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IDTechEx Explores 3D Electronics and Additive Electronics in the Automotive Industry

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BOSTON, June 3, 2024 /PRNewswire/ — With 3D electronics, bulky PCBs can be replaced, resulting in sleek and integrated designs. The automotive industry is one of the largest sectors benefiting from this technology, as electronics can be printed in a thin layer onto surfaces or integrated within components, which can be particularly useful for human-machine interfaces (HMIs).

In-mold electronics

Streamlined automotive interiors are a large market for 3D electronics, where the technology can incorporate electronic functions into new form factors with aesthetic appeal and modern design features. There are many possibilities for 3D electronics on a number of surface materials. The IDTechEx report, “3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets“, explores these further, alongside market predictions for the future of the technology.

Touch-sensitive interfaces are an example of a component that could use in-mold electronics (IME), using screen printing with conductive inks and adhesives. IME can make components completely functional and built-in with no excess materials and are most suited to HMIs in automotive interiors.

Higher outputs with lower production costs are a benefit of IME technology and are cheaper to install than touch screens. There are lots of surface opportunities for 3D electronics within automotive displays and dashboards, where buttons might otherwise look bulky and not conform to the desired aesthetic. IME can also be suitable for mass production, with its use of simple and trusted technology and very few process restrictions.

Partially additive electronics

Partially additive electronics, or applying electronics to a surface, include methods like laser direct structuring (LDS), aerosol, or inkjet printing. The technology uses conductive inks or LDS-compatible thermoplastics to create electronic capabilities over 3D structures, adding a circuit to a surface rather than integrating it, and also removing the need for a PCB. LDS is currently the most popular, allowing electronics to be incorporated into a number of surfaces quite easily, and it is commercially used in the automotive industry. Other methods of additive electronics are still in the prototyping stages.

Film-insert molding and capacitive switches with foils are other new alternative manufacturing technologies for automotive interiors and have already been launched into the market. They could work alongside IME and LDS technologies to produce modern, high-tech hardware.

3D printed electronics

3D printed electronics or fully additive electronics are known for being hard-wearing and can provide reliable quality with electronics embedded within products. The technology allows for mass customization and minor changes to be made and can create the most complex of designs, including medical devices such as prosthetics and hearing aids.

Rapid prototyping is also possible with fully additive electronics, using materials from conductive inks to thermoplastics. It could also be used to make spare parts, highlighting versatility in a number of sectors. However, this method is still in the semi-commercial prototyping stage for the automotive industry, just behind in-mold and 3D additive electronics, so it could soon make progress to be a top contender for HMI opportunities, especially with its possibilities of prototyping and spare part manufacturing.

The report highlights that the sales of 3D electronics are increasing rapidly and that overall, IME technology appears to be better for human-machine interfaces than additive electronics. IDTechEx does identify some challenges for this technology within the report, which include the speed at which 3D electronics can be produced, product reliability, and acceptability within the market as various sectors and consumers adjust to this new technology.

Drivers for 3D electronics include reduced shipping volume, cost, and material consumption. In a market as large as the automotive industry, these new technologies will be hugely beneficial for new vehicle designs. With reduced materials, new components could promise to be simpler to assemble and, therefore, simpler to fix or replace.

To find out more, please see the IDTechEx report, “3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets”, by visiting http://www.idtechex.com/3DElec . Downloadable sample pages are available.

For the full portfolio of printed and flexible electronics market research from IDTechEx, please see www.IDTechEx.com/Research/PE.

About IDTechEx:

IDTechEx provides trusted independent research on emerging technologies and their markets. Since 1999, we have been helping our clients to understand new technologies, their supply chains, market requirements, opportunities and forecasts. For more information, contact research@IDTechEx.com or visit www.IDTechEx.com

Media Contact:

Lucy Rogers
Sales and Marketing Administrator
press@IDTechEx.com
+44(0)1223 812300

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View original content:https://www.prnewswire.co.uk/news-releases/idtechex-explores-3d-electronics-and-additive-electronics-in-the-automotive-industry-302161952.html

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Saramonic K9 Unveiled – Digital UHF Audio System With User Experience Friendlier for Filmmakers

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NEW YORK, April 7, 2025 /PRNewswire/ — Saramonic launches Saramonic K9, its first dual-channel digital UHF wireless audio system for filmmakers during NAB Show 2025. This new system features what a professional looks for in a reliable audio system: ultra-wide 550-960 MHz digital UHF, 130 dB high dynamic range, 32-bit float onboard recording*, and timecode, giving filmmakers a friendlier user experience.

Cinema-Grade Precision And Reliability Redefined

Strong anti-interference performance, high-fidelity audio recordings, and safety backup constitute a reliable audio system. Designed with that in mind, Saramonic K9 is a digital UHF system that converts audio signals into a digital format before transmission, making it less prone to interference than analog. In addition, the ultra-wide UHF spectrum (550-960 MHz) it operates in offers more channels to auto-scan and locks onto optimal channels within 0.3 seconds, even in densely crowded RF environments.

The Saramonic K9 delivers cinematic clarity through its 130dB input – 120dB output dynamic range , capturing whispers to explosions without distortion. Engineered with industry-standard 32-bit float recording, Saramonic K9 preserves 192kHz/32bit fidelity across its full dynamic spectrum. Editors gain post-production superpowers: rescuing clipped dialogue, amplifying subtle ambiance, or isolating frequencies – all while maintaining phase accuracy.

Cinema-Ready Innovation for All Productions

32-Bit Float Onboard Recording with 32GB storage safeguards pristine audio for post-production freedom, capturing whispers to explosions without clipping.Timecode Sync ensures frame-perfect alignment across multi-camera shoots, slashing editing time.Saramonic System controls up to 48 devices remotely, offering more flexibility when transmitters are hard to access.Industry’s Smallest IP67 Lavalier Mic (Ø3mm) withstands dust, sweat, and rain while remaining virtually invisible on talent.Dual-Screen Monitoring displays real-time transmitter status and RF health at a glance.

Availability

Saramonic K9 is available through Saramonic Online Store and worldwide dealers with a recommended retail price at EUR 999 (global version) and USD 999.99 (US version). Order now: saramonic.com/product/saramonic-k9-uhf-microphone

About Saramonic

Saramonic is a leading audio brand dedicated to empowering creators to sound remarkable. Founded in 2012, the company has built a strong foundation for innovation, which is supported by an R&D team of over 100 members, 400+ patents, and 5 acoustic labs. Today, Saramonic continues to drive innovation for its growing community of 40 million users.

Contact: Jingyi Chen, chenjinyi@sz-cf.cn

Photo – https://mma.prnewswire.com/media/2652486/A_Closer_Look_Saramonic_K9.jpg

View original content:https://www.prnewswire.co.uk/news-releases/saramonic-k9-unveiled—digital-uhf-audio-system-with-user-experience-friendlier-for-filmmakers-302421550.html

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DB HiTek to Participate in PCIM 2025, Strengthening Marketing in Europe

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Germany’s Largest Power Semiconductor Exhibition in Nuremberg (May 6–8)
… Sharing the latest developments in Analog & Power, Specialty CIS, SiC and GaN technologies 

SEOUL, South Korea, April 7, 2025 /PRNewswire/ — DB HiTek, a leading 8-inch foundry company, will participate in PCIM 2025, Europe’s largest power semiconductor exhibition, held in Nuremberg, Germany, from May 6 to May 8 (local time), to expand its presence in the European market.

At the exhibition, DB HiTek plans to showcase the latest technology developments in its world-best BCDMOS, Specialty CIS, and the next-generation power semiconductor SiC and GaN. Notably, the company’s SiC and GaN power semiconductor processes, which DB HiTek has been actively developing as key future growth drivers, will be prominently featured at the event.

In February, DB HiTek secured the basic characteristics of its 8-inch SiC wafer through full in-house processing. The company aims to improve yield and reliability throughout this year and plans to offer the process to its customers by late 2025.

Additionally, DB HiTek has successfully developed an 8-inch GaN process with 650V HEMT characteristics and plans to complete reliability validation within the year. The company announced that it will launch a dedicated GaN MPW service in October, actively supporting customer product evaluations.

According to market research firm Yole Développement, the global SiC and GaN power semiconductor market is expected to grow from $3.6 billion in 2024 to $7.6 billion in 2027, with a high CAGR of 27.6%.

Regarding its participation in PCIM 2025, DB HiTek commented, “This exhibition will provide an opportunity to demonstrate our recognized strengths in supporting fabless customers and collaborating with global clients in the European market.”

DB HiTek has established itself as a global leader in 8-inch Analog and Power semiconductor processes. However, the European customer base remains relatively small compared to other regions. The company aims to use this event to expand its footprint in the growing European market by acquiring new customers and strengthening collaborations with existing clients.

Currently, DB HiTek is mass-producing chips for 400 companies, with cumulative shipments of 6 million 8-inch wafers for Analog and Power semiconductor. The company has also secured Specialty CIS process technologies, including X-ray sensors, Global Shutter, and SPAD, and is actively engaged in mass production with various partners. Its semiconductor applications span mobile, consumer, and industrial sectors, with a growing share of automotive chips in recent years.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/db-hitek-to-participate-in-pcim-2025-strengthening-marketing-in-europe-302418257.html

SOURCE DB HiTek

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CIBF2025 to Unveil Breakthroughs Shaping the Future of Energy Storage

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Batteries Spearhead Dual Economic and Technological Race in 2025 

TIANJIN, China, April 7, 2025 /PRNewswire/ — The 17th China International Battery Fair (CIBF2025), Asia’s premier battery industry gathering, will be held at the Shenzhen Convention & Exhibition Center from May 15-17, 2025. Organized by the China Industrial Association of Power Sources (CIAPS), the 300,000-sqm event will span 15 halls, hosting 3,100 global exhibitors spotlighting next-gen technologies and solutions. 

Industry Giants to Showcase Synergies Between Innovation and Commercialization

Confirmed participants include industry leaders CATL, BYD, EVE Energy, Gotion High-tech, Cornex, Sunwoda, and Lishen Battery, alongside Dynanonic, Hunan Yuneng, SEMCORP and other key suppliers. The event will also highlight advancements in smart battery management systems (BMS) and energy storage solutions. In a move to streamline event access, CIBF2025 has set up two registration entrances (North/South), in anticipation of the more than 400,000 professional buyers and visitors worldwide, who are looking forward to the opportunities for networking and deal-making. 

Attendees to the CIBF2025 Conference on the Frontier Technology of Advanced Batteries taking place concurrently will discuss critical industry themes of the day, with a focus on the lastest advancements in lithium-ion batteries, battery safety and testing, solid-state and next-gen batteries, high-power fast charging, sodium-ion batteries, advanced materials, and smart manufacturing with digital twins. 

Additionally, the event will host several high-level forums including the Electric Aviation & Next-Gen Batteries (CIBF2025 Shenzhen) Technical Conference, the CIBICS Battery Industry Cooperation Forum, and the Isotope Nuclear Battery Status and Future Development Symposium, in addition to more than 200 technical presentations to decode emerging trends and explore the future of battery ecosystems.

The TWh Era Arrives: Batteries Power Economic Growth

China’s lithium battery industry achieved landmark growth in 2024, with total output surging 24% year on year to 1,170GWh and industry valuation exceeding 1.2 trillion yuan. The sector demonstrated balanced growth across key applications: consumer electronics (84GWh); energy storage (260GWh); and power batteries (826GWh). Total installations surpassed 645GWh, reflecting a year-on-year increase of 48%. 

Electric vehicles (EVs) have cemented China’s leadership in the global battery revolution. With 2024 power battery shipments rising to 1,157GWh worldwide, the industry has decisively crossed into the TWh era – a milestone underscored by Chinese firms’ growing market dominance.

The lithium battery boom extends beyond EVs, with energy storage deployments reaching record highs. According to BloombergNEF and SNE Research, global installations for energy storage exceeded 175GWh in 2024, while shipments surged 64% year-on-year to 303GWh. Chinese battery manufacturers are emerging as key drivers of the global clean energy transition.

The low-altitude economy has evolved into a strategic growth sector, featured prominently in regional government blueprints and poised to unlock a new trillion-yuan market. Over 10 innovative applications—among them, air taxis, emergency rescue systems, drone logistics, and regional air mobility—are creating unprecedented demand for advanced battery solutions. 

As new entrants flood this high-potential market, competition is accelerating breakthroughs in critical technologies, including enhanced safety protocols, ultra-fast charging capabilities, high energy density solutions, and extended cycle life performance.

Join the event at CIBF2025, May 15-17, 2025, at the Shenzhen Convention & Exhibition Center.

 

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/cibf2025-to-unveil-breakthroughs-shaping-the-future-of-energy-storage-302417722.html

SOURCE China Industrial Association of Power Sources

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