Technology

Hitek Systems Introduces Agilex® 7 SoC FPGA-Based Radio Development Platform

Published

7 months ago

February 15, 2024

Hitek Systems, Intel and Texas Instruments Collaboration Supports Open RAN Architectures for Small- to Macro-cell Base Stations. Hitek Systems today introduced a new Hitek eSOM7C development platform designed to ease the design and deployment of Intel-based Open Radio Access Network (RAN) architectures (O-RAN) for LTE, 5G and other wireless communications systems, while increasing system interoperability and performance.

GERMANTOWN, Md., Feb. 15, 2024 /PRNewswire-PRWeb/ — Hitek Systems today introduced a new Hitek eSOM7C development platform designed to ease the design and deployment of Intel-based Open Radio Access Network (RAN) architectures (O-RAN) for LTE, 5G and other wireless communications systems, while increasing system interoperability and performance.

The new ESOM7C development platform incorporates TI’s AFE7769D into Hitek’s Intel Agilex® 7 SoC FPGA embedded system on module (eSOM7C) development platform to provide efficient conversion of baseband data into RF signals for single-, dual- and even tri-band wireless systems. The AFE7769D quad-channel RF transceiver with integrated crest factor reduction and digital pre-distortion (DPD) enables designers to more efficiently optimize power levels from gallium nitride or other RF power amplifiers ranging from 24 dBm at 250 mW to >50 dBm (>100 W), enabling them to optimize system efficiency and performance, regardless of the power transmission level.

Modern high-power amplifiers rely on DPD functionality to linearize RF output signals to comply with the 3GPP standard and regional RF spectrum emissions specifications. TI’s AFE7769D integrates a high-performance, low-power, hardware-accelerated DPD engine to reduce FPGA overhead, which can enable system designers to achieve an approximate 30% throughput reduction, 30% power savings and 50% system design cost reduction.

“Hitek Systems created the new development platform to help streamline system integration and interoperability to enable more adaptable flexible radio access networks, while enhancing any system integrator’s choices, capabilities and time to market” said Tariq Muhammad, President Hitek Systems.

Hitek’s Intel Agilex® SoC FPGA based eSOM7, eSOM7C and eSOM5C modules are designed for embedded applications such as high-speed signal processing, wireless nodes with high-performance RF transceivers, and networking equipment. The compatibility between TI’s AFE7769D evaluation module and Intel’s Agilex® 7 SoC FPGA is simplified by an FPGA mezzanine card (FMC+) connector that enables multivendor interoperability. Hitek’s eSOM development platforms reduce the integration overhead of the FPGA, DDR4 memory and power-management subsystem design, to help solve the challenge of layout complexity during the product development cycle.

The new Hitek platform enables swift assembly of functional radio designs within days or weeks instead of months, resulting from Intel’s Open-Radio Unit (O-RU) radio enablement package, which encompasses a full-fledged 5G New Radio (NR) O-RU workload. The package includes a foundational CAT-A radio data path, an array of development tools, in-depth documentation, and hardware capable of handling 200-MHz bandwidth for four-transmitter, four-receiver (4T4R) time-division duplexing configurations. Enhancing this suite, Intel’s integrated IEEE 1588 version 2 solution, alongside Hitek’s Skyworks Si5518 network synchronizer module, ensures system-wide synchronization, providing the precise network timing and low-phase noise transmit clocks necessary for 5G applications.

In addition, a comprehensive TI user guide, “Interfacing AFE7769DEVM With the Hitek Agilex eSOM7 FPGA,” accompanies the platform, supporting the hardware and software setup, including images to visually guide users through the process. In addition to simple setup instructions, the guide covers insights into bring-up steps, loop-back examples and detailed LTE signal testing.

“Seamless access to wireless systems has been a barrier in the industry for manufacturers and network operators – and ultimately consumers – for decades,” said Karthik Vasanth, TI vice president and general manager of Data Converters and Clocks. “With this design, engineers can take advantage of the predefined hardware and software solutions to speed time to market for Intel-based Open RAN designs for small- to macro-cell base stations.”

“Our collaboration with a diverse range of ecosystem participants is a driving force behind Intel’s rapid progress of Open RAN and pioneering of wireless technologies.” Shared by Mike Fitton, Vice President of Intel PSG’s Network Business Division. “I feel privileged to share this joint investment with our customers and partners – it’s a testament to our commitment to providing tools and IP that not only offer significant cost savings in capital and engineering expenditures but also enable the innovation of distinct, customizable designs. This approach democratizes the market, welcoming both new entrants and established vendors, paving the way for novel innovations by creating valuable time for development.”

Intel will demonstrate the Hitek eSOM7C with TI’s AFE7769D and Intel’s Agilex® 7 SoC FPGA at Mobile World Congress on February 26t- 29 in Barcelona, in Hall 3, Stand 3E31.

TI will host a technical webinar with Intel and Hitek Systems on March 6, 2024 about the Hitek eSOM7C with TI’s AFE7769D and Intel’s Agilex® 7 SoC FPGA for O-RAN, broadband wireless, satellite communications gateways, networking, edge AI and machine learning applications.

The Hitek eSOM7 and eSOM7C are commercially available today via Hitek Systems. The Hitek eSOM5C is drop-in compatible with Hitek eSOM7C, supporting Intel Agilex® 5 SOC FPGA.

Media Contact

Matt Walker, Hitek Systems LLC, 1 3015288074, info@hiteksys.com, www.hiteksys.com

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SOURCE Hitek Systems LLC

Technology

Huawei Launches All-New Xinghe Intelligent Campus with Full Upgrades, Maximizing Enterprises’ Intelligent Productivity

Published

24 mins ago

September 21, 2024

SHANGHAI, Sept. 21, 2024 /PRNewswire/ — During HUAWEI CONNECT 2024, the Xinghe Intelligent Campus session was successfully held, attracting more than 200 industry pioneers, experts, and scholars from around the world to explore campus network trends and technological innovations. Also at the event, Huawei unveiled its all-new Xinghe Intelligent Campus Solution that stands out for full upgrades to wireless, application, and operations & maintenance (O&M) experience.

Shawn Zhao, President of the Campus Network Domain, Huawei’s Data Communication Product Line, said, “As video conferencing, AI terminals, and AI applications become more widespread, the campus network access density has increased threefold, and the demand for bandwidth has grown tenfold. In this case, users place new requirements on the assurance for AI applications and audio/video services while expecting more intelligent O&M.”

To meet these needs, Huawei launched its all-new Xinghe Intelligent Campus Solution with full upgrades. Specifically, this solution upgrades wireless experience in performance, roaming, and IoT convergence. It also leverages X-Scheduler (an experience scheduling engine) to upgrade application experience, while drawing on AI-assisted decision-making and a tidal prediction algorithm to upgrade O&M experience. These help customers build an industry-leading digital infrastructure and facilitate the digital and intelligent transformation of enterprises.

In addition, the solution provides end-to-end security assurance. On the wireless side, the innovative Wi-Fi Shield technology radically prevents packet eavesdropping on the air interface. On the wired side, the full-link MACsec capabilities from switches to APs ensure secure campus network data transmission since the very beginning.

Also at the session, leading analyst firms, customers, and partners in various industries shared their unique insights, best practices, and successful cases. Key speakers include Sian Morgan, Research Director of Dell’Oro Group; Dr. Haitham S. Hamsa, Professor of Information Technology, Cairo University; Shang Qun, Assistant to the Director of the Computing Center, Peking University; Sun Pan, Director of Infrastructure Operations Dept, System Digitalization Dept, FAW Group; Connee Zhang, CEO of CypressTel. Their valuable practices will provide a unique reference for the digital and intelligent transformation of enterprises across industries.

Looking ahead, Huawei believes that the Xinghe Intelligent Campus Solution will become the preferred choice for global enterprises’ digital and intelligent transformation to reap more benefits.

For more information about Huawei’s Xinghe Intelligent Campus Solution, visit https://e.huawei.com/en/solutions/enterprise-network/campus-network.

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SOURCE Huawei

Technology

Duplicate File Finder from Nektony goes global: Now available in six languages

Published

24 mins ago

September 21, 2024

Nektony proudly announces the release of Duplicate File Finder version 8, featuring six additional languages and the highly anticipated Dark Mode.

ODESA, Ukraine , Sept. 21, 2024 /PRNewswire-PRWeb/ — Nektony is excited to unveil Duplicate File Finder version 8, a powerful tool designed to help users efficiently find and remove duplicate files on their Macs, freeing up valuable disk space and improving system performance.

With the latest update, Duplicate File Finder is now accessible to an even broader audience, thanks to its new multilingual support. In addition to localization, version 8 introduces Dark Mode.

With the latest update, Duplicate File Finder is now accessible to an even broader audience, thanks to its new multilingual support:

FrenchItalianUkrainianRussianChineseGermanSpanish

The addition of these languages ensures that users around the world can navigate and utilize the app in their native language, making the process of cleaning up duplicate files even more intuitive and user-friendly.

In addition to localization, version 8 introduces Dark Mode, allowing users to switch to a darker interface that’s easier on the eyes, especially in low-light environments. Dark Mode not only enhances visual comfort but also provides a modern and stylish look to the app, aligning with macOS’s native Dark Mode functionality.

Best strengths

Accurate byte-to-byte resultsFinding all types of duplicate filesSupport of any drive type, Photos, and Music librariesThe Auto Select feature to quickly select all duplicatesFinding similar photos and musicComparing and merging foldersCleaning up duplicates from similar foldersChecking two files to see whether they are duplicates

Availability:

Duplicate File Finder v.8 is available for download from the Mac App Store. It is compatible with macOS 10.13 or later and requires a 64-bit processor. The app is free to use for finding duplicate files, while advanced features are available through an in-app purchase of $14.95.

Brief Description:

App Name: Duplicate File FinderSystem Requirements: macOS 10.13 – 15, 64-bit processorPrice: Free, with advanced features for $14.95

Key Links:

Duplicate File Finder product page Download Duplicate File Finder from the App Store

About Nektony:

Nektony is a trusted developer of Mac optimization software tools with over 10 years of experience and millions of satisfied customers worldwide. Nektony’s products include MacCleaner Pro, App Cleaner & Uninstaller, Disk Space Analyzer, and more. The company’s mission is to help users get the most out of their Macs by providing simple, effective, and affordable solutions.

For more information, please contact:

pr@nektony.com

nektony.com

Media Contact

Asya Karapetyan, Nektony, 34 624983684, pr@nektony.com, https://nektony.com/help

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SOURCE Nektony

Technology

2024 World Manufacturing Convention Showcases Next-Gen Technologies

Published

24 mins ago

September 21, 2024

HEFEI, China, Sept. 21, 2024 /PRNewswire/ — As technology and innovation converge, a grand feast celebrating the manufacturing industry is commencing. On September 20, the 2024 World Manufacturing Convention opened its doors at the Hefei Binhu International Convention and Exhibition Center in Hefei, Anhui Province. As a premier event in the manufacturing sector, this convention has brought together top global enterprises, innovative technologies, and cutting-edge concepts to present a feast of technology and innovation to the attendees.

In the Smart Robotics Zone, a variety of robots are busy showcasing their diverse capabilities. The latest unveiling at Jianghuai Advance Technology Center, the ‘Qijiang No.2’ humanoid robot, standing at 1.8 meters tall and weighing 60 kilograms, with 38 degrees of freedom throughout its body. It can not only perform basic human limb movements but also execute delicate tasks like folding clothes, opening bottles, pouring water, and washing dishes with ease. Moreover, it can navigate rough terrains, resembling an intelligent steel companion, sparking anticipation for the future of automation and intelligence in the manufacturing industry.

In the 3D Printing Zone, exquisite exhibits leave spectators in awe. From intricate mechanical components to lifelike artworks, 3D printing technology, with its precise replication and rapid prototyping capabilities, has brought revolutionary changes to the manufacturing industry. Inside the zone, staff are busy calibrating equipment, preparing for a spectacular 3D printing showcase. Meanwhile, the third-generation locally developed 72-qubit superconducting quantum computer, “Origin Wukong,” from the Hefei High-tech Zone, is capturing significant interest. This quantum computer, with over 80% domestic components from hardware to quantum chips, operating systems, and application software, boasts unimaginable computing power, paving new paths for future research, finance, and numerous other fields, shining brightly as a rising star in the quantum technology realm.

Green energy and environmental protection technologies are also significant highlights of this convention. The Green Manufacturing Zone showcases a wide array of energy-saving and eco-friendly equipment and renewable energy products. The application of these technologies not only reduces energy consumption and emissions in manufacturing but also provides robust support for sustainable development.

Furthermore, the convention features multiple zones such as Precision Manufacturing and Intelligent Manufacturing, comprehensively displaying the latest achievements and future trends in the manufacturing industry. Exhibitors have expressed their intentions to leverage this platform to showcase their capabilities, seek collaboration opportunities, and collectively drive high-quality development in manufacturing.

The 2024 World Manufacturing Convention is not just a feast of technology and innovation but also a platform for exchange and cooperation. Here, top leaders in the global manufacturing sector will convene to discuss the future trajectories and pathways of manufacturing. It is believed that in the near future, these cutting-edge technologies and innovative concepts will lead the manufacturing industry towards an even brighter future.

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SOURCE World Manufacturing Convention