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IBM Debuts Next-Generation Quantum Processor & IBM Quantum System Two, Extends Roadmap to Advance Era of Quantum Utility

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University of Tokyo, Argonne National Laboratory, Fundacion Ikerbasque, Qedma, Algorithmiq, University of Washington, University of Cologne, Harvard University, UC Berkeley, Q-CTRL demonstrate new research to explore power of utility-scale quantum computing ‘IBM Quantum Heron’ is released as IBM’s most performant quantum processor in the world, with newly built architecture offering up to five-fold improvement in error reduction over ‘IBM Quantum Eagle’ IBM Quantum System Two begins operation with three IBM Heron processors, designed to bring quantum-centric supercomputing to reality Expansion of IBM Quantum Development Roadmap for next ten years prioritizes improvements in gate operations to scale with quality towards advanced error-corrected systems Qiskit 1.0 announced, the world’s most widely used open-source quantum programming software, with new features to help computational scientists execute quantum circuits with ease and speedIBM showcases generative AI models engineered to automate quantum code development with watsonx and optimize quantum circuits

NEW YORK, Dec. 4, 2023 /PRNewswire/ — Today, at the annual IBM Quantum Summit in New York, IBM (NYSE: IBM) debuted ‘IBM Quantum Heron,’ the first in a new series of utility-scale quantum processors with an architecture engineered over the past four years to deliver IBM’s highest performance metrics and lowest error rates of any IBM Quantum processor to date.

IBM also unveiled IBM Quantum System Two, the company’s first modular quantum computer and cornerstone of IBM’s quantum-centric supercomputing architecture. The first IBM Quantum System Two, located in Yorktown Heights, New York, has begun operations with three IBM Heron processors and supporting control electronics. 

With this critical foundation now in place, along with other breakthroughs in quantum hardware, theory, and software, the company is extending its IBM Quantum Development Roadmap to 2033 with new targets to significantly advance the quality of gate operations. Doing so would increase the size of quantum circuits able to be run and help to realize the full potential of quantum computing at scale. 

“We are firmly within the era in which quantum computers are being used as a tool to explore new frontiers of science,” said Dario Gil, IBM SVP and Director of Research. “As we continue to advance how quantum systems can scale and deliver value through modular architectures, we will further increase the quality of a utility-scale quantum technology stack – and put it into the hands of our users and partners who will push the boundaries of more complex problems.”

As demonstrated by IBM earlier this year on a 127-qubit ‘IBM Quantum Eagle’ processor, IBM Quantum systems can now serve as a scientific tool to explore utility-scale classes of problems in chemistry, physics, and materials beyond brute force classical simulation of quantum mechanics.

Since that demonstration, leading researchers, scientists, and engineers from organizations including the U.S. Department of Energy’s Argonne National Laboratory, the University of Tokyo, the University of Washington, the University of Cologne, Harvard University, Qedma, Algorithmiq, UC Berkeley, Q-CTRL, Fundacion Ikerbasque, Donostia International Physics Center, and the University of the Basque Country, as well as IBM, have expanded demonstrations of utility-scale quantum computing to confirm its value in exploring uncharted computational territory.

This includes experiments already running on the new IBM Quantum Heron 133-qubit processor, which IBM is making available for users today via the cloud. IBM Heron is the first in IBM’s new class of performant processors with significantly improved error rates, offering a five-times improvement over the previous best records set by IBM Eagle. Additional IBM Heron processors will join IBM’s industry-leading, utility-scale fleet of systems over the course of the next year.

IBM Quantum System Two and Extended IBM Quantum Development Roadmap

IBM Quantum System Two is the foundation of IBM’s next generation quantum computing system architecture. It combines scalable cryogenic infrastructure and classical runtime servers with modular qubit control electronics. The new system is a building block for IBM’s vision of quantum-centric supercomputing. This architecture combines quantum communication and computation, assisted by classical computing resources, and leverages a middleware layer to appropriately integrate quantum and classical workflows.

As part of the newly expanded ten-year IBM Quantum Development Roadmap, IBM plans for this system to also house IBM’s future generations of quantum processors. Also, as part of this roadmap, these future processors are intended to gradually improve the quality of operations they can run to significantly extend the complexity and size of workloads they are capable of handling.

Qiskit and Generative AI to Increase Ease of Quantum Software Programming 

Today, IBM is also detailing plans for a new generation of its software stack, within which Qiskit 1.0 will be a pivot point defined by stability and speed. Additionally, and with the goal of democratizing quantum computing development, IBM is announcing Qiskit Patterns.

Qiskit Patterns will serve as a mechanism to allow quantum developers to more easily create code. It is based in a collection of tools to simply map classical problems, optimize them to quantum circuits using Qiskit, executing those circuits using Qiskit Runtime, and then postprocess the results. With Qiskit Patterns, combined with Quantum Serverless, users will be able to build, deploy, and execute workflows integrating classical and quantum computation in different environments, such as cloud or on-prem scenarios. All of these tools will provide building blocks for users to build and run quantum algorithms more easily.

Additionally, IBM is pioneering the use of generative AI for quantum code programming through watsonx, IBM’s enterprise AI platform. IBM will integrate generative AI available through watsonx to help automate the development of quantum code for Qiskit. This will be achieved through the finetuning of the IBM Granite model series.

“Generative AI and quantum computing are both reaching an inflection point, presenting us with the opportunity to use the trusted foundation model framework of watsonx to simplify how quantum algorithms can be built for utility-scale exploration,” said Jay Gambetta, Vice President and IBM Fellow at IBM. “This is a significant step towards broadening how quantum computing can be accessed and put in the hands of users as an instrument for scientific exploration.”

With advanced hardware across IBM’s global fleet of 100+ qubit systems, as well as easy-to-use software that IBM is debuting in Qiskit, users and computational scientists can now obtain reliable results from quantum systems as they map increasingly larger and more complex problems to quantum circuits.

About IBM

IBM is a leading provider of global hybrid cloud and AI, and consulting expertise. We help clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. More than 4,000 government and corporate entities in critical infrastructure areas such as financial services, telecommunications and healthcare rely on IBM’s hybrid cloud platform and Red Hat OpenShift to affect their digital transformations quickly, efficiently and securely. IBM’s breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and consulting deliver open and flexible options to our clients. All of this is backed by IBM’s long-standing commitment to trust, transparency, responsibility, inclusivity and service.

Visit www.ibm.com for more information.

MEDIA CONTACTS

Erin Angelini
IBM Communications
edlehr@us.ibm.com 

Hugh Collins
IBM Communications
hughdcollins@ibm.com 

 

 

 

 

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Innatera Showcases Revolutionary Neuromorphic Processor Enabling Next-Generation Ambient Intelligence at CES 2025

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Delft University of Technology spin-off’s Spiking Neural Processor utilizes a proprietary analog-mixed signal computing architecture that harnesses spiking neural networks to deliver unprecedented, brain-inspired cognition performance within an ultra-low power envelope.

LAS VEGAS, Jan. 7, 2025 /PRNewswire/ — Innatera, the pioneer of groundbreaking ultra-low power neuromorphic processors, is showcasing its Spiking Neural Processor (SNP) that transforms the way battery-powered devices make sense of the physical world at CES 2025. Demonstrations will take place January 7-10 at the Venetian North Tower Suite #26-136.

“At this pivotal moment in computing, Innatera’s breakthrough Spiking Neural Processor delivers unmatched energy-efficient, brain-inspired cognition for sensors, unlocking the promise of ambient intelligence,” said Sumeet Kumar, CEO of Innatera. “This revolutionary processor provides an all-in-one solution that simplifies and optimizes sensor data processing at the edge.”

Innatera’s SNP combines a Spiking Neural Network (SNN) engine with a RISC-V processor core and other accelerators to deliver a complete solution with exceptional performance in energy-constrained environments. The single-chip solution brings intelligence closer to sensors, enabling next-generation AI and signal processing for applications in consumer electronics, smart homes, and industrial IoT, such as audio interfaces, touch-free interfaces, presence detection, activity recognition, and ECG recognition.

The SNP achieves high-performance pattern recognition at the sensor edge and enables real-time analysis of sensor data to detect and identify embedded patterns, with sub-milliwatt power dissipation and sub-millisecond latency.

Ambient Intelligence marks a major departure from computing technology as we know it, paving the way for a future where digital interactions are as natural as breathing.

At CES 2025, Innatera is demonstrating how the SNP can transform computing in several real-world applications:

Audio Scene Classification: Audio scene classification allows devices to be aware of the environment they operate in and use this information to adapt their operation. For example, in noise canceling headphones, this might mean adapting to the ambient noise profile of an airplane or a city bus.Robust Human Presence Sensing: The detection of human presence is important in a wide range of indoor and outdoor applications, such as security cameras, smart lighting, video doorbells and smart TVs. Using a radar sensor, this demo showcases always-on, privacy-preserving human presence detection with exceptional accuracy and power efficiency.Robust People Counting Using Far Infrared Sensors: Innatera will showcase how its SNP enables advanced people counting and human presence detection with passive infrared sensors. Infrared technology is a non-intrusive, low-light, and privacy-preserving method for people counting and human presence detection.

The company’s presence at CES 2025 follows a remarkable year of growth and development for the innovation-driven Delft University of Technology spin-off. Earlier this year, the company announced the oversubscription of a Series A $21-million funding round that is now accelerating the company’s development of neuromorphic processors.

For the press kit, click here. To schedule a meeting or learn more about Innatera’s technology, click here.

About Innatera
Born out of a decade of research on energy-efficient neuromorphic computing at the Delft University of Technology, Innatera is pioneering a new breed of Ambient Intelligent microprocessors that revolutionize sensors with brain-like thinking. Backed by leading European deep-tech VCs Matterwave Ventures, MIG Capital, InvestNL, the European Innovation Council, Delft Enterprises and Innavest, Innatera is on a mission to infuse a billion sensors with brain-like intelligence by 2030. Innatera envisions a future where electronic devices integrate seamlessly into everyday life, making the world around us smarter, safer, and cleaner for everyone.

Media Contact
Samantha Bryton
Griffin360
388426@email4pr.com
212-481-3456

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ID.me Appoints Brian Robins and Bill Welch to Board of Directors

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MCLEAN, Va., Jan. 7, 2025 /PRNewswire/ — ID.me, the market-leading digital identity wallet, today announced the appointments of SaaS industry leaders Brian Robins and William “Bill” Welch as independent members to ID.me’s Board of Directors. Robins, Chief Financial Officer of GitLab Inc., and Welch, Chief Executive Officer of Sysdig, bring decades of experience in scaling high-growth public and private technology companies. Robins and Welch join ID.me amid significant momentum, as the company has seen revenue grow more than 370% from 2020 through 2023.

“Brian and Bill are exceptional leaders whose complementary experience will be invaluable as ID.me continues to grow,” said Blake Hall, Founder and CEO of ID.me. “Brian’s financial and strategic leadership and Bill’s expertise in cloud security will strengthen our efforts to keep Americans safe while transacting online.”

Brian Robins will serve as Chair of the ID.me Board’s Audit Committee. Currently serving as CFO of GitLab, the DevSecOps platform, Robins brings over 25 years of experience leading both private and public high-growth software companies. Robins is responsible for GitLab’s financial and business systems functions, including accounting, tax, treasury, corporate finance, and investor relations. Robins led GitLab’s IPO readiness effort and public offering. In addition, he has led and advised multibillion dollar technology companies through hyper growth, IPO readiness/listings, and capital markets transactions. Prior to GitLab, Robins served as CFO at Cylance (acquired by BlackBerry), AlienVault (acquired by AT&T), and Verisign. Robins has a proven track record of improving financial performance, increasing go to market productivity, and creating shareholder value. Robins currently serves as special advisor at Brighton Park Capital, and on the Advisory Council at ForgePoint Capital Cybersecurity, and also serves on the GitLab Foundation Board of Directors.

“I am honored to help ID.me make identity verification through use of its digital wallet simpler and more secure for millions of Americans, as well as many critical government agencies and companies,” said Robins. “I’m looking forward to contributing to ID.me’s next phase of growth and helping to ensure that no identity is left behind.”

Bill Welch will serve as Chair of the ID.me Board’s Compensation Committee and Member of the Audit Committee. As CEO of Sysdig, the leader in real-time cloud security, Welch drives the company’s vision to stop cloud attacks instantly with AI-powered Sysdig Sage™ and open source Falco, the standard for cloud threat detection. Welch is a Cybersecurity industry veteran, bringing over 30 years of extensive experience leading public and private software companies and operationalizing and scaling product development and innovation, customer experience, talent acquisition, and strategic alliances globally. Prior to joining Sysdig as CEO, Welch served as President and COO of Talkdesk, where he was responsible for advancing the company’s long-term vision and global go-to-market operations. Welch also previously served as COO of Zscaler, where he led Zscaler’s global sales, channel, operations, customer care, and strategy, culminating in an industry-leading initial public offering and a nearly $32 billion market capitalization today. Welch has held senior leadership roles at Duo Security, HP Americas Software and Symantec, and, while serving as President and COO of Duo, Welch helped secure a $2.35 billion merger transaction with Cisco. Welch currently serves on Sysdig’s Board of Directors.

“I have always believed that fostering a performance-driven culture with a strong focus on customer-centered decisions leads to success,” said Welch. “I’m excited to join a dynamic leadership team at ID.me as the company provides a growing number of Americans with a better, safer experience online.”

ID.me is proud to welcome both Brian and Bill to the Board while we continue driving towards a safer, simpler, and more convenient way to interact online.

About ID.me
ID.me is the next-generation digital identity wallet that simplifies how individuals securely prove their identity online. Consumers can verify their identity with ID.me once and seamlessly login across websites without having to create a new login and verify their identity again. Over 135 million users experience streamlined login and identity verification with ID.me at 19 federal agencies, 44 state government agencies, and 66 healthcare organizations. More than 600 consumer brands use ID.me to verify communities and user segments to honor service and build more authentic relationships. ID.me’s technology meets the federal standards for consumer authentication set by the Commerce Department and is approved as a NIST 800-63-3 IAL2 / AAL2 credential service provider by the Kantara Initiative. ID.me is committed to “No Identity Left Behind” to enable all people to have a secure digital identity. To learn more, visit https://network.id.me/.

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KYOCERA AVX EXHIBITS AT CES 2025

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KYOCERA AVX and Kyocera Corporation are showcasing an extensive selection of highly engineered component and device technologies designed to enable state-of-the-art innovations in the automotive, transportation, industrial automation, logistics, communications, and medical industries.

FOUNTAIN INN, S.C., Jan. 7, 2025 /PRNewswire/ — KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is co-exhibiting with its parent company, Kyocera Corporation, at CES 2025 in Las Vegas this week.

CES is widely renowned as one of the world’s foremost tech events and has earned a reputation for presenting the industry’s boldest breakthroughs, sharpest minds, and most impactful brands and uniting key stakeholders committed to pioneering the future and transforming how we live.

In light of this, KYOCERA AVX and Kyocera Corporation are showcasing an extensive range of highly engineered component and device technologies designed to enable state-of-the-art solutions to the world’s most pressing and pervasive challenges.

Kyocera Corporation is showcasing a number of new products and technologies optimized for next-generation, high-reliability automotive, transportation, industrial automation, logistics, communications, and medical applications, including:

A cutting-edge, High-Definition Aerial Display that uses curved mirrors and a variety of non-contact sensors to produce realistic, high-resolution floating images while minimizing physical space requirements and power consumption. CES attendees can experience the new display in a futuristic automotive navigation demonstration at the co-branded booth, #4816 in the Vehicle Tech and Advanced Mobility zone.A breakthrough AI-Based Depth Sensor that accurately measures challenging targets, including extremely small, shiny, and semi-transparent objects, with best-in-class resolution that’s 10 times more accurate than traditional monocular measurements and, in turn, helps users better contend with labor shortages and improve productivity. Ideal applications include helping robots sort tiny parts in industrial manufacturing operations, accurately measuring elements of the human body, identifying shiny metallic surgical instruments, and enabling the peripheral monitoring of transportation robots in logistics and retail operations.A groundbreaking new Underwater Wireless Optical Communication technology that delivers the world’s fastest underwater communication speeds — up to 2Gb/s — thanks to a combination of fast-response, semi-polar gallium nitride (GaN) lasers that enhance data communication capabilities by expanding optical bandwidth and unique beam shape propagation characteristics. In addition to being fast, this new optical communication technology is highly reliable and secure, capable of sending transmissions to specific receivers, and resistant to sunlight.A smart, contactless, Millimeter-Wave (mmWave) Sensing System that accurately detects even minute vibrations in vital sensing applications, including autonomous driving and health (e.g., heart rate) monitors.A mmWave Simultaneous Localization and Mapping (SLAM) technology designed to replace mechanical-based LiDAR with 4D imaging radar to enable safer, more accurate autonomous driving capabilities, even in bad weather conditions, while minimizing cost.The versatile new Camera-LiDAR Fusion Sensor — the world’s first LiDAR sensor equipped with an integrated camera, an optical axis, and a unique MEMS mirror that delivers the world’s highest resolution and durability and enables the real-time superimposition of camera image data and LiDAR distance data for advanced object recognition. Ideal applications include ADAS, ships, and heavy machinery.A new Bifocal Mirror that displays enlarged images in the distance, making it easier for farsighted drivers to adjust their focus and clearly see their surroundings, and leverages augmented reality (AR) technology to better support safe driving by instantly displaying information recognized by the rearview camera in the mirror.

KYOCERA AVX is showcasing a selection of advanced components designed to enable next-generation technologies in a number of different industries. Featured components on display at CES 2025 include:

Antennas optimized to facilitate wireless connectivity in a wide variety of applications extending throughout the automotive, industrial, IoT, consumer, medical, transportation, and networking industries, including high-reliability standard and ultra-small chip antennas rigorously tested to AEC-Q200 requirements, such as the A-Series all-in-one (LTE, GNSS, and NTN) embedded automotive broadband antennas and 2.4GHz automotive corner chip antennas.Multilayer ceramic capacitors (MLCC) that exhibit low parasitics, excellent EMI filtering capabilities, high capacitance values, and various voltage ratings over a wide temperature range and are available in chip, leaded, and stacked configurations in addition to unique geometries.The industry’s widest range of high-reliability tantalum capacitors, which includes the smallest case size, highest temperature, and lowest DCL MnO2 solid tantalum technologies available on the market.An award-winning portfolio of conductive, low-profile, lead- and halogen-free solid electrolytic polymer capacitors that exhibit excellent stability, high capacitance, low-ESR performance, and a benign failure mode under recommended use conditions — including the smallest, highest-voltage, and highest reliability polymer capacitors available on the market.Aluminum electrolytic chip capacitors that deliver high-CV, high endurance, and very low ESR performance in smaller packages than competing can-type aluminum capacitors and specialized conductive polymer and hybrid electrolytic versions that also exhibit higher tolerance for ripple currents, inrush currents, and high temperatures than standard versions.Low-, medium-, and high-power dry and oil-impregnated film capacitors based on polyester and polypropylene dielectrics that exhibit controlled self-healing capabilities, are engineered for power electronics applications rated for 75V to 100kV, and are ideal for applications ranging from DC filtering and semiconductor protection and tuning to discharge and high energy storage.Supercapacitors or double-layer capacitors that provide a unique combination of characteristics, including very high pulse power and capacitance densities.An extensive portfolio of high-quality sensing and control products that make engines more efficient, emissions cleaner, and cars safer and are designed and produced according to the stringent requirements of the global automotive industry.A variety of unique connectors based on industry-proven contact technology and proven to provide robust, performance-driven solutions in a wide range of harsh-environment applications, including the industry’s first dual-entry card-edge connectors, which also feature the company’s lowest above-board height profile.

For more information about the future-forward component and device technologies that KYOCERA AVX and Kyocera Corporation are showcasing and demonstrating at CES 2025, please visit the links embedded here or visit them at Booth #4816 in the Vehicle Tech and Advanced Mobility Zone in the West Hall. For all other inquiries, please visit https://www.kyocera-avx.com/, email inquiry@kyocera-avx.com, follow them on LinkedInX (Twitter), and Instagram, like them on Facebook, call 864-967-2150, or write to One AVX Boulevard, Fountain Inn, S.C. 29644.

About KYOCERA
Kyocera Corporation (TOKYO:6971), the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of fine ceramics (also known as “advanced ceramics”). By combining these engineered materials with metals and integrating them with other technologies, Kyocera has become a leading supplier of industrial and automotive components, semiconductor packages, electronic devices, smart energy systems, printers, copiers, and mobile phones. During the year ended March 31, 2024, the company’s consolidated sales revenue totaled 2.0 trillion yen (approx. US$13.3 billion). Kyocera is ranked #874 on Forbes magazine’s 2024 “Global 2000” list of the world’s largest publicly traded companies and has been named among “The World’s 100 Most Sustainably Managed Companies” by The Wall Street Journal.

About KYOCERA AVX
KYOCERA AVX is a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future. As a wholly owned subsidiary of Kyocera Corporation structured to capitalize on shared resources and technical expertise, KYOCERA AVX has an expansive global footprint comprised of several dozen research, development, and manufacturing facilities spanning more than 15 countries and staffed with talented personnel dedicated to innovation, component quality, customer service, and enabling a brighter future through technology. KYOCERA AVX designs, develops, manufactures, and supplies advanced capacitors, antennas, interconnects, circuit protection and timing devices, sensors, controls, filters, fuses, diodes, resistors, couplers, and inductors optimized for employment in the international 5G, IoT, aerospace, automotive, consumer electronics, industrial, medical, and military markets.

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