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China Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report 2023 Featuring 11 Automotive Power Supply Providers and 7 Automotive Power Supply Chip Suppliers

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DUBLIN, Feb. 15, 2024 /PRNewswire/ — The “Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report, 2023” report has been added to ResearchAndMarkets.com’s offering.

Automotive power supply and IC: Chinese chips are promising in the evolution from physical integration to system integration

As the core component of a new energy vehicle, automotive power supply is mainly used to convert the electric energy of the power battery into the voltage and current suitable for the vehicle, and also provides stable power support for the electrical equipment inside the vehicle. The surging new energy vehicle sales spur the boom of automotive power supply market.

OBCs, DC/DC converters and PDUs in automotive power supply can be independent components or integrated systems. As per the product structure of mainstream suppliers in recent two years, the proportion of independent components is declining sharply, while the shipments of ‘two-in-one’, ‘three-in-one’ and ‘all-in-one’ integrated forms are jumping.

All-in-one solution from physical integration to system integration

The integration trend of automotive power supply is clear, and OBCs, DC/DC converters and PDUs are further integrated with electric drive and ECU. FinDreams Powertrain, Changan NE, Huawei Digital Power, etc. are all promoting the all-in-one electric drive assembly integrated with OBCs. The mode of high integration can save space, reduce weight and improve the overall efficiency.

In the future, the ‘all-in-one’ integrated solution will evolve from mechanical hardware integration to power components integration, and deeply integrate software with the backend to form a control domain for the drive system – fully combining battery data, electric drive data, charging data, etc., evolving towards the power domain controller.

Huawei: the hyper-converged ‘ten-in-one’ power domain module launched in April 2023 pioneers chip integration, power integration, function integration and domain controller integration to reduce the BOM by 40% and the number of chips by 60%, thus improving the development efficiency of automakers by 30%. In addition, it enables more concise layout of the front cabin of vehicles, releases more interior space and provides better comfort experiences for occupants.

ST: ST New Energy Vehicle Innovation Center has built a range of system solutions based on Stella series, including the 22kW Stellar E-based OBC-DC/DC combined solution and the Stella P-based all-in-one powertrain domain controller.

The all-in-one powertrain domain controller is based on ST’s latest Stellar P series automotive MCU, and integrates the following components: main drive inverter, vehicle control unit (VCU), battery management unit (BMU) motherboard, on-board charger (OBC) and DC/DC converter. The highly integrated solution improves power density, reduces the number of high/low-voltage connectors, and optimizes the cost of hardware BOM and software development and maintenance.

Localization is promising in the upstream supply chain of automotive power supply.

Silicon carbide is widely used in automotive power supply products.

Conventional silicon-based power semiconductors can only limitedly improve the efficiency and power density of automotive power supply, while SiC power devices have advantages in on-resistance, blocking voltage and junction capacitance, and are rapidly introduced in high-end new energy electric vehicles.

OBCs and DC/DC converters have started wide adoption of SiC devices, for instance, PFC diodes are replaced by SiC SBDs, or DC/DC primary circuit MOS tubes of OBCs are substituted by SiC MOS, and all-SiC solution is expected to enter the stage of mass application soon. So far, BYD, Tesla, Hyundai, Jaguar Land Rover, Geely, Renault, SAIC Volkswagen and Nissan among others have used the third-generation SiC semiconductor devices in automotive power supply.

Infineon: In June 2023, Infineon presents its new generation of 1200 V CoolSiCT MOSFETs in TO263-7 for automotive applications. The automotive-graded silicon carbide (SiC) MOSFET generation offers high power density and efficiency, enables bi-directional charging and significantly reduces system cost in on-board charging (OBC) and DC-DC applications. In addition, the 1200 V CoolSiC family member offers best-in-class switching performance through 25% lower switching losses and lowers the SiC MOSFET junction temperature by 25%, compared to the first generation.

The pace of homemade automotive power supply MCUs in China replacing imported counterparts quickens.

At present, major automotive power supply IC vendors are working to improve product performance to meet ever higher requirements.

TI: In the existing automotive power supply system, customers often have high requirements for high efficiency and better thermal performance. Both OBCs and communication power supply products are getting smaller, and the switching frequency is also becoming higher, posing bigger EMI challenges. In March 2023, TI introduced standalone active electromagnetic interference (EMI) filter integrated circuits (ICs), enabling engineers to implement smaller, lighter EMI filters, to enhance system functionality at reduced system cost while simultaneously meeting EMI regulatory standards.

The new portfolio of stand-alone active EMI filter ICs can sense and cancel common-mode EMI by as much as 30 dB at frequencies between 100 kHz and 3 MHz in single- and three-phase AC power systems. This capability enables designers to reduce the size of chokes by 50%, compared to purely passive filter solutions.

Currently, ST and TI’s solutions prevail in the automotive power supply market, especially TI’s C2000 series chips that are still seen in popular electric models, such as Xpeng P7, and are used by mainstream OBC/DC-DC suppliers such as Shinry Technologies and Zhejiang EV-Tech as the main control chips.

In the recent two years, Chinese main control chip suppliers have stood a chance to replace foreign counterparts with the products made in China. Domestic suppliers have accelerated their layout in the field of main control chips, and are developing from basic OBC and DC-DC applications to all-in-one dynamic domains.

Automotive Power Supply (OBC+DC/DC+PDU) and Integrated Circuits (IC) Industry Report, 2023 highlights the following:

Automotive power supply (technology trends, market size, products & solutions, etc.);On-board charger (OBC) (product structure, technology development trends, market size, structure of main suppliers, price trend, etc.);DC/DC converter (technology trends, market size, competitive landscape, cost structure, main solutions, etc.);Power distribution unit (PDU) (product structure, technology trends, market size, competitive landscape, cost structure, solutions of main suppliers, etc.);Main automotive power supply components (MCU, power supply IC, relay, PFC converter, etc.) (product structure, main suppliers and products, etc.);Main automotive power supply suppliers (product line, technology layout, product price, main customers, market position, etc.).

Key Topics Covered:

1. Automotive Power Supply Industry Development
1.1 Development Status of China New Energy Vehicle Industry
1.2 Overview of New Energy Vehicle Power Supply Products
1.3 Development Trend of Automotive Power Supply Technology
1.4 Automotive Power Supply Market Size and Share
1.5 Automotive Power Supply Cost, Price and Supply Chain
1.6 Automotive Power Supply Suppliers and Product Solutions

2. Automotive On-board Charger (OBC) Technology and Market
2.1 OBC Overview
2.2 Development Trend of OBC Technology
2.3 OBC Market Size and Share
2.4 OBC Cost, Price and Supply Chain
2.5 OBC Suppliers and Product Solutions
2.6 Main Suppliers of New Energy Passenger Car OBC

3. DC/DC Converter Technology and Market
3.1 DC/DC Converter Overview
3.2 Development Trend of DC/DC Technology
3.3 DC/DC Market Size and Share
3.4 DC/DC Cost, Price and Supply Chain
3.5 DC/DC Suppliers and Product Solutions

4. Power Distribution Unit (PDU) Technology and Market
4.1 PDU Product Overview
4.2 Development Trend of PDU Technology
4.3 PDU Market Size and Share
4.4 PDU Cost, Price and Supply Chain
4.5 PDU Suppliers and Product Solutions

5 Research on Vehicle Power Supply Chain (Chips, Components)
5.1 Analysis of Vehicle Power Supply Solution
5.2 Key Technology of Vehicle Power Supply: MCU
5.3 Key Technology of Automotive Power Supply: Power Chip
5.4 Key Technology of Automotive Power Supply: Isolation Chip
5.5 Key Technology of Automotive Power Supply: silicon carbide
5.6 Key Technology of Automotive Power Supply: relay
5.7 Key Technology of Automotive Power Supply PFC converter

6. Automotive Power Supply Providers
6.1 Shenzhen VMAX New Energy Co., Ltd.
6.2 FinDreams Powertrain
6.3 Zhejiang EV-Tech Co., Ltd.
6.4 Tesla (Sanmina Corporation)
6.5 Shinry Technologies
6.6 Tiecheng Information Technology Co., Ltd.
6.7 Zhuhai Enpower Electric Co., Ltd.
6.8 KOSTAL
6.9 Shanghai Huawei Digital Energy Technology Co., Ltd.
6.10 Meta System (Chongqing) (Shenzhen Deren Electronic )
6.11 Valeo

7. Automotive Power Supply Chip Suppliers
7.1 ST
7.2 TI
7.3 NXP
7.4 OnSemiconductor
7.5 ChipON
7.6 SemiDrive
7.7 Silergy

For more information about this report visit https://www.researchandmarkets.com/r/xer5pl

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Huawei Launches Over 20 All-New Xinghe Intelligent Network Offerings to Amplify Industrial Intelligence

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September 21, 2024

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SHANGHAI, Sept. 21, 2024 /CNW/ — During HUAWEI CONNECT 2024, Leon Wang, President of Huawei’s Data Communication Product Line, announced more than 20 all-new Xinghe Intelligent Network offerings globally at the summit themed “Xinghe Intelligent Network, Amplify Industrial Intelligence”. These purpose-built offerings contribute to an AI network ecosystem and help customers seize opportunities for intelligent development and maximize intelligent productivity.

With the development of AI technologies, the world is advancing from digital transformation to intelligent transformation. All industries are quickly adopting AI technologies to create new use cases, for example, self-driving cars, intelligent diagnosis and treatment, and intelligent train inspection. All of these are significantly improving the efficiency and experience of our work and daily lives.

The advent of the intelligent era is driving networks into intelligent ones. Huawei has been making joint efforts with partners to lead research and practices of intelligent networks. That’s why Huawei constantly upgrades its Xinghe Intelligent Network offerings to help customers grasp opportunities for intelligent development, build new intelligent network infrastructure, and maximize intelligent productivity in the intelligent era. Key highlights include the following:

Xinghe Intelligent Campus focuses on AI-enabled, experience-centric campus network construction, ensuring zero freezing for audio and video applications, zero degradation on services, and zero waiting for interactions.Xinghe Intelligent WAN introduces a wide range of intelligent technologies to intelligently schedule millions of flows and precisely optimize service experience.Xinghe Intelligent Fabric adopts the AI Turbo engine to improve network throughput, enhancing foundation model training efficiency.Xinghe Intelligent Network Security integrates AI technologies into network security detection, accurately and rapidly identifying threats.

To support network solutions in various scenarios, Huawei released more than 20 featured offerings globally. Examples include the industry’s first 100 Tbps fixed-form Ethernet data center switch, the industry’s first 51.2 Tbps liquid-cooled fixed-form data center switch, the industry’s first AI router, high-quality 10 Gbps campus switches and Wi-Fi 7 APs, Intelligent SASE Branch Security Solution, and the industry’s first IP Autonomous Driving Network Solution. All these offerings are designed to help customers with greater business returns.

As the intelligent era calls for intelligent networks, Huawei will continue to drive the development of intelligent networks and upgrade its Xinghe Intelligent Network products and solutions, ultimately helping global customers to stride towards the intelligent era and reap more benefits.

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SOURCE Huawei

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HUAWEI CONNECT 2024 | Huawei Unveils the Brand-New Xinghe Intelligent Fabric Solution, Powering the AI Era

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1 hour ago

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September 21, 2024

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SHANGHAI, Sept. 21, 2024 /PRNewswire/ — At HUAWEI CONNECT 2024, over 300 industry leaders, experts, and scholars gathered for the data center network session themed “Xinghe Intelligent Fabric, Powering the AI Era.” The event featured discussions on the evolution and technological advancements of data center networks. During the session, Arthur Wang, President of Data Center Network Domain at Huawei’s Data Communication Product Line, introduced the newly upgraded Xinghe Intelligent Fabric solution. This cutting-edge solution aims to establish a data center network characterized by one map for intelligent operations and maintenance (O&M), one network for diverse computing, and one platform for simplified deployment, providing a robust network infrastructure to support enterprises’ digital and intelligent transformations.

In his keynote speech, Arthur Wang outlined the emerging trends in data center network development. He emphasized that in the AI era, data center networks require both a “brilliant brain” and “resilient bones.” The newly launched Xinghe Intelligent Fabric solution is designed to deliver a powerful network infrastructure tailored for the AI era, featuring:

One Map for Intelligent O&M: Zero Management Concerns

Huawei’s exclusive network digital map enables rapid cross-data center and cross-vendor fault identification within minutes. Additionally, the NetMaster network large model facilitates AI-driven O&M, eliminating manual intervention and ensuring zero management concerns.

One Network for Diverse Computing: Zero Service Interruptions

The Xinghe Intelligent Fabric supports various application scenarios, including intelligent computing, general-purpose computing, and storage. The innovative Network Scale Load Balancing (NSLB) algorithm increases network throughput to 95% and boosts AI training efficiency by over 10%. With the exclusive iReliable three-level fast switchover capability, it achieves sub-millisecond switchover, guaranteeing zero service interruptions.

One Platform for Simplified Deployment: Zero Configuration Errors

By employing digital twins to simulate networks in advance and verify configurations post-deployment, the solution ensures 100% accuracy in network changes. By harnessing network-security convergence capabilities, AI creates an intelligent security matrix to analyze millions of security policies, achieving zero configuration errors.

Looking ahead, Huawei will continue to collaborate with industry partners to enhance research and innovation in data center networks, promote intelligent upgrades, and create greater value for the industry.

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SOURCE Huawei

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Cultivating a Culture of Peace: International Day of Peace Statement by Education Cannot Wait Executive Director Yasmine Sherif

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4 hours ago

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September 21, 2024

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NEW YORK, Sept. 21, 2024 /CNW/ — The longing for peace transcends time, geography and religion. Based on justice, human rights and universal values outlined in the UN Charter, a culture of peace brings us all together in our common agenda for humanity. We can only co-exist by aligning ourselves with such a world order.

On today’s International Day of Peace, we call on world leaders to end conflict and embrace a culture of peace as enshrined in the UN Charter and related international law.

As the UN General Assembly outlined in the Declaration and Programme of Action on a Culture of Peace  a quarter of a century ago, this must include: “Respect for life, human rights and fundamental freedoms; the promotion of non-violence through education, dialogue and cooperation; commitment to peaceful settlement of conflicts; and adherence to freedom, justice, democracy, tolerance, solidarity, cooperation, pluralism, cultural diversity, dialogue and understanding at all levels of society and among nations.”

Educating for peace starts at home and continues in school through years of education. This takes place during the most formative years of a child learning about their identity, ethics, values, conscience, courage and compassion. Wherever there has been a failure in imparting on children the imperative for peace, the world is turned upside down. This is a global failure with no geographical boundaries.

Today, we live in a world of unprecedented violence, armed conflict and chaos. All the genuine and heartfelt commitments made in 1945 in the UN Charter seem to be fading away. Children and adolescents are the most vulnerable, the least protected, and the most impacted. They bear the brunt. 

Global conflicts killed three times as many children in 2023 than in the previous year, according to the United Nations. The number of forcibly displaced people reached an unprecedented 120 million in May 2024.

“In 2023, the United Nations verified a record 32,990 grave violations against 22,557 children in 26 conflict zones, a 35% increase from the previous year,” according to recent analysis by the UN.

We can end these violations and invest in a constructive co-existence globally. We can use our resources for education, rather than for wars. In classrooms around the world, girls and boys who have withstood the wrath of war can rebuild their hopes and their lives. Cultivating a culture of peace is possible. The financial resources exist. The choice as to how we use them is ours.

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SOURCE Education Cannot Wait

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