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IDTechEx Discusses Segmenting the Conductive Inks Market by Formulation and Application

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BOSTON, June 7, 2024 /PRNewswire/ — The conductive inks market will grow to exceed US$6.5 billion by 2034 but remains a highly segmented industry, underpinning both photovoltaics and the emerging field of printed electronics. Taking stock of the different outlooks for the myriad of conductive ink types and the various application areas is a complex task. IDTechEx has tackled this problem by assessing the market for different conductive ink types across 15 application areas and providing granular ten-year market forecasts.

IDTechEx has covered the printed electronics and conductive inks market for over ten years, independently assessing technological and commercial progress within the industry. IDTechEx has published a new report, “Conductive Inks Market 2024-2034: Technologies, Applications, Players“, which includes granular 10-year market forecasts, is based on profiles of 30+ key players, and leverages extensive in-depth coverage of many end-use markets for conductive inks. 

Conductive inks are a platform technology that facilitate a very broad range of applications, spanning from the established (photovoltaics) to the emerging (smart packaging). As printed/flexible/hybrid electronics gain traction, opportunities will be created for differentiated conductive inks to meet the needs of emerging applications such as in-mold electronics and wearable technologies. There are many different types of conductive ink, each spanning a different range of parameters, including conductivity, printing yield, and curing time. In this article, IDTechEx gives an overview of some considerations taken when assessing ink technologies and key application areas. 

Ink technology

The conductive ink technologies in IDTechEx’s report are segmented into the major categories used to market the inks while minimizing duplication where possible. Flake-based silver is today’s dominant conductive ink material, estimated to comprise around 97% of the market by weight. It is primarily produced in substantial volumes by large companies such as Henkel, DuPont, and Sun Chemical. Therefore, while it is arguably not an ’emerging technology’ itself, the emergence of high-volume applications for printed/flexible electronics, such as smart packaging or electronic skin patches, is expected to drive an increase in sales. Nanoparticle-based inks are generally produced by smaller suppliers, with the key selling point being higher conductivity. However, substantial displacement of conventional flake-based inks for most applications is yet to be seen. Particle-free conductive inks are produced by a range of early-stage companies and offer distinct benefits for electromagnetic interference (EMI) shielding and printed antennas.

Moving beyond silver, copper inks have long been desirable due to the far lower raw material price, and after years of unsuccessfully battling the challenges of oxidation during sintering, they are finally gaining some commercial traction. Carbon-based inks fall into two categories: those based on low-cost commoditized carbon (typically carbon black) and those based on more expensive conductive/semi-conducting nanocarbons such as graphene and carbon nanotubes (CNTs). Stretchable and/or thermoformable conductive inks can be produced using multiple formulations, with flake-based inks with an elastomeric binder the most common. This class of conductive inks is likely to grow rapidly with the adoption of wearable electronics/e-textiles and in-mold electronics (IME). Moving further down the list of ink types also includes silver nanowires and conductive polymers – both suited to particular applications.

Key applications

Conductive inks are arguably the premier platform technology for printed/flexible electronics, utilized in all types of devices and components. As such, these materials have a large and diverse application space, ranging from photovoltaic panels to electronic skin patches and from transparent antennas to pressure sensors. IDTechEx aims to bring structure to this complex application space by segmenting the market into three distinct categories. Circuit manufacturing accounts for conductive inks being used to connect components, with the required properties determined by the manufacturing methodology rather than the device’s functionality. Conductive inks may also be used to enable a specific type of sensing, which determines the required properties. Furthermore, conductive inks are used to provide non-sensing functionality beyond simply connecting components.

The current status of the conductive ink market is dominated by the use of silver flake-based ink as a charge collector in photovoltaics. However, an increase in efficiency and transition to the next iteration of solar cell technology will lead to an extremely modest growth in demand for silver flake-based ink in photovoltaics over the coming decade. Indeed, the vast majority of the growth in demand for this dominant ink type will come from emerging opportunities in applications such as 3D electronics, printed heaters, RFID, and smart packaging. 

The largest growth opportunity for conductive inks will be in non-silver inks, with market revenue forecast to grow with a CAGR of 24% by IDTechEx. Stretchable/thermoformable inks and copper inks will seize the largest share of this expanding market, driven by applications such as in-mold electronics and wearable electronics. As for silver flake-based inks, RFID and smart packaging is also set to be a key application area when assessing growth over the next ten years.  

For more details on the conductive inks market, including segmentations by application area, see the new IDTechEx report, “Conductive Inks Market 2024-2034: Technologies, Applications, Players”. To find out more, including downloadable sample pages, please see www.IDTechEx.com/Ink

For the full portfolio of printed and flexible electronics market research from IDTechEx, please visit www.IDTechEx.com/Research/PE

Upcoming free-to-attend webinar

IDTechEx Discusses the Key Emerging Applications for Conductive Inks

Dr Conor O’Brien, Senior Technology Analyst at IDTechEx and author of this article, will be presenting a free-to-attend webinar on the topic on Wednesday 3 July 2024IDTechEx Discusses the Key Emerging Applications for Conductive Inks.

This webinar will tackle the important question of which applications will drive the conductive inks market, taking into consideration both the volume and value of the required inks for each application. It will include:

Introduction to the broad family of conductive inks, the range of applications covered by IDTechEx, and the segmentation of forecast lines in the reportThe status and outlook for the dominant conductive ink type, silver flake-based ink, including an assessment of current demand and a ten-year forecast.An overview of emerging applications such as 3D electronics, printed heaters, and RFID & smart packaging, alongside analysis of the required conductive inksCritical assessment of the outlook for non-silver inks such as stretchable/thermoformable inks and copper inks

Please click here to check timings and register for your specific time zone.

If you are unable to make the date, please register anyway to receive the links to the on-demand recording (available for a limited time) and webinar slides as soon as they are available.

About IDTechEx:

IDTechEx provides trusted independent research on emerging technologies and their markets. Since 1999, we have been helping our clients to understand new technologies, their supply chains, market requirements, opportunities and forecasts. For more information, contact research@IDTechEx.com or visit www.IDTechEx.com.  

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Media Contact:

Lucy Rogers
Sales and Marketing Administrator
press@IDTechEx.com
+44(0)1223 812300

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Twitter: www.twitter.com/IDTechEx 
LinkedIn: www.linkedin.com/company/IDTechEx

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DomaCom Appoints Giuseppe Porcelli as Chairman and Secures $2 Million Private Placement

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SYDNEY, Jan. 10, 2025 /PRNewswire/ — DomaCom Limited (ASX:DCL) is pleased to announce two significant developments that will strengthen its leadership and financial position as it advances its fund-first, technology-driven strategy.

Appointment of Giuseppe Porcelli as Non-Executive Chairman

DomaCom has appointed Giuseppe Porcelli as Non-Executive Chairman. Giuseppe is the Founder, Chairman, and CEO of Lakeba Group, a global technology leader renowned for AI-powered, scalable solutions. With extensive expertise in technology-driven investment strategies, his leadership will be instrumental in accelerating DomaCom’s growth, innovation, and investor value creation.

“Giuseppe’s appointment strengthens our leadership team at a pivotal time for DomaCom,” said Darren Younger, CEO of DomaCom. “His experience in driving technological innovation and scaling businesses will support our strategy to enhance investor value and expand our market presence.”

Successful Completion of $2 Million Private Placement

DomaCom has successfully secured a $2 million investment through a private placement from sophisticated investor Martin Groen. The placement involved issuing 142,857,143 fully paid ordinary shares at $0.014 per share, reflecting investor confidence in DomaCom’s strategy and growth potential.

“This investment demonstrates strong confidence in our vision to transform DomaCom into a leading fund-first, technology-driven business,” said Giuseppe Porcelli, Chairman of DomaCom. “The additional option to secure further funding underscores the long-term alignment between DomaCom and our investors. This capital will allow us to accelerate key initiatives, deliver value to our stakeholders, and position the business for sustained growth.”

These developments mark an important step forward in DomaCom’s transformation, reinforcing its commitment to technological innovation, financial growth, and enhanced investor value.

Contact person: Darren Younger, DomaCom CEO
Darren.younger@domacom.com.au 

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SOURCE DomaCom Limited

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GlocalMe Unveils New Brand Identity and Cutting-Edge Innovations at CES 2025

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LAS VEGAS, Jan. 10, 2025 /PRNewswire/ — GlocalMe, a global leader in mobile data connectivity under uCloudlink (NASDAQ: UCL), is proud to announce its participation in CES 2025, the world’s largest technology trade show. This year marks a significant milestone for GlocalMe as it unveils its newly refreshed brand identity and showcases an impressive lineup of innovative products that are set to redefine global connectivity.

With the theme “The Ideal Network of Life,” GlocalMe’s rebranding reflects its dedication to providing seamless, secure, and reliable internet connectivity that feels local, no matter where users are. Powered by its patented Cloud SIM and HyperConn™ technology, the brand emphasizes “Global Connectivity, Local Mindedness,” delivering a borderless yet personalized connection experience for modern digital lifestyles.

“Our new brand identity represents a transformative step in our journey to empower users with effortless and reliable global connectivity,” said Chaohui Chen, CEO of uCloudlink. “At CES 2025, we are thrilled to showcase how our innovative solutions bring the world closer together, delivering technology that feels personal and local, even in a globalized world.”

Spotlight on the GlocalMe Life Series

A major highlight of GlocalMe’s CES 2025 showcase is the GlocalMe Life Series, a collection of advanced products designed to provide secure and convenient connectivity for daily and travel use. With a focus on user convenience and peace of mind, the Life Series empowers users to stay connected effortlessly.

At CES 2025, GlocalMe will pre-launch three new additions to the Life Series:

GPet: The second generation of GlocalMe’s smart global pet tracker, featuring unique 6-tech positioning technologies to ensure the safety and location tracking of pets worldwide. New features, including ‘AI Wellness’ and ‘Pet Interaction,’ will enhance pet health monitoring and strengthen the bond between pets and their owners.UniCord S and UniCord P: Upgraded versions of the UniCord, designed specifically for drivers and remote workers. These devices offer advanced tracking features and provide secure and seamless connectivity during commutes or road trips. The UniCord P boasts upgraded mobile internet specifications, delivering a network experience comparable to a Wi-Fi hotspot.

These new products join the existing Life Series, which includes:

UniCord: The world’s first 3-in-1 multi-functional USB cable, which has been honored with the “CES Breakthrough Award 2025” by Android Authority for its innovative design and functionality.RoamPlug: The world’s only travel adapter with a built-in 4G mobile hotspot.KeyTracker: A global intelligent tracker featuring 6-tech positioning to secure and locate personal belongings with precision.

Introducing HyperConn™ Technology: Seamless Connectivity Redefined

GlocalMe will also debut its revolutionary HyperConn™ mobile Wi-Fi hotspot technology at CES 2025, redefining how users stay connected on the move. Leading this innovation is the MeowGo G40 Pro, a HyperConn™-enabled 4G multi-network mobile Wi-Fi hotspot. Designed for road trip families and remote workers, this device leverages AI-powered network switching to provide uninterrupted internet access by seamlessly connecting to multiple 4G carriers and Wi-Fi providers. This ensures reliable connectivity anywhere in the world, no matter where life takes users.

Experience GlocalMe at CES 2025

From January 7 to 10, 2025, GlocalMe will showcase its new brand identity and innovative product lineup at booth LVCC North Hall #8211. Attendees are invited to experience firsthand how GlocalMe is redefining global connectivity through its cutting-edge products and advanced technologies.

All pre-launched products from CES will be officially available by the end of the first quarter of 2025.

About GlocalMe

GlocalMe is a digital lifestyle brand under Nasdaq-listed technology company uCloudlink (NASDAQ: UCL). With its mission to enable people to ‘Connect and Share without Limitations’, uCloudlink is a leading mobile technology solutions provider that provides a marketplace for mobile data traffic sharing to billions of users in over 200 countries and regions. By using uCloudlink’s patented Cloud SIM technology, mobile users are no longer confined to the service of a single network operator but are opened to a world of connectivity whenever and wherever they are.

For more information, visit www.glocalme.com.

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Reap Receives In-Principle Approval for Major Payment Institution License from Monetary Authority of Singapore

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SINGAPORE, Jan. 9, 2025 /PRNewswire/ — Reap, a leading payment technology provider, is thrilled to announce today that it has received an In-Principle Approval (IPA) from the Monetary Authority of Singapore (MAS) for its application of the Major Payment Institution (MPI) License for its Singapore entity, Reap Singapore.

Obtaining the IPA marks a significant milestone for Reap. Reap is committed to regulatory excellence while continuously enhancing its capabilities and presence in Singapore and the broader Asia Pacific region. While the IPA marks a critical step forward, Reap Singapore remains steadfast in meeting the required conditions for the MPI License. Reap is equally committed to dedicating the necessary resources to support and assist Reap Singapore in achieving this goal. Together, Reap and Reap Singapore will continue to refine its compliance standards and beyond, ensuring it delivers enhanced value and trusted solutions to Singapore and the broader APAC customers.

“At Reap, compliance has always been paramount, not only to safeguard our users but also as a fundamental pillar for growth. Receiving this IPA from the MAS, a globally renowned financial regulator, is incredibly motivating and will be a key driver of secure growth in the region. It fuels our enthusiasm to continue collaborating closely with regulatory bodies to shape a secure and efficient money movement across the region. Reap is also committed to building a strong payment service.” stated Kevin Kang, Co-Founder of Reap.

Singapore is integral to Reap’s mission of enhancing global money movement. Its high regulatory standards and commitment to foster sustainable innovation align seamlessly with Reap’s vision for the future of payment services. This alignment empowers Reap to drive secure and efficient financial flows while delivering exceptional value to its clients and partners.

About Reap

Reap group is a leading global payment technology provider that enables financial connectivity and access for businesses worldwide. By bridging disparate economies, merging technological divides, and connecting key financial players, we are transforming the financial landscape into a more interconnected and interoperable space for efficient money movement.

With corporate cards, payout solutions, and expense management tools, we streamline financial operations and empower businesses to scale. Our APIs enable businesses to embed finance into their own products and services, from issuing Visa cards to facilitating cross-border payments.

Founded in 2018 in Hong Kong, Reap has since expanded to a team of over 100 across the globe, including Singapore. Reap is supported by a strong network of investors, including Acorn Pacific Ventures, Arcadia Funds, HashKey Capital, Hustle Fund, Fresco Capital, Abacus Ventures, and Payment Asia.

For media enquiries, please contact:

Christine Cheuk
Marketing & PR Manager, Reap
christine@reap.global

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/reap-receives-in-principle-approval-for-major-payment-institution-license-from-monetary-authority-of-singapore-302347620.html

SOURCE Reap

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