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Sarcina Unveils Bump Pitch Transformer Capabilities

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7 months ago

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New Multi-die Technology Radically Alters 2.5D Packaging Landscape

PALO ALTO, Calif., June 18, 2024 /PRNewswire/ — Sarcina Technology, the Application Specific Advanced Packaging (ASAP) Design Service and Production leader, today unveiled its Bump Pitch Transformer design capabilities that slash 2.5D packaging NRE and production costs while significantly reducing design cycle time. 

     The new technology will open new artificial intelligence computing opportunities.   

     Sarcina’s Bump Pitch Transformer, which is a silicon bridge technology, replaces expensive silicon TSV interposers with more cost-effective re-distribution layers (RDL). This architecture is ideal for homogenous and heterogenous chiplet integration targeting high-performance computing (HPC) devices for AI, data center, microprocessor, and networking applications.

     “We believe that the Bump Pitch Transformer architecture will accelerate the growth rate of 2.5D semiconductor packages that are key to meeting the explosive demand for AI-driven computing capabilities,” said Dr. Larry Zu, Founder and CEO, Sarcina Technology.

     Current advanced 2.5D packaging necessitates the use of a substrate to transpose the microbump pitch from 40-50 mm to 130 mm. These substrates are very expensive, in short supply, and are complex to design resulting in lead-time and cost challenges for many AI system companies.

     The Bump Pitch Transformer is effectively a Wafer Fan-out RDL technology which due to its maturity has inherently a lower cost and shorter lead time thus enabling system designers to optimize AI for new lower cost applications.

     Sarcina is currently engaging customers with two Bump Pitch Transformer derivatives across a range of applications.

     One derivative creates a silicon bridge in high density applications to connect the I/Os of adjacent dice. Tall copper pillars with a pitch of about 130 mm will be grown underneath the RDLs. Because the majority of the I/O interconnections are between adjacent dice and have been connected by the silicon bridge, a fewer number of I/Os need to be routed to the next level of interconnect with 130 mm bump pitch with tall copper-pillar bumping onto a standard substrate for flip-chip assembly. The RDLs will merge power and ground micro-bumps with 40-50 mm bump pitch, reducing the number of power and ground bumps with tall copper pillars suitable for 130 mm bump pitch density. These bumps may also be assembled onto a standard organic or laminate substrate for flip-chip assembly.  

     “Today’s substrate fabrication and package assembly technologies can’t handle such a small micro-bump pitch without a bump pitch transformer. They can only handle approximately a 130 mm copper-pillar bump pitch. Secondly, adjacent die-to-die interconnections require a higher routing density to handle a 40 mm micro-bump pitch with several thousand I/Os,” explained Dr. Zu .

     Sarcina also provides a “chip last” service, that handles die-to-die interconnects with less interconnection routing density. The company is prepared to accommodate a broad range of interconnect densities across both assembly technologies.

About Sarcina Technology

Founded in 2011, Sarcina Technology is the Application Specific Advanced Packaging Service that provides a boutique collaborative experience for small-to-mid-sized IC companies. It boasts a proven 100% right-the-first time advanced packaging track record of wafer-to-production services that reduce overheads and speeds time-to-volume.  For more information, visit sarcinatech.com.

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SOURCE Sarcina Technology LLC

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Pollo AI Releases Multi-Model Support, Offering All-in-One Video Generation Capabilities

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45 minutes ago

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January 13, 2025

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SINGAPORE, Jan. 12, 2025 /PRNewswire/ — Pollo AI, an innovative leader in AI-powered video generation, today announced the launch of a new feature that allows users to select from a range of well-known AI video models, making it an all-in-one AI video generation platform.

With the introduction of multi-model support, users can now choose from popular AI video models on Pollo AI, including Kling AI, Hailuo AI, Runway, Vidu AI, Luma AI, and PixVerse. The multi-model support is available on Pollo AI’s text to video and image to video generators. These model options enhance the versatility and customization of the Pollo AI platform, empowering creators to experience different technologies to produce their videos.

Camille Sawyer, CEO of HIX.AI, the parent company of Pollo AI, expressed her enthusiasm for the new feature, stating, “At Pollo AI, we believe in fostering creativity without limits. By integrating multiple AI models, Pollo AI has become an all-in-one platform enabling our users to explore diverse cutting-edge video generation technologies at one place.”

Each model offers distinct customization options that cater to various creative needs, such as output video style, video length, resolution, motion range, aspect ratio, and camera movement. This feature is designed to provide users with the flexibility to bring their visions to life in ways that best suit their projects on Pollo A.

It is seamless and intuitive to access and use the different models offered in this all-in-one AI video generator. After log in to your Pollo AI account, on the UI of the generators, you’ll find the option to select from the various available AI models. After choosing your preferred model, you can customize the settings it comes with and start your generation.

“We believe the multi-model support will ultimately enhance their storytelling capabilities,” Camille added. “This update is a testament to our commitment to innovation and our dedication to supporting creators in their artistic journeys.”

This multi-model support feature is now available to all users. For more information about this feature and to start creating with any of the models, visit https://pollo.ai/text-to-video or https://pollo.ai/image-to-video.

MEDIA CONTACT
Camille Sawyer
CEO, HIX.AI
support@pollo.ai 

View original content:https://www.prnewswire.com/news-releases/pollo-ai-releases-multi-model-support-offering-all-in-one-video-generation-capabilities-302348811.html

SOURCE Pollo AI

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SUS ENVIRONMENT, Global Leading WtE Corporation, Launches New Brand Identity

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46 minutes ago

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January 13, 2025

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SHANGHAI, Jan. 13, 2025 /PRNewswire/ — As the world’s population grows and industrialization accelerates, the conflict between energy and the environment is intensifying. The search for a balance between energy supply and environmental protection has become a crucial issue for global sustainable development.

In January 2025, SUS ENVIRONMENT launches new global brand identity. This renewal improves the brand image and enriches the brand connotation, bolstering its commitment to global sustainable development.

PART 1: Logo Renewal

The abbreviation “SUS”,” which is derived from “sustainable”,” emphasizes the company’s mission to create a cleaner and more friendly living environment through waste-to-energy solutions. Inspired by the traditional Chinese Tai Chi diagram, the graphic incorporates the concept of cyclic generation, shows the characteristics of energy recycling and expresses the brand endless vitality.

PART 2: Mission Connotation Expansion  

The refreshed brand highlights SUS ENVIRONMENT’S unwavering focus on stakeholder benefits:

Environmental Impact: Solving waste disposal challenges to create cleaner environments.Employee Well-Being: Promoting diversity, equity and inclusiveness to enhance employee satisfaction.Community Engagement: Building supportive environments to improve community living standards.Business Integrity: Establishing fair and transparent practices to strengthen partnerships.

PART 3: Brand Colors

The primary colors of SUS ENVIRONMENT are blue and green to symbolize technological innovation and environmental protection. They are complemented by metallic gold and technical silver to convey high quality and stability. Together, these colors embody the core values of the brand: Professionalism, Innovation, Vitality, and Trustworthiness.

The new global brand identity heralds the next chapter for SUS ENVIRONMENT. In the future, SUS ENVIRONMENT will leverage its strength to make the world a better place.

About SUS ENVIRONMENT

SUS ENVIRONMENT is the world’s largest provider of waste incineration equipment and technology, as well as one of the top three investors and operators of waste-to-energy projects (low-carbon Eco-industrial parks) globally. 

As of June 2024, SUS ENVIRONMENT has established 10 management centers worldwide, providing environmental and energy services to over 100 million people. It has invested in and constructed 84 waste-to-energy projects (low-carbon Eco-industrial parks), with a daily processing capacity 110,000 tons of municipal solid waste and annual green power generation of approximately 18,000 GWh. Its equipment and technology are applied in 277 waste-to-energy plants across the world, comprising 518 incineration lines, with a daily capacity 290,000 tons of municipal solid waste. 

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/sus-environment-global-leading-wte-corporation-launches-new-brand-identity-302348819.html

SOURCE Shanghai SUS ENVIRONMENT Co.,Ltd.

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MitrEarth, a knowledge platform, identifies risk points, provides disaster warning, reduces losses

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46 minutes ago

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January 13, 2025

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BANGKOK, Thailand, Jan. 13, 2025 /PRNewswire/ — MitrEarth, an innovative online platform developed by Chulalongkorn University lecturers, simplifies geological knowledge and provides cutting-edge topographic data for each Thai province. It identifies risk points, delivers disaster warnings, and enhances community preparedness. The platform gained prominence when heavy rains and muddy water devastated Mae Sai District, Chiang Rai Province, raising urgent questions: Where will the water flow? Will it reach our homes? Should we prepare to relocate?

Created by Prof. Dr. Santi Phailobli from Chulalongkorn University’s Department of Geology, MitrEarth addresses these concerns. Since its launch in 2019, it has become a trusted source for disaster-related information, gaining over 200,000 followers. Its topographic maps, developed using GIS tools and satellite data, enable users to understand their local terrain and assess disaster risks. These maps have been utilized by local authorities and public pages for disaster warnings and response planning.

During recent floods in Chiang Rai, Lampang, and Sukhothai, MitrEarth’s maps provided actionable insights. Pages like Chiang Rai Conversation and Ramrome Weather cited MitrEarth to warn residents in vulnerable areas. As Dr. Santi emphasizes, “Disasters, whether rare or frequent, can cause immense damage. Understanding geology helps us communicate and prepare effectively, reducing impacts.”

Dr. Santi’s platform also serves as an educational tool, offering free access to maps and resources for both teaching and disaster management. He advocates integrating disaster education into school curriculums, ensuring everyone understands local risks such as floods, mudslides, and tsunamis. Notably, he highlights the severe 2001 Phetchabun mudslide, which claimed 136 lives, as a reminder of the need for vigilance.

MitrEarth’s GIS maps play a crucial role in disaster management, offering detailed, real-time data tailored to various scenarios. The platform also collaborates with Chulalongkorn University’s Digital War Room, integrating predictive tools for floods and landslides. While Dr. Santi acknowledges AI’s potential in disaster forecasting, he believes Thailand lacks sufficient data for reliable implementation.

Despite these challenges, Dr. Santi remains committed to expanding MitrEarth’s capabilities. He continues to refine data sets, improve map accessibility, and engage directly with communities to enhance disaster preparedness. For those seeking to understand and mitigate natural disasters, MitrEarth offers a vital resource.

Explore more at the Facebook page mitrearth or mitrearth.org.

Read the full article at https://www.chula.ac.th/en/highlight/207225/

Media Contact:        

Chula Communication Center
Email: Pataraporn.r@chula.ac.th     

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/mitrearth-a-knowledge-platform-identifies-risk-points-provides-disaster-warning-reduces-losses-302348829.html

SOURCE Chulalongkorn University Communication Center

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