities.

Institutions in the Wisconsin Technical College System:

Blackhawk Technical CollegeChippewa Valley Technical CollegeFox Valley Technical CollegeGateway Technical CollegeLakeshore Technical CollegeMadison Area Technical CollegeMid-State Technical CollegeMilwaukee Area Technical CollegeMoraine Park Technical CollegeNicolet Area Technical CollegeNorthcentral Technical CollegeNortheast Wisconsin Technical CollegeNorthwood Technical CollegeSouthwest Wisconsin Technical CollegeWaukesha County Technical CollegeWestern Technical College

The S.A.F.E. platform’s advanced identity verification services will play a pivotal role in securing sensitive data and ensuring a safe and fraud-free environment for Wisconsin’s technical colleges and their students.

For more information about AMSimpkins & Associates and the S.A.F.E. platform, please visit amsa-highered.com.

Media Contact

LAQWACIA SIMPKINS, AMSimpkins & Associates, 1 6786824193, LSIMPKINS@AMSA-CONSULTING.COM, amsa-highered.com

Twitter, Facebook, LinkedIn

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SOURCE AMSimpkins & Associates

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Shijingshan: Committed to High-Level Openness

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BEIJING, Sept. 22, 2024 /PRNewswire/ — Following the third plenary session of the 20th Central Committee of the Communist Party of China, China successfully hosted its first national-level international large-scale fair—the China International Fair for Trade in Services (CIFTIS) 2024, which concluded on September 16. The event featured exhibitors from 85 countries and international organizations, participating under their national governments or headquarters, with over 450 Fortune Global 500 companies and industry leaders showcasing their offerings both online and offline.

Adhering to the open, cooperative and mutually beneficial principle, the CIFTIS injects new momentum into global economic development through concrete actions. As one of the “dual venues” for the fair, Shijingshan District hosted a variety of business activities, including exhibitions, negotiations, and conferences. While providing meeting organization services, it showcased the achievements of Shijingshan in fostering openness and development. By leveraging the Fair’s platform, Shijingshan seeks to promote its developmental advantages globally and aims to attract more partners to this welcoming district for mutually beneficial and win-win cooperation.

Presenting Achievements in Open Cooperation and Development in Multiple Dimensions

This CIFTIS’s Shougang Park venue is composed of nine thematic exhibitions, including telecommunications, computer and information services; financial services; culture & tourism services; education services; sports services; supply chain & business services; engineering consulting & construction services; health services; and environmental services. It circles around cultivating new quality productive forces while showcasing the latest achievements, technologies, and applications in the digitalization, intelligentization, and greening of services trade, creating a “debut stage” for global services trade.

Shijingshan leverages its strengths by organizing five thematic exhibitions and four promotional booths on-site. The culture & tourism services exhibition promoted Shijingshan’s rich culture and tourism resources, while also building a support area for paired assistance to highlight its revitalization efforts to a global audience. The financial services exhibition showcased its achievements in economic development across five sectors, that is, sci-tech finance, green finance, inclusive finance, pension finance, and digital finance. The exhibition of telecommunications, computer and information services highlighted the growth of Shijingshan’s the artificial intelligence large model industry cluster and key humanoid robot enterprises. In addition, the primary and secondary school science education experimental zone invited participation from six national-level science education centers, including Shijingshan District, to display their accomplishments. Four schools, including the Beijing National Day School Shijingshan, showcased their scientific research and learning outcomes through visual presentations and videos, while also engaging visitors in interactive science experiments.

The AIES Beijing Open is made up of four competition areas, virtual cycling, virtual rowing, virtual dance, and virtual table tennis. The event welcomed international competitors, domestic professional athletes, high-level amateurs, and university students, while showing the achievements of the “digital + sports” industry. Besides, four promotional booths focused on taxation, justice, investment, and commerce showcases Shijingshan’s tax and judicial policies, offering one-stop policy guidance for participating businesses and visitors. These booths also clarified investment promotion policies, creating a unique event that integrates commerce, tourism, culture, and sports.

Working Together for Global Open Cooperation and Development

The Open Cooperation Forum 2024 was held on the afternoon of September 13. Experts, scholars, government representatives, and business leaders from both domestic and international backgrounds gathered at the Shougang Park to engage in in-depth discussions on promoting high-level open cooperation and supporting regional economic development. Shijingshan District is committed to taking industrial transformation as the strategic foundation for its initiatives, establishing several distinctive industrial parks, including the Intelligent Technology Park, Industrial Internet Park, Virtual Reality Park, Science Fiction Industry Cluster, and Artificial Intelligence Large Model Cluster. What’s more, the district is focusing on new opportunities in future information, future health, future manufacturing, and future space, continually enhancing its innovation capacity, development vitality, economic strength, and overall competitiveness.

It is dedicated to expanding openness as a key driver for integrating into the capital’s new development pattern. The district capitalizes on a range of policy opportunities, including the construction of Beijing’s two zones, effectively leveraging the role of expanding services and deepening economic reforms. It continues to optimize the business environment, actively participates in organizing the CIFTIS, and develops high-standard international cooperation zones to provide a broad platform and efficient services for enterprises to settle and cluster. Shijingshan aims to implement high-level openness to promote high-quality development, enhance mechanisms for foreign openness, innovate and elevate services trade, and align with international economic and trade standards, creating a premier business environment characterized by marketization, rule of law, and internationalization.

Three parallel forums took place during this CIFTIS. With the theme of “Leveraging Overseas Strength for Development • Pursuing Broad Horizons Through Innovation”, the Dream Incubator of Overseas Chinese Beijing Forum set up ten sub-venues abroad, aiming to enhance the involvement of overseas Chinese’s capital and expertise in Beijing’s high-quality development. The Artificial General Intelligence Computility Forum focused on “Releasing New Quality Productive Forces with Unbounded Intelligence and Computational Foundations”, where industry experts and scholars explored new possibilities in artificial general intelligence computility. The Digital Energy Development Forum 2024, themed as “Energizing the Future with Digital Innovation”, showcased a range of quality development achievements and finalized partnerships for several high-quality projects, uniting all parties to advance digital innovation and development.

The rich array of side events is one of the highlights of this CIFTIS. The International Open Cooperation Promotion Conference circled around developing the international open cooperation zone, drawing representatives from international organizations, leading global companies, and prospective businesses seeking to establish a presence in these areas. It centered on the advantages of Shijingshan’s key industries to attract target enterprises. Furthermore, the Roundtable Discussion of Foreign-Funded Enterprises engaged representatives from international organizations, business associations, and foreign-funded companies from countries like Malaysia, Singapore, and France to explore collaboration in aligning with high-standard international economic and trade rules, as well as market access in the service sector, sharing the successes of modernization with Chinese characteristics.

To enhance the consumer experience for attendees of the CIFTIS, Shijingshan has expanded its comprehensive service offerings in areas such as food, accommodation, transportation, tourism, entertainment and shopping. The Second “Here I Am for CIFTIS” Shijingshan Culture and Tourism Carnival has been significantly upgraded, evidenced by the “Divine Beasts Ascend to Immortal Mountain”: Enchanting Night Tour in Shijing Mountain. The “Surprises Await in Shijingshan. Hey There, CIFTIS!” promotional event was held during the 14th Shijingshan Consumption Festival. This included online surprise announcements and a consumption map showcasing quality shopping venues. Special surprise floats were on display, with oversized themed shopping bags distributed. Shopping centers like Joy City, Xirondo Plaza, Modern Plaza, and Chang’an Mills in Shijingshan also launched supporting promotional activities. Business tours in Shijingshan offered three dedicated routes, inviting exhibitors from digital technology, finance and insurance, culture and tourism, and sports related industries to explore relevant industrial parks and attractions for in-depth exchanges.

The China International Fair for Trade in Services 2024 has successfully concluded. Utilizing this platform, Shijingshan has once again showed its high-quality development achievements and favorable business environment to a global audience. We look forward to collaborating with more partners in an open and inclusive manner to create a win-win future.

View original content:https://www.prnewswire.com/news-releases/shijingshan-committed-to-high-level-openness-302254872.html

SOURCE Open Cooperation Forum

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